PHILIPS Z0109MA

Z0109MA
Logic level four-quadrant triac
Rev. 03 — 4 August 2009
Product data sheet
1. Product profile
1.1 General description
Passivated sensitive gate 4-Q triac in a SOT54 plastic package
1.2 Features and benefits
„ Direct interfacing to logic level ICs
„ High blocking voltage of 600V
„ Direct interfacing to low power gate
drive circuits
„ Sensitive gate in four quadrants
1.3 Applications
„ General purpose low power motor
control
„ Industrial process control
„ Low power AC Fan controllers
„ Home appliances
1.4 Quick reference data
Table 1.
Quick reference
Symbol Parameter
VDRM
repetitive peak
off-state voltage
IT(RMS)
RMS on-state
current
Conditions
Min
Typ
Max
Unit
-
-
600
V
full sine wave; Tlead ≤ 38 °C;
see Figure 4 and 1
-
-
1
A
VD = 12 V; Tj = 25 °C; T2+ G-;
see Figure 6
-
-
10
mA
VD = 12 V; Tj = 25 °C; T2- G-
-
-
10
mA
Static characteristics
IGT
gate trigger current
VD = 12 V; Tj = 25 °C; T2+ G+
-
-
10
mA
VD = 12 V; Tj = 25 °C; T2- G+
-
-
10
mA
Z0109MA
NXP Semiconductors
Logic level four-quadrant triac
2. Pinning information
Table 2.
Pinning information
Pin
Symbol
Description
Simplified outline
Graphic symbol
1
T2
main terminal 2
2
G
gate
T2
3
T1
main terminal 1
sym051
T1
G
321
SOT54
(TO-92)
3. Ordering information
Table 3.
Ordering information
Type number
Z0109MA
Package
Name
Description
Version
TO-92
plastic single-ended leaded (through hole) package; 3 leads
SOT54
4. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
VDRM
repetitive peak off-state
voltage
IT(RMS)
RMS on-state current
dIT/dt
rate of rise of on-state
current
Conditions
Min
Max
Unit
-
600
V
full sine wave; Tlead ≤ 38 °C; see Figure 4 and 1
-
1
A
IT = 1 A; IG = 20 mA; dIG/dt = 100 mA/µs; T2+ G+
-
50
A/µs
IT = 1 A; IG = 20 mA; dIG/dt = 100 mA/µs; T2- G+
-
20
A/µs
IT = 1 A; IG = 20 mA; dIG/dt = 100 mA/µs; T2+ G-
-
50
A/µs
IT = 1 A; IG = 20 mA; dIG/dt = 100 mA/µs; T2- G-
-
50
A/µs
-
1
A
IGM
peak gate current
PGM
peak gate power
-
2
W
Tstg
storage temperature
-40
150
°C
Tj
junction temperature
-
125
°C
ITSM
non-repetitive peak
on-state current
full sine wave; tp = 16.7 ms; Tj(init) = 25 °C
-
8.5
A
full sine wave; tp = 20 ms; Tj(init) = 25 °C; see Figure 2
and 3
-
8
A
I2t
I2t for fusing
tp = 10 ms; sine-wave pulse
-
0.32
A2s
PG(AV)
average gate power
-
0.1
W
Z0109MA_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 4 August 2009
2 of 12
Z0109MA
NXP Semiconductors
Logic level four-quadrant triac
003aac259
2.0
Ptot
(W)
1.6
1.2
conduction
angle
(degrees)
form
factor
a
30
60
90
120
180
4
2.8
2.2
1.9
1.57
α = 180°
α
120°
90°
60°
0.8
30°
0.4
0.0
0
Fig 1.
0.2
0.4
0.6
0.8
1
1.2
IT(RMS) (A)
Total power dissipation as a function of RMS on-state current; maximum values
003aad318
10
ITSM
(A)
8
6
4
ITSM
IT
t
2
1/f
Tj(init) = 25 °C max
0
1
Fig 2.
102
10
number of cycles
103
Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum
values
Z0109MA_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 4 August 2009
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Z0109MA
NXP Semiconductors
Logic level four-quadrant triac
003aad319
103
ITSM
IT
ITSM
(A)
t
tp
Tj(init) = 25 °C max
102
(1)
(2)
10
1
10−5
Fig 3.
10−4
10−3
10−2
tp (s)
10−1
Non-repetitive peak on-state current as a function of pulse width; maximum values
003aac264
1.2
IT(RMS)
(A)
0.8
0.4
0
−50
Fig 4.
0
50
100
150
Tlead (°C)
RMS on-state current as a function of lead temperature; maximum values
Z0109MA_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 4 August 2009
4 of 12
Z0109MA
NXP Semiconductors
Logic level four-quadrant triac
5. Thermal characteristics
Table 5.
Thermal characteristics
Symbol
Parameter
Rth(j-a)
Rth(j-lead)
Conditions
Min
Typ
Max
Unit
thermal resistance from
junction to ambient
-
150
-
K/W
thermal resistance from Full cycle; see Figure 5
junction to lead
-
-
60
K/W
003aac206
102
Zth(j-lead)
(K/W)
10
1
P
10−1
tp
t
10−2
10−5
Fig 5.
10−4
10−3
10−2
10−1
1
tp (s)
10
Transient thermal impedance from junction to lead as a function of pulse width
Z0109MA_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 4 August 2009
5 of 12
Z0109MA
NXP Semiconductors
Logic level four-quadrant triac
6. Characteristics
Table 6.
Characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VD = 12 V; Tj = 25 °C; T2+ G-; see Figure 6
-
-
10
mA
VD = 12 V; Tj = 25 °C; T2- G-
-
-
10
mA
VD = 12 V; Tj = 25 °C; T2+ G+
-
-
10
mA
VD = 12 V; Tj = 25 °C; T2- G+
-
-
10
mA
VD = 12 V; Tj = 25 °C; IG = 0.1 A; T2+ G-;
see Figure 7
-
-
25
mA
VD = 12 V; Tj = 25 °C; IG = 0.1 A; T2+ G+
-
-
15
mA
VD = 12 V; Tj = 25 °C; IG = 0.1 A; T2- G+
-
-
15
mA
Static characteristics
gate trigger current
IGT
latching current
IL
VD = 12 V; Tj = 25 °C; IG = 0.1 A; T2- G-
-
-
15
mA
IH
holding current
VD = 12 V; Tj = 25 °C; see Figure 10
-
-
10
mA
VT
on-state voltage
IT = 1 A; see Figure 8
-
1.3
1.6
V
VGT
gate trigger voltage
IT = 0.1 A; VD = 12 V; Tj = 25 °C; see Figure 9
-
-
1.3
V
IT = 0.1 A; VD = 600 V; Tj = 125 °C
0.2
-
-
V
ID
off-state current
VD = 600 V; Tj = 125 °C
-
-
0.5
mA
Dynamic characteristics
dVD/dt
rate of rise of off-state
voltage
VDM = 402 V; Tj = 110 °C; gate open circuit;
see Figure 11
50
-
-
V/µs
dVcom/dt
rate of rise of
commutating voltage
VD = 400 V; Tj = 110 °C; dIcom/dt = 0.44 A/ms;
gate open circuit
2
-
-
V/µs
003aaa205
4
003aaa203
3
IGT
IL
IGT(25°C)
IL(25°C)
3
(1)
(2)
2
(3)
(4)
2
1
1
0
−50
0
50
100
0
−50
150
Tj (°C)
Fig 7.
Fig 6.
0
50
100
150
Tj (°C)
Normalized latching current as a function of
junction temperature
Normalized gate trigger current as a function of
junction temperature
Z0109MA_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 4 August 2009
6 of 12
Z0109MA
NXP Semiconductors
Logic level four-quadrant triac
003aac258
2
003aaa209
1.6
IT
(A)
VGT
VGT(25°C)
1.6
1.2
1.2
0.8
0.8
(1)
(2)
(3)
0.4
0.4
0
0
0.4
0.8
1.2
1.6
VT (V)
0
−50
2
Fig 9.
Fig 8.
0
50
100
150
Tj (°C)
Normalized gate trigger voltage as a function of
junction temperature
On-state current as a function of on-state
voltage
003aaa204
3
IH
IH(25°C)
2
1
0
−50
0
50
100
150
Tj (°C)
Fig 10. Normalized holding current as a function of junction temperature
Z0109MA_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 4 August 2009
7 of 12
Z0109MA
NXP Semiconductors
Logic level four-quadrant triac
003aaa208
1.6
A
1.2
0.8
0.4
0
0
50
100
150
Tj (°C)
Fig 11. Normalized critical rate of rise of off-state voltage as a function of junction temperature;typical values
Z0109MA_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 4 August 2009
8 of 12
Z0109MA
NXP Semiconductors
Logic level four-quadrant triac
7. Package outline
Plastic single-ended leaded (through hole) package; 3 leads
SOT54
c
E
d
A
L
b
1
e1
2
D
e
3
b1
L1
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
b
b1
c
D
d
E
mm
5.2
5.0
0.48
0.40
0.66
0.55
0.45
0.38
4.8
4.4
1.7
1.4
4.2
3.6
e
2.54
e1
L
L1(1)
1.27
14.5
12.7
2.5
max.
Note
1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities.
OUTLINE
VERSION
REFERENCES
IEC
SOT54
JEDEC
JEITA
TO-92
SC-43A
EUROPEAN
PROJECTION
ISSUE DATE
04-06-28
04-11-16
Fig 12. Package outline SOT54 (TO-92)
Z0109MA_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 4 August 2009
9 of 12
Z0109MA
NXP Semiconductors
Logic level four-quadrant triac
8. Revision history
Table 7.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
Z0109MA_3
20090804
Product data sheet
-
Z0103_07_09_SERIES-02
Modifications:
•
The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
•
•
Legal texts have been adapted to the new company name where appropriate.
Type number Z0109MA separated from data sheet Z0103_07_09_SERIES-02.
Z0103_07_09_SERIES-02 20020912
(9397 750 10102)
Product data
-
Z0103_07_09_SERIES-01
Z0103_07_09_SERIES-01 20020411
(9397 750 09419)
Product data
-
-
Z0109MA_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 4 August 2009
10 of 12
Z0109MA
NXP Semiconductors
Logic level four-quadrant triac
9. Legal information
9.1
Data sheet status
Document status [1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term 'short data sheet' is explained in section "Definitions".
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product
status information is available on the Internet at URL http://www.nxp.com.
9.2
Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
9.3
Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein may
be subject to export control regulations. Export might require a prior
authorization from national authorities.
9.4
Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
10. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Z0109MA_3
Product data sheet
© NXP B.V. 2009. All rights reserved.
Rev. 03 — 4 August 2009
11 of 12
Z0109MA
NXP Semiconductors
Logic level four-quadrant triac
11. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
9
9.1
9.2
9.3
9.4
10
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1
General description . . . . . . . . . . . . . . . . . . . . . .1
Features and benefits . . . . . . . . . . . . . . . . . . . . .1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Quick reference data . . . . . . . . . . . . . . . . . . . . .1
Pinning information . . . . . . . . . . . . . . . . . . . . . . .2
Ordering information . . . . . . . . . . . . . . . . . . . . . .2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .2
Thermal characteristics . . . . . . . . . . . . . . . . . . .5
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . .9
Revision history . . . . . . . . . . . . . . . . . . . . . . . . .10
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 11
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 11
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Contact information. . . . . . . . . . . . . . . . . . . . . . 11
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 4 August 2009
Document identifier: Z0109MA_3