TPS658310 SLVSB52 – NOVEMBER 2011 www.ti.com Power Management Unit 1 Introduction 1.1 Features • Power Management Core – Dual Input Power Path – Switch Mode Charger – Integrated Charge Current Sense FET – Automatic Battery Supplement Mode – 2 Boost Converters • 1 Boost supports 2 strings of up to 6 LEDs with Internal and External Dimming Control • 1 Boost supports 1 string of 6 LEDs • Boost Converters can also be used in Constant Voltage Mode – LED Matrix Controller – RGB Controller – I2C™ Interface to Device for Low Latency Communication 12 1.2 • Applications Portable Applications 1.3 Description The TPS658310 Power Management Unit is a broad use, multi-channel device, for portable applications. The device consists of an Integrated Power Path Management and Switch Mode Li-Ion Battery Charger that provides system power from a regulated wall adapter or a USB port. It also handles lighting management with integrated Backlight Boosts, LED Matrix Controller for keypad, Camera Flash LED Controller, Current Source and RGB channels. To request a full data sheet, please send an email to: [email protected] 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. I2C is a trademark of NPX Corporation. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2011, Texas Instruments Incorporated TPS658310 SLVSB52 – NOVEMBER 2011 1.4 www.ti.com Block Diagram MINIPWR VINT POWER PATH OVP / OCP REFSYS SWITCH MODE CHARGER (Integrated Sense FET & R ISET) FLASH LED CONTROLLER LEDM_ROW[3] LEDM_ROW[2] LEDM_ROW[1] LEDM_ROW[0] LEDM_COL[3] LEDM_COL[2] LEDM_COL[1] LEDM_COL[0] FLASHMASK FLASHSYNC FLASHSRC SYS PGNDCHG TS CHG_L PWR USB AC The simplified TPS658310 system diagram is shown in Figure 1-1. Multiple Pins LED MATRIX LED MATRIX CONTROLLER CONTROLLER BAT MAIN BOOST nRESET ALGDIMC CNTPWM MBST_FB MBST_L BKLSINK[1] BKLSINK[0] MBST Control Registers ABST_FB ABST_L AUX BOOST ABSTSINK ABST PGNDBST SDAT SCLK nINT RGB RED BLUE GREEN AGND DGND Figure 1-1. Simplified System Diagram 2 Introduction Copyright © 2011, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TPS658310 TPS658310 SLVSB52 – NOVEMBER 2011 www.ti.com 2 Application Schematic To Host TPS658310 Adapter 1µF SCLK SDAT nINT nRESET USB LEDM_ROW[3] LEDM_ROW[2] LEDM_ROW[1] LEDM_ROW[0] LEDM_COL[3] LEDM_COL[2] LEDM_COL[1] LEDM_COL[0] AC P 1µF P USB PWR PWR 10µF P 4.7µF 4.7µF 1.5µH To Host VSYS RED GREEN BLUE MINIPWR VINT CNTPWM MBST_L MBST BKSINK[1] CHG_L VSYS P 47µF SYS VSYS 4.7µH BKSINK[0] FLASHMASK FLASHSYNC FLASHSRC ANLGDIM 100nF P MBST_FB 20Ω P 1µF P 4.7µH 0.1µF ABST_L ABST ABSTSINK ABST_FB 1µF 20Ω PGNDBST P P 150µF BAT AGND DGND PGNDCHG P P TS NTC P Multiple Pins Pack NOTE: Component values shown are the minimum required. Figure 2-1. Application Schematic Application Schematic Copyright © 2011, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): TPS658310 3 PACKAGE OPTION ADDENDUM www.ti.com 29-Feb-2012 PACKAGING INFORMATION Orderable Device TPS658310YFFR Status (1) ACTIVE Package Type Package Drawing DSBGA YFF Pins Package Qty 49 1500 Eco Plan (2) Green (RoHS & no Sb/Br) Lead/ Ball Finish SNAGCU MSL Peak Temp (3) Samples (Requires Login) Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. 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