10Base-T Interface Module ELECTRONICS INC. EPA2013D & EPA2013D-RC • General Purpose 10Base-T Filter Module • Complies with or exceeds IEEE 802.3, 10Base-T Standards • Add “-RC” after part number for RoHS Compliant • Available in SMD and DIP Packages Electrical Parameters @ 25° C Cut-Off Frequency (MHz) Insertion Loss (dB Max.) Return Loss (dB Min.) Attenuation (dB Min.) Common Mode Rejection (dB Min.) Crosstalk (dB Min.) ± 1.0 MHz Xmit/Rcv 1-10 MHz 5-10 MHz @ 20 MHz @ 25 MHz @ 30 MHz @ 40 MHz @ 50 MHz @ 100 MHz 1-10 MHz Xmit/Rcv Xmit/Rcv Xmit/Rcv Xmit/Rcv Xmit/Rcv Xmit/Rcv Xmit Xmit Xmit/Rcv 17/17 -1/-1 -15/-15 -7/-6 -19/-14 -30/-20 -35/-31 -30 -25 -30/-30 Isolation : meets or exceeds 802.3 IEEE Requirements • Characteristic Filter Impedance : 100 Ω • • Referenced to the Output Level Fundamental Frequency @ 5 MHz • CMC is common to both channels • • Package .990 (25.15) Transmit Channel PCA EPA2013D(-RC) Date Code .270 (6.86) .700 (17.78) 3 .300 (7.62) 15 14 1:1 .034 Ø (.864) Drill .060 Ø (1.52) Solder Pad Receive Channel 11 6 .125/.150 (3.18/3.81) .020/.030 (.508/.762) .300 (7.62) LPF 2 Suggested PCB Layout .700 (17.78) 16 1 .300 (7.62) .145 (3.68) Pin 1 I.D. Schematic Component Outline .390 x .990 (10.13 x 25.15) LPF 8 10 7 1:1 9 .008/.012 (.203/.305) .018/.022 (.457/.599) .310 (7.87) .100 (2.54) .300 (7.62) EPA2013D EPA2013D-RC 1. Lead Finish Notes : SnPb Hot Tin Dip (Sn) † 2. Peak Temperature Rating (Wave Solder Process Only) 225°C 260°C 10 (+2/-0) seconds (per JESD22A111) 3. Weight 4. Packaging Information (Tube) 2.8 grams 2.8 grams 19 pieces/tube 19 pieces/tube † Lead Material : Matte Tin with Ni Barrier Unless Otherwise Specified Dimensions are in Inches /mm ± .010 /.25 PCA ELECTRONICS, INC. 16799 SCHOENBORN ST. NORTH HILLS, CA 91343 Product performance is limited to specified parameters. Data is subject to change without prior notice. CSA2013D & -RC Rev. G4 6/26/07 JDG TEL: (818) 892-0761 FAX: (818) 894-5791 http://www.pca.com