TI 5962-9555602Q2A

 SLOS098D − AUGUST 1991 − REVISED MAY 1998
D 1/2 VI Virtual Ground for Analog Systems
D Self-Contained 3-terminal TO-226AA
D Excellent Output Regulation
Package
D
D
D Micropower Operation . . . 170 µA Typ,
D
D
VI = 5 V
Wide VI Range . . . 4 V to 40 V
High Output-Current Capability
− Source . . . 20 mA Typ
− Sink . . . 20 mA Typ
− −45 µV Typ at IO = 0 to −10 mA
− +15 µV Typ at IO = 0 to + 10 mA
Low-Impedance Output . . . 0.0075 Ω Typ
Noise Reduction Pin (D, JG, and P
Packages Only)
INPUT/OUTPUT TRANSFER CHARACTERISTICS
10
VI
description
VI
V
V + I
O
2
Voltage − V
8
In signal-conditioning applications utilizing a
single power source, a reference voltage equal to
one-half the supply voltage is required for
termination of all analog signal grounds. Texas
Instruments presents a precision virtual ground
whose output voltage is always equal to one-half
the input voltage, the TLE2426 “rail splitter.”
VO
6
4
VO
The unique combination of a high-performance,
2
micropower operational amplifier and a precisiontrimmed divider on a single silicon chip results in
a precise VO/VI ratio of 0.5 while sinking and
sourcing current. The TLE2426 provides a low0
0
0.25
0.5
0.75
1
impedance output with 20 mA of sink and source
t − Time − s
capability while drawing less than 280 µA
of supply current over the full input range of 4 V to 40 V. A designer need not pay the price in terms of board
space for a conventional signal ground consisting of resistors, capacitors, operational amplifiers, and voltage
references. The performance and precision of the TLE2426 is available in an easy-to-use, space saving,
3-terminal LP package. For increased performance, the optional 8-pin packages provide a noise-reduction pin.
With the addition of an external capacitor (CNR), peak-to-peak noise is reduced while line ripple rejection is
improved.
Initial output tolerance for a single 5-V or 12-V system is better than 1% with 3.6% over the full 40-V input range.
Ripple rejection exceeds 12 bits of accuracy. Whether the application is for a data acquisition front end, analog
signal termination, or simply a precision voltage reference, the TLE2426 eliminates a major source of system
error.
AVAILABLE OPTIONS
PACKAGED DEVICES
TA
SMALL
OUTLINE
(D)
CERAMIC
DIP
(JG)
PLASTIC
(LP)
PLASTIC
DIP
(P)
0°C to 70°C
TLE2426CD
—
TLE2426CLP
TLE2426CP
CHIP
FORM
(Y)
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  1998, Texas Instruments Incorporated
! " #$%! " &$'(#! )!%*
)$#!" # ! "&%##!" &% !+% !%" %," "!$%!"
"!)) -!.* )$#! &#%""/ )%" ! %#%""(. #($)%
!%"!/ (( &%!%"*
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SLOS098D − AUGUST 1991 − REVISED MAY 1998
−40°C to 85°C
TLE2426ID
−55°C to 125°C
TLE2426MD
—
TLE2426ILP
TLE2426IP
TLE2426MJG
TLE2426MLP
TLE2426MP
TLE2426Y
The D and LP packages are available taped and reeled in the commercial temperature range only. Add R suffix
to the device type (e. g., TLC2426CDR). Chips are tested at 25°C.
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SLOS098D − AUGUST 1991 − REVISED MAY 1998
description (continued)
The C-suffix devices are characterized for operation from 0°C to 70°C. The I suffix devices are characterized
for operation from −40°C to 85°C. The M suffix devices are characterized over the full military temperature range
of −55°C to 125°C.
LP PACKAGE
(TOP VIEW)
D, JG, OR P PACKAGE
(TOP VIEW)
OUT
COMMON
IN
NC
1
8
2
7
3
6
4
5
NOISE REDUCTION
NC
NC
NC
IN
COMMON
OUT
NC − No internal connection
TLE2426Y chip information
This chip, properly assembled, displays characteristics similar to the TLE2426C. Thermal compression or
ultrasonic bonding may be used on the doped aluminum bonding pads. The chips may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
(3) (3)
(2)
(2)
(1) (1)
IN
(3)
NOISE (8)
REDUCTION
60
(2)
COMMON
(8)
88
POST OFFICE BOX 655303
NOTE A:
+1
CHIP THICKNESS:
15 MILS TYPICAL
(1)
OUT
BONDING PADS:
4 × 4 MILS MINIMUM
TJmax = 150°C
TOLERANCES ARE ± 10%.
ALL DIMENSIONS ARE IN
MILS.
Both bonding pads numbered 1, both numbered 2,
and both numbered 3, must be bonded out to the
corresponding functions pin.
• DALLAS, TEXAS 75265
3
SLOS098D − AUGUST 1991 − REVISED MAY 1998
absolute maximum ratings over operating free-air temperature (unless otherwise noted)†
Continuous input voltage, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 V
Continuous filter trap voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 V
Output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 80 mA
Duration of short-circuit current at (or below) 25°C (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . unlimited
Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table
Operating free-air temperature range, TA: C suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
I suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 85°C
M suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −55°C to 125°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds: D or P package . . . . . . . . . . . . . . . . . 260°C
Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds: JG or LP package . . . . . . . . . . . . . . 300°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The output may be shorted to either supply. Temperature and/or supply voltages must be limited to ensure that the maximum dissipation
rating is not exceeded.
DISSIPATION RATING TABLE
TA ≤ 25
25°C
C
POWER RATING
DERATING FACTOR
ABOVE TA = 25°C
TA = 70
70°C
C
POWER RATING
D
725 mV
5.8 mW/°C
464 mW
377 mW
145 mW
JG
1050 mV
8.4 mW/°C
672 mW
546 mW
210 mW
PACKAGE
TA = 85
85°C
C
POWER RATING
TA = 125
125°C
C
POWER RATING
LP
775 mV
6.2 mW/°C
496 mW
403 mW
155 mW
P
1000 mV
8.0 mW/°C
640 mW
520 mW
200 mW
recommended operating conditions
C SUFFIX
I SUFFIX
M SUFFIX
MIN
MAX
MIN
MAX
MIN
MAX
Input voltage, VI
4
40
4
40
4
40
V
Operating free-air temperature, TA
0
70
−40
85
−55
125
°C
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
UNIT
SLOS098D − AUGUST 1991 − REVISED MAY 1998
electrical characteristics at specified free-air temperature, VI = 5 V, IO = 0 (unless otherwise noted)
PARAMETER
Output voltage
TEST CONDITIONS
VI = 4 V
VI = 5 V
TA†
25°C
25
C
VI = 40 V
VI = 5 V
Full range
Temperature coefficient of output voltage
VI = 5 V
VI = 4 to 40 V
TLE2426C
MIN
TYP
MAX
1.98
2
2.02
2.48
2.5
2.52
19.8
20
20.2
2.475
25
25°C
170
ppm/°C
300
Supply current
No load
Output voltage regulation
(sourcing current)‡
IO = 0 to − 10 mA
Full range
IO = 0 to − 20 mA
25°C
−150
± 450
25°C
15
IO = 0 to 10 mA
± 160
Output voltage regulation
(sinking current)‡
Full range
IO = 0 to 20 mA
25°C
65
± 235
25°C
7.5
22.5
25°C
110
Output impedance
Noise-reduction impedance
Sinking current,
Short-circuit current
Output noise voltage, rms
VO = 5 V
VO = 0
Sourcing current,
CNR = 0
f = 10 Hz to 10 kHz
VO to 0.1%,
CNR = 1 µF
IO = ± 10 mA
Output voltage current step response
VO to 0.01%, IO = ± 10 mA
Step response
VI = 0 to 5 V, VO to 0.1%
VI = 0 to 5 V, VO to 0.01%
CL = 0
CL = 100 pF
CL = 0
CL = 100 pF
CL = 100 pF
V
2.525
Full range
Full range
25°C
UNIT
400
−45
µA
A
± 160
± 250
± 250
µV
µV
mΩ
kΩ
26
25°C
−47
120
25°C
30
mA
µV
V
290
25°C
275
400
25°C
25°C
µss
390
20
160
µs
† Full range is 0°C to 70°C.
‡ The listed values are not production tested.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
SLOS098D − AUGUST 1991 − REVISED MAY 1998
electrical characteristics at specified free-air temperature, VI = 12 V, IO = 0 (unless otherwise noted)
PARAMETER
Output voltage
TEST CONDITIONS
VI = 4 V
VI = 12 V
TA†
25°C
25
C
VI = 40 V
VI = 12 V
Full range
Temperature coefficient of output voltage
VI = 12 V
VI = 4 to 40 V
TLE2426C
MIN
TYP
MAX
1.98
2
2.02
5.95
6
6.05
19.8
20
20.2
5.945
35
25°C
195
ppm/°C
300
Supply current
No load
Output voltage regulation
(sourcing current)‡
IO = 0 to − 10 mA
Full range
IO = 0 to − 20 mA
25°C
−150
± 450
25°C
15
IO = 0 to 10 mA
± 160
Output voltage regulation
(sinking current)‡
Full range
IO = 0 to 20 mA
25°C
65
± 235
25°C
7.5
22.5
25°C
110
Output impedance
Noise-reduction impedance
Sinking current,
Short-circuit current
Output noise voltage, rms
VO = 12 V
VO = 0
Sourcing current,
CNR = 0
f = 10 Hz to 10 kHz
VO to 0.1%,
CNR = 1 µF
IO = ± 10 mA
Output voltage current step response
VO to 0.01%, IO = ± 10 mA
Step response
VI = 0 to 12 V, VO to 0.1%
VI = 0 to 12 V, VO to 0.01%
CL = 0
CL = 100 pF
CL = 0
CL = 100 pF
CL = 100 pF
† Full range is 0°C to 70°C.
‡ The listed values are not production tested.
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
V
6.055
Full range
Full range
25°C
UNIT
400
−45
µA
A
± 160
± 250
± 250
µV
µV
mΩ
kΩ
31
25°C
−70
120
25°C
30
mA
µV
V
290
25°C
275
400
25°C
25°C
µss
390
20
120
µs
SLOS098D − AUGUST 1991 − REVISED MAY 1998
electrical characteristics at specified free-air temperature, VI = 5 V, IO = 0 (unless otherwise noted)
PARAMETER
Output voltage
TEST CONDITIONS
VI = 4 V
VI = 5 V
TA†
25°C
25
C
VI = 40 V
VI = 5 V
Full range
Temperature coefficient of output voltage
VI = 5 V
VI = 4 to 40 V
Supply current
No load
Output voltage regulation
(sourcing current)‡
IO = 0 to − 10 mA
TYP
MAX
1.98
2
2.02
2.48
2.5
2.52
19.8
20
20.2
2.47
25
25°C
170
Full range
IO = 0 to 8 mA
IO = 0 to 20 mA
−45
−150
± 450
25°C
15
± 160
± 250
Full range
65
± 235
22.5
25°C
7.5
Noise-reduction impedance
25°C
110
Sinking current,
Output noise voltage, rms
VO = 5 V
VO = 0
Sourcing current,
CNR = 0
f = 10 Hz to 10 kHz
VO to 0.1%,
CNR = 1 µF
IO = ± 10 mA
Output voltage current step response
VO to 0.01%, IO = ± 10 mA
Step response
VI = 0 to 5 V,
VI = 0 to 5 V,
VO to 0.1%
VO to 0.01%
CL = 0
CL = 100 pF
CL = 0
CL = 100 pF
CL = 100 pF
µA
A
± 160
± 250
Output impedance
Short-circuit current
300
25°C
25°C
V
ppm/°C
400
Full range
IO = 0 to − 20 mA
IO = 0 to 10 mA
UNIT
2.53
Full range
25°C
Output voltage regulation
(sinking current)‡
TLE2426I
MIN
µV
µV
mΩ
kΩ
26
25°C
−47
120
25°C
30
mA
V
µV
290
25°C
275
400
25°C
25°C
µss
390
20
160
µs
† Full range is − 40°C to 85°C.
‡ The listed values are not production tested.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
7
SLOS098D − AUGUST 1991 − REVISED MAY 1998
electrical characteristics at specified free-air temperature, VI = 12 V, IO = 0 (unless otherwise noted)
PARAMETER
Output voltage
TEST CONDITIONS
VI = 4 V
VI = 12 V
TA†
25°C
25
C
VI = 40 V
VI = 12 V
Full range
Temperature coefficient of output voltage
VI = 12 V
VI = 4 to 40 V
Supply current
No load
Output voltage regulation
(sourcing current)‡
IO = 0 to − 10 mA
Output voltage regulation
(sinking current)‡
IO = 0 to 8 mA
IO = 0 to 20 mA
IO = 0 to − 20 mA
IO = 0 to 10 mA
Sinking current,
VO = 12 V
VO = 0
Sourcing current,
CNR = 0
f = 10 Hz to 10 kHz
CNR = 1 µF
IO = ± 10 mA
Output voltage current step response
VO to 0.01%, IO = ± 10 mA
Step response
VI = 0 to 12 V, VO to 0.1%
VI = 0 to 12 V, VO to 0.01%
CL = 0
CL = 100 pF
CL = 0
CL = 100 pF
CL = 100 pF
† Full range is − 40°C to 85°C.
‡ The listed values are not production tested.
8
POST OFFICE BOX 655303
1.98
2
2.02
5.95
6
6.05
19.8
20
20.2
5.935
• DALLAS, TEXAS 75265
UNIT
V
6.065
35
25°C
195
Full range
ppm/°C
300
400
−45
µA
A
± 160
± 250
25°C
−150
± 450
25°C
15
± 160
± 250
Full range
Noise-reduction impedance
VO to 0.1%,
MAX
Full range
Output impedance
Output noise voltage, rms
TYP
Full range
25°C
Short-circuit current
TLE2426I
MIN
25°C
65
± 235
25°C
7.5
22.5
25°C
110
µV
µV
mΩ
kΩ
31
25°C
−70
120
25°C
30
mA
µV
V
290
25°C
275
400
25°C
25°C
µss
390
20
120
µs
SLOS098D − AUGUST 1991 − REVISED MAY 1998
electrical characteristics at specified free-air temperature, VI = 5 V, IO = 0 (unless otherwise noted)
PARAMETER
Output voltage
TEST CONDITIONS
VI = 4 V
VI = 5 V
TA†
25°C
25
C
VI = 40 V
VI = 5 V
Full range
Temperature coefficient of output voltage
VI = 5 V
VI = 4 to 40 V
Supply current
No load
Output voltage regulation
(sourcing current)‡
IO = 0 to − 10 mA
Output voltage regulation
(sinking current)‡
IO = 0 to 3 mA
IO = 0 to 20 mA
IO = 0 to − 20 mA
IO = 0 to 10 mA
Sinking current,
VO = 5 V
VO = 0
Sourcing current,
CNR = 0
f = 10 Hz to 10 kHz
CNR = 1 µF
IO = ± 10 mA
Output voltage current step response
VO to 0.01%, IO = ± 10 mA
Step response
VI = 0 to 5 V,
VI = 0 to 5 V,
1.98
2
2.02
2.48
2.5
2.52
19.8
20
20.2
2.465
VO to 0.1%
VO to 0.01%
CL = 0
CL = 100 pF
CL = 0
CL = 100 pF
CL = 100 pF
UNIT
V
2.535
25
25°C
170
Full range
ppm/°C
300
400
−45
µA
A
± 160
± 250
25°C
−150
± 450
25°C
15
± 160
± 250
Full range
Noise-reduction impedance
VO to 0.1%,
MAX
Full range
Output impedance
Output noise voltage, rms
TYP
Full range
25°C
Short-circuit current
TLE2426M
MIN
25°C
65
± 235
25°C
7.5
22.5
25°C
110
µV
µV
mΩ
kΩ
26
25°C
−47
120
25°C
30
mA
µV
V
290
25°C
275
400
25°C
25°C
µss
390
20
120
µs
† Full range is − 55°C to 125°C.
‡ The listed values are not production tested.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
9
SLOS098D − AUGUST 1991 − REVISED MAY 1998
electrical characteristics at specified free-air temperature, VI = 12 V, IO = 0 (unless otherwise noted)
PARAMETER
Output voltage
TEST CONDITIONS
VI = 4 V
VI = 12 V
TA†
25°C
25
C
VI = 40 V
VI = 12 V
Full range
Temperature coefficient of output voltage
VI = 12 V
VI = 4 to 40 V
Supply current
No load
Output voltage regulation
(sourcing current)‡
IO = 0 to − 10 mA
Output voltage regulation
(sinking current)‡
IO = 0 to 8 mA
IO = 0 to 20 mA
IO = 0 to − 20 mA
IO = 0 to 10 mA
Sinking current,
VO = 12 V
VO = 0
Sourcing current,
CNR = 0
f = 10 Hz to 10 kHz
CNR = 1 µF
IO = ± 10 mA
Output voltage current step response
VO to 0.01%, IO = ± 10 mA
Step response
VI = 0 to 12 V, VO to 0.1%
VI = 0 to 12 V, VO to 0.01%
CL = 0
CL = 100 pF
CL = 0
CL = 100 pF
CL = 100 pF
† Full range is − 55°C to 125°C.
‡ The listed values are not production tested.
10
POST OFFICE BOX 655303
1.98
2
2.02
5.95
6
6.05
19.8
20
20.2
5.925
• DALLAS, TEXAS 75265
UNIT
V
6.075
35
25°C
195
Full range
ppm/°C
250
350
−45
µA
A
± 160
± 250
25°C
−150
± 450
25°C
15
± 160
± 250
Full range
Noise-reduction impedance
VO to 0.1%,
MAX
Full range
Output impedance
Output noise voltage, rms
TYP
Full range
25°C
Short-circuit current
TLE2426M
MIN
25°C
65
± 235
25°C
7.5
22.5
25°C
110
µV
µV
mΩ
kΩ
31
25°C
−70
120
25°C
30
mA
µV
V
290
25°C
275
400
25°C
25°C
µss
390
12
120
µs
SLOS098D − AUGUST 1991 − REVISED MAY 1998
electrical characteristics at specified free-air temperature, VI = 5 V, IO = 0, TA = 25°C (unless
otherwise noted)
PARAMETER
Output voltage
TEST CONDITIONS
TLE2426Y
MIN
VI = 5 V
No load
Supply current
Output voltage regulation (sourcing current)†
IO = 0 to − 10 mA
IO = 0 to − 20 mA
Output voltage regulation (sinking current)†
IO = 0 to 10 mA
IO = 0 to 20 mA
TYP
MAX
UNIT
2.5
V
170
µA
−45
µV
−150
15
µV
65
Output impedance
7.5
mΩ
Noise-reduction impedance
110
kΩ
Short-circuit current
Output noise voltage, rms
Sinking current,
Sourcing current,
VO = 5 V
VO = 0
−47
CNR = 0
120
f = 10 Hz to 10 kHz
IO = ± 10 mA
VO to 0.1%,
Output voltage current step response
Step response
VO to 0.01%,
IO = ± 10 mA
VI = 0 to 5 V,
VI = 0 to 5 V,
VO to 0.1%
VO to 0.01%
26
CNR = 1 µF
mA
µV
30
CL = 0
290
CL = 100 pF
275
CL = 0
400
CL = 100 pF
390
µs
20
CL = 100 pF
µss
160
† The listed values are not production tested.
electrical characteristics at specified free-air temperature, VI = 12 V, IO = 0, TA = 25°C (unless
otherwise noted)
PARAMETER
Output voltage
Supply current
TLE2426Y
TEST CONDITIONS
MIN
VI = 12 V
No load
Output voltage regulation (sourcing current)†
IO = 0 to − 10 mA
IO = 0 to − 20 mA
Output voltage regulation (sinking current)†
IO = 0 to 3 mA
IO = 0 to 20 mA
TYP
MAX
UNIT
6
V
195
µA
−45
−150
15
65
µV
µV
Output impedance
7.5
mΩ
Noise-reduction impedance
110
kΩ
Short-circuit current
Output noise voltage, rms
Sinking current,
Sourcing current,
f = 10 Hz to 10 kHZ
VO to 0.1%,
IO = ± 10 mA
Output voltage current, step response
Step response
VO to 0.01%,
IO = ± 10 mA
VI = 0 to 12 V,
VI = 0 to 12 V,
VO to 0.1%
VO to 0.01%
VO = 12 V
VO = 0
−70
CNR = 0
120
CNR = 1 µF
31
30
CL = 0
290
CL = 100 pF
275
CL = 0
400
CL = 100 pF
390
12
CL = 100 pF
120
mA
µV
µs
µss
† The listed values are not production tested.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
11
SLOS098D − AUGUST 1991 − REVISED MAY 1998
TYPICAL CHARACTERISTICS
Table Of Graphs
FIGURE
Output voltage
Distribution
Output voltage change
vs Free-air temperature
3
Output voltage error
vs Input voltage
4
vs Input voltage
5
Input bias current
vs Free-air temperature
6
Output voltage regulation
vs Output current
7
Output impedance
vs Frequency
8
Short-circuit output current
12
1,2
vs Input voltage
9,10
vs Free-air temperature
11,12
Ripple rejection
vs Frequency
13
Spectral noise voltage density
vs Frequency
14
Output voltage response to output current step
vs Time
15
Output voltage power-up response
vs Time
16
Output current
vs Load capacitance
17
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SLOS098D − AUGUST 1991 − REVISED MAY 1998
TYPICAL CHARACTERISTICS†
DISTRIBUTION
OF
OUTPUT VOLTAGE
DISTRIBUTION
OF
OUTPUT VOLTAGE
3
Percentage of Units − %
Percentage of Units − %
2.5
40
98 Units Tested
From 2 Wafer Lots
VI = 5 V
TA = 25°C
2
1.5
1
98 Units Tested
From 2 Wafer Lots
VI = 12 V
TA = 25°C
30
20
10
0.5
0
2.48
0
2.49
2.5
2.51
VO − Output Voltage − V
2.52
6.05
6.075
6.025
VO − Output Voltage − V
6
Figure 1
Figure 2
OUTPUT VOLTAGE ERROR
vs
INPUT VOLTAGE
OUTPUT VOLTAGE CHANGE
vs
FREE-AIR TEMPERATURE
4
150
VI = 40 V
IO = 0
TA = 25°C
IO = 0
3
75
Output Voltage Error − %
VO − Output Voltage Change − mV
∆V
O
6.1
VI = 12 V
0
VI = 4 V, 5 V
Error Equals VO / VI Deviation From 50%
2
1
−75
0
−150
−75
−1
−50
−25
0
25
50
75
100
125
0
4
TA − Free-Air Temperature − °C
8
12
16
20
24
28
32
36
40
VI − Input Voltage − V
Figure 3
Figure 4
† Data at high and low temperatures are applicable within the rated operating free-air temperature ranges of the various devices.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
13
SLOS098D − AUGUST 1991 − REVISED MAY 1998
TYPICAL CHARACTERISTICS†
INPUT BIAS CURRENT
vs
INPUT VOLTAGE
INPUT BIAS CURRENT
vs
FREE-AIR TEMPERATURE
300
300
IO = 0
VI = 40 V
250
TA = 25°C
IIB
I IB − Input Bias Current − µ A
IIB
I IB − Input Bias Current − µ A
250
200
TA = − 55°C
150
TA = 125°C
100
VI = 12 V
200
VI = 5 V
150
VI = 4 V
100
50
50
IO = 0
0
0
0
5
10
15
20
25
30
35
40
−75
−50
VI − Input Voltage − V
125
Figure 6
Figure 5
OUTPUT VOLTAGE REGULATION
vs
OUTPUT CURRENT
OUTPUT IMPEDANCE
vs
FREQUENCY
500
100
VI = 5 V or 12 V
IO = 0
TA = 25°C
VI = 5 V or 12 V
TA = 25°C
Max
10
z o − Output Impedance − Ω
Output Voltage Regulation − µV
75
100
0
25
50
−20
TA − Free-Air Temperature − °C
250
Max
Typ
0
Typ
Min
−250
1
0.1
0.01
Min
−500
−20
0.001
0
10
−10
IO − Output Current − mA
20
10
100
1k
10 k
100 k
f − Frequency − Hz
Figure 7
Figure 8
† Data at high and low temperatures are applicable within the rated operating free-air temperature ranges of the various devices.
14
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1M
SLOS098D − AUGUST 1991 − REVISED MAY 1998
TYPICAL CHARACTERISTICS†
SHORT-CIRCUIT OUTPUT CURRENT
vs
INPUT VOLTAGE
SHORT-CIRCUIT OUTPUT CURRENT
vs
INPUT VOLTAGE
40
VO = GND
(Output Sourcing)
IOS
I OS − Short-Circuit Output Current − mA
IOS
I OS − Short-Circuit Output Current − mA
0
−20
−40
TA = − 55°C
−60
TA = 125°C
TA = 25°C
TA = 25°C
TA = − 55°C
30
TA = 125°C
20
10
VO = VI
(Output Sinking)
0
−80
0
5
10
15
20
30
25
35
0
40
5
Figure 9
25
30
35
40
40
VI = 40 V
VO = GND
(Output Sourcing)
VI = 4 V
−20
−30
VI = 5 V
−40
−50
VI = 12 V
−60
−70
VI = 40 V
−50
−25
0
25
50
75
100
125
IOS
I OS − Short-Circuit Output Current − mA
IOS
I OS − Short-Circuit Output Current − mA
20
SHORT-CIRCUIT OUTPUT CURRENT
vs
FREE-AIR TEMPERATURE
0
−80
−75
15
Figure 10
SHORT-CIRCUIT OUTPUT CURRENT
vs
FREE-AIR TEMPERATURE
−10
10
VI − Input Voltage − V
VI − Input Voltage − V
VI = 12 V
30
VI = 5 V
VI = 4 V
20
10
VO = VI
(Output Sinking)
0
−75
−50
TA − Free-Air Temperature − °C
−25
0
25
50
75
100
125
TA − Free-Air Temperature − °C
Figure 12
Figure 11
† Data at high and low temperatures are applicable within the rated operating free-air temperature ranges of the various devices.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
15
SLOS098D − AUGUST 1991 − REVISED MAY 1998
TYPICAL CHARACTERISTICS
RIPPLE REJECTION
vs
FREQUENCY
SPECTRAL NOISE VOLTAGE DENSITY
vs
FREQUENCY
400
VI = 5 V or 12 V
∆VI(PP) = 1 V
IO = 0
TA = 25°C
90
Ripple Rejection − dB
80
Vn − Spectral Noise Voltage Density − nV/ Hz
100
CNR = 1 µF
70
60
50
40
30
20
CNR = 0
10
VI = 5 V or 12 V
TA = 25°C
300
200
100
CNR = 0
CNR = 1 µF
0
0
10
100
1k
10 k
100 k
10
1
1M
100
1k
f − Frequency − Hz
f − Frequency − Hz
Figure 13
Figure 14
OUTPUT VOLTAGE RESPONSE
TO OUTPUT CURRENT STEP
10 k
OUTPUT VOLTAGE POWER-UP RESPONSE
3
1.5 V
0.1%
3
0.1%
VI = 5 V
CL = 100 pF
TA = 25°C
Output Voltage Response
2
1
0.01%
0
0.01%
−1
−2
10 mA
−3
IO Step
0.01%
2.5
VV)
O − Output Voltage − V
∆V
VO
O − Change In Output Voltage − mV
4
0.1%
2
1.5
IO = 0
CL = 100 pF
TA = 25°C
1
0.5
0
5
Input Voltage Step
−4
−10 mA
−1.5 V
0
1000
2000
3000
0
0
4000
Time − µs
50
100
Time − µs
Figure 16
Figure 15
16
100 k
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
150
200
SLOS098D − AUGUST 1991 − REVISED MAY 1998
TYPICAL CHARACTERISTICS
STABILITY RANGE
OUTPUT CURRENT
vs
LOAD CAPACITANCE
20
15
VI = 5 V
TA = 25°C
Unstable
I O − Output Current − mA
10
5
0
Stable
−5
−10
−15
−20
10 −6 10 −5 10 −4 10 −3 10 −2 10 −1 10 0
CL− Load Capacitance − mF
10 1
10 2
Figure 17
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
17
SLOS098D − AUGUST 1991 − REVISED MAY 1998
MACROMODEL INFORMATION
*
*
*
*
TLE2426 OPERATIONAL AMPLIFIER “MACROMODEL” SUBCIRCUIT
CREATED USING PARTS RELEASE 4.03 0N 08/21/90 AT 13:51
REV (N/A)
SUPPLY VOLTAGE: 5 V
CONNECTIONS:
FILTER
| INPUT
*
| | COMMON
*
| | | OUTPUT
*
| | | |
.SUBCKT TLE2426
1 3 4 5
C1
C2
C3
CPSR
DCM +
DCM −
DC
DE
DLP
DLN
DP
ECMR
EGND
EPSR
ENSE
FB
GA
GCM
GPSR
GRC1
GRC2
GRE1
GRE2
HLIM
HCMR
IRP
IEE
IIO
I1
Q1
Q2
R2
RCM
REE
RN1
RN2
RO1
RO2
VCM +
VCM −
VB
VC
VE
VLIM
VLP
VLN
VPSR
RFB
RIN1
RIN2
.MODEL DX
.MODEL QX
.ENDS
18
11 12 21.66E−12
6 7 30.00E−12
87 0 10.64E−9
85 86 15.9E−9
81 82 DX
83 81 DX
5 53 DX
54 5 DX
90 91 DX
92 90 DX
4 3 DX
84 99 (2,99) 1
99 0 POLY(2)
(3,0) (4,0) 0 .5 .5
85 0 POLY(1)
(3,4) −16.22E − 6 3.24E − 6
89 2 POLY(1)
(88,0) 120E − 6 1
7 99 POLY(6)
VB VC VE VLP VLN VPSR 0 74.8E6 − 10E6 10E6
6 0 11 12 320.4E − 6
0 6 10 99 1.013E − 9
85 86 (85,86)
100E − 6
4 11 (4,11) 3.204E − 4
4 12 (4,12) 3.204E − 4
13 10 (13,10)
1.038E − 3
14 10 (14,10)
1.038E − 3
90 0 VLIM
1K
80 1 POLY(2)
VCM+
VCM − 0 1E2
1E2
3 4 146E − 6
3 10 DC 24.05E − 6
2 0 .2E − 9
88 0 1E − 21
11 89 13 QX
12 80 14 QX
6 9 100.0E3
84 81 1K
10 99 8.316E6
87 0 2.55E8
87 88 11.67E3
8 5 63
7 99 62
82 99 1.0
83 99 − 2.3
9 0 DC 0
3 53 DC 1.400
54 4 DC 1.400
7 8 DC 0
91 0 DC 30
0 92 DC 30
0 86 DC 0
5 2 1K
3 1 220K
1 4 220K
D(IS=800.OE−18)
PNP(IS=800.OE− 18 BF=480)
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
10E6
− 10E6 74E6
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
5962-9555602Q2A
OBSOLETE
LCCC
FK
20
TBD
Call TI
Call TI
-55 to 125
5962-9555602QPA
OBSOLETE
CDIP
JG
8
TBD
Call TI
Call TI
-55 to 125
TLE2426CD
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
2426C
TLE2426CDG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
2426C
TLE2426CDR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
2426C
TLE2426CDRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
2426C
TLE2426CLP
ACTIVE
TO-92
LP
3
1000
Pb-Free
(RoHS)
CU SN
N / A for Pkg Type
2426C
TLE2426CLPE3
ACTIVE
TO-92
LP
3
1000
Pb-Free
(RoHS)
CU SN
N / A for Pkg Type
2426C
TLE2426CLPR
ACTIVE
TO-92
LP
3
2000
Pb-Free
(RoHS)
CU SN
N / A for Pkg Type
2426C
TLE2426CLPRE3
ACTIVE
TO-92
LP
3
2000
Pb-Free
(RoHS)
CU SN
N / A for Pkg Type
2426C
TLE2426CP
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
TLE2426CP
TLE2426CPE4
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
TLE2426CP
TLE2426ID
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
2426I
TLE2426IDG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
2426I
TLE2426IDR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
2426I
TLE2426IDRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
2426I
TLE2426ILP
ACTIVE
TO-92
LP
3
1000
Pb-Free
(RoHS)
CU SN
N / A for Pkg Type
2426I
TLE2426ILPE3
ACTIVE
TO-92
LP
3
1000
Pb-Free
(RoHS)
CU SN
N / A for Pkg Type
2426I
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
TLE2426ILPR
ACTIVE
TO-92
LP
3
2000
Pb-Free
(RoHS)
CU SN
N / A for Pkg Type
2426I
TLE2426ILPRE3
ACTIVE
TO-92
LP
3
2000
Pb-Free
(RoHS)
CU SN
N / A for Pkg Type
2426I
TLE2426IP
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
TLE2426IP
TLE2426IPE4
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
TLE2426IP
TLE2426MD
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
2426M
TLE2426MDG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
2426M
TLE2426MFKB
OBSOLETE
LCCC
FK
20
TBD
Call TI
Call TI
-55 to 125
TLE2426MJGB
OBSOLETE
CDIP
JG
8
TBD
Call TI
Call TI
-55 to 125
TLE2426MLP
OBSOLETE
TO-92
LP
3
TBD
Call TI
Call TI
-55 to 125
TLE2426MP
OBSOLETE
PDIP
P
8
TBD
Call TI
Call TI
-55 to 125
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TLE2426 :
• Automotive: TLE2426-Q1
• Enhanced Product: TLE2426-EP
NOTE: Qualified Version Definitions:
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
• Enhanced Product - Supports Defense, Aerospace and Medical Applications
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
TLE2426CDR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
TLE2426IDR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TLE2426CDR
SOIC
D
8
2500
367.0
367.0
35.0
TLE2426IDR
SOIC
D
8
2500
367.0
367.0
35.0
Pack Materials-Page 2
MECHANICAL DATA
MCER001A – JANUARY 1995 – REVISED JANUARY 1997
JG (R-GDIP-T8)
CERAMIC DUAL-IN-LINE
0.400 (10,16)
0.355 (9,00)
8
5
0.280 (7,11)
0.245 (6,22)
1
0.063 (1,60)
0.015 (0,38)
4
0.065 (1,65)
0.045 (1,14)
0.310 (7,87)
0.290 (7,37)
0.020 (0,51) MIN
0.200 (5,08) MAX
Seating Plane
0.130 (3,30) MIN
0.023 (0,58)
0.015 (0,38)
0°–15°
0.100 (2,54)
0.014 (0,36)
0.008 (0,20)
4040107/C 08/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a ceramic lid using glass frit.
Index point is provided on cap for terminal identification.
Falls within MIL STD 1835 GDIP1-T8
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated