SGLS252A − AUGUST 2004 − REVISED JUNE 2008
D Qualified for Automotive Applications
D 1/2 VI Virtual Ground for Analog Systems
D Micropower Operation . . . 170 µA Typ,
D
D
D
D
D
D PACKAGE
(TOP VIEW)
OUT
COMMON
IN
NC
VI = 5 V
Wide VI Range . . . 4 V to 40 V
High Output-Current Capability
− Source . . . 20 mA Typ
− Sink . . . 20 mA Typ
Excellent Output Regulation
− −102 µV Typ at IO = 0 to −10 mA
− +49 µV Typ at IO = 0 to + 10 mA
Low-Impedance Output . . . 0.0075 Ω Typ
Noise Reduction Pin
1
8
2
7
3
6
4
5
NOISE REDUCTION
NC
NC
NC
NC − No internal connection
INPUT/OUTPUT TRANSFER CHARACTERISTICS
10
VI
VI
VO
V
V + I
O
2
8
In signal-conditioning applications utilizing a
single power source, a reference voltage equal to
one-half the supply voltage is required for
termination of all analog signal grounds. Texas
Instruments presents a precision virtual ground
whose output voltage is always equal to one-half
the input voltage, the TLE2426 rail splitter.
Voltage − V
description
6
4
VO
2
The unique combination of a high-performance,
micropower operational amplifier and a precision0
trimmed divider on a single silicon chip results in
0
0.25
0.5
0.75
1
a precise VO/VI ratio of 0.5 while sinking and
t − Time − s
sourcing current. The TLE2426 provides a
low-impedance output with 20 mA of sink and
source capability while drawing less than 280 µA of supply current over the full input range of 4 V to 40 V. A
designer need not pay the price in terms of board space for a conventional signal ground consisting of resistors,
capacitors, operational amplifiers, and voltage references. For increased performance, the 8-pin package
provides a noise-reduction pin. With the addition of an external capacitor (CNR), peak-to-peak noise is reduced
while line ripple rejection is improved.
Initial output tolerance for a single 5-V or 12-V system is better than 1% over the full 40-V input range. Ripple
rejection exceeds 12 bits of accuracy. Whether the application is for a data acquisition front end, analog signal
termination, or simply a precision voltage reference, the TLE2426 eliminates a major source of system error.
ORDERING INFORMATION{
TA
PACKAGE}
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
−40°C to 125°C
SOIC (D)
Tape and Reel TLE2426QDRQ1
2426Q1
† For the most current package and ordering information, see the Package Option Addendum at the
end of this document, or see the TI web site at http://www.ti.com.
‡ Package drawings, thermal data, and symbolization are available at http://www.ti.com/packaging.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2008 Texas Instruments Incorporated
!" # $%&" !# '%()$!" *!"&+
*%$"# $ " #'&$$!"# '& ",& "&# &-!# #"%&"#
#"!*!* .!!"/+ *%$" '$&##0 *&# " &$&##!)/ $)%*&
"&#"0 !)) '!!&"&#+
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SGLS252A − AUGUST 2004 − REVISED JUNE 2008
absolute maximum ratings over operating free-air temperature (unless otherwise noted)†
Continuous input voltage, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 V
Continuous filter trap voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 V
Output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 80 mA
Duration of short-circuit current at (or below) 25°C (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . unlimited
Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table
Operating free-air temperature range, TA: Q suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 125°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds: D package . . . . . . . . . . . . . . . . . . . . . 260°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The output may be shorted to either supply. Temperature and/or supply voltages must be limited to ensure that the maximum dissipation
rating is not exceeded.
DISSIPATION RATING TABLE
PACKAGE
TA ≤ 25
25°C
C
POWER RATING
D
1102 mV
DERATING FACTOR
ABOVE TA = 25°C
10.3 mW/°C
TA = 70
70°C
C
POWER RATING
TA = 85
85°C
C
POWER RATING
TA = 125
125°C
C
POWER RATING
638.5 mW
484 mW
72.1 mW
recommended operating conditions
Input voltage, VI
Operating free-air temperature, TA
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MIN
MAX
4
40
UNIT
V
−40
125
°C
SGLS252A − AUGUST 2004 − REVISED JUNE 2008
electrical characteristics at specified free-air temperature, VI = 5 V, IO = 0 (unless otherwise noted)
PARAMETER
Output voltage
TEST CONDITIONS
VI = 4 V
VI = 5 V
TA†
25°C
25
C
VI = 40 V
VI = 5 V
Full range
Temperature coefficient of output
voltage
VI = 5 V
VI = 4 to 40 V
Supply current
No load
Output voltage regulation
(sourcing current)‡
IO = 0 to − 10 mA
Output voltage regulation
(sinking current)‡
IO = 0 to 8 mA
IO = 0 to 20 mA
IO = 0 to − 20 mA
IO = 0 to 10 mA
Sinking current,
VO = 5 V
VO = 0
Sourcing current,
CNR = 0
f = 10 Hz to 10 kHz
CNR = 1 µF
IO = ± 10 mA
Output voltage current step response
VO to 0.01%, IO = ± 10 mA
Step response
VI = 0 to 5 V,
VI = 0 to 5 V,
1.98
2
2.02
2.48
2.5
2.52
19.8
20
20.2
2.465
VO to 0.1%
VO to 0.01%
CL = 0
CL = 100 pF
CL = 0
CL = 100 pF
CL = 100 pF
UNIT
V
2.535
25
25°C
170
Full range
ppm/°C
300
400
−0.102
µA
A
± 0.7
± 10
25°C
−0.121
± 1.4
25°C
0.049
± 0.5
± 10
Full range
Noise-reduction impedance
VO to 0.1%,
MAX
Full range
Output impedance‡
Output noise voltage, rms
TYP
Full range
25°C
Short-circuit current
MIN
25°C
0.175
± 1.4
25°C
7.5
22.5
25°C
110
mV
mV
mΩ
kΩ
26
25°C
−47
120
25°C
30
mA
µV
V
290
25°C
275
400
25°C
25°C
µss
390
20
120
µs
† Full range is −40°C to 125°C.
‡ The listed values are not production tested.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SGLS252A − AUGUST 2004 − REVISED JUNE 2008
electrical characteristics at specified free-air temperature, VI = 12 V, IO = 0 (unless otherwise noted)
PARAMETER
Output voltage
TEST CONDITIONS
VI = 4 V
VI = 12 V
TA†
25°C
25
C
VI = 40 V
VI = 12 V
Full range
Temperature coefficient of output voltage
VI = 12 V
VI = 4 to 40 V
Supply current
No load
Output voltage regulation
(sourcing current)‡
IO = 0 to − 10 mA
IO = 0 to − 20 mA
IO = 0 to 10 mA
IO = 0 to 8 mA
IO = 0 to 20 mA
Sinking current,
VO = 12 V
VO = 0
Sourcing current,
CNR = 0
f = 10 Hz to 10 kHz
VO to 0.1%,
CNR = 1 µF
IO = ± 10 mA
Output voltage current step response
VO to 0.01%, IO = ± 10 mA
Step response
VI = 0 to 12 V, VO to 0.1%
VI = 0 to 12 V, VO to 0.01%
CL = 0
CL = 100 pF
CL = 0
CL = 100 pF
CL = 100 pF
† Full range is −40°C to 125°C.
‡ The listed values are not production tested.
4
POST OFFICE BOX 655303
1.98
2
2.02
5.95
6
6.05
19.8
20
20.2
5.925
• DALLAS, TEXAS 75265
UNIT
V
6.075
35
25°C
195
Full range
ppm/°C
300
400
−1.48
A
µA
±10
±10
25°C
−3.9
±10
25°C
2.27
±10
±10
Full range
Noise-reduction impedance
Output noise voltage, rms
MAX
Full range
Output impedance‡
Short-circuit current
TYP
Full range
25°C
Output voltage regulation
(sinking current)‡
MIN
25°C
4.3
±10
25°C
7.5
22.5
25°C
110
mV
mV
mΩ
kΩ
31
25°C
−70
120
25°C
30
mA
µV
V
290
25°C
275
400
25°C
25°C
µss
390
12
120
µs
SGLS252A − AUGUST 2004 − REVISED JUNE 2008
TYPICAL CHARACTERISTICS
Table Of Graphs
FIGURE
Output voltage
Distribution
Output voltage change
vs Free-air temperature
3
Output voltage error
vs Input voltage
4
vs Input voltage
5
Input bias current
1, 2
vs Free-air temperature
6
Output voltage regulation
vs Output current
7
Output impedance
vs Frequency
8
Short-circuit output current
vs Input voltage
9, 10
vs Free-air temperature
11, 12
Ripple rejection
vs Frequency
13
Spectral noise voltage density
vs Frequency
14
Output voltage response to output current step
vs Time
15
Output voltage power-up response
vs Time
16
Output current
vs Load capacitance
17
POST OFFICE BOX 655303
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5
SGLS252A − AUGUST 2004 − REVISED JUNE 2008
TYPICAL CHARACTERISTICS†
DISTRIBUTION
OF
OUTPUT VOLTAGE
DISTRIBUTION
OF
OUTPUT VOLTAGE
3
Percentage of Units − %
Percentage of Units − %
2.5
40
98 Units Tested
From 2 Wafer Lots
VI = 5 V
TA = 25°C
2
1.5
1
98 Units Tested
From 2 Wafer Lots
VI = 12 V
TA = 25°C
30
20
10
0.5
0
2.48
0
2.49
2.5
2.51
VO − Output Voltage − V
2.52
6.05
6.075
6.025
VO − Output Voltage − V
6
Figure 1
Figure 2
OUTPUT VOLTAGE ERROR
vs
INPUT VOLTAGE
OUTPUT VOLTAGE CHANGE
vs
FREE-AIR TEMPERATURE
4
150
IO = 0
TA = 25°C
IO = 0
3
75
Output Voltage Error − %
VO − Output Voltage Change − mV
∆V
O
VI = 40 V
VI = 12 V
0
VI = 4 V, 5 V
Error Equals VO / VI Deviation From 50%
2
1
−75
0
−150
−75
−1
−50
−25
0
25
50
75
100
125
0
4
TA − Free-Air Temperature − °C
8
12
16
20
24
28
32
VI − Input Voltage − V
Figure 3
Figure 4
† Data at high and low temperatures are applicable within the rated operating free-air temperature ranges of the various devices.
6
6.1
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
36
40
SGLS252A − AUGUST 2004 − REVISED JUNE 2008
TYPICAL CHARACTERISTICS†
INPUT BIAS CURRENT
vs
INPUT VOLTAGE
INPUT BIAS CURRENT
vs
FREE-AIR TEMPERATURE
300
300
IO = 0
VI = 40 V
250
TA = 25°C
IIB
I IB − Input Bias Current − µ A
IIB
I IB − Input Bias Current − µ A
250
200
TA = − 55°C
150
TA = 125°C
100
VI = 12 V
200
VI = 5 V
150
VI = 4 V
100
50
50
IO = 0
0
0
0
5
10
15
20
25
30
35
40
−75
−50
VI − Input Voltage − V
OUTPUT VOLTAGE REGULATION
vs
OUTPUT CURRENT
OUTPUT IMPEDANCE
vs
FREQUENCY
200
VI = 5 V or 12 V
IO = 0
TA = 25°C
VI = 5 V
TA = 25°C
10
z o − Output Impedance − Ω
Output Voltage Regulation − µV
100
100
50
0
125
Figure 6
Figure 5
150
75
100
0
25
50
−20
TA − Free-Air Temperature − °C
TYP
−50
−100
1
0.1
0.01
−150
−200
−20
0.001
0
10
−10
IO − Output Current − mA
20
10
100
1k
10 k
100 k
1M
f − Frequency − Hz
Figure 7
Figure 8
† Data at high and low temperatures are applicable within the rated operating free-air temperature ranges of the various devices.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
7
SGLS252A − AUGUST 2004 − REVISED JUNE 2008
TYPICAL CHARACTERISTICS†
SHORT-CIRCUIT OUTPUT CURRENT
vs
INPUT VOLTAGE
SHORT-CIRCUIT OUTPUT CURRENT
vs
INPUT VOLTAGE
40
VO = GND
(Output Sourcing)
IOS
I OS − Short-Circuit Output Current − mA
IOS
I OS − Short-Circuit Output Current − mA
0
−20
−40
TA = − 55°C
−60
TA = 125°C
TA = 25°C
TA = 25°C
TA = − 55°C
30
TA = 125°C
20
10
VO = VI
(Output Sinking)
0
−80
0
5
10
15
20
25
30
35
0
40
5
Figure 9
25
30
40
VI = 40 V
VO = GND
(Output Sourcing)
VI = 4 V
−20
−30
VI = 5 V
−40
−50
VI = 12 V
−60
−70
VI = 40 V
−50
−25
0
25
50
75
100
125
VI = 12 V
30
VI = 5 V
VI = 4 V
20
10
VO = VI
(Output Sinking)
0
−75
−50
TA − Free-Air Temperature − °C
−25
0
25
50
75
TA − Free-Air Temperature − °C
Figure 12
Figure 11
† Data at high and low temperatures are applicable within the rated operating free-air temperature ranges of the various devices.
8
35
40
IOS
I OS − Short-Circuit Output Current − mA
IOS
I OS − Short-Circuit Output Current − mA
20
SHORT-CIRCUIT OUTPUT CURRENT
vs
FREE-AIR TEMPERATURE
0
−80
−75
15
Figure 10
SHORT-CIRCUIT OUTPUT CURRENT
vs
FREE-AIR TEMPERATURE
−10
10
VI − Input Voltage − V
VI − Input Voltage − V
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
100
125
SGLS252A − AUGUST 2004 − REVISED JUNE 2008
TYPICAL CHARACTERISTICS
RIPPLE REJECTION
vs
FREQUENCY
SPECTRAL NOISE VOLTAGE DENSITY
vs
FREQUENCY
400
VI = 5 V or 12 V
∆VI(PP) = 1 V
IO = 0
TA = 25°C
90
Ripple Rejection − dB
80
Vn − Spectral Noise Voltage Density − nV/ Hz
100
CNR = 1 µF
70
60
50
40
30
20
CNR = 0
10
VI = 5 V or 12 V
TA = 25°C
300
200
100
CNR = 0
CNR = 1 µF
0
0
10
100
1k
10 k
100 k
10
1
1M
100
1k
f − Frequency − Hz
f − Frequency − Hz
Figure 13
Figure 14
OUTPUT VOLTAGE RESPONSE
TO OUTPUT CURRENT STEP
10 k
OUTPUT VOLTAGE POWER-UP RESPONSE
3
1.5 V
0.1%
3
0.1%
VI = 5 V
CL = 100 pF
TA = 25°C
Output Voltage Response
2
1
0.01%
0
0.01%
−1
−2
10 mA
−3
IO Step
0.01%
2.5
VV)
O − Output Voltage − V
4
∆V
VO
O − Change In Output Voltage − mV
100 k
0.1%
2
1.5
IO = 0
CL = 100 pF
TA = 25°C
1
0.5
0
5
Input Voltage Step
−4
−10 mA
−1.5 V
0
1000
2000
3000
0
0
4000
Time − µs
50
100
150
200
Time − µs
Figure 16
Figure 15
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
9
SGLS252A − AUGUST 2004 − REVISED JUNE 2008
TYPICAL CHARACTERISTICS
STABILITY RANGE
OUTPUT CURRENT
vs
LOAD CAPACITANCE
20
15
VI = 5 V
TA = 25°C
Unstable
I O − Output Current − mA
10
5
0
Stable
−5
−10
−15
−20
10 −6 10 −5 10 −4 10 −3 10 −2 10 −1 10 0
CL− Load Capacitance − mF
Figure 17
10
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
10 1
10 2
SGLS252A − AUGUST 2004 − REVISED JUNE 2008
MACROMODEL INFORMATION
*
*
*
*
TLE2426 OPERATIONAL AMPLIFIER “MACROMODEL” SUBCIRCUIT
CREATED USING PARTS RELEASE 4.03 0N 08/21/90 AT 13:51
REV (N/A)
SUPPLY VOLTAGE: 5 V
CONNECTIONS:
FILTER
| INPUT
*
| | COMMON
*
| | | OUTPUT
*
| | | |
.SUBCKT TLE2426
1 3 4 5
C1
C2
C3
CPSR
DCM +
DCM −
DC
DE
DLP
DLN
DP
ECMR
EGND
EPSR
ENSE
FB
GA
GCM
GPSR
GRC1
GRC2
GRE1
GRE2
HLIM
HCMR
IRP
IEE
IIO
I1
Q1
Q2
R2
RCM
REE
RN1
RN2
RO1
RO2
VCM +
VCM −
VB
VC
VE
VLIM
VLP
VLN
VPSR
RFB
RIN1
RIN2
.MODEL DX
.MODEL QX
.ENDS
11 12 21.66E−12
6 7 30.00E−12
87 0 10.64E−9
85 86 15.9E−9
81 82 DX
83 81 DX
5 53 DX
54 5 DX
90 91 DX
92 90 DX
4 3 DX
84 99 (2,99) 1
99 0 POLY(2)
(3,0) (4,0) 0 .5 .5
85 0 POLY(1)
(3,4) −16.22E − 6 3.24E − 6
89 2 POLY(1)
(88,0) 120E − 6 1
7 99 POLY(6)
VB VC VE VLP VLN VPSR 0 74.8E6 − 10E6 10E6
6 0 11 12 320.4E − 6
0 6 10 99 1.013E − 9
85 86 (85,86)
100E − 6
4 11 (4,11) 3.204E − 4
4 12 (4,12) 3.204E − 4
13 10 (13,10)
1.038E − 3
14 10 (14,10)
1.038E − 3
90 0 VLIM
1K
80 1 POLY(2)
VCM+
VCM − 0 1E2
1E2
3 4 146E − 6
3 10 DC 24.05E − 6
2 0 .2E − 9
88 0 1E − 21
11 89 13 QX
12 80 14 QX
6 9 100.0E3
84 81 1K
10 99 8.316E6
87 0 2.55E8
87 88 11.67E3
8 5 63
7 99 62
82 99 1.0
83 99 − 2.3
9 0 DC 0
3 53 DC 1.400
54 4 DC 1.400
7 8 DC 0
91 0 DC 30
0 92 DC 30
0 86 DC 0
5 2 1K
3 1 220K
1 4 220K
D(IS=800.OE−18)
PNP(IS=800.OE− 18 BF=480)
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
10E6
− 10E6 74E6
11
PACKAGE OPTION ADDENDUM
www.ti.com
17-Aug-2012
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
2500
TLE2426QDRG4Q1
ACTIVE
SOIC
D
8
TLE2426QDRQ1
ACTIVE
SOIC
D
8
Eco Plan
(2)
Green (RoHS
& no Sb/Br)
TBD
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
CU NIPDAU Level-1-260C-UNLIM
Call TI
Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TLE2426-Q1 :
• Catalog: TLE2426
• Enhanced Product: TLE2426-EP
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
17-Aug-2012
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Enhanced Product - Supports Defense, Aerospace and Medical Applications
Addendum-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time
of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
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