SMG2314N 4A , 20V, RDS(ON) 32 m N-Channel Enhancement Mode MOSFET Elektronische Bauelemente RoHS Compliant Product A suffix of “-C” specifies halogen and lead-free SC-59 DESCRIPTION These miniature surface mount MOSFETs utilize High Cell Density process. Low RDS(on) assures minimal power loss and conserves energy, making this device ideal for use in power management circuitry. Typical applications are power switch, power management in portable and battery-powered products such as computers, printers, PCMCIA cards, cellular and cordless telephones. A L 3 3 C B Top View 1 1 2 K E 2 D FEATURES F Low RDS(on) provides higher efficiency and extends battery life. Low gate charge Fast switch Miniature SC-59 surface mount package saves board space. H G REF. A B C D E F Millimeter Min. Max. 2.70 3.10 2.25 3.00 1.30 1.70 1.00 1.40 1.70 2.30 0.35 0.50 REF. G H J K L J Millimeter Min. Max. 0.10 REF. 0.40 REF. 0.10 0.20 0.45 0.55 0.85 1.15 PACKAGE INFORMATION Package MPQ LeaderSize SC-59 3K 7’ inch ABSOLUTE MAXIMUM RATINGS(TA=25°C UNLESS OTHERWISE NOTED) Parameter Drain-Source Voltage Gate-Source Voltage Symbol Ratings Unit VDS VGS 20 ±12 4.0 3.1 ±20 1.6 1.3 0.8 -55 ~ 150 V V A A A A W W °C 100 166 °C / W ID @ TA=25°C ID @ TA=70°C Continuous Drain Current 1 Pulsed Drain Current 2 Continuous Source Current (Diode Conduction) 1 IDM IS PD @ TA=25°C PD @ TA=70°C Power Dissipation 1 ID Operating Junction and Storage Temperature Range PD Tj, Tstg Thermal Resistance Ratings Maximum Junction to Ambient 1 Notes: 1 2 t ≦ 5 sec Steady State RJA Surface Mounted on 1” x 1” FR4 Board. Pulse width limited by maximum junction temperature. http://www.SeCoSGmbH.com/ 27-Jan-2011 Rev. A Any changes of specification will not be informed individually. Page 1 of 4 SMG2314N 4A , 20V, RDS(ON) 32 m N-Channel Enhancement Mode MOSFET Elektronische Bauelemente ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise specified) Parameter Symbol Min. Typ. Max. Unit VGS(th) 0.7 - - V VDS=VGS, ID= 250uA Gate-Body Leakage IGSS - - ±100 nA VDS= 0V, VGS= ±8V Zero Gate Voltage Drain Current IDSS - - 1 - - 10 10 - - - - 32 - - 44 gfs - 11.3 - S VDS= 10V, ID= 4.0A VSD - 0.75 - V IS= 1.6A, VGS= 0V Gate-Threshold Voltage On-State Drain Current 1 ID(on) Drain-Source On-Resistance 1 Forward Transconductance Diode Forward Voltage 1 RDS(ON) Dynamic Qg - 13.4 - Gate-Source Charge Qgs - 0.9 - Gate-Drain Charge Qgd - 2.0 - Turn-on Delay Time Td(on) - 8 - Tr - 24 - Td(off) - 35 - Tf - 10 - Trr - 40 - Turn-off Delay Time Fall Time Source-Ddrain Reverse Recovery Time Notes: 1 2 A VDS= 16V, VGS= 0V VDS= 16V, VGS= 0V, TJ= 55°C VDS = 5V, VGS= 4.5V mΩ VGS= 4.5V, ID= 4.6A VGS= 2.5V, ID= 3.9A 2 Total Gate Charge Rise Time uA Test Conditions nC nS VDS= 10V, VGS= 4.5V, ID= 4.0A VDD= 10V, VGEN= 4.5V, RL= 15, ID= 1A IF=1.6A, di/dt =100 A/uS Pulse test:PW ≦ 300 us duty cycle ≦ 2%. Guaranteed by design, not subject to production testing. http://www.SeCoSGmbH.com/ 27-Jan-2011 Rev. A Any changes of specification will not be informed individually. Page 2 of 4 SMG2314N Elektronische Bauelemente 4A , 20V, RDS(ON) 32 m N-Channel Enhancement Mode MOSFET CHARACTERISTIC CURVE http://www.SeCoSGmbH.com/ 27-Jan-2011 Rev. A Any changes of specification will not be informed individually. Page 3 of 4 SMG2314N Elektronische Bauelemente 4A , 20V, RDS(ON) 32 m N-Channel Enhancement Mode MOSFET CHARACTERISTIC CURVE http://www.SeCoSGmbH.com/ 27-Jan-2011 Rev. A Any changes of specification will not be informed individually. Page 4 of 4