STT3405P -4.9 A, -20 V, RDS(ON) 56 m P-Channel Enhancement Mode MOSFET Elektronische Bauelemente RoHS Compliant Product A suffix of “-C” specifies halogen and lead-free DESCRIPTION TSOP-6 These miniature surface mount MOSFETs utilize a high cell density process. Low RDS(on) assures minimal power loss and conserves energy, making this device ideal for use in power management circuitry. Typical applications are PWMDC-DC converters, power management in portable and battery-powered products such as computers, printers, battery charger, telecommunication power system, and telephones power system. A E 6 L 4 B F 1 2 3 C Low RDS(on) provides higher efficiency and extends battery life. Miniature TSOP-6 surface mount package saves board space. High power and current handling capability. REF. A B C D E F PACKAGE INFORMATION Package MPQ LeaderSize TSOP-6 3K 7’ inch H J K DG FEATURES 5 Millimeter Min. Max. 2.70 3.10 2.60 3.00 1.40 1.80 1.10 MAX. 1.90 REF. 0.30 0.50 REF. G H J K L Millimeter Min. Max. 0 0.10 0.60 REF. 0.12 REF. 0° 10° 0.95 REF. D D D D G S ABSOLUTE MAXIMUM RATINGS (TA=25°C unless otherwise specified) Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current TA= 25°C TA= 70°C 1 2 Power Dissipation Ratings Unit VDS VGS -20 ±12 -4.9 -4.0 -20 -1.7 2 1.3 -55 ~ 150 V ID IDM IS Pulsed Drain Current Continuous Source Current (Diode Conduction) 1 TA= 25°C TA= 70°C 1 Symbol PD Tj, Tstg Thermal Resistance Ratings Operating Junction and Storage Temperature Range Maximum Junction to Ambient 1 t ≦ 5 sec RJA 62.5 110 V A A A W °C °C / W Notes: 1. Surface Mounted on 1” x 1” FR4 Board. 2. Pulse width limited by maximum junction temperature. http://www.SeCoSGmbH.com/ 06-Jan-2011 Rev. A Any changes of specification will not be informed individually. Page 1 of 4 STT3405P -4.9 A, -20 V, RDS(ON) 56 m P-Channel Enhancement Mode MOSFET Elektronische Bauelemente ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise specified) Parameter Symbol Min. Typ. Max. Unit Test Conditions Static Gate-Threshold Voltage VGS(th) -0.7 - - V VDS= VGS, ID= -250μA Gate-Body Leakage IGSS - - ±100 nA VDS= 0V, VGS= ±12V - - -1 Zero Gate Voltage Drain Current IDSS On-State Drain Current 1 Drain-Source On-Resistance 1 ID(on) RDS(ON) μA - - -5 -15 - - - - 56 - - 80 - - 150 VDS= -16V, VGS= 0V VDS= -16V, VGS= 0V, TJ= 55°C A VDS = -4.5V, VGS= -4.5V VGS= -4.5V, ID= -4.9A mΩ VGS= -2.5V, ID= -4.2A VGS= -1.8V, ID= -3.1A Forward Transconductance 1 gfs - 11 - S VDS= -10V, ID= -4.9A Diode Forward Voltage VSD - -0.8 - V IS= 1.7A, VGS= 0V Dynamic 2 Total Gate Charge Qg - 8 - Gate-Source Charge Qgs - 1.8 - Gate-Drain Charge Qgd - 1.9 - Turn-on Delay Time Td(on) - 22 - Tr - 35 - Td(off) - 45 - Tf - 25 - Rise Time Turn-off Delay Time Fall Time nC VDS= -10V, VGS= -4.5V, ID= -4.9A nS VDD= -10V, VGEN= -4.5V, RL= 6, ID= -1A Notes: 1. Pulse test:PW ≦ 300 us duty cycle ≦ 2%. 2. Guaranteed by design, not subject to production testing. http://www.SeCoSGmbH.com/ 06-Jan-2011 Rev. A Any changes of specification will not be informed individually. Page 2 of 4 STT3405P Elektronische Bauelemente -4.9 A, -20 V, RDS(ON) 56 m P-Channel Enhancement Mode MOSFET CHARACTERISTICS CURVE http://www.SeCoSGmbH.com/ 06-Jan-2011 Rev. A Any changes of specification will not be informed individually. Page 3 of 4 STT3405P Elektronische Bauelemente -4.9 A, -20 V, RDS(ON) 56 m P-Channel Enhancement Mode MOSFET CHARACTERISTICS CURVE http://www.SeCoSGmbH.com/ 06-Jan-2011 Rev. A Any changes of specification will not be informed individually. Page 4 of 4