STT3490N N-Channel Enhancement Mode Mos.FET 1.2 A, 150 V, RDS(ON) 700 m Elektronische Bauelemente RoHS Compliant Product A suffix of “-C” specifies halogen and lead-free KEY FEATURES TSOP-6 Low RDS(on) trench technology. Low thermal impedance. Fast switching speed. A E 5 6 L 4 TYPICAL APPLICATIONS B White LED boost converters. Automotive Systems Industrial DC/DC Conversion Circuits F 1 2 3 C H J K DG PRODUCT SUMMARY PRODUCT SUMMARY VDS(V) RDS(on) (m 700@VGS= 10V 1200@VGS= 4.5V 150 ID(A) 1.2 1 REF. D D D D G S A B C D E F Millimeter Min. Max. 2.70 3.10 2.60 3.00 1.40 1.80 1.10 MAX. 1.90 REF. 0.30 0.50 REF. G H J K L Millimeter Min. Max. 0 0.10 0.60 REF. 0.12 REF. 0° 10° 0.95 REF. ABSOLUTE MAXIMUM RATINGS(TA=25°C UNLESS OTHERWISE NOTED) Parameter Symbol VDS VGS Drain-Source Voltage Gate-Source Voltage TA= 25°C TA= 70°C Continuous Drain Current a b Power Dissipation TA= 25°C TA= 70°C a Operating Junction and Storage Temperature Range Unit 150 ±20 1.2 1 ±10 2.5 2 1.3 -55 ~ 150 °C Symbol Maximum Unit RJA 62.5 110 °C / W ID IDM IS Pulsed Drain Current Continuous Source Current (Diode Conduction) a Ratings Maximum PD Tj, Tstg V V A A A W THERMAL RESISTANCE RATINGS Parameter Maximum Junction to Ambient a t ≦ 10 sec Steady State Notes a. Surface Mounted on 1” x 1” FR4 Board. b. Pulse width limited by maximum junction temperature. http://www.SeCoSGmbH.com/ 25-Aug-2010 Rev. B Any changes of specification will not be informed individually. Page 1 of 4 STT3490N N-Channel Enhancement Mode Mos.FET 1.2 A, 150 V, RDS(ON) 700 m Elektronische Bauelemente ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise specified) Parameter Gate-Threshold Voltage Symbol Min. Typ. Max. Unit Test Conditions VGS(th) 1 - 3.5 V VDS=VGS, ID= 250uA Gate-Body Leakage IGSS - - ±100 uA VDS= 0V, VGS= ±20V - - 1 Zero Gate Voltage Drain Current IDSS On-State Drain Current a Drain-Source On-Resistance a ID(on) RDS(ON) uA - - 10 10 - - - - 700 VDS= 120V, VGS= 0V, TJ= 55°C A VDS = 5V, VGS= 10V mΩ - - 1200 VDS= 120V, VGS= 0V VGS= 10V, ID= 1.2A VGS= 4.5V, ID= 1A Forward Transconductance a gfs - 11 - S VDS= 15V, ID= 1.2A Diode Forward Voltage a VSD - 0.8 - V IS= 1.25A, VGS= 0V DYNAMIC b Total Gate Charge Qg - 2.5 - Gate-Source Charge Qgs - 1 - Gate-Drain Charge Qgd - 0.8 - Turn-on Delay Time Td(on) - 5 - Tr - 5 - Td(off) - 6 - Tf - 4 - Input Capacitance Ciss - 320 - Output Capacitance Coss - 37 - Reverse Transfer Capacitance Crss - 20 - Rise Time Turn-off Delay Time Fall Time nC VDS= 10V, VGS= 4.5V, ID= 1A nS VDD= 10V, VGEN= 10V, RL= 10, ID= 1A, RGEN= 6 pF VDS= 15V, VGS= 0V, f= 1MHz Notes a. Pulse test:PW ≦ 300 us duty cycle ≦ 2%. b. Guaranteed by design, not subject to production testing. http://www.SeCoSGmbH.com/ 25-Aug-2010 Rev. B Any changes of specification will not be informed individually. Page 2 of 4 STT3490N Elektronische Bauelemente N-Channel Enhancement Mode Mos.FET 1.2 A, 150 V, RDS(ON) 700 m CHARACTERISTIC CURVES http://www.SeCoSGmbH.com/ 25-Aug-2010 Rev. B Any changes of specification will not be informed individually. Page 3 of 4 STT3490N Elektronische Bauelemente N-Channel Enhancement Mode Mos.FET 1.2 A, 150 V, RDS(ON) 700 m CHARACTERISTIC CURVES http://www.SeCoSGmbH.com/ 25-Aug-2010 Rev. B Any changes of specification will not be informed individually. Page 4 of 4