WINSEMI WCU4C60S

WCU4C60S
Silicon Controlled Rectifiers
Features
�
Repetitive Peak Off-State Voltage : 600V
�
R.M.S On-State Current ( IT(RMS)= 4 A )
�
Low On-State Voltage (1.6V(Typ.) @ ITM)
General Description
Sensitive gate triggering SCR is suitable for the application
where requiring high bidirectional blocking voltage capability
and also suitable for over voltage protection ,motor control
circuit in power tool, inrush current limit circuit and heating
control system.
Absolute Maximum Ratings (T = 25°C unless otherwise specified)
J
Parameter
Symbol
VDRM
Condition
Repetitive Peak Off-State Voltage
Ratings
Units
600
V
Average On-State Current(180°
Ti =60 °C
1.35
Conduction Angle)
Tamb=25 °C
0.9
R.M.S On-State Current(180°
Ti =60 °C
Conduction Angle)
Tamb=25 °C
IT(AV)
A
4
IT(RMS)
A
1.35
1/2 Cycle, 60Hz, Sine
ITSM
Surge On-State Current
33
A
WaveNon-Repetitive
I2t
I2t for Fusing
t =10ms
4.5
A2s
di/dt
Critical rate of rise of on-state current
F=60Hz,Tj=125 °C
50
A/㎲
PGM
Forward Peak Gate Power Dissipation
0.5
W
0.2
W
1.2A
A
Operating Junction Temperature
-40~125 °C
°C
Storage Temperature
-40~150 °C
°C
PG(AV)
IFGM
TJ
TSTG
Forward Average Gate Power Dissipation
Tj=125 °C
Forward Peak Gate Current
Thermal Characteristics
Parameter
Symbol
Value
Units
RθJc
Thermal Resistance Junction to Case(DC)
15
℃/W
RθJA
Thermal Resistance Junction to Ambient(DC)
100
℃/W
Rev.A Aug.2010
Copyright@Winsemi Microelectronics Co., Ltd., All right reserved.
WCU4C60S
Electrical Characteristics (TC=25℃ unless otherwise noted)
Symbol
Parameter
Test Conditions
IDRM
Repetitive Peak Off-State Current
VTM
Peak On-State Voltage (1)
IGT
Gate Trigger Current (2)
VD=12V,RL=140
Gate Trigger Voltage (2)
VGD
Non-Trigger Gate Voltage (1)
Critical
Rate
of
Rise
Off-State
dv/dt
Units
Min
Typ
Max
-
-
5
μA
-
-
1
mA
-
-
1.8
V
20
-
50
μA
-
-
0.8
V
VAK=VDRM RGK=1KΩ
ITM=8A, tp=380㎲
VGT
Value
VD=12V,RL=3.3KΩ, RGK=1 KΩ
0.1
V
VD=67%VDRM, RGK=1 KΩ
15
-
-
V/㎲
Voltage
IH
Holding Current
IT=50mA, RGK=1 KΩ
-
-
5
mA
IL
Latching Current
IT=1mA, RGK=1 KΩ
6
-
-
mA
Rd
Dynamic resistance
Tj=125°C
-
-
100
mΩ
Note:
1. Pulse Width = 1.0 ms , Duty cycle ≤ 1%
2. RGK Current not Included in measurement
2/5
Steady, keep you advance
WCU4C60S
Fig.1
Fig.1Average and D.C.on-state currentversus Fig. 2Maximum average power dissipation
ambient temperature (device mounted on versus average on-state current
FR4 with recommended pad layout)
Fig.
3Relative variation of gate trigger current
Fig.3
and holding current versus junction temperature
Fig. 4Surge peak on-state current versus
Number of cycles.
Fig.5
Fig.5Relative variation of dV/dt immunity
versus gate-cathode resistance(typical
values)
Fig.6 Relative Variation of dV/dt immunity
versus gate-cathode capacitance (typical
values)
3/5
Steady, keep you advance
WCU4C60S
Fig.7 On-state Characteristics (maximum
values)
Fig.8 Thermal Resistance junction to ambient
Versus copper surface under tab (Epoxy printed
Circuit board FR4,copper thickness:35mm)
4/5
Steady, keep you advance
WCU4C60S
TO25
1 Package Dimension
TO251
Unit: mm
5/5
Steady, keep you advance