TI SN74HC595MPWREP

SN74HC595-EP
www.ti.com
SCLS719 – FEBRUARY 2010
8-BIT SHIFT REGISTERS WITH 3-STATE OUTPUT REGISTERS
Check for Samples: SN74HC595-EP
FEATURES
1
•
•
•
•
•
•
•
•
8-Bit Serial-In, Parallel-Out Shift
Wide Operating Voltage Range of 2 V to 6 V
High-Current 3-State Outputs Can Drive Up To
15 LSTTL Loads
Low Power Consumption: 80-mA (Max) ICC
tpd = 13 ns (Typ)
±6-mA Output Drive at 5 V
Low Input Current: 1 mA (Max)
Shift Register Has Direct Clear
PW PACKAGE
(TOP VIEW)
QB
QC
QD
QE
QF
QG
QH
GND
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
VCC
QA
SER
OE
RCLK
SRCLK
SRCLR
QH′
SUPPORTS DEFENSE, AEROSPACE,
AND MEDICAL APPLICATIONS
•
•
•
•
•
•
•
(1)
Controlled Baseline
One Assembly/Test Site
One Fabrication Site
Available in Military (–55°C/125°C)
Temperature Range (1)
Extended Product Life Cycle
Extended Product-Change Notification
Product Traceability
Additional temperature ranges available - contact factory
DESCRIPTION
The SN74HC595 contains an 8-bit serial-in, parallel-out shift register that feeds an 8-bit D-type storage register.
The storage register has parallel 3-state outputs. Separate clocks are provided for both the shift and storage
register. The shift register has a direct overriding clear (SRCLR) input, serial (SER) input, and serial outputs for
cascading. When the output-enable (OE) input is high, the outputs are in the high-impedance state.
Both the shift register clock (SRCLK) and storage register clock (RCLK) are positive-edge triggered. If both
clocks are connected together, the shift register always is one clock pulse ahead of the storage register.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2010, Texas Instruments Incorporated
SN74HC595-EP
SCLS719 – FEBRUARY 2010
www.ti.com
ORDERING INFORMATION (1)
PACKAGE (2)
TA
–55°C to 125°C
(1)
(2)
TSSOP – PW
Reel of 2000
ORDERABLE PART NUMBER
TOP-SIDE MARKING
SN74HC595MPWREP
HC595EP
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
Table 1. FUNCTION TABLE
INPUTS
2
FUNCTION
SER
SRCLK
SRCLR
RCLK
OE
X
X
X
X
H
Outputs QA−QH are disabled.
X
X
X
X
L
Outputs QA−QH are enabled.
X
X
L
X
X
Shift register is cleared.
L
↑
H
X
X
First stage of the shift register goes low.
Other stages store the data of previous stage, respectively.
H
↑
H
X
X
First stage of the shift register goes high.
Other stages store the data of previous stage, respectively.
X
X
X
↑
X
Shift-register data is stored in the storage register.
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): SN74HC595-EP
SN74HC595-EP
www.ti.com
SCLS719 – FEBRUARY 2010
LOGIC DIAGRAM (POSITIVE LOGIC)
OE
RCLK
SRCLR
SRCLK
SER
13
12
10
11
14
1D
C1
R
3R
C3
3S
15
2S
2R
C2
R
3R
C3
3S
1
2S
2R
C2
R
3R
C3
3S
2
2S
2R
C2
R
3R
C3
3S
3
2S
2R
C2
R
3R
C3
3S
4
2S
2R
C2
R
3R
C3
3S
5
2S
2R
C2
R
3R
C3
3S
6
2S
2R
C2
R
3R
C3
3S
7
QA
QB
QC
9
QD
QE
QF
QG
QH
QH′
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): SN74HC595-EP
3
SN74HC595-EP
SCLS719 – FEBRUARY 2010
www.ti.com
TIMING DIAGRAM
SRCLK
SER
RCLK
SRCLR
OE
QA
QB
QC
QD
QE
QF
QG
QH
QH’
NOTE:
implies that the output is in 3-State mode.
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
VCC
Supply voltage range
IIK
Input clamp current (2)
−0.5 V to 7 V
(2)
IOK
Output clamp current
IO
Continuous output current
VI < 0 or VI > VCC
±20 mA
VO < 0 or VO > VCC
±20 mA
VO = 0 to VCC
±35 mA
Continuous current through VCC or GND
±70 mA
qJA
Package thermal impedance (3)
108°C/W
Tstg
Storage temperature range
(1)
(2)
(3)
4
−65°C to 150°C
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
The package thermal impedance is calculated in accordance with JESD 51-7.
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): SN74HC595-EP
SN74HC595-EP
www.ti.com
SCLS719 – FEBRUARY 2010
RECOMMENDED OPERATING CONDITIONS (1)
MIN
VCC
Supply voltage
VCC = 2 V
VIH
NOM
2
High-level input voltage
MAX
5
VCC = 4.5 V
3.15
V
4.2
VCC = 2 V
Low-level input voltage
0.5
VCC = 4.5 V
1.35
VCC = 6 V
VI
Input voltage
VO
Output voltage
0
0
Input transition rise/fall time (2)
TA
(1)
(2)
V
1.8
VCC = 2 V
Δt/Δv
V
1.5
VCC = 6 V
VIL
UNIT
6
VCC
V
VCC
V
1000
VCC = 4.5 V
500
VCC = 6 V
400
Operating free-air temperature
–55
125
ns
°C
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. See the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
If this device is used in the threshold region (from VILmax = 0.5 V to VIHmin = 1.5 V), there is a potential to go into the wrong state from
induced grounding, causing double clocking. Operating with the inputs at tt = 1000 ns and VCC = 2 V does not damage the device;
however, functionally, the CLK inputs are not ensured while in the shift, count, or toggle operating modes.
ELECTRICAL CHARACTERISTICS
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
IOH = −20 mA
VOH
VI = VIH or VIL
QH′, IOH = −4 mA
QA−QH, IOH = −6 mA
QH′, IOH = −5.2 mA
QA−QH, IOH = −7.8 mA
IOL = 20 mA
VOL
VI = VIH or VIL
QH′, IOL = 4 mA
QA−QH, IOL = 6 mA
QH′, IOL = 5.2 mA
QA−QH, IOL = 7.8 mA
II
VCC
TA = 25°C
TA = –55°C to 125°C
MIN
TYP
2V
1.9
1.998
1.9
4.5 V
4.4
4.499
4.4
6V
5.9
5.999
5.9
3.98
4.3
3.7
3.98
4.3
3.7
5.48
5.8
5.2
5.48
5.8
4.5 V
6V
MAX
MIN
MAX
V
5.2
2V
0.002
0.1
0.1
4.5 V
0.001
0.1
0.1
6V
0.001
0.1
0.1
0.17
0.26
0.4
0.17
0.26
0.4
0.15
0.26
0.4
0.15
0.26
0.4
4.5 V
6V
UNIT
V
VI = VCC or 0
6V
±0.1
±100
±1000
nA
IOZ
VO = VCC or 0, QA−QH
6V
±0.01
±0.5
±10
µA
ICC
VI = VCC or 0, IO = 0
6V
8
160
µA
10
10
pF
Ci
2V
to 6 V
3
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): SN74HC595-EP
5
SN74HC595-EP
SCLS719 – FEBRUARY 2010
www.ti.com
TIMING REQUIREMENTS
over operating free-air temperature range (unless otherwise noted)
VCC
fclock
Clock frequency
TA = 25°C
MIN
tw
Pulse duration
SRCLR low
SER before SRCLK↑
SRCLK↑ before RCLK↑ (1)
tsu
Setup time
SRCLR low before RCLK↑
SRCLR high (inactive) before SRCLK↑
th
(1)
6
Hold time, SER after SRCLK↑
MIN
MAX
2V
6
4.2
4.5 V
31
21
6V
SRCLK or RCLK high or low
TA = –55°C to 125°C
MAX
36
UNIT
MHz
25
2V
80
120
4.5 V
16
24
6V
14
20
2V
80
120
4.5 V
16
24
6V
14
20
2V
100
150
4.5 V
20
30
6V
17
25
2V
75
113
4.5 V
15
23
6V
13
19
2V
50
75
4.5 V
10
15
6V
9
13
2V
50
75
4.5 V
10
15
6V
9
13
2V
0
0
4.5 V
0
0
6V
0
0
ns
ns
ns
This setup time allows the storage register to receive stable data from the shift register. The clocks can be tied together, in which case
the shift register is one clock pulse ahead of the storage register.
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): SN74HC595-EP
SN74HC595-EP
www.ti.com
SCLS719 – FEBRUARY 2010
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
fmax
SRCLK
QH′
tpd
QA−QH
RCLK
tPHL
ten
tdis
SRCLR
QH′
QA−QH
OE
QA−QH
OE
QA−QH
tt
QH′
VCC
TA = 25°C
MIN
TYP
TA = –55°C to 125°C
MAX
MIN
2V
6
26
4.2
4.5 V
31
38
21
6V
36
42
MAX
UNIT
MHz
25
2V
50
160
240
4.5 V
17
32
48
6V
14
27
41
2V
50
150
225
4.5 V
17
30
45
6V
14
26
38
2V
51
175
261
4.5 V
18
35
52
6V
15
30
44
2V
40
150
255
4.5 V
15
30
45
6V
13
26
38
2V
42
200
300
4.5 V
23
40
60
6V
20
34
51
2V
28
60
90
4.5 V
8
12
18
6V
6
10
15
2V
28
75
110
4.5 V
8
15
22
6V
6
13
19
ns
ns
ns
ns
ns
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, CL = 150 pF (unless otherwise noted)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
VCC
tpd
RCLK
QA−QH
ten
QA−QH
OE
QA−QH
tt
TA = 25°C
MIN
TA = –55°C to 125°C
TYP
MAX
MIN
MAX
2V
60
200
300
4.5 V
22
40
60
6V
19
34
51
2V
70
200
298
4.5 V
23
40
60
6V
19
34
51
2V
45
210
315
4.5 V
17
42
63
6V
13
36
53
UNIT
ns
ns
ns
OPERATING CHARACTERISTICS
TA = 25°C
PARAMETER
Cpd
Power dissipation capacitance
TEST CONDITIONS
No load
TYP
UNIT
400
pF
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): SN74HC595-EP
7
SN74HC595-EP
SCLS719 – FEBRUARY 2010
www.ti.com
PARAMETER MEASUREMENT INFORMATION
VCC
S1
Test
Point
From Output
Under Test
PARAMETER
RL
CL
(see Note A)
tPZH
ten
1 kΩ
tPZL
tPHZ
tdis
S2
RL
tPLZ
1 kΩ
Reference
Input
VCC
Data
Input
VCC
50%
10%
50%
VCC
0V
In-Phase
Output
50%
10%
tPHL
90%
90%
tr
tPHL
Out-ofPhase
Output
90%
50%
10%
tf
Closed
Closed
Open
Open
Open
VCC
th
90%
90%
VCC
50%
10% 0 V
tf
Output
Control
(Low-Level
Enabling)
VCC
50%
50%
0V
tPZL
VOH
50%
10% V
OL
tf
tPLZ
Output
Waveform 1
(See Note B)
90%
tr
VOH
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
≈VCC
≈VCC
50%
10%
tPZH
tPLH
50%
10%
Open
VOLTAGE WAVEFORMS
SETUP AND HOLD AND INPUT RISE AND FALL TIMES
50%
tPLH
Open
tr
VOLTAGE WAVEFORMS
PULSE DURATIONS
50%
Closed
0V
0V
Input
Closed
tsu
0V
50%
Open
50%
50%
tw
Low-Level
Pulse
S2
50 pF
or
150 pF
LOAD CIRCUIT
50%
S1
50 pF
tpd or tt
High-Level
Pulse
CL
50 pF
or
150 pF
VOL
tPHZ
Output
Waveform 2
(See Note B)
50%
90%
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES FOR 3-STATE OUTPUTS
NOTES: A. CL includes probe and test-fixture capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns.
D. For clock inputs, fmax is measured when the input duty cycle is 50%.
E. The outputs are measured one at a time, with one input transition per measurement.
F. t PLZ and tPHZ are the same as tdis.
G. tPZL and tPZH are the same as ten.
H. tPLH and tPHL are the same as tpd.
Figure 1. Load Circuit and Voltage Waveforms
8
Submit Documentation Feedback
Copyright © 2010, Texas Instruments Incorporated
Product Folder Link(s): SN74HC595-EP
PACKAGE OPTION ADDENDUM
www.ti.com
22-Mar-2010
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
SN74HC595MPWREP
PREVIEW
TSSOP
PW
Pins Package Eco Plan (2)
Qty
16
2000
TBD
Lead/Ball Finish
Call TI
MSL Peak Temp (3)
Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN74HC595-EP :
SN74HC595
• Catalog:
• Military: SN54HC595
NOTE: Qualified Version Definitions:
- TI's standard catalog product
• Catalog
• Military - QML certified for Military and Defense Applications
Addendum-Page 1
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DLP® Products
www.dlp.com
Communications and
Telecom
www.ti.com/communications
DSP
dsp.ti.com
Computers and
Peripherals
www.ti.com/computers
Clocks and Timers
www.ti.com/clocks
Consumer Electronics
www.ti.com/consumer-apps
Interface
interface.ti.com
Energy
www.ti.com/energy
Logic
logic.ti.com
Industrial
www.ti.com/industrial
Power Mgmt
power.ti.com
Medical
www.ti.com/medical
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
RFID
www.ti-rfid.com
Space, Avionics &
Defense
www.ti.com/space-avionics-defense
RF/IF and ZigBee® Solutions www.ti.com/lprf
Video and Imaging
www.ti.com/video
Wireless
www.ti.com/wireless-apps
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2010, Texas Instruments Incorporated