TI CDCV304PW

CDCV304
SCAS643H – SEPTEMBER 2000 – REVISED FEBRUARY 2011
www.ti.com
200-MHz GENERAL-PURPOSE CLOCK BUFFER, PCI-X COMPLIANT
Check for Samples: CDCV304
FEATURES
•
•
1
•
•
•
•
•
•
General-Purpose and PCI-X 1:4 Clock Buffer
Operating Frequency
– 0 MHz to 200 MHz General-Purpose
Low Output Skew: <100 ps
Distributes One Clock Input to One Bank of
Four Outputs
Output Enable Control that Drives Outputs
Low when OE is Low
Operates from Single 3.3-V Supply or 2.5-V
Supply
PCI-X Compliant
8-Pin TSSOP Package
TSSOP
PW PACKAGE
(TOP VIEW)
1
2
3
4
CLKIN
OE
1Y0
GND
8
7
6
5
1Y3
1Y2
VDD
1Y1
DESCRIPTION
The CDCV304 is a high-performance, low-skew, general-purpose PCI-X compliant clock buffer. It distributes one
input clock signal (CLKIN) to the output clocks (1Y[0:3]). It is specifically designed for use with PCI-X
applications. The CDCV304 operates at 3.3 V and 2.5 V and is therefore compliant to the 3.3-V PCI-X
specifications.
The CDCV304 is characterized for operation from –40°C to 85°C for automotive and industrial applications.
FUNCTIONAL BLOCK DIAGRAM
OE
CLKIN
2
Logic
Control
3
1
1Y0
5
1Y1
7
1Y2
8
1Y3
Table 1. FUNCTION TABLE
INPUTS
OUTPUTS
CLKIN
OE
1Y[0:3]
L
L
L
H
L
L
L
H
L
H
H
H
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
© 2000–2011, Texas Instruments Incorporated
CDCV304
SCAS643H – SEPTEMBER 2000 – REVISED FEBRUARY 2011
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
TERMINAL FUNCTIONS
TERMINAL
I/O
NAME
NO.
1Y[0:3]
3, 5, 7, 8
CLKIN
GND
DESCRIPTION
O
Buffered output clocks
1
I
Input reference frequency
4
Power
OE
2
I
VDD
6
Power
Ground
Output enable control
Supply
THERMAL INFORMATION (1)
THERMAL AIR FLOW (CFM)
CDCV304PW 8-PIN TSSOP
0
150
250
500
RθJA
High K
149
142
138
132
RθJA
Low K
230
185
170
150
RθJB
High K
102.0
RθJC
High K
43.7
ψ
JT
High K
1.8
ψ
JB
High K
100.2
(1)
UNIT
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1)
UNIT
–0.5 V to 4.3 V
Supply voltage range, VDD
Input voltage range, VI
(2) (3)
Output voltage range, VO
–0.5 V to VDD + 0.5 V
(2) (3)
–0.5 V to VDD + 0.5 V
Input clamp current, IIK (VI < 0 or VI> VDD)
±50 mA
Output clamp current, IOK (VO < 0 or VO > VDD)
±50 mA
Continuous total output current, IO (VO = 0 to VDD)
±50 mA
Package thermal impedance, θJA: PW package
230.5°C/W
–65°C to 150°C
Storage temperature range Tstg
(1)
(2)
(3)
2
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output negative voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
This value is limited to 4.6 V maximum.
Submit Documentation Feedback
© 2000–2011, Texas Instruments Incorporated
Product Folder Link(s): CDCV304
CDCV304
SCAS643H – SEPTEMBER 2000 – REVISED FEBRUARY 2011
www.ti.com
RECOMMENDED OPERATING CONDITIONS
MIN
Supply voltage, VDD
NOM
MAX
2.3
Low-level input voltage, VIL
High-level input voltage, VIH
V
V
0
Low-level output current, IOL
V
0.3 x VDD
0.7 x VDD
Input voltage, VI
High-level output current, IOH
UNIT
3.6
VDD
VDD = 2.5 V
–12
VDD = 3.3 V
–24
VDD = 2.5 V
12
VDD = 3.3 V
24
–40
Operating free-air temperature, TA
V
mA
mA
°C
85
TIMING REQUIREMENTS
over operating free-air temperature range (unless otherwise noted)
PARAMETER
fclk
TEST CONDITIONS
Clock frequency
MIN
TYP
0
MAX
UNIT
200
MHz
ELECTRICAL CHARACTERISTICS
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
VIK
VOH
VOL
Input voltage
High-level output voltage
Low-level output voltage
IOH
High-level output current
IOL
Low-level output current
II
Input current
TEST CONDITIONS
MIN
TYP (1)
MAX
UNIT
–1.2
V
VDD = 3 V,
II = –18 mA
VDD = 2.3 V,
IOH = –8 mA
VDD = 2.3 V,
IOH = –16 mA
VDD = min to max,
IOH = –1 mA
VDD = 3 V,
IOH = –24 mA
2
VDD = 3 V,
IOH = –12 mA
2.4
VDD = 2.3 V,
IOL = 8 mA
0.5
VDD = 2.3 V,
IOL = 16 mA
0.7
VDD = min to max,
IOL = 1 mA
0.2
VDD = 3 V,
IOL = 24 mA
0.8
VDD = 3 V,
IOL = 12 mA
0.55
VDD = 3 V,
VO = 1 V
VDD = 3.3 V,
VO = 1.65 V
VDD = 3 V,
VO = 2 V
VDD = 3.3 V,
VO = 1.65 V
1.8
1.5
VDD – 0.2
V
–50
mA
–55
60
mA
70
±5
VI = VO or VDD
V
f = 67 MHz,
VDD = 2.7 V
28
f = 67 MHz,
VDD = 3.6 V
37
μA
IDD
Dynamic current, see Figure 5
CI
Input capacitance
VDD = 3.3 V,
VI = 0 V or VDD
3
pF
CO
Output capacitance
VDD = 3.3 V,
VI = 0 V or VDD
3.2
pF
(1)
mA
All typical values are with respect to nominal VDD and TA = 25°C.
Submit Documentation Feedback
© 2000–2011, Texas Instruments Incorporated
Product Folder Link(s): CDCV304
3
CDCV304
SCAS643H – SEPTEMBER 2000 – REVISED FEBRUARY 2011
www.ti.com
SWITCHING CHARACTERISTICS
VDD = 2.5 V ± 10%, CL= 10 pF (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP (1)
MAX
2
2.9
4.5
2
3
4.5
UNIT
tPLH
Low-to-high propagation delay
tPHL
High-to-low propagation delay
tsk(o)
Output skew (2)
50
150
tr
Output rise slew rate
1.5
2.2
4
V/ns
tf
Output fall slew rate
1.5
2.2
4
V/ns
MIN
TYP (1)
MAX
UNIT
1.8
2.4
3
1.8
2.5
3
50
100
(1)
(2)
See Figure 1 and Figure 2
See Figure 3
ns
ps
All typical values are with respect to nominal VDD.
The tsk(o) specification is only valid for equal loading of all outputs.
SWITCHING CHARACTERISTICS
VDD = 3.3 V ± 10%, CL= 10 pF (unless otherwise noted)
PARAMETER
TEST CONDITIONS
tPLH
Low-to-high propagation delay
tPHL
High-to-low propagation delay
tsk(o)
Output skew (2)
tjitter
Additive phase jitter from input to output 1Y0
tsk(p)
Pulse skew
tsk(pr)
Process skew
tsk(pp)
Part-to-part skew
Clock high time, see Figure 4
tlow
Clock low time, see Figure 4
tr
Output rise slew rate (3)
(1)
(2)
(3)
4
Output fall slew rate
12 kHz to 5 MHz, fout = 30.72 MHz
63
12 kHz to 20 MHz, fout = 125 MHz
56
VIH = VDD, VIL = 0 V
thigh
tf
See Figure 1 and Figure 2
(3)
66 MHz
6
140 MHz
3
66 MHz
6
140 MHz
3
ns
ps
fs rms
150
ps
0.2
0.3
ns
0.25
0.4
ns
ns
ns
VO = 0.4 V to 2 V
1.5
2.7
4
V/ns
VO = 2 V to 0.4 V
1.5
2.7
4
V/ns
All typical values are with respect to nominal VDD.
The tsk(o) specification is only valid for equal loading of all outputs.
This symbol is according to PCI-X terminology.
Submit Documentation Feedback
© 2000–2011, Texas Instruments Incorporated
Product Folder Link(s): CDCV304
CDCV304
SCAS643H – SEPTEMBER 2000 – REVISED FEBRUARY 2011
www.ti.com
PARAMETER MEASUREMENT INFORMATION
VDD
140 Ω
Yn
10 pF
140 Ω
Figure 1. Test Load Circuit
VDD
50% VDD
CLKIN
0V
tPLH
tPHL
0.6 VDD
0.6 VDD
50% VDD
50% VDD
0.2 VDD
1Y0 − 1Y3
VOH
0.2 VDD
tr
VOL
tf
Figure 2. Voltage Waveforms Propagation Delay (tpd) Measurements
50% VDD
Any Y
50% VDD
Any Y
tsk(0)
Figure 3. Output Skew
tcyc
PARAMETER
VIH(Min)
VIL(Max)
Vtest
VALUE
0.5 VDD
thigh
UNIT
V
0.35 VDD
V
VIH(Min)
0.4 VDD
V
Vtest
0.6 VDD
VIL(Max)
tlow
0.2 VDD
0.4 VDD
Peak to Peak (Minimum)
A.
All parameters in Figure 4 are according to PCI-X 1.0 specifications.
Figure 4. Clock Waveform
Submit Documentation Feedback
© 2000–2011, Texas Instruments Incorporated
Product Folder Link(s): CDCV304
5
CDCV304
SCAS643H – SEPTEMBER 2000 – REVISED FEBRUARY 2011
www.ti.com
SUPPLY CURRENT
vs
FREQUENCY
60
ICC − Supply Current − mA
TA = 85°C
Output Load: as in Figure 1
50
VDD = 3.6V
40
VDD = 2.7V
30
20
0
20
40
60
80
100
120
140
160
f − Frequency − MHz
Figure 5.
HIGH-LEVEL OUTPUT VOLTAGE
vs
HIGH-LEVEL OUTPUT CURRENT
VOH − High-Level Output Voltage − V
3.5
3.0
VDD = 3.3 V
TA = 25°C
2.5
2.0
1.5
1.0
0.5
0.0
−100
−90
−80
−70
−60
−50
−40
−30
−20
−10
0
IOH − High-Level Output Current − mA
Figure 6.
6
Submit Documentation Feedback
© 2000–2011, Texas Instruments Incorporated
Product Folder Link(s): CDCV304
CDCV304
SCAS643H – SEPTEMBER 2000 – REVISED FEBRUARY 2011
www.ti.com
LOW-LEVEL OUTPUT VOLTAGE
vs
LOW-LEVEL OUTPUT CURRENT
VOL − Low-Level Output Voltage − V
3.5
3.0
VDD = 3.3 V
TA = 25°C
2.5
2.0
1.5
1.0
0.5
0.0
−20
0
20
40
60
80
100
120
IOL − Low-Level Output Current − mA
Figure 7.
Submit Documentation Feedback
© 2000–2011, Texas Instruments Incorporated
Product Folder Link(s): CDCV304
7
CDCV304
SCAS643H – SEPTEMBER 2000 – REVISED FEBRUARY 2011
www.ti.com
REVISION HISTORY
Changes from Revision F (April 2009) to Revision G
•
Added ψ JT and ψ JB specs to the Thermal Information Table and changed RθJB and RθJC specs from 65 and
69 °C/W respectively. ........................................................................................................................................................... 2
Changes from Revision G (January 2011) to Revision H
•
8
Page
Page
Added missing characteristics graphs. ................................................................................................................................. 6
Submit Documentation Feedback
© 2000–2011, Texas Instruments Incorporated
Product Folder Link(s): CDCV304
PACKAGE OPTION ADDENDUM
www.ti.com
11-Feb-2012
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
CDCV304PW
ACTIVE
TSSOP
PW
8
150
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Add to cart
CDCV304PWG4
ACTIVE
TSSOP
PW
8
150
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Add to cart
CDCV304PWR
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Add to cart
CDCV304PWRG4
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Add to cart
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
CDCV304PWR
Package Package Pins
Type Drawing
TSSOP
PW
8
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
2000
330.0
12.4
Pack Materials-Page 1
7.0
B0
(mm)
K0
(mm)
P1
(mm)
3.6
1.6
8.0
W
Pin1
(mm) Quadrant
12.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
CDCV304PWR
TSSOP
PW
8
2000
367.0
367.0
35.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time
of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Mobile Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated