ZMD MDS727

ZMD-Standard
November 1995
Package SOP20
(300 mil)
MDS
727
Supersedes
Edition 01.95
Dimensions in millimetres
Based on IEC 191-2Q: Type 075E04 B
View X
k x 45°
A
X
A2
1 Dimensions
0,1
1
Z
e
b
G
c
LP
HE
E
A1
20
0,2 M
D
Dimensions of Sub-Group B1
Dimensions of Sub-Group C1
Amax
2,65
Amin
2,35
bPmin
0,35
A1min
0,10
bPmax
0,49
A1max
0,30
enom
1,27
A2min
2,25
HEmin
10,00
A2max
2,45
HEmax
10,65
cmin
0,23
LPmin
0,40
cmax
0,32
Zmax
0,81
Dmin*
12,60
Dmax*
13,00
Emin*
7,40
2 Weight
£ 0,55 g
3 Package Body Material
Low Stress Epoxy
Emax*
7,60
4 Lead Material
FeNi-Alloy or Cu-Alloy
kmin
0,25
5 Lead Finish
solder plating
qmin
0°
6 Lead Form
Z-bends
qmax
8°
* without mold-flash
Zentrum Mikroelektronik Dresden GmbH
Editor: signed Schoder
Date: 13.11.1995
Check signed Wlde:
Quality: signed Lorenz
Als Betriebsgeheimnis anvertraut. Alle Rechte vorbehalten.
Doc-No.
QS-000727-HD-02
Proprietary data, company confidential. All rights reserved.