ZMD-Standard November 1995 Package SOP20 (300 mil) MDS 727 Supersedes Edition 01.95 Dimensions in millimetres Based on IEC 191-2Q: Type 075E04 B View X k x 45° A X A2 1 Dimensions 0,1 1 Z e b G c LP HE E A1 20 0,2 M D Dimensions of Sub-Group B1 Dimensions of Sub-Group C1 Amax 2,65 Amin 2,35 bPmin 0,35 A1min 0,10 bPmax 0,49 A1max 0,30 enom 1,27 A2min 2,25 HEmin 10,00 A2max 2,45 HEmax 10,65 cmin 0,23 LPmin 0,40 cmax 0,32 Zmax 0,81 Dmin* 12,60 Dmax* 13,00 Emin* 7,40 2 Weight £ 0,55 g 3 Package Body Material Low Stress Epoxy Emax* 7,60 4 Lead Material FeNi-Alloy or Cu-Alloy kmin 0,25 5 Lead Finish solder plating qmin 0° 6 Lead Form Z-bends qmax 8° * without mold-flash Zentrum Mikroelektronik Dresden GmbH Editor: signed Schoder Date: 13.11.1995 Check signed Wlde: Quality: signed Lorenz Als Betriebsgeheimnis anvertraut. Alle Rechte vorbehalten. Doc-No. QS-000727-HD-02 Proprietary data, company confidential. All rights reserved.