ZMD-Standard December 2004 Package TSOP32 (I/8x20) (Normal Option) MDS 751 Dimensions in millimetres Based on JEDEC: JEP95 MO-142 1 Dimensions A A2 Z Detail Z E 0,1 M bp e D HD Dimensions of Sub-Group B1 Dimensions of Sub-Group C1 Amax 1,20 Amin - bPmin 0,17 A1min 0,05 bPmax 0,27 A1max 0,15 enom 0,50 A2min 0,90 HDmin 19,80 A2max 1,05 HDmax 20,20 cmin 0,10 LPmin 0,40 cmax 0,21 Dmin* 18,30 2 Weight ≤ 0,3 g Dmax* 18,50 3 Package Body Material Low Stress Epoxy Emin* 7,80 4 Lead Material FeNi-Alloy or Cu-Alloy Emax* 8,20 5 Lead Finish solder plating θmin 0° 6 Lead Form Z-bends θmax 5° * without mold-flash Zentrum Mikroelektronik Dresden Editor: signature by Schoder Date: 07.12.2004 Check: signature by Marx Quality: signature by Tina Kochan Doc-No. QS-000751-HD-02 θ c LP A1 1 32 0,1