ZMD MDS726

ZMD-Standard
January 2005
Package SOP8
(150 mil)
MDS
726
Supersedes
Edition 11.95
Dimensions in millimetres
Based on IEC 191-2Q: Type 076E35 B
1 Dimensions
X
A2
A
View X
k x 45°
0,1
b
θ
LP
c
A1
0,2 M
HE
E
8
1
Z
e
D
Dimensions of Sub-Group B1
Dimensions of Sub-Group C1
Amax
1,95
Amin
1,55
bPmin
0,35
A1min
0,10
bPmax
0,49
A1max
0,30
enom
1,27
A2min
1,40
HEmin
5,80
A2max
1,80
HEmax
6,30
cmin
0,15
LPmin
0,40
cmax
0,25
Zmax
0,635
Dmin*
4,80
Dmax*
5,00
2 Weight
≤ 0,3 g
Emin*
3,80
3 Package Body Material
Low Stress Epoxy
Emax*
4,00
4 Lead Material
FeNi-Alloy or Cu-Alloy
kmin
0,33
5 Lead Finish
solder plating
θmin
0°
6 Lead Form
Z-bends
θmax
8°
* without mold-flash
Zentrum Mikroelektronik Dresden
Editor: signature by Schoder
Date: 06.01.2005
Check: signature by Marx
Quality: signature by Tina Kochan
Als Betriebsgeheimnis anvertraut. Alle Rechte vorbehalten.
Doc-No.
QS-000726-HD-03
Proprietary data, company confidential. All rights reserved.