AAT AAT1204

Advanced Analog Technology, Inc.
AAT1204
400-mA MULTI-INPUT LOW-DROPOUT REGULATOR
WITH VAUX SWITCH
Features
z Complete Power Management
z
Automatic Input Voltage Selection
z
Input Voltage Source Detector With
Hysteresis
z
400-mA Load Current Capability With
VCC50 or VSB50 or AUX33 Input Source
z
Integrated Low rDS (on) Switch
z
Regulated Output 3.3V (fixed)
z
Output Short Circuit Protection
Pin Configuration
TOP VIEW
VSB50
1
8
GND
VCC50
2
7
GND
OUT33
3
6
GND
AUX33
4
5
GND
( 8-PIN SOIC )
Description
The AAT1204 is a multi-input low-dropout
regulator that provides constant output supply
3.3V at the output capable of driving a 400-mA
load.
The AAT1204 provides regulated power output
for systems that have multiple input sources and
require constant voltage source with a
low-dropout voltage. This is a intelligent power
source selection device with a low-dropout
regulator for either VCC50 or VSB50 inputs, and
a low-resistance bypass switch for the AUX33
input.
Transitions may occur from one input supply to
another without generating a glitch outside of the
specification range on the 3.3-V output. The
device has an incorporated reverse-blocking
scheme to prevent excess leakage from the input
terminals in the event that the output voltage is
greater than the input voltage.
The input voltage is prioritized in the following
order: VCC50, VSB50, AUX33.
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AAT1204
Functions Table
INPUT VOLTAGE STATUS
(V)
VCC50
0
0
0
0
5
5
5
5
VSB50
0
0
5
5
0
0
5
5
AUX33
0
3.3
0
3.3
0
3.3
0
3.3
INPUT SELECTED
OUTPUT
(V)
VCC50/VSB50/AUX33
None
AUX33
VSB50
VSB50
VCC50
VCC50
VCC50
VCC50
OUT33
0
3.3
3.3
3.3
3.3
3.3
3.3
3.3
OUTPUT
(I)(mA)
Iout33
0
400
400
400
400
400
400
400
PIN Description
TERMINAL
NAME
NO.
VSB50
VCC50
OUT33
AUX33
GND
GND
GND
GND
1
2
3
4
5
6
7
8
I/O
I
I
O
I
I
I
I
I
Description
5-V standby supply input
5-V main supply input
3.3-V regulated output
3.3-V auxiliary supply input
Ground
Ground
Ground
Ground
absolute maximum ratings┼
• Main Supply voltage, V(VCC50)…………….…….………………………………... -0.5V~7V
• Standby Supply voltage, V(VSB50)……………….………………………………… -0.5V~7V
• Auxiliary Supply voltage, V(AUX33)…………….……………………….…....….... -0.5V~7V
• Output current limit, I(LIMIT)………………………………….…………….…………... 1.5A
• Continuous power dissipation, PD(see Note 1)…………….…………………….….. 1.1W
• Electrostatic discharge susceptibility, human body model………………….……….…....2kV
• Operating ambient temperature range, TA……………….……………..…………0℃ to 70℃
• Storage temperature range, Tstg…………….…………….…………………..-55℃ to 150℃
• Operating junction temperature range, TJ…………….………………...……....-5℃ to 135℃
• Lead temperature (soldering, 10 second),T(LEAD)………………….…………..…...260℃
NOTE 1:The device deteriorate with increase in ambient temperature, TA. See Thermal Information section.
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AAT1204
Recommended operating conditions
Min
4.5
4.5
3
4.23
0
0
5-V main supply input, VCC50
5-V standby supply input, VSB50
3.3V auxiliary supply input, AUX33
Load capacitance, CL
Load current, IL
Ambient temperature, TA
Typ
4.7
Max
5.5
5.5
3.6
5.17
400
70
Unit
V
V
V
µF
mA
℃
Electrical Characteristics over recommended operating free-air temperature, TA = 0℃ to 70
℃,CL = 4.7µF (unless otherwise noted)
Parameter
VCC50
VSB50
OUT33
△VO(△VI)
△VO(△IO)
I50
Test Condition
5-V inputs
3.3-V output
Line regulation voltage
Load regulation voltage
Quiescent supply current
Iout33 = 400mA
VSB50 or VCC50 = 4.5V to 5.5V
20 mA<IL<400 mA
From VCC50 VSB50 terminals,
IL= 0 to 400mA
From AUX33 terminal, IL = 0A
IAUX
IL33
ILIMIT
Out33 load current
Output current limit
TTSD
Thermal shutdown(NOTE 2)
Thys
Thermal hysteresis(NOTE2)
CL
Load capacitance
Min
Typ
4.5
5
Max Unit
5.5
V
3.135
3.3
2
40
3.465
V
mV
mV
1.0
3.0
mA
1.0
3.0
mA
0.4
Out33 output short to 0v
150
180
℃
15
Minimal ESR to insure stability of
regulated output
Reverse leakage output current Tested for input that is grounded.
AUX33, VSB50 or VCC50 = GND,
Out33 = 3.3v
VLO
Threshold voltage, low
VSB50 or VCC50↓
VHI
Threshold voltage, high
VSB50 or VCC50↑
VSB50 = VCC50 = 0V,
R(SWITCH) Auxiliary switch resistance
AUX33 = 3.3V, IL = 150mA
RθJA
Thermal impedance,
Without copper for heat spreading
Junction-to-ambient(NOTE3) With copper for heat spreading
A
1.5
4.7
IIkg(REV)
4.0
4.25
4.2
4.45
100
70
μF
50
μA
4.4
4.65
0.4
V
V
Ω
℃/W
NOTE 2:Design targets only. Not tested in production.
NOTE 3:Please refer to "Thermal Information"
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AAT1204
VCC50
VSB50
3.3V
+
+
-
-
VCC50
Detector
AUX33
Control
3.3V
VSB50
Detector
Low on Resistance
OUT33
GND
GND
GND
OVER
TEMPERATURE
PROTECTION
GND
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TYPICAL CHARACTERISTICS
Figure 1.
3.3V VCC50 Cold Start
Figure 2.
3.3V AUX33 Cold Start
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TYPICAL CHARACTERISTICS
Figure 3.
Figure 4.
3.3V VCC50 Power Up(VSB50=5V)
3.3V VCC50 Power Up(AUX33=3.3V)
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AAT1204
TYPICAL CHARACTERISTICS
Figure 5.
3.3V VSB50 Power Up(AUX33=3.3V)
Figure 6.
3.3V VCC50 Power Down(VSB=5V)
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TYPICAL CHARACTERISTICS
Figure 7.
3.3V VCC50 Power Down(AUX33=3.3V)
Figure 8.
3.3V Load Transient Response Falling.
TYPICAL CHARACTERISTICS
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Figure 9.
3.3V Load Transient Response Rising
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AAT1204
THERMAL INFORMATION
To ensure reliable operation of the device, the junction temperature of the output device must be within the
safe operating area(SOA). This is achieved by having a means to dissipate the heat generated from the
junction of the output structure. There are two components that contribute to thermal resistance. They
consist of two paths in series. The first is the junction to case thermal resistance, RJC; the second is the case
to ambient thermal resistance, RCA. The overall junction to ambient thermal resistance, RJA, is determined
by:
RJA=RJC+RCA
The ability to efficiently dissipate the heat from the junction is a function of the package style and board
layout incorporated in the application. The operating junction temperature is determined by the operation
ambient temperature, TA, and the junction power dissipation, PJ.
The junction temperature, TJ, is equal to the following thermal equation:
TJ=TA+PJ(RJC)+PJ(RCA)
TJ=TA+PJ(RJA)
This particular application uses the 8-pin SO package with standard lead frame with a dedicated ground
terminal. Hence, the maximum power dissipation allowable for an operating ambient temperature of 70℃,
and a maximum junction temperature of 150℃ is determined as:
PJ=(TJ-TA)/ RJA
PJ=(150-70)/70=1.1W
Worst case maximum power dissipation is determined by:
PD=(5.5-3.135)×0.4=0.946W
Normal operating maximum power dissipation is:
PD=(5-3.3)×0.4=0.68W
Note: The thermal characteristics of the AAT1204 were measured using a double-sided board with two
square inches of copper area connected to the GND pins for "heat spreading". The use of multi-layer
board construction with power planes will further enhance the thermal performance of the package.
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AAT1204
THERMAL INFORMATION
Power-W
1.78
0.946
0.68
25
83
102
150
Ambient Temperature - °C
NOTE: These curves are to be used for guideline purposes only. For a particular application, a more specijic thermal characterization is required.
Power Dissipation Derating Curves
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APPLICATION INFORMATION
1
8
VSB50
GND
VCC50
GND
GND
4.7μF
0.1μF
2
4.7μF
0.1μF
3
7
AAT1204
OUT33
3.3V
GND
6
GND
GND
4.7μF
5
4
AUX33
4.7μF
GND
GND
0.1μF
Typical Application Schematic
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AAT1204
Package Dimension
θ
L
D
E1
7°(4X)
A1
8REF.
7°(4X)
6(MIN)
50TYP.
B
eB
Symbol
A
A1
B
D
E1
eB
L
θ
Dimension in mils
Min
Nom
Max
59
63
67
22
24
26
12
16
20
188
190
192
152
154
156
229
235
241
24
---
0º
3º
6º
Dimension in
Min
Nom
1.498
1.600
0.56
0.610
0.305
0.406
4.775
4.826
3.861
3.912
5.816
5.969
0.6
--
0º
3º
mm
Max
1.702
0.66
0.508
4.877
3.962
6.121
--
6º
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