AAT AAT1203

Advanced Analog Technology, Inc.
AAT1203
Details are subject to change without notice
250-mA MULTI-INPUT LOW-DROPOUT REGULATOR
WITH VAUX SWITCH
Features
z
Complete Power Management
z
Automatic Input Voltage Selection
z
Input Voltage Source Detector With
Hysteresis
z
250-mA Load Current Capability With
VCC50 or VSB50 or AUX33 Input Source
z
Integrated Low rDS(on ) Switch
z
Regulated Output 3.3V (fixed)
z
Output Short Circuit Protection
Pin Configuration
TOP VIEW
VSB50
1
8
GND
VCC50
2
7
GND
3
6
GND
4
5
GND
OUT33
AUX33
( 8-PIN SOP )
Description
The AAT1203 is a multi-input low-dropout
regulator designed for LAN cards. It provides
constant output supply 3.3V at an output capable
of driving a 250-mA load.
The AAT1203 is equipped with regulated power
output for systems that have multiple input
sources and require constant voltage source with a
low-dropout voltage. This is an intelligent power
source selection device with a low-dropout
regulator for either VCC50 or VSB50 inputs, and
a low-resistance bypass switch for the AUX33
input.
The AAT1203 allows transitions to progress
smoothly from one input supply to another
without generating a glitch outside of the specified
range of the 3.3-V output. The device has an
incorporated reverse-blocking scheme to prevent
excess leakage from the input terminals in the
event that the output voltage is greater than the
input voltage.
The input voltage is prioritized in the following
order: VCC50, VSB50, AUX33.
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AAT1203
Function Table
INPUT VOLTAGE STATUS
(V)
VCC50
0
0
0
0
5
5
5
5
VSB50
0
0
5
5
0
0
5
5
AUX33
0
3.3
0
3.3
0
3.3
0
3.3
INPUT SELECTED
OUTPUT
(V)
VCC50/VSB50/AUX33
None
AUX33
VSB50
VSB50
VCC50
VCC50
VCC50
VCC50
OUT33
0
3.3
3.3
3.3
3.3
3.3
3.3
3.3
OUTPUT
(I)(mA)
Iout33
0
250
250
250
250
250
250
250
Pin Description
TERMINAL
NAME
TERMINAL NO.
I/O
VSB50
VCC50
OUT33
AUX33
GND
GND
GND
GND
1
2
3
4
5
6
7
8
I
I
O
I
I
I
I
I
DESCRIPTION
5V Standby Supply Input
5V Main Supply Input
3.3V Regulated Output
3.3V Auxiliary Supply Input
Ground
Ground
Ground
Ground
Absolute Maximum Ratings┼
• Main Supply Voltage, V(VCC50 ) )…………….…….……………………………… − 0.5 V~7V
• Standby Supply Voltage, V(VSB50 ) ……………….……………………………….. − 0.5 V~7V
• Auxiliary Supply Voltage, V(AUX33) …………….……………………….……….. − 0.5 V~7V
• Output Current Limit, I (LIMIT ) ………………………………….………………….1.5A
• Continuous Power Dissipation, Pd (see Note 1)…………….………………….1.1W
• Electrostatic Discharge Susceptibility, Human Body Mode………………….…….2kV
• Operating Ambient Temperature Range, TC ……………….……………..……….0℃ to +70℃
• Storage Temperature Range, Tstorage …………….…………….……………… − 45 ℃ to +125℃
• Operating Junction Temperature Range, TJ …………….……………………….. − 5 ℃ to +130℃
• Lead Temperature (Soldering for 10 seconds), T(LEAD) ………………….…...260℃
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AAT1203
Note 1:The device deteriorates with increase in ambient temperature, TC . See Thermal Information section.
Recommended Operating Conditions
Parameter
5V Main Supply Input, VCC50
5V Standby Supply Input, VSB50
3.3V Auxiliary Supply Input, AUX33
Load Capacitance, C L
Min
4.5
4.5
3.0
4.23
Typ
4.70
Max
5.5
5.5
3.6
5.17
Unit
V
V
V
µF
Load Current, I L
0
-
250
mA
Ambient Temperature, TC
0
-
70
℃
Electrical Characteristics Over Recommended Operating Free-Air
Temperature, TC = 0℃ to 70℃, CL = 4.7µF (Unless Otherwise Specified)
Parameter
Symbol
Test Condition
Min
Typ
4.5
5.0
5.5
V
3.135
3.300
3.465
V
VSB50 or VCC50 = 4.5V to 5.5V
-
2
-
mV
20 mA< I L <250 mA
-
40
-
mV
From VCC50 VSB50 terminals,
I L = 0mA to 250mA
-
1.0
3.0
mA
From AUX33 terminal, I L = 0A
-
1.0
3.0
mA
0.25
-
-
-
-
1.5
TTSD
150
-
180
Thermal Hysteresis
(Note 2)
Thys
-
15
-
Load Capacitance
CL
-
4.7
-
μF
-
-
50
μA
3.85
4.05
4.25
V
4.1
4.3
4.5
V
-
-
0.4
Ω
Without copper for heat spreading
-
100
-
With copper for heat spreading
-
70
-
3.3V Output
VCC50
VSB50
OUT33
I out 33 = 250mA
Line Regulation Voltage
∆VO (∆VI )
Load Regulation Voltage
∆VO (∆IO )
5V Inputs
Quiescent Supply Current
I 50
I AUX
I AUX
Out33 Load Current
I L33
Output Current Limit
Thermal Shutdown
I LIMIT
(Note 2)
Reverse Leakage Output
Current
I Ikg (REV )
Threshold Voltage, Low
VLO
Threshold Voltage, High
VHI
Auxiliary Switch
Resistance
Thermal Impedance,
Junction-to-Ambient
(Note 3)
R (SWITCH )
R θJA
Out33 Output short to 0V
A
℃
Minimal ESR to insure stability of regulated
output
Tested for grounded input
AUX33, VSB50 or VCC50 = GND,
Out33 = 3.3V
VSB50 or VCC50↓
VSB50 or VCC50↑
VSB50 = VCC50 = 0V,
AUX33 = 3.3V, I L = 150mA
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℃/W
Advanced Analog Technology, Inc.
AAT1203
Note 2:Design targets only. Not tested in production.
Note 3:Please refer to "Thermal Information"
Block Diagram
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AAT1203
VCC50
VSB50
3.3V
+
+
-
-
VCC50
Detector
AUX33
Control
3.3V
VSB50
Detector
Low on Resistance
OUT33
GND
GND
GND
Over
Temperature
Protection
GND
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AAT1203
Typical Characteristics
Fig. 1.
3.3V VCC50 Cold Start
Fig. 2.
3.3V VUX33 Cold Start
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AAT1203
Typical Characteristics
Fig. 3.
Fig. 4.
3.3V VCC50 Power Up (VSB50=5V)
3.3V VCC50 Power Up (AUX33=3.3V)
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AAT1203
Typical Characteristics
Fig. 5.
3.3V VSB50 Power Up (AUX33=3.3V)
Fig. 6.
3.3V VCC50 Power Down (VSB=5V)
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AAT1203
Typical Characteristics
Fig. 7.
3.3V VCC50 Power Down (AUX33=3.3V)
Fig. 8.
3.3V Load Transient Response Falling.
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AAT1203
Typical Characteristics
Fig. 9.
3.3V Load Transient Response Rising
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AAT1203
Thermal Information
To ensure reliable operation of the device, the junction temperature of the output device must be within
the safe operating area(SOA). This is achieved by having a means to dissipate the heat generated from
the junction of the output structure. There are two components that contribute to thermal resistance.
They consist of two paths in series. The first path is the junction to case thermal resistance, RJC; the
second path is the case to ambient thermal resistance, RCA. The overall junction to ambient thermal
resistance, RJA, is determined by:
RJA=RJC+RCA
Package and board layout incorporated in the application determines the ability to efficiently dissipate
the heat from the junction. The operating junction temperature is determined by the operation ambient
temperature, TC , and the junction power dissipation, PJ.
The junction temperature, TJ, is equal to the following thermal equation:
TJ= TC +PJ(RJC)+PJ(RCA)
TJ= TC +PJ(RJA)
This particular application uses the 8-pin SOIC package with standard lead frame with a dedicated
ground terminal. Hence, the maximum power dissipation allowable for an operating ambient
temperature of 70℃, and a maximum junction temperature of 150℃ is determined as:
PJ=(TJ- TC )/ RJA
PJ=(150-70)/70=1.1W
Worst case maximum power dissipation is determined by:
Pd =(5.5-3.135)×0.25=0.591W
Normal operating maximum power dissipation is:
Pd =(5-3.3)×0.25=0.425W
Note: The thermal characteristics of the AAT1203 were measured using a double-sided board with two
square inches of copper area connected to the GND pins for "heat spreading". The use of multi- layer
board construction with power planes will further enhance the thermal performance of the package.
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AAT1203
Thermal Information (Cont.)
Power-W
1.78
0.591
0.425
25
108
120
150
Ambient Temperature -°C
NOTE: These curves are to be used for guideline purposes only. For a particular application, a more specijic thermal characterization is required.
Power Dissipation Derating Curves
Application Information
1
8
VSB50
GND
VCC50
GND
GND
4.7μF
0.1μF
2
4.7μF
0.1μF
3
7
AAT1203
OUT33
3.3V
GND
6
GND
GND
4.7μF
5
4
AUX33
4.7μF
GND
GND
0.1μF
Typical Application Schematic
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AAT1203
Package Dimension
8-Pin SOP
θ
SYMBOLS
DIMENSIONS IN MILLIMETERS DEMINSIONS IN INCHES
MIN
TYP
MAX
MIN
TYP
MAX
A
1.47
1.60
1.73
0.058
0.063
0.068
A1
0.10
---
0.22
0.004
---
0.008
A2
---
1.45
---
---
0.057
---
b
0.33
0.41
0.51
0.013
0.016
0.020
C
0.19
0.20
0.25
0.0075
0.008
0.0098
D
4.80
4.85
4.95
0.189
0.191
0.195
E
5.80
6.00
6.20
0.228
0.236
0.244
E1
3.80
3.90
4.00
0.150
0.154
0.157
e
---
1.27
---
---
0.050
---
L
0.38
0.71
1.27
0.015
0.028
0.050
y
---
---
0.076
---
---
0
θ
0
---
0
0
---
0
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AAT1203
Tape and Reel
8-Pin SOP
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AAT1203
Tape and Reel
8-Pin SOP (Cont.)
NOTE:
1. 10 SPROCKET HOLE PITCH CUMULATIVE TOLERANCE ± 0.2 MILLIMETERS.
2. CAMBER NOT TO EXCEED 1 MILLIMETER IN 100 MILLIMETERS
3. MATERIAL: ANTI-STATIC BLACK ADVANTEK POLYSTYRENE.
4. A 0 AND B 0 ARE MEASURED ON A PLANE 0.3 MILLIMETERS ABOVE THE BOTTOM OF THE POCKET.
5.
K 0 IS MEASURED FROM A PLANE ON THE INSIDE BOTTOM OF THE POCKET TO THE TOP SURFACE OF THE
6.
CARRIER.
POCKET POSITION RELATIVE TO SPROCKET HOLE IS MEASURED AS TRUE POSITION OF POCKET, NOT
POCKET HOLE.
Part Marking
SOP8 Top Marking
SOP8 Back Marking
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AAT1203
Ordering Information
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