AAT AAT1205-S

Advanced Analog Technology, Inc.
AAT1205
Details are subject to change without notice
400-mA MULTI-INPUT LOW-DROPOUT REGULATOR WITH DUAL
OUTPUT POWER MANAGEMENT
Features
Description
z
Complete Power Management
z
Automatic Input Voltage Selection
z
Input Voltage Source Detector With
Hysteresis
z
400-mA Load Current Capability With
VCC50、VSB50 or AUX33 Input Source
z
Integrated Low rDS(on ) Switch
z
Dual Regulated Output 3.3V(fixed)& 2.5V
(fixed)
z
Output Short Circuit Protection (SCP)
The AAT1205 is a multi-input low-dropout
regulator (LDO) specially designed for LAN cards.
It provides advanced dual constant output supply
3.3V & 2.5V at the output capable of driving a
400-mA load. The output (OUT25) can be
disabled by connecting EN25 pin to GND.
The AAT1205 is equipped with dual regulated
power output for systems with multiple input
sources and require dual constant voltage source
with a low-dropout voltage. This is an intelligent
power source selection device with a low-dropout
regulator for either VCC50 or VSB50 inputs, and
a low-resistance bypass switch for the AUX33
input.
The AAT1205 allows transitions to progress
smoothly from one input supply to another without
generating a glitch outside of the specified range
of 3.3V & 2.5V output. Furthermore, this device
has an incorporated reverse-blocking scheme to
prevent excessive leakage from the input terminals
in the event that the output voltage is greater than
the input voltage.
The input voltage is prioritized in the following
order: VCC50, VSB50, AUX33.
Pin Configuration
TOP VIEW
VSB50
1
8
GND
VCC50
2
7
GND
OUT33
3
6
EN25
AUX33
4
5
OUT25
( 8-PIN SOP )
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AAT1205
Function Table
INPUT VOLTAGE STATUS
(V)
EN25
Hi
Low
Hi
Low
Hi
Low
Hi
Low
Hi
Low
Hi
Low
Hi
Low
Hi
Low
VCC50
0
0
0
0
0
0
0
0
5
5
5
5
5
5
5
5
VSB50
0
0
0
0
5
5
5
5
0
0
0
0
5
5
5
5
INPUT SELECTED
AUX33
0
0
3.3
3.3
0
0
3.3
3.3
0
0
3.3
3.3
0
0
3.3
3.3
VCC50/VSB50/AUX33
None
None
AUX33
AUX33
VSB50
VSB50
VSB50
VSB50
VCC50
VCC50
VCC50
VCC50
VCC50
VCC50
VCC50
VCC50
OUTPUT
(V)
OUT33
0
0
3.3
3.3
3.3
3.3
3.3
3.3
3.3
3.3
3.3
3.3
3.3
3.3
3.3
3.3
OUT25
0
0
2.5
0
2.5
0
2.5
0
2.5
0
2.5
0
2.5
0
2.5
0
OUTPUT
(I)(mA)
Iout33+Iout25
0
0
400
400
400
400
400
400
400
400
400
400
400
400
400
400
Pin Description
TERMINAL
NAME
NO.
VSB50
VCC50
OUT33
AUX33
OUT25
EN25
GND
GND
1
2
3
4
5
6
7
8
I/O
I
I
O
I
O
I
I
I
Description
5V Standby Supply Input
5V Main Supply Input
3.3V Regulated Output
3.3V Auxiliary Supply Input
2.5V Regulated Output
Enable Input of OUT25
Ground
Ground
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AAT1205
Absolute Maximum Ratings┼
• Main Supply Voltage, V(VCC50 ) …………….…….………………………………... − 0.5 V~7V
• Standby Supply Voltage, V(VSB50 ) ……………….………………………………… − 0.5 V~7V
• Auxiliary Supply Voltage, V(AUX33) …………….……………………….…....….... − 0.5 V~7V
• Output Current Limit, I (LIMIT ) ………………………………….…………….………1.5A
• Continuous Power Dissipation, Pd (see Note 1)…………….…………………… 1.6W
• Electrostatic Discharge Susceptibility, Human Body Mode………………….……….2kV
• Operating Ambient Temperature Range, TC ……………….……………..…………0℃ to 70℃
• Storage Temperature Range, Tstorage …………….…………….…………………….. − 45 ℃ to +125℃
• Operating Junction Temperature Range, TJ …………….………………...……........ − 5 ℃ to +130℃
• Lead Temperature (Soldering for 10 seconds), T(LEAD) ………………….……….260℃
Note 1:The device deteriorates with increase in ambient temperature, TC . See Thermal Information section.
Recommended Operating Conditions
Parameter
5V Main Supply Input, VCC50
5V Standby Supply Input,
VSB50
3.3V Auxiliary Supply Input,
AUX33
Load Capacitance, C L
Load Current, I L
Ambient Temperature, TC
Min
4.5
Typ Max
5.5
Unit
V
4.5
-
5.5
V
3.0
-
3.6
V
4.23 4.70 5.17
0
400
µF
0
-
70
mA
℃
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AAT1205
Electrical Characteristics Over Recommended Operating Free-Air Temperature,
TC = 0℃ to 70℃, CL = 4.7µF (unless otherwise specified)
Parameter
5V Inputs
3.3V Output
2.5V Output
Symbol
VCC50
VSB50
OUT33
Test Condition
Min
Typ
Max
Unit
4.5
5.0
5.5
V
I out 33 + I out 25 = 400mA
3.135
3.300
3.465
V
I out 33 =0, I out 25 = 300mA
2.375
2.500
2.625
V
Line Regulation Voltage
OUT25
∆VO (∆VI )
VSB50 or VCC50 = 4.5V to 5.5V
-
2
-
mV
Load Regulation Voltage
∆VO (∆IO )
20 mA< I L <250 mA
-
40
-
mV
Quiescent Supply Current
I 50
-
1.0
3.0
mA
-
1.0
3.0
mA
0.4
-
-
0.3
-
-
-
-
1.5
I AUX
I AUX
Out33 Load Current
I L33
Out25 Load Current
I L 25
From VCC50 VSB50 terminals, I L = 0
to 400mA
From AUX33 terminal, I L = 0A
Out33 or Out25 output shorted
to 0V
A
Output Current Limit
I LIMIT
Thermal Shutdown (Note 2)
Thermal Hysteresis
(Note 2)
TTSD
150
-
180
Thys
-
15
-
-
4.7
-
µF
-
-
50
µA
4.0
4.2
4.4
V
4.25
4.45
4.65
V
-
-
0.4
Ω
-
80
-
-
50
-
Load Capacitance
CL
Reverse Leakage Output
Current
I Ikg (REV )
Threshold Voltage, Low
VLO
Threshold Voltage, High
VHI
Auxiliary Switch
Resistance
R SWITCH
R θJA
Minimal ESR to insure stability of
regulated output
Tested for input that is grounded.
AUX33, VSB50 or VCC50 = GND,
Out33 = 3.3V
VSB50 or VCC50↓
VSB50 or VCC50↑
VSB50 = VCC50 = 0V,
AUX33 = 3.3V, I L = 150mA
Power Pad is not soldered on the heat
spreading copper
Power Pad is soldered on the heat
spreading copper
Note 2:Design targets only. Not tested in production.
Note 3:Please refer to "Thermal Information"
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℃
℃/
W
Advanced Analog Technology, Inc.
AAT1205
Function Block
VCC50
VSB50
3.3V
+
+
-
-
VCC50
Detector
3.3V
VSB50
Detector
Control
OUT33
AUX33
Low on Resistance
GND
Over
Temperature
Protection
2.5V
EN25
+
OUT25
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AAT1205
Typical Characteristics
Fig. 1. 3.3V VCC50 Cold Start
Fig. 2. 2.5V VCC50 Cold Start
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AAT1205
Typical Characteristics
Fig. 3. 3.3V AUX33 Cold Start
Fig. 4. 2.5V AUX33 Cold Start
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AAT1205
Typical Characteristics
Fig. 5. 3.3V VCC50 Power Up (VSB50=5V)
Fig. 6.
2.5V VCC50 Power Up (VSB50=5V)
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AAT1205
Typical Characteristics
Fig. 7. 3.3V VCC50 Power Up (AUX33=3.3V)
Fig. 8. 2.5V VCC50 Power Up (AUX33=3.3V)
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AAT1205
Typical Characteristics
Fig. 9. 3.3V VSB50 Power Up (AUX33=3.3V)
Fig. 10. 2.5V VSB50 Power Up (AUX33=3.3V)
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AAT1205
Typical Characteristics
Fig.11. 3.3V VCC50 Power Down (VSB=5V)
Fig. 12. 2.5V VCC50 Power Down (VSB=5V)
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AAT1205
Typical Characteristics
Fig. 13. 3.3V VCC50 Power Down (AUX33=3.3V)
Fig. 14. 2.5V VCC50 Power Down (AUX33=3.3V)
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AAT1205
Typical Characteristics
Fig. 15.
3.3V Load Transient Response Falling
Fig. 16.
2.5V Load Transient Response Falling
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AAT1205
Typical Characteristics
Fig. 17.
3.3V Load Transient Response Rising
Fig. 18.
2.5V Load Transient Response Rising
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AAT1205
Thermal Information
To ensure reliable operation of the device, the junction temperature of the output device must be within the
safe operating area(SOA). This is achieved by having a means to dissipate the heat generated from the
junction of the output structure. There are two components that contribute to thermal resistance. They
consist of two paths in series. The first path is the junction to case thermal resistance, RJC; the second path is
the case to ambient thermal resistance, RCA. The overall junction to ambient thermal resistance, RJA, is
determined by:
RJA=RJC+RCA
Package and board layout incorporated in the application determines the ability to efficiently dissipate the
heat from the junction. The operating junction temperature is determined by the operation ambient
temperature, TC, and the junction power dissipation, PJ.
The junction temperature, TJ, is equal to the following thermal equation:
TJ=TC+PJ(RJC)+PJ(RCA)
TJ=TC+PJ(RJA)
The AAT1205 is housed in a thermal enhanced package where the power pad is located in the bottom of the
device. When the power pad is soldered on a double-sided printed circuit board with two square inches of
copper allocated for "heat spreading", the resulting θJA is 50℃/W. Hence, the maximum power dissipation
allowable for an operating ambient temperature of 70℃, and a maximum junction temperature of 150℃ is
determined as:
PJ=(TJ-TC)/ RJA
PJ=(150-70)/50=1.6W
Worst case maximum power dissipation is determined by:
Pd=(5.5-2.375)×0.3+(5.5-3.135) ×0.1=0.0.9375+0.2365=1.174W
Normal operating maximum power dissipation is:
Pd=(5-2.5)×0.3+(5-3.3) ×0.1=0.75+0.17=0.92W
Note: All thermal characteristics of the AAT1205 were measured using a double-sided board with two
square inches of copper area connected to the GND pins for "heat spreading". The use of multi-layer
board construction with power planes will further enhance the thermal performance of the package.
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AAT1205
Thermal Information (Cont.)
Power-W
2.5
1.174
0.92
25
91
104
150
Ambient Temperature -°C
Note: These curves are to be used for guideline purposes only. For a particular
application, a more specijic thermal characterization is required.
Power Dissipation Derating Curves
PCB Layout Example
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AAT1205
Application Information
1
4.7μ F
8
4.7μ F
GND
VCC50
GND
0.1μ F
2
3.3V
VSB50
0.1μ F
AAT1205
3
OUT33
EN25
AUX33
OUT25
7
6
TO OUT33 or
FLOATING
4.7μ F
5
4
4.7μ F
2.5V
4.7μ F
0.1μ F
Typical Application Schematic - Dual Output
1
4.7μF
GND
VCC50
GND
8
GND or
FLOATIN
0.1μF
2
4.7μF
VSB50
0.1μF
3
3.3V
AAT1205
OUT33
EN25
AUX33
OUT25
7
6
GND
4.7μF
4
4.7μF
5
0.1μF
GND or
FLOATIN
Typical Application Schematic - Only OUT33 Used
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AAT1205
Package Dimension
8-PIN SOP
θ
SYMBOL
S
DIMENSIONS IN
MIN
TYP
MAX
DEMINSIONS IN
MIN
TYP
MAX
A
1.47
1.60
1.73
0.058
0.063
0.068
A1
0.10
---
0.22
0.004
---
0.008
A2
---
1.45
---
---
0.057
---
b
0.33
0.41
0.51
0.013
0.016
0.020
C
0.19
0.20
0.25
0.0075
0.008
0.0098
D
4.80
4.85
4.95
0.189
0.191
0.195
E
5.80
6.00
6.20
0.228
0.236
0.244
E1
3.80
3.90
4.00
0.150
0.154
0.157
e
---
1.27
---
---
0.050
---
L
0.38
0.71
1.27
0.015
0.028
0.050
y
---
---
0.076
---
---
0
θ
0
---
0
0
---
0
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AAT1205
Tape and Reel
8-Pin SOP
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AAT1205
Tape and Reel
8-Pin SOP (Cont.)
NOTE:
1. 10 SPROCKET HOLE PITCH CUMULATIVE TOLERANCE ± 0.2 MILLIMETERS.
2. CAMBER NOT TO EXCEED 1 MILLIMETER IN 100 MILLIMETERS
3. MATERIAL: ANTI-STATIC BLACK ADVANTEK POLYSTYRENE.
4. A 0 AND B 0 ARE MEASURED ON A PLANE 0.3 MILLIMETERS ABOVE THE BOTTOM OF THE POCKET.
5.
K 0 IS MEASURED FROM A PLANE ON THE INSIDE BOTTOM OF THE POCKET TO THE TOP SURFACE OF
6.
THE CARRIER.
POCKET POSITION RELATIVE TO SPROCKET HOLE IS MEASURED AS TRUE POSITION OF POCKET, NOT
POCKET HOLE.
Part Marking
SOP8 Top Marking
AAT1205
XXXXXX
SOP8 Back Marking
YYWW
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AAT1205
Ordering Information
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