AIC AIC1993

ary
AIC1993
Linear Fan Control Driver IC
FEATURES
GENERAL DESCRIPTION
VOUT Follows 1.6 Times of VSET
The AIC1993 is a high performance positive linear
voltage regulator designed for applications requiring low dropout voltage at maximum 500mA output
current. The AIC1993 VO output voltage follows
1.6 times of VSET voltage until it reaches VIN voltage. The VSET voltage must be larger than 1V to
guarantee VOUT as 1.6 times of VSET voltage. An
enable pin can be used to reduce power dissipation in shutdown mode. The AIC1993 provides excellent line and load regulation. The AIC1993 is
available in SOP-8 package.
150mV Dropout at 500mA Output Current
Over Current and Over Temperature Protection
Enable Function
5uA Quiescent Current in Shutdown Mode
SOP-8 Package
APPLICATIONS
Notebook PC
PC Motherboard
Battery Powered Systems
Peripheral Cards
TYPICAL APPLICATION CIRCUIT
Typical Application Circuit
Analog Integrations Corporation
Si-Soft Research Center
DS-1993-P1 050708
3A1, No.1, Li-Hsin Rd. I , Science Park , Hsinchu 300, Taiwan , R.O.C.
TEL: 886-3-5772500
FAX: 886-3-5772510 www.analog.com.tw
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AIC1993
ORDERING INFORMATION
AIC1993XXXXX
PIN CONFIGURATION
PACKING TYPE
TR: TAPE & REEL
TB: TUBE
PACKAGING TYPE
S8: SOP-8
SOP-8
TOP VIEW
EN 1
VIN 2
8 GND
7 GND
VO 3
6 GND
VSET 4
5 GND
P: Lead Free Commercial
Example: AIC1993PS8TR
Lead Free SOP-8 Package & Taping & Reel
Packing Type
ABSOLUTE MAXIMUM RATINGS
VIN, EN, VSET to GND .......................................................................................................-0.3V to +6V
Ouput Switch Current ..................................................………………......................................... 500mA
Operating Junction Temperature ...........................………………………………….................... 125°C
Operating Ambient Temperature Range.......................………………. … …......................... -40~85°C
Maximum Storage Temperature Range......................................................................... -65°C to 150°C
Maximum Lead Temperature (Soldering 10s) ..............................................................................260°C
Thermal Resistance Junction to Case SOP8…..………..………..……………………..………… 40°C/W
Thermal Resistance Junction to Ambient SOP8…..………..……………………………………….160°C/W
(Assume no ambient airflow)
TEST CIRCUIT
Refer to Typical Application Circuit.
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AIC1993
ELECTRICAL CHARACTERISTICS
(VIN=5V, VEN=5V, VSET=2V, CIN=COUT=2.2μF,
TA= TJ=25°C, Unless otherwise specified.) (Note1)
PARAMETER
TEST CONDITIONS
Operating Voltage
SYMBOL
MIN.
VIN
4.5
TYP.
MAX. UNITS
5.5
V
Quiescent Current
VO = 5V
0.5
Shutdown Supply Current
VEN = 0
5
30
μA
Output Voltage/VSET Voltage
VIN = 5.5V, VSET = 1V to
3.2V
1.6
1.648
V/V
Line Regulation
VIN = 4.5V to 5.5V
0.2
0.5
%
Load Regulation
10mA≦IO ≦500mA
0.5
0.8
%
Output Resistance
IO = 500mA, VSET = 3.4V
0.2
0.3
Ω
1.552
Short Circuit Current
mA
0.3
A
Minimum VSET Voltage
1
V
VSET Pin Current
80
VEN Voltage High
1.6
VEN = 0
nA
V
VEN Voltage Low
VEN Pin Bias Current
200
1.5
0.4
V
10
μA
Thermal-Shutdown Threshold
+150
℃
Thermal-Shutdown Hysteresis
20
℃
Note 1: Specifications are production tested at TA=25°C. Specifications over the -40°C to 85°C operating
temperature range are assured by design, characterization and correlation with Statistical Quality Controls
(SQC).
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AIC1993
TYPICAL PERFORMANCE CHARACTERISTICS
VIN=VEN=5V, VSET=2V, IOUT=0.5A, CIN= 4.7μF, COUT=10μF, TA= TJ=25°C
Fig.1 Load Transient Response
Fig.3 Short Circuit current
Fig.5 Quiescent Current vs. Vin
Fig.2 Start-UP
Fig.4 Overcurrent Protection Characteristics
Fig.6 Quiescent Current vs. Temperature
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AIC1993
Fig.7 Output Voltage vs. Temperature
Fig.8 Output Voltage vs. VIN
6
5
VIN=5.5V
VOUT(V)
4
3
2
1
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
VSET(V)
Fig.9 Dropout Voltage vs. Iout
Fig.10 Vout vs. V SET
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AIC1993
BLOCK DIAGRAM
Functional Block Diagram of AIC1993
PIN DESCRIPTIONS
Pin 1:
VEN: Enable input. Pulling this pin under 0.4V turns the regulator off, reducing the quiescent current
to a fraction of its operating value. The device will be enabled if this pin is left open. Connect
to VIN if not being used.
Pin 2:
VIN: Power input pin. Supply the power to the IC.
Pin 3:
VO: The pin is the power output of the regulator. Its voltage is 1.6 times of VSET.
Pin 4: VSET: This pin sets the output voltage. Its voltage must be larger than 1V to guarantee VO as 1.6
times of VSET.
Pin 5:
GND: Reference ground. Use all four pins on the SOP-8 device.
Pin 6:
GND: Reference ground. Use all four pins on the SOP-8 device.
Pin 7:
GND: Reference ground. Use all four pins on the SOP-8 device.
Pin 8:
GND: Reference ground. Use all four pins on the SOP-8 device.
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AIC1993
APPLICATION INFORMATIONS
INPUT-OUTPUT CAPACITORS
Linear regulators require input and output capacitors to maintain stability. Input ceramic capacitor at 2.2µF with a 2.2uF output ceramic capacitor is recommended.
EN
EN is used to make system enable and disable. It
supply to output voltage in shutdown logic mode of
fan control.
VSET
The output voltage control pin has 1.6 Time become the output voltage. Voltage limilt form 0V
to 3.125 V like to feedback control resistance in
internal R1 and R2 modulation.
POWER DISSIPATION
The maximum power dissipation of AIC1993
depends on the thermal resistance of its case
and circuit board, the temperature difference between the die junction and ambient air, and the
rate of airflow. The rate of temperature rise is
greatly affected by the mounting pad configuration on the PCB, the board material, and the
ambient temperature. When the IC mounting
with good thermal conductivity is used, the junc-
tion temperature will be low even when large
power dissipation applies.
The power dissipation across the device is
P = IOUT (VIN-VOUT).
The maximum power dissipation is:
(TJ − TA)
PMAX =
(RθJB + RθBA)
Where TJ-TA is the temperature difference between the die junction and the surrounding air,
RθJB is the thermal resistance of the package,
and RθBA is the thermal resistance through the
PCB, copper traces, and other materials to the
surrounding air.
As a general rule, the lower temperature is, the
better reliability of the device is. So the PCB
mounting pad should provide maximum thermal
conductivity to maintain low device temperature.
GND pin performs a dual function of providing an
electrical connection to ground and channeling
heat away. Therefore, connecting the GND pin to
ground with a large pad or ground plane would
increase the power dissipation and reduce the
device temperature.
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AIC1993
PHYSICAL DIMENSIONS (unit: mm)
SOP-8 PACKAGE OUTLINE DRAWING
h X 45°
A
H
E
D
A
S EE VIEW B
A
e
A1
B
0.25
C
WITH P LATING
BAS E METAL
S ECTIO N A-A
G AUGE P LANE
S EATING P LANE
VIEW B
θ
L
Note : 1. Re fe r to J EDEC MS -012AA.
2. Dime ns ion "D" doe s not include mold fla s h, protrus ions
or ga te burrs . Mold fla s h, protrus ion or ga te burrs s ha ll not
e xce e d 6 mil pe r s ide .
3. Dime ns ion "E" doe s not include inte r-le a d fla s h or protrus ions .
4. Controlling dime ns ion is millime te r, conve rte d inc h
dime ns ions a re not ne ce s s a rily e xa ct.
S
Y
M
B
O
L
SOP-8
MILLIMETERS
MIN.
MAX.
A
1.35
1.75
A1
0.10
0.25
B
0.33
0.51
C
0.19
0.25
D
4.80
5.00
E
3.80
4.00
e
1.27 BSC
H
5.80
6.20
h
0.25
0.50
L
0.40
1.27
0°
8°
θ
8