APL5610/A Low Dropout Linear Regulator Controller Features General Description • Wide Supply Voltage Range from 4.5 to 13.5V • High Output Accuracy Over Operating Temperature The APL5610/A is a low dropout linear regulator controller. The APL5610/A could drive an external N-Channel MOSFET and provides an adjustable output by using an external resistive divider. and Loading Ranges • Fast Transient Response • Power-On-Reset Monitoring on VCC • Internal Soft-Start Function • Low Shutdown Current: < 5µA • Enable Control Function • Under-Voltage Protection • Power-OK Output with a Delay Time • Two Versions of IC Available: The APL5610/A integrates various functions. For example, a Power-On-Reset (POR) circuit monitors VCC supply voltage to prevent wrong operations; the function of Under-Voltage Protection (UVP) protects the device from short circuit condition. A POK indicates that the output status with time delay which is set internally. It can control other converter for power sequence. Moreover, the APL5610/A can be enabled by other power system; namely, holding - APL5610A: UVP Activated after VCC is Supplied the EN above 1.6V enables output and pulling the EN under 0.4 disables output. • SOT-23-6 Package The APL5610/A is available in SOT-23-6 package. • Lead Free and Green Devices Available - APL5610: UVP Activated after VOUT is Ready Simplified Application Circuit (RoHS Compliant) Applications VCC • Note Book PC Applications • Motherboard Applications VIN ON EN EN VCC DRV OFF APL5610 APL5610A Pin Configuration POK POK VOUT FB GND - APL5610/A EN 1 GND 2 FB 3 6 VCC 5 DRV 4 POK SOT-23-6 (Top View) ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright ANPEC Electronics Corp. Rev. A.4 - Sep., 2009 1 www.anpec.com.tw APL5610/A Ordering and Marking Information Package Code C : SOT-23-6 Operating Ambient Temperature Range I : -40 to 85 oC Handling Code TR : Tape & Reel Assembly Material G : Halogen and Lead Free Device APL5610 APL5610A Assembly Material Handling Code Temperature Range Package Code APL5610 C: L10X X - Date Code APL5610A C: LA0X X - Date Code Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight). Absolute Maximum Ratings (Note 1 ) Symbol VCC VFB VDRV TJ Parameter Rating Unit VCC Input Voltage (VCC to GND) -0.3 to 15 V EN, POK, to GND Voltage -0.3 to 7 V FB to GND Voltage -0.3 to 7 V DRV to GND Voltage -0.3 to VCC+0.3 Maximum Junction Temperature TSTG Storage Temperature TSDR Maximum Lead Soldering Temperature, 10 Seconds V 150 o -65 to 150 o 260 o C C C Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Thermal Characteristic Symbol θJA Parameter Junction-to-Ambient Resistance in Free Air Typical Value Unit (Note 2) SOT-23-6 o 250 C/W Note 2: θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. Recommended Operating Conditions (Note 3) Symbol Parameter VCC VCC Input Voltage (VCC to GND) VEN EN to GND Voltage VOUT VOUT Output Voltage (Note4) TA TJ Range Unit 4.5 to 13.5 V 0 to 5.5 V 0.8 ~ VIN - VDROP Ambient Temperature Junction Temperature V -40 to 85 o -40 to 125 o C C Note 3: Refer to the typical application circuit. Note 4: VDROP defined as the VIN -VOUT voltage at VOUT = 98% normal VOUT. The linear regulator must provide the output MOSFET with sufficient Gate-to-Source voltage (VGS = VCC - VOUT) to regulate the output voltage. Copyright ANPEC Electronics Corp. Rev. A.4 - Sep., 2009 2 www.anpec.com.tw APL5610/A Electrical Characteristics Unless otherwise specified, these specifications apply over VCC = 5/12V, TA = -40 to 85 oC. Typical values are at TA =25oC. Symbol Parameter APL5610/A Test Conditions Min. Typ. Unit Max. SUPPLY CURRENT ICC VCC Supply Current ISD VCC Shutdown Current VCC = 12V - 0.8 1.0 VCC = 5V - 0.8 1.0 VCC = 12V, EN=GND - - 5 VCC = 5V, EN=GND - - 5 3.8 4.0 4.2 V - 0.4 - V mA µA POWER-ON-RESET (POR) VCC POR Threshold VCC rising VCC POR Hysteresis REFERENCE VOLTAGE VREF Reference Voltage VCC = 12V, TA = 25 oC - 0.8 - V Reference Voltage Accuracy VCC = 12V, TA = 25 oC -0.5 - 0.5 % Line Regulation VCC = 4.5V to 13.2V FB Input Current -1.5 - 1.5 % -100 - 100 nA - 2 - MHz ERROR AMPLIFIER PSRR Unity Gain Bandwidth VCC = 5/12V Open Loop DC Gain VCC =12V, No Load 60 80 - dB Power Supply Rejection Ratio VCC =12V, 100Hz, No Load 50 - - dB VCC =12V, IDRV (SOURCE) = 5mA, VFB = 0.6V 11.2 11.5 - VCC =5V, IDRV (SOURCE) = 5mA, VFB = 0.6V - 4.7 - VCC =12V, IDRV (SINK) = 5mA, VFB = 1V - 0.5 1 VCC =5V, IDRV (SINK) = 5mA, VFB = 1V - 0.8 - VCC =12V, VDRV =6V, VFB = 0.6V - 50 - VCC =5V, VDRV =2.5V, VFB = 0.6V - 10 - VCC =12V, VDRV =6V, VFB = 1V - 40 - VCC =5V, VDRV =2.5V, VFB = 1V - 10 - VEN rising - 0.8 - V - 50 - mV - 2 - µs 100 200 300 µs 68 75 82 % - 5 - µs VDRV (high) DRV High Voltage VDRV (low) DRV Low Voltage IDRV (source) DRV Source Current IDRV (sink) DRV Sink Current V V mA mA ENABLE VEN (TH) EN Logic High Threshold Voltage EN Hysteresis EN Shutdown Debounce VEN falling SOFT-START TSS Soft-Start Interval UNDER-VOLTAGE PROTECTION (UVP) VUV (TH) Under-Voltage Threshold VEN =5V, VFB falling UVP Debounce Interval POWER-OK AND DELAY VCC =12V, VFB rising - 90 - % POK Threshold Hysteresis VCC =12V - 15 - % POK Pull-Low Voltage VCC =12V, POK sinks 4mA - 0.2 0.4 V POK Debounce Interval VFB<falling POK voltage threshold - 5 - µs VPOK (TH) Rising POK Threshold Voltage Copyright ANPEC Electronics Corp. Rev. A.4 - Sep., 2009 3 www.anpec.com.tw APL5610/A Electrical Characteristics (Cont.) Unless otherwise specified, these specifications apply over VCC = 5/12V, TA = -40 to 85 oC. Typical values are at TA =25oC. Symbol Parameter APL5610/A Test Conditions Min. Typ. Unit Max. POWER-OK AND DELAY (CONT.) POK Delay Time From VFB =VTHPOK to rising edge of the VPOK 1 2 4 ms POK Leakage Current VPOK =5V - - 1.0 µA Copyright ANPEC Electronics Corp. Rev. A.4 - Sep., 2009 4 www.anpec.com.tw APL5610/A Typical Operating Characteristics Feedback Voltage vs. Junction Temperature Supply Current vs. Supply Voltage 0.50 0.900 0.45 Feedback Voltage (V) Supply Current (mA) 0.875 IC Enabled 0.40 0.35 0.30 0.25 0.20 0.15 IC Disabled 0.10 0.850 0.825 0.800 0.775 0.750 0.725 0.05 0.700 -50 0 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 0 25 50 75 Junction Temperature Supply Voltage (V) 100 125 (oC) DRV Source Current vs. DRV Voltage DRV Sink Current vs. DRV Voltage 70 45 40 60 35 DRV Sink Current (µA) DRV Sink Current (µA) -25 30 25 20 15 10 VIN = 12V, VFB=1V, TA=25oC 5 50 40 30 20 10 VIN = 12V, VFB=0.75V, TA=25oC 0 0 0 2 4 6 8 10 0 12 DRV Voltage (V) Copyright ANPEC Electronics Corp. Rev. A.4 - Sep., 2009 2 4 6 8 10 12 DRV Voltage (V) 5 www.anpec.com.tw APL5610/A Operating Waveforms The test condition TA= 25oC unless otherwise specified. Turn On Response Turn Off Response V CC VCC VDRV 1 1 VDRV V OUT 2 2 VOUT 3 3 VPOK VPOK 4 4 VCC=5V, VIN =5V, VOUT =1.5V, CIN =33µF/ Electrolytic,COUT =1µF/Electrolytic, CH1: VCC, 2V/Div, DC CH2: VDRV, 2V/Div, DC CH3: VOUT, 1V/Div, DC CH4: VPOK, 5V/Div, DC TIME: 2ms/Div VCC=5V, VIN =5V, VOUT =1.5V, CIN =33µF/ Electrolytic,COUT =1µF/Electrolytic, CH1: VCC, 2V/Div, DC CH2: VDRV, 2V/Div, DC CH3: VOUT, 1V/Div, DC CH4: VPOK, 5V/Div, DC TIME: 0.1s/Div Load Transient Response-1 Load Transient Response-2 V OUT VOUT 1 1 I LOA D ILOA D 2 2 VCC=5V, VIN =5V, VOUT=1.2V, ILOAD =0-5-0A(rising/falling edge=1A/µs ), CIN =22µF/MLCC, C OUT =100µF/Electrolytic, VCC=5V, VIN =5V, VOUT=1.5V, ILOAD =0-5-0A(rising/falling edge=1A/µs ), CIN =22µF/MLCC, C OUT =22µF/MLCC, CH1: VOUT, 50mV/Div, AC CH2: IOUT, 2A/Div, DC CH1: VOUT, 50mV/Div, AC CH2: IOUT, 2A/Div, DC TIME:100µs/Div TIME:20µs/Div Copyright ANPEC Electronics Corp. Rev. A.4 - Sep., 2009 6 www.anpec.com.tw APL5610/A Operating Waveforms (Cont.) The test condition TA= 25oC unless otherwise specified. Short Circuit Response (Short-Circuit after Power-up) Load Transient Response-3 VOUT 1 1 2 3 IOUT IOUT VDRV VOUT VPOK 2 4 VCC=5V, VIN =5V, VOUT=1.5V, ILOAD =0-0.2-0A(rising/falling edge=1A/µs ), CIN =22µF/MLCC, C OUT =22µF/MLCC, VCC=5V, VIN =5V, VOUT =1.5V, CIN =22µF/MLCC,COUT =22µF/MLCC, CH1: IOUT, 20A/Div, DC CH2: VDRV, 2V/Div, DC CH3: VOUT (Short to GND after power-up),1V/Div, DC CH4: VPOK, 5V/Div, DC TIME: 20µs/Div CH1: VOUT, 20mV/Div, AC CH2: IOUT, 100mA/Div, DC TIME:100µs/Div Short Circuit Response (Short-Circuit before Power-up) (APL5610A) VOCB VCC VOUT 1 2 3 IOUT VOUT IOUT VPOK 4 VCC=5V, VIN =5V, VOUT =1.5V, CIN =22µF/MLCC,COUT =22µF/MLCC, CH1: VCC, 2V/Div, DC CH2: IOUT, 20A/Div, DC CH3: VOUT (Short to GND before power-up),1V/Div, DC CH4: VPOK, 5V/Div, DC TIME: 20µs/Div Copyright ANPEC Electronics Corp. Rev. A.4 - Sep., 2009 7 www.anpec.com.tw APL5610/A Pin Description PIN FUNCTION NO. NAME 1 EN 2 GND 3 FB 4 POK 5 DRV Voltage Feedback Pin. Connecting this pin to an external resistor divider receives the feedback voltage of the regulator. Power-OK signal output pin. This pin is an open-drain output used to indicate the status of output voltage by sensing FB voltage. This pin is pulled low when output voltage is not within the Power-OK voltage window. This pin drives the gate of an external N-channel MOSFET for linear regulator. 6 VCC Power input pin of the device. The voltage at this pin is monitored for Power-On-Reset purpose. Enable control pin. Pulling the EN high (VEN>1.6) enables the VOUT; forcing the EN low (VEN<0.4V) disables the VOUT. When re-enabled, the IC undergoes a new soft-start process. Ground pin of the circuitry. All voltage levels are measured with respect to this pin. Block Diagram Power-On Reset VCC Internal Regulator Enable_EA POR SoftStart DRV VREF 0.8V Error Amplifier UVP Comparator EN Enable FB Control Logic UV 75%VREF 0.8V POK Power-OK Comparator Enable_EA PWOK Delay GND 90%VREF Copyright ANPEC Electronics Corp. Rev. A.4 - Sep., 2009 8 www.anpec.com.tw APL5610/A Typical Application Circuit VCC CCC 5V or 12V 1µF VIN 1.5V ON EN VCC EN CIN 100µF DRV OFF APM4354KP VOUT APL5610 APL5610A R1 10kΩ POK GND R2 20kΩ 100kΩ Copyright ANPEC Electronics Corp. Rev. A.4 - Sep., 2009 100µF FB POK R3 1.2V COUT 9 www.anpec.com.tw APL5610/A Function Description Power-On-Reset (POR) Power-OK and Delay The APL5610/A monitors the VCC pin voltage (VCC) for power-on-reset function to prevent wrong operation. The The APL5610/A indicates the status of the output voltage by monitoring the feedback voltage (VFB) on FB pin. As the VFB rises and reaches the rising Power-OK voltage thresh- built-in POR circuit keeps the output shutting off until internal circuit is operating properly. Typical POR threshold old (VPOKTH), an internal delay function starts to work. At the end of the delay time, the IC turns off the internal is 4.0V with 0.4V hysteresis. NMOS of the POK to indicate that the output is ok. As the V FB falls and reaches the falling Power-OK voltage Soft-Start The APL5610/A provides an internal soft-start circuitry to threshold, the IC turns on the NMOS of the POK (after a debounce time of 5µs typical). control rise rate of the output voltage and limit the current surge during start-up. Typical soft-start interval is about 0.3ms. Output Voltage Regulation Under-Voltage Protection (UVP) The APL5610/A is a linear regulator controller. An external N-channel MOSFET should be connected to DRV as the The APL5610/A monitors the voltage on FB. When the voltage on FB falls below the under-voltage threshold, pass element. The output voltage set by the resistor divider is determined by: the UVP circuit shuts off the output voltage immediately by pulling down DRV to 0V and latches APL5610/A off, R1 VOUT = 0.8 ⋅ 1 + R 2 requiring either a VCC POR or EN re-enable again to restart. The UVP activation timing is different in these 2 variants Where R1 is connected from VOUT to FB and R2 is connected from FB to GND. of IC, APL5610 and APL5610A. The APL5610 UVP is activated after VOUT voltage has reached 90% POK threshold while the APL5610A UVP is activated after VCC has been applied to VCC pin. In order to avoid erroneous UVP latchoff in APL5610A, please make sure the power sequence is a proper one when you use the APL5610A. For the suggested power sequence of APL5610A, you can refer to the Power Sequencing in Application Information. Enable Control The APL5610/A has a dedicated enable pin (EN). A logic low signal applied to this pin shuts down the output. Following a shutdown, a logic high signal re-enables the output through initiation of a new soft-start cycle. It’s not necessary to use an external transistor to save cost. Copyright ANPEC Electronics Corp. Rev. A.4 - Sep., 2009 10 www.anpec.com.tw APL5610/A Application Information 2. RDS(on) : Select the MOSFET RDS(on) to ensure that the output voltage will never enter dropout: Input Capacitor The APL5610/A requires proper input capacitor of VIN RDS(on )(max) < (VIN(min) –VOUT(max))/ IOUT(max) (connected to the external MOSFET’s drain) to supply surge current during stepping load transients to prevent (Note: RDS(on)(max) must be met at all temperatures and at the minimum VGS condition) the input rail from dropping. Because the parasitic inductor from the voltage sources or other bulk capacitors to 3. Continuous IDS(max): Select the IDS(max) that can support the output current: the VIN limits the slew rate of the surge current, it is necessary to place the input capacitor near the MOSFET’s Continuous IDS(max) > IOUT(max) 4. Package Thermal Resistance θ(JA): Select a package of MOSFET that can dissipate the heat, θ(JA) < (TJ –TA)/PD, drain as close as possible. If the MOSFET is located near the bulk capacitor for upstream voltage regulator, where TJ is the maximum allowable Junction temperature of MOSFET, TA is the ambient temperature, PD is the this input capacitor may not be required. The Input capacitor for VIN should be larger than 1µF. Higher capaci- maximum power dissipation on MOSFET, calculated as below: tance of this VIN input capacitor is needed if the stepping load transients are large and fast. PD =(VIN(max) –VOUT(min)) x IOUT(max) Another input capacitor for VCC is recommended. Placing the input capacitor of VCC as close to VCC pin as possible Power Sequencing (Only for APL5610A) prevents outside noise from entering APL5610/A’s control circuitry. The recommended capacitance of VCC input At start-up, it is necessary to ensure that the VIN (the volt- capacitor is 1µF. age supplied to MOSFET drain), VCC and V EN are sequenced correctly to avoid erroneous latch-off. To avoid Output Capacitor The APL5610/A needs a proper output capacitor to main- UVP latch-off happened at start-up due to sequencing issues, the key method is the VIN should be larger than tain circuit stability and to improve transient response over temperature and current. In order to insure the cir- the output under-voltage threshold plus the drop through the pass MOSFET when that output is enabled. cuit stability, the proper output capacitor value should be larger than 10µF. With X5R and X7R dielectrics, 22µF is Figure 1 and 2 show the two types of power on sequence. Figure 1 shows the VCC comes up before the VIN, and then sufficient at all operating temperatures. the output would be enabled when the VEN is applied. Figure 2 shows the VIN comes up before the VCC, and then POK Pull High the output can either be enabled with the VCC or VEN. Recommended power on sequence is shown in Figure1 and The POK is an open-drain output that needs to be pulled high to a proper voltage (not greater than 5.5V) via a pull- 2. up resistor. The pull-up resistor can be 20kΩ~100kΩ. VCC MOSFET Selection APL5610/A requires an N-channel MOSFET as a pass VIN element. There are some parameters must be considered in selecting a MOFSET, including: Threshold Volt- VEN age VTH, RDS(on ), Continuous IDS current and Package Thermal Resistance. The MOSFET selection guidelines are VUV(TH) VEN(TH) VOUT listed as below: 1. Threshold Voltage VTH: Select the MOSFET VTH rating to VEN(TH) occurs after VUV(TH) is reached meet the following equation: VTH < VCC(min) –VOUT(max) Figure 1. APL5610A supply comes up before MOSFET drain supply Copyright ANPEC Electronics Corp. Rev. A.4 - Sep., 2009 11 www.anpec.com.tw APL5610/A Application Information (Cont.) VCC Power Sequencing (Only for APL5610A) (Cont.) VIN VCC CVCC VIN CVIN VUV(TH) VEN VCC VEN(TH) DRV VOUT APL5610 APL5610A VEN(TH) occurs after VUV(TH) is reached R1 FB Figure 2. MOSFET drain supply comes up before GND R2 COUT Load APL5610A supply Short Circuit Concerns (Only for APL5610) Figure 3 Since the APL5610 UVP function is activated after the VOUT reaches 90% level, any combinations of sequence among VIN, VCC, and VEN are allowable. However, please note that the advantage of none-power-sequencing brings a drawback. If and only if a short circuit condition of output voltage occurs before VIN supply, the UVP won’t be activated. Thus, the short circuit current persists to flow and could impair the MOSFET. If in your application the short circuit is most likely to be encountered before VIN supply, we suggest you use the APL5610A instead of the APL5610, who can provide this short circuit protection. Nevertheless, if the V IN supply can provide the OCP protection, this short circuit won’t be an issue in APL5610. Layout Consideration Figure 3 illustrates the layout. Below is a checklist for your layout: 1. Please place the input capacitor CVCC close to the VCC pin. 2. Please place the CVIN close to the MOSFET’s drain. 3. Layout a copper plane for N-channel MOSFET’s drain to improve the heat dissipation. 4. Output capacitor COUT for load must be placed near the load as close as possible. 5. Large current paths, the bold lines in figure 3, must have wide tracks. Copyright ANPEC Electronics Corp. Rev. A.4 - Sep., 2009 12 www.anpec.com.tw APL5610/A Package Information SOT-23-6 D e E E1 SEE VIEW A b c 0.25 A L 0 GAUGE PLANE SEATING PLANE A1 A2 e1 VIEW A S Y M B O L SOT-23-6 INCHES MILLIMETERS MAX. MIN. A MIN. MAX. 1.45 0.057 0.00 0.15 0.000 0.006 A2 0.90 1.30 0.035 0.051 b 0.30 0.50 0.012 0.020 A1 c 0.08 0.22 0.003 0.009 D 2.70 3.10 0.106 0.122 E 2.60 3.00 0.102 0.118 E1 1.40 1.80 0.055 e 0.95 BSC e1 L 0 0.071 0.037 BSC 0.075 BSC 1.90 BSC 0.30 0.60 0° 8° 0.012 0° 0.024 8° Note : 1. Follow JEDEC TO-178 AB. 2. Dimension D and E1 do not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side. Copyright ANPEC Electronics Corp. Rev. A.4 - Sep., 2009 13 www.anpec.com.tw APL5610/A Carrier Tape & Reel Dimensions P0 P2 P1 A B0 W F E1 OD0 K0 A0 A OD1 B B T SECTION A-A SECTION B-B H A d T1 Application SOT-23-6 A H T1 C d D W E1 F 178.0±2.00 50 MIN. 8.4+2.00 -0.00 13.0+0.50 -0.20 1.5 MIN. 20.2 MIN. 8.0±0.30 1.75±0.10 3.5±0.05 P0 P1 P2 D0 D1 T A0 B0 K0 4.0±0.10 4.0±0.10 2.0±0.05 1.5+0.10 -0.00 1.0 MIN. 0.6+0.00 -0.40 3.20±0.20 3.10±0.20 1.50±0.20 (mm) Devices Per Unit Package Type Unit Quantity SOT-23-6 Tape & Reel 3000 Copyright ANPEC Electronics Corp. Rev. A.4 - Sep., 2009 14 www.anpec.com.tw APL5610/A Taping Direction Information SOT-23-6 USER DIRECTION OF FEED AAAX AAAX AAAX AAAX AAAX AAAX AAAX Classification Profile Copyright ANPEC Electronics Corp. Rev. A.4 - Sep., 2009 15 www.anpec.com.tw APL5610/A Classification Reflow Profiles Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly 100 °C 150 °C 60-120 seconds 150 °C 200 °C 60-120 seconds 3 °C/second max. 3°C/second max. 183 °C 60-150 seconds 217 °C 60-150 seconds See Classification Temp in table 1 See Classification Temp in table 2 Time (tP)** within 5°C of the specified classification temperature (Tc) 20** seconds 30** seconds Average ramp-down rate (Tp to Tsmax) 6 °C/second max. 6 °C/second max. 6 minutes max. 8 minutes max. Preheat & Soak Temperature min (Tsmin) Temperature max (Tsmax) Time (Tsmin to Tsmax) (ts) Average ramp-up rate (Tsmax to TP) Liquidous temperature (TL) Time at liquidous (tL) Peak package body Temperature (Tp)* Time 25°C to peak temperature * Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Table 1. SnPb Eutectic Process – Classification Temperatures (Tc) Package Thickness <2.5 mm ≥2.5 mm Volume mm <350 235 °C 220 °C 3 Volume mm ≥350 220 °C 220 °C 3 Table 2. Pb-free Process – Classification Temperatures (Tc) Package Thickness <1.6 mm 1.6 mm – 2.5 mm ≥2.5 mm Volume mm <350 260 °C 260 °C 250 °C 3 Volume mm 350-2000 260 °C 250 °C 245 °C 3 Volume mm >2000 260 °C 245 °C 245 °C 3 Reliability Test Program Test item SOLDERABILITY HOLT PCT TCT HBM MM Latch-Up Copyright ANPEC Electronics Corp. Rev. A.4 - Sep., 2009 Method JESD-22, B102 JESD-22, A108 JESD-22, A102 JESD-22, A104 MIL-STD-883-3015.7 JESD-22, A115 JESD 78 16 Description 5 Sec, 245°C 1000 Hrs, Bias @ 125°C 168 Hrs, 100%RH, 2atm, 121°C 500 Cycles, -65°C~150°C VHBM≧2KV VMM≧200V 10ms, 1tr≧100mA www.anpec.com.tw APL5610/A Customer Service Anpec Electronics Corp. Head Office : No.6, Dusing 1st Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 2F, No. 11, Lane 218, Sec 2 Jhongsing Rd., Sindian City, Taipei County 23146, Taiwan Tel : 886-2-2910-3838 Fax : 886-2-2917-3838 Copyright ANPEC Electronics Corp. Rev. A.4 - Sep., 2009 17 www.anpec.com.tw