APW7209 1MHz, High-Efficiency, Step-Up Converter for 2 to 10 White LEDs Features General Description • • • • • 0.3V Reference Voltage The APW7209 is a current-mode and fixed frequency boost converter with an integrated N-FET to drive up to 10 Fixed 1MHz Switching Frequency white LEDs in series. High Efficiency up to 88% The series connection allows the LED current to be identical for uniform brightness. Its low on-resistance of N- Wide Input Voltage from 2.5V to 6V 100Hz to 100kHz PWM Brightness Control Fre- FET and low feedback voltage reduce power loss and achieve high efficiency. Fast switching frequency(1MHz quency • • • Open-LED Protection • <1µA Quiescent Current during Shutdown • • SOT-23-6 Package typical) allows using small-size inductor and both of input and output capacitors. An over voltage protection Under-Voltage Lockout Protection Over-Temperature Protection function, which monitors the output voltage via OVP pin, stops switching of the IC if the OVP voltage exceeds the over voltage threshold. An internal soft-start circuit eliminates the inrush current during start-up. Lead Free and Green Devices Available The APW7209 also integrates under-voltage lockout, overtemperature protection, and current limit circuits to pro- (RoHS Compliant) tect the IC in abnormal conditions.The APW7209 is available in a SOT-23-6 package. Applications • White LED Display Backlighting • Cell Phone and Smart Phone • PDA, PMP, MP3 • Digital Camera Simplified Application Circuit VIN VOUT L1 22µH Pin Configuration C1 4.7µF SOT-23-6 Top View LX 1 GND 2 FB 3 6 2 6 VIN 5 OVP OFF ON 4 VIN GND LX OVP APW7209 EN FB 1 5 C2 1µF Up to 10 WLEDs 3 R1 15Ω 4 EN ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright ANPEC Electronics Corp. Rev. A.3 - Jul., 2008 1 www.anpec.com.tw APW7209 Ordering and Marking Information Package Code C : SOT-23-6 Operating Ambient Temperature Range I : -40 to 85oC Handling Code TR : Tape & Reel Assembly Material L : Lead Free Device G : Halogen and Lead Free Device APW7209 Assembly Material Handling Code Temperature Range Package Code APW7209 CI: X - Date Code W09X Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight). Absolute Maximum Ratings Symbol VIN (Note 1) Parameter VIN Supply Voltage (VIN to GND) Rating Unit -0.3 ~ 7 V FB, EN to GND Voltage -0.3 ~ VIN V VLX LX to GND Voltage -0.3 ~ 42 V VOVP OVP to GND Voltage -0.3 ~ 42 V 150 °C TJ Maximum Junction Temperature TSTG Storage Temperature TSDR Maximum Lead Soldering Temperature, 10 Seconds -65 ~ 150 °C 260 °C Note 1: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Thermal Characteristics (Note 2) Parameter Symbol θJA Typical Value Junction to Ambient Thermal Resistance. SOT-23-6 Unit °C/W 250 Note 2: θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. Recommended Operating Conditions (Note 3) Symbol Parameter Range Unit VIN VIN Input Voltage 2.5~ 6 V CIN Input Capacitor 4.7 or higher µF COUT Output capacitor 0.68 or higher µF 6.8 ~ 47 µH L1 Inductor TA Ambient Temperature -40 ~ 85 °C TJ Junction Temperature -40 ~ 125 °C Note 3: Refer to the application circuit for further information. Copyright ANPEC Electronics Corp. Rev. A.3 - Jul., 2008 2 www.anpec.com.tw APW7209 Electrical Characteristics (Refer to figure 1 in the “Typical Application Circuits”. These specifications apply over VIN = 3.6V, TA = -40°C to 85°C, unless otherwise noted. Typical values are at TA = 25°C.) Symbol Parameter Test Conditions APW7209 Min. Typ. Max. Unit SUPPLY VOLTAGE AND CURRENT VIN Input Voltage Range IDD1 IDD2 Input DC bias current ISD TA = -40 ~ 85°C, TJ = -40 ~ 125°C 2.5 - 6 V VFB = 0.4V, no switching 70 100 130 µA FB = GND, switching - 1 2 mA EN = GND - - 1 µA VIN Rising 2.0 2.2 2.4 V 50 100 150 mV TA = 25°C 0.285 0.3 0.315 TA = -40 ~ 85°C (TJ = -40 ~ 125°C) 0.276 - 0.324 -50 - 50 nA 0.8 1.0 1.2 MHz Ω UNDER VOLTAGE LOCKOUT UVLO Threshold Voltage UVLO Hysteresis Voltage REFERENCE AND OUTPUT VOLTAGES VREF IFB Regulated Feedback Voltage FB Input Current V INTERNAL POWER SWITCH FSW Switching Frequency RON Power Switch On Resistance ILIM Power Switch Current Limit LX Leakage Current DMAX FB=GND VEN=0V, VLX=0V or 5V, VIN = 5V LX Maximum Duty Cycle - 0.6 - 0.7 0.9 1.2 A -1 - 1 µA 92 95 98 % OUTPUT OVER VOLTAGE PROTECTION VOVP Over Voltage Threshold VOVP rising - 40 - V - 3 - V VOVP =40V - 50 - µA VEN Rising 0.4 0.7 1 V - 0.1 - V VEN= 0~5V, VIN = 5V -1 - 1 µA TJ Rising - 150 - °C - 40 - °C OVP Hysteresis OVP Leakage Current ENABLE AND SHUTDOWN VTEN EN Voltage Threshold EN Voltage Hysteresis ILEN EN Leakage Current OVER-TEMPERATURE PROTECTION TOTP Over-Temperature Protection (Note 4) Over-Temperature Protection Hysteresis (Note 4) Note 4: Guaranteed by design, not production tested. Copyright ANPEC Electronics Corp. Rev. A.3 - Jul., 2008 3 www.anpec.com.tw APW7209 Typical Operating Characteristics (Refer to figure 1 in the section “Typical Application Circuits”, VIN=3.6V, TA=25oC, 10WLEDs unless otherwise specified) WLED Current vs. PWM Duty Cycle 20 90 18 85 16 WLED Current, ILED (mA) Efficiency (η) Efficiency vs. WLED Current 95 80 75 70 VIN=5V 65 VIN=4.2V VIN=3.6V 60 VIN=3.3V 55 10 WLEDs ≅ 33V@20mA η=POUT/PIN 14 12 10 8 100KHz 6 4 1KHz 2 100Hz 0 50 0 5 10 15 20 25 30 0 20 WLED Current, ILED (mA) 21.0 80 100 100 Maximum Duty Cycle, DMAX (%) 20.8 WLED Current, ILED (mA) 60 Maximum Duty Cycle vs. Supply Voltage WLED Current vs. Supply Voltage 20.6 20.4 20.2 20.0 19.8 19.6 19.4 19.2 19.0 90 80 70 60 50 40 2.5 3 3.5 4 4.5 5 5.5 6 2.5 3 Supply Voltage, VIN (V) 3.5 4 4.5 5 5.5 6 Supply Voltage, VIN (V) Switching Frequency vs. Supply Voltage Switch ON Resistance vs. Supply Voltage 0.8 Switch ON Resistance, RON (Ω) 1.2 Switching Frequency, FSW (MHz) 40 PWM Duty Cycle (%) 1.1 1 0.9 0.8 0.7 0.6 0.5 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0.4 2.5 3 3.5 4 4.5 5 5.5 2.5 6 3.5 4 4.5 5 5.5 6 Supply Voltage, VIN (V) Supply Voltage, VIN (V) Copyright ANPEC Electronics Corp. Rev. A.3 - Jul., 2008 3 4 www.anpec.com.tw APW7209 Operating Waveforms (Refer to the application circuit in the section “Typical Application Circuits”, VIN=3.6V, TA=25oC, 10WLEDs unless otherwise specified ) Start-up 1 Normal Operating Waveform VEN 1 VOUT, 10V/Div VLX, 20V/Div, DC 2 VOUT, 100mV/Div, AC 2 IIN, 0.2A/Div 3 IL, 0.2A/Div 3 10WLEDs, L=22µH, VIN=3.6V, ILED=20mA 10WLEDs, L=22µH, VIN=3.6V, ILED=20mA CH1: VEN, 1V/Div, DC CH2: VOUT, 10V/Div, DC CH3: IIN, 0.2A/Div, DC Time: 0.5ms/Div CH1: VLX, 20V/Div, DC CH2: VOUT, 100mV/Div, AC CH3: IL, 0.2A/Div, DC Time: 500ns/Div Open-LED Protection VOUT, 10V/Div 1 CH1: VOUT, 10V/Div, DC Time: 20ms/Div Copyright ANPEC Electronics Corp. Rev. A.3 - Jul., 2008 5 www.anpec.com.tw APW7209 Pin Description PIN NO. NAME 1 LX 2 GND 3 FB FUNCTION Switch pin. Connect this pin to inductor/diode here. Power and signal ground pin. Feedback Pin. Reference voltage is 0.3V(typical). Connect this pin to cathode of the lowest LED and current-sense resistor (R1). Calculate resistor value according to R1=0.3V/ILED. Enable Control Input. Forcing this pin above 1.0V enables the device, or forcing this pin below 0.4V 4 to shut it down. In shutdown, all functions are disabled to decrease the supply current below 1µA. EN Do not leave this pin floating. 5 OVP Over Voltage Protection Input Pin. OVP is connected to the output capacitor of the converter. 6 VIN Main Supply Pin. Must be closely decoupled to GND with a 4.7µF or greater ceramic capacitor. Block Diagram VIN EN OVP UVLO LX Gate Driver Control Logic OverTemperature Protection Slope Compensation Current limit Current Sense Amplifier ICMP Error Amplifier Σ Oscillator FB GND COMP EAMP Softstart Copyright ANPEC Electronics Corp. Rev. A.3 - Jul., 2008 6 VREF 0.3V www.anpec.com.tw APW7209 Typical Application Circuits VOUT L1 VIN 22µH C1 4.7µF 6 2 4 OFF ON 1 LX VIN GND C2 1µF Up to 10 WLEDs 5 OVP APW7209 3 FB EN R1 15Ω Figure 1. Typical 10 WLEDs Application L1 VIN VOUT 22µH C1 4.7µF 6 2 100Hz~100kHz VIN 1 LX GND C2 1µF Up to 10 WLEDs 5 OVP APW7209 4 EN 3 FB Duty=100%, ILED=20mA R1 15Ω Duty=0%, LED off Figure 2. Brightness control by using a PWM signal applied to EN VIN VOUT L1 22µH C1 4.7µF 6 2 OFF ON 4 LX VIN GND OVP FB 5 Up to 10 WLEDs 3 R2 10K R3 100K PWM 0V brightness control Duty=100%, LED off Duty=0%, ILED=22mA R1 = C2 1µF APW7209 EN 3.3V R2 = VREF ⋅ 1 R1 15Ω VADJ R4 10K C3 0.1µF ILED,MAX ⋅ R3 + VADJ,MIN − ILED,MIN ⋅ R3 − VADJ,MAX VADJ,MAX ⋅ ILED,MAX + VREF ⋅ ILED,MIN − VADJ,MIN ⋅ ILED,MIN − VREF ⋅ ILED,MAX R2 R2 V REF ⋅ 1 + ⋅ V ADJ − R3 R3 ILED ,MAX ,MIN Figure 3. Brightness control using a filtered PWM signal Copyright ANPEC Electronics Corp. Rev. A.3 - Jul., 2008 7 www.anpec.com.tw APW7209 Function Description Main Control Loop Over-Temperature Protection (OTP) The APW7209 is a constant frequency current-mode The over-temperature circuit limits the junction temperature of the APW7209. When the junction temperature ex- switching regulator. During normal operation, the internal N-channel power MOSFET is turned on each cycle ceeds 150 oC, a thermal sensor turns off the power MOSFET, allowing the device to cool. The thermal sen- when the oscillator sets an internal RS latch and turned off when an internal comparator (ICMP) resets the latch. sor allows the converter to start a soft-start process and regulate the LEDs current again after the junction tem- The peak inductor current at which ICMP resets the RS latch is controlled by the voltage on the COMP node, which perature cools by 40oC. The OTP is designed with a 40oC hysteresis to lower the average Junction Temperature is the output of the error amplifier (EAMP). An external current-sense resistor connected between cathode of the (TJ) during continuous thermal overload conditions, increasing the lifetime of the device. lowest LED and ground allows the EAMP to receive a current feedback voltage VFB at FB pin. When the LEDs Enable/Shutdown voltage increases to cause the LEDs current to decrease, it causes a slightly decrease in VFB relative to the 0.3V Driving EN to ground places the APW7209 in shutdown reference, which in turn causes the COMP voltage to increase until the LEDs current reaches the set point. mode. When in shutdown, the internal power MOSFET turns off, all internal circuitry shuts down and the quiescnet supply current reduces to 1µA maximum. VIN Under-Voltage Lockout (UVLO) The Under-Voltage Lockout (UVLO) circuit compares the This pin also could be used as a digital input allowing brightness controlled by using a PWM signal with fre- input voltage at VIN with the UVLO threshold (2.2V rising, typical) to ensure the input voltage is high enough for quency from 100Hz to 100kHz. The 0% duty cycle of PWM signal corresponds to zero LEDs current and 100% cor- reliable operation. The 100mV (typ) hysteresis prevents supply transients from causing a restart. Once the input responds to full one. voltage exceeds the UVLO rising threshold, startup begins. When the input voltage falls below the UVLO falling Open-LED Protection In driving LED applications, the feedback voltage on FB pin falls down if one of the LEDs, in series, is failed. threshold, the controller turns off the converter. Soft-Start Meanwhile, the converter unceasingly boosts the output voltage like a open-loop operation. Therefore, an over- The APW7209 has a built-in soft-start to control the Nchannel MOSFET current rise during start-up. During soft- voltage protection (OVP), monitoring the output voltage via OVP pin, is integrated into the chip to prevent the LX start, an internal ramp voltage, connected to one of the inverting inputs of the comoarator ICMP, raise up to re- and the output voltages from exceeding their maximum voltage ratings. When the voltage on the OVP pin rises place the output voltage of error amplifier until the ramp voltage reaches the VCOMP. above the OVP threshold (40V, typical), the converter stops switching and prevents the output voltage from Current-Limit Protection rising. The converter can work again when the falling OVP voltage falls below the OVP voltage threshold. The APW7209 monitors the inductor current, flowing through the N-channel MOSFET, and limits the current peak at current-limit level to prevent loads and the APW7209 from damages in overload conditions. Copyright ANPEC Electronics Corp. Rev. A.3 - Jul., 2008 8 www.anpec.com.tw APW7209 Application Information The peak inductor current is calculated as the following equation: Input Capacitor Selection The input capacitor (CIN) reduces the ripple of the input current drawn from the input supply and reduces noise injection into the IC. The reflected ripple voltage will be smaller when an input capacitor with larger capacitance is used. For reliable operation, it is recommended to select the capacitor with maximum voltage rating at least IPEAK = IIN(MAX ) + VIN 1.2 times of the maximum input voltage. The capacitors should be placed close to the VIN and GND. 1 VIN ⋅ (VOUT − VIN ) ⋅ 2 VOUT ⋅ L ⋅ FSW IL IIN LX N-FET CIN IOUT D1 VOUT ESR ISW COUT Inductor Selection Selecting an inductor with low dc resistance reduces con- IL duction losses and achieves high efficiency. The efficiency is moderated whilst using small chip inductor which op- ILIM IPEAK erates with higher inductor core losses. Therefore, it is ∆IL necessary to take further consideration while choosing an adequate inductor. Mainly, the inductor value deter- IIN mines the inductor ripple current: larger inductor value results in smaller inductor ripple current and lower con- ISW duction losses of the converter. However, larger inductor value generates slower load transient response. A reasonable design rule is to set the ripple current, ∆IL, to be 30% to 50% of the maximum average inductor current, IL(AVG). The inductor value can be obtained as below, V L ≥ IN VOUT ID 2 VOUT − VIN η × × F ×I ∆IL SW OUT (MAX ) IL (AVG ) IOUT Output Capacitor Selection where The current-mode control scheme of the APW7209 al- VIN = input voltage lows the usage of tiny ceramic capacitors. The higher capacitor value provides good load transient response. VOUT = output voltage Ceramic capacitors with low ESR values have the lowest output voltage ripple and are recommended. If required, FSW = switching frequency in MHz IOUT = maximum output current in amp. tantalum capacitors may be used as well. The output ripple is the sum of the voltages across the ESR and the ideal η = Efficiency ∆IL /IL(AVG) = inductor ripple current/average current output capacitor. (0.3 to 0.5 typical) To avoid saturation of the inductor, the inductor should be rated at least for the maximum input current of the con- Δ VOUT = ΔVESR + ΔVCOUT verter plus the inductor ripple current. The maximum input current is calculated as below: ∆VCOUT ≈ IIN(MAX ) = ∆VESR ≈ IPEAK × RESR IOUT (MAX ) × VOUT where IPEAK is the peak inductor current. VIN × η Copyright ANPEC Electronics Corp. Rev. A.3 - Jul., 2008 IOUT VOUT − VIN × COUT VOUT × FSW 9 www.anpec.com.tw APW7209 Application Information (Cont.) Output Capacitor Selection (Cont.) Setting the LED Current For ceramic capacitor application, the output voltage ripple is dominated by the ∆VCOUT. When choosing the input and In figure 1, the converter regulates the voltage on FB pin, connected with the cathod of the lowest LED and the cur- output ceramic capacitors, the X5R or X7R with their good temperature and voltage characteristics are rent-sense resistor R1, at 0.3V (typical). Therefore, the current (ILED), flowing via the LEDs and the R1, is calcu- recommended. lated by the following equation: Diode Selection ILED = To achieve high efficiency, a Schottky diode must be used. The current rating of the diode must meet the peak cur- 0 .3 V R1 rent rating of the converter. Recommended Inductor Selection Designator Manufacturer L1 L1 GOTREND GOTREND 0.35 0.59 Saturation Current (A) 0.62 0.52 Dimensions L x W x H (mm3) 5 x 5 x 2.8 3.85 x 3.85 x 1.8 TC Code X5R X7R Rated Voltage (V) 6.3 50 Case size 0603 0805 Part Number Inductance (µH) Max DCR (ohm) GTSD-53-470 GTSD-32-220 47 22 Recommended Capacitor Selection Part Number Designator Manufacturer C1 Murata GRM188R60J475KE19 C2 Murata GRM21BR71H105KA12 Capacitance (µF) 4.7 1.0 Recommended Diode Selection Designator Manufacturer D1 Zowie Part Number MSCD106 Maximum average forward rectified current (A) 1.0 Maximum repetitive peak reverse voltage (V) 60 Case size 0805 Layout Consideration For all switching power supplies, the layout is an important step in the design; especially at high peak currents and switching frequencies. If the layout is not carefully done, the regulator might show noise problems and duty cycle jitter. Via To OVP L1 To Anode of WLEDs VOUT D1 C1 LX VIN C2 1. The input capacitor should be placed close to the VIN and GND. Connecting the capacitor with VIN and GND pins by short and wide tracks without using any vias for filtering and minimizing the input voltage ripple. Via To VOUT R1 VEN From Cathod of WLEDs 2. The inductor should be placed as close as possible to the LX pin to minimize length of the copper tracks as well as the noise coupling into other circuits. Refer to Fig. 1 Optimized APW7209 Layout 3. Since the feedback pin and network is a high impedance circuit, the feedback network should be routed away from the inductor. The feedback pin and feedback network should be shielded with a ground plane or track to minimize noise coupling into this circuit. 4. A star ground connection or ground plane minimizes ground shifts and noise is recommended. Copyright ANPEC Electronics Corp. Rev. A.3 - Jul., 2008 10 www.anpec.com.tw APW7209 Package Information SOT-23-6 D e E E1 SEE VIEW A b c 0.25 A L 0 GAUGE PLANE SEATING PLANE A1 A2 e1 VIEW A S Y M B O L SOT-23-6 MILLIMETERS MIN. INCHES MAX. A MIN. MAX. 1.45 0.057 A1 0.00 0.15 0.000 0.006 A2 0.90 1.30 0.035 0.051 b 0.30 0.50 0.012 0.020 c 0.08 0.22 0.003 0.009 D 2.70 3.10 0.106 0.122 E 2.60 3.00 0.102 0.118 E1 1.40 1.80 0.055 e e1 L 0 0.071 0.037 BSC 0.95 BSC 0.075 BSC 1.90 BSC 0.30 0.60 0° 8° 0.012 0° 0.024 8° Note : 1. Follow JEDEC TO-178 AB. 2. Dimension D and E1 do not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side. Copyright ANPEC Electronics Corp. Rev. A.3 - Jul., 2008 11 www.anpec.com.tw APW7209 Carrier Tape & Reel Dimensions P0 P2 P1 A B0 W F E1 OD0 K0 A0 A OD1 B B T SECTION A-A SECTION B-B H A d T1 Application SOT-23-6 A H T1 C d 178.0± 2.00 50 MIN. P0 P1 P2 D0 D1 4.0±0.10 4.0±0.10 2.0±0.05 1.5+0.10 -0.00 1.0 MIN. D W E1 F 8.0±0.30 1.75±0.10 3.5±0.05 T A0 B0 K0 0.6+0.00 -0.40 3.20±0.20 8.4+2.00 13.0+0.50 1.5 MIN. 20.2 MIN. -0.00 -0.20 3.10±0.20 1.50±0.20 (mm) Devices Per Unit Package Type Unit Quantity SOT-23-6 Tape & Reel 3000 Copyright ANPEC Electronics Corp. Rev. A.3 - Jul., 2008 12 www.anpec.com.tw APW7209 Reflow Condition (IR/Convection or VPR Reflow) tp TP Critical Zone TL to TP Ramp-up Temperature TL tL Tsmax Tsmin Ramp-down ts Preheat 25 t 25°C to Peak Time Reliability Test Program Test item SOLDERABILITY HOLT PCT TST ESD Latch-Up Method MIL-STD-883D-2003 MIL-STD-883D-1005.7 JESD-22-B, A102 MIL-STD-883D-1011.9 MIL-STD-883D-3015.7 JESD 78 Description 245°C, 5 sec 1000 Hrs Bias @125°C 168 Hrs, 100%RH, 121°C -65°C~150°C, 200 Cycles VHBM > 2KV, VMM > 200V 10ms, 1tr > 100mA Classification Reflow Profiles Profile Feature Average ramp-up rate (TL to TP) Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts) Time maintained above: - Temperature (TL) - Time (tL) Peak/Classification Temperature (Tp) Time within 5°C of actual Peak Temperature (tp) Ramp-down Rate Time 25°C to Peak Temperature Sn-Pb Eutectic Assembly Pb-Free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 217°C 60-150 seconds See table 1 See table 2 10-30 seconds 20-40 seconds 6°C/second max. 6°C/second max. 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface. Copyright ANPEC Electronics Corp. Rev. A.3 - Jul., 2008 13 www.anpec.com.tw APW7209 Classification Reflow Profiles (Cont.) Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures 3 3 Package Thickness Volume mm <350 Volume mm ≥350 <2.5 mm ≥2.5 mm 240 +0/-5°C 225 +0/-5°C 225 +0/-5°C 225 +0/-5°C Table 2. Pb-free Process – Package Classification Reflow Temperatures 3 Package Thickness 3 Volume mm <350 Volume mm 350-2000 3 Volume mm >2000 <1.6 mm 260 +0°C* 260 +0°C* 260 +0°C* 1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C* ≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C* * Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level. Customer Service Anpec Electronics Corp. Head Office : No.6, Dusing 1st Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 2F, No. 11, Lane 218, Sec 2 Jhongsing Rd., Sindian City, Taipei County 23146, Taiwan Tel : 886-2-2910-3838 Fax : 886-2-2917-3838 Copyright ANPEC Electronics Corp. Rev. A.3 - Jul., 2008 14 www.anpec.com.tw