APX9267 Single-Phase Full-Wave Motor Driver for Silent Fan Motor General Description Features • Single Phase Full Wave Fan Driver • Silent Driver • Low Supply Current • Low Standby Current (Lock mode TOFF or PWM=0 The APX9267 is a single phase full wave motor driver for DC fan motor, and speed controlled by PWM input signal. The output signal of this IC is the amplified hall input signal. It is suitable for both game machine and CPU cooler that need silent drivers. The device is built-in lock protection. When fan is locked, the device will enter the duty), Supply current less than 220µA • Speed Controllable by PWM Input Signal • Built-in Quick Start Function • Lock Protection and Auto Restart Function • Built-in FG Output • Built-in Thermal Protection Circuit • Lead Free and Green Devices Available lockup protection mode. It is also with thermal shutdown function. In normal operation, supply current is less than 5mA, but in PWM=0 standby mode, it is just around 150mA. Moreover, this feature will shutdown Amplifier and FG. The APX9267 is available in MSOP-8 package. Pin Configuration (RoHS Compliant) OUT2 VCC IN+ IN- Applications • Motor Drivers For Silent Fan Motors 1 2 3 4 MSOP-8 8 7 6 5 GND OUT1 PWM FG Ordering and Marking Information Package Code X : MSOP-8 Operating Ambient Temperature Range I : -40 to 105 °C Handling Code TR : Tape & Reel Assembly Material L : Lead Free Device G :Halogen and Lead Free Device APX9267 Assembly Material Handling Code Temperature Range Package Code APX9267 X : A9267 XXX XX XXXXX - Date Code Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish;which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature.ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight). Absolute Maximum Ratings (Note 1) Symbol VCC Parameter VCC Pin Supply Voltage Rating Unit 7 V IOUT Output Pin Output Current 1 A VOUT Output Pin Output Voltage 7 V VFG FG Pin Output Voltage 7 V IFG FG Pin Sink Current 10 mA ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright ANPEC Electronics Corp. Rev. A.6 - Mar., 2008 1 www.anpec.com.tw APX9267 Absolute Maximum Ratings (Cont.) Symbol RTH, JA Parameter Thermal Resistance-Junction to Ambient MSOP-8 Rating Unit 225 °C/W PD Power Dissipation 0.585 W TJ Junction Temperature -40 to 150 °C TSTG Storage Temperature -65 to 150 °C TSDR Maximum Lead Soldering Temperature, 10 Seconds 260 °C Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Recommended Operating Conditions Symbol Parameter Rating Unit VCC VCC Pin Supply Voltage 2.3 to 5.5 V VHall Hall Input Voltage Range 0.2 to Vcc-1.1 V -40 to 105 °C TA Ambient Temperature Electrical Characteristics Symbol Parameter (VCC=5V, TA= 25°C, unless otherwise specified) Test Conditions APX9267 Min. Typ. Max. Unit ICC1 Operating Current Rotation Mode - 3 5 mA ICC2 Standby Supply Current Lock Protect TOFF or PWM= 0 - 150 220 µA 2.5 - VCC+0.5 V 0 - 1 V 0.02 - 50 kHz VPWMH PWM Input High Level Voltage VPWML PWM Input Low Level Voltage FPWM PWM Input Frequency VHOFS Input Offset Voltage GIO Input–Output Gain VOUT/H+-H-(ratio) - - ±6 mV 45 48 51 dB VOL Output Lower Side Saturation IOUT= 250mA - 0.15 0.22 V VOH Output Upper Side Saturation IOUT= 250mA - 0.15 0.22 V VFG FG Pin Low Voltage IFG= 3mA - 0.2 0.3 V IFG FG Pin Leak Current VFG= 5V - - 10 µA Over Temperature Shutdown - 170 - Over Temperature Shutdown Hysteresis - 35 - Quick Start Enable Time - 66.5 90 TQS Copyright ANPEC Electronics Corp. Rev. A.6 - Mar., 2008 2 °C mSec www.anpec.com.tw APX9267 Typical Operating Characteristics VCC Supply Current vs. VCC Supply Voltage VCC Supply Current vs. VCC Supply Voltage 250 4 Operation Mode Standby Mode VCC Supply Current (µA) VCC Supply Current (mA) 3.5 3 2.5 2 1.5 1 0.5 0 200 150 100 50 0 0 1 2 3 4 5 6 0 7 1 VCC Supply Voltage (V) Offset Voltage (mV) FG Pin Current (mA) 5 6 7 1.2 1 0.8 0.6 0.4 0.2 0 0 -40 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 -20 Maximum Power Dissipation (mW) 0.7 0.6 Upper Side MOSFET 0.4 0.3 0.2 Low Side MOSFET 0.1 0 100 200 300 400 500 600 700 40 60 80 700 600 500 400 300 200 100 0 800 0 Output Current (mA) Copyright ANPEC Electronics Corp. Rev. A.6 - Mar., 2008 20 Maximum Power Dissipation vs. Ambient Temperature 0.8 0.5 0 Ambient Temperature (°C) Saturation Voltage vs. Output Current Saturation Voltage (V) 4 1.4 FG Pin Low Voltage (V) 0 3 Offset Voltage vs. Ambient Temperature FG Pin Current vs. FG Pin Low Voltage 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 2 VCC Supply Voltage (V) 25 50 75 100 125 150 Ambient Temperature (°C) 3 www.anpec.com.tw APX9267 Operating Waveforms Rotation Waveform 1 VIN+(50mV/div) Rotation Waveform 2 VIN+(50mV/div) VIN-(50mV/div) VOUT1(2V/div) VOUT2(2V/div) VIN-(50mV/div) VOUT1(2V/div) Time (0.2ms/div) VOUT2(2V/div) Time (0.2ms/div) Rotation Waveform 3 Rotation Waveform 4 IIN(100mA/div) IIN(100mA/div) VOUT1(5V/div) VOUT1(5V/div) VOUT2(5V/div) VOUT2(5V/div) VFG(5V/div) VFG(5V/div) Time (0.2ms/div) Time (2ms/div) Lock Protection Waveform 1 Lock Protection Waveform 2 IOUT(200mA/div) IOUT(200mA/div) VOUT1(5V/div) VOUT1(5V/div) VOUT2(5V/div) VOUT2(5V/div) VFG(5V/div) VFG(5V/div) Time (2s/div) Time (2s/div) Copyright ANPEC Electronics Corp. Rev. A.6 - Mar., 2008 4 www.anpec.com.tw APX9267 Pin Description PIN Description No. Name 1 OUT2 H-bridge Output Connection. The output stage is a H-bridge formed by four transistors and four-protection diode for switching applications. 2 VCC Supply Voltage Input Pin. 3 IN+ Hall Input +. 4 IN- Hall Input -. 5 FG Rotation Speed Output. 6 PWM PWM Signal Input Terminal. 7 OUT1 H-bridge Output Connection. The output stage is a H-bridge formed by four transistors and four-protection diode for switching applications. 8 GND Ground. Block Diagram OUT2 GND 150kΩ OSC VCC 500Ω Vcc Lock Protection OUT1 5µA Control TSD 90KΩ PWM 10kΩ IN+ 500Ω 150kΩ FG IN- Copyright ANPEC Electronics Corp. Rev. A.6 - Mar., 2008 5 www.anpec.com.tw APX9267 Typical Application Circuit D1 1 OUT2 GND 8 2 VCC OUT1 7 Zener D2 VIN C1 6V Hall PWM control signal 3 IN+ PWM 6 4 IN- FG 5 10kΩ Pull High Voltage RFG FG Output Note 2: In hot plug application, it’s necessary to protect against a hot plug input voltage overshoot. Add an input zener diode, between the VCC and GND, to clamp the overshoot. In normal operation diode, the zener diode isn’t stressed because output current doesn’t reverse to VCC. Function Description Lockup Protection and Automatic Restart Quick Start and Standby mode This IC detects the rotation of the motor by hall signal, and adjusts lock detection ON time (TON) and lock detection OFF time (TOFF) by internal counter. These times (TON, TOFF) are showed below. This IC would enter standby mode when the PWM input keeps low level for more than 66.5ms (typ.). In standby mode, it will shutdown amplifier and FG. Thus, the supply current is around 150µA. In standby mode, the lock protection function doesn’t work, therefore, starting fan is unobstructed when releasing standby mode. IN+ IN- OUT2 TOFF PWM TOFF 66.5ms (typ.) Lock protect enable (internal) TON OUT1 enable disable enable Figure 2. Quick Start Waveform FG Frequency Generator Function Lock Lock Detection Release Reset The FG pin is an open collector output, connecting a pull up resistor to a high level voltage for the frequency gen- Figure 1. Lock Protection and Automatic Protection Waveform Copyright ANPEC Electronics Corp. Rev. A.6 - Mar., 2008 6 www.anpec.com.tw APX9267 Function Description (Cont.) Frequency Generator Function (Cont.) junction temperature reaches 170°C, the output devices will be switched off. When the IC’s junction temperature erator function. During the Lock Mode, the FG will be always high (switch off) (See Truth Table). Open the terminal when not in using. cools by 35°C, the thermal sensor will turn the output devices on again, resulting in a pulsed output during Thermal Protection continuous thermal protection. The APX9267 has thermal protection, when internal Truth Table Input IN- IN+ L H H L H L L H L H H L - - Output PWM H L L OUT1 OUT2 FG H L L L H OFF L L OFF L L L L L OFF L L OFF OFF OFF OFF Mode Operation Mode Lock Mode Standby Mode Application Information Input Protection Diode & Capacitor (IN+)-(IN-) The APX9267 should be added a protection diode (D1) to protect the damage from the power reverse connection. However, the protection diode will cause a voltage drop on the supply voltage. The current rating of the diode must be greater than the maximum output current. For the noise reduction purpose, a capacitor (C1) 1µF is connected between VCC and GND (See Typical Application Circuit). OUT1 Hall input (IN+)-(IN-) Please adjust hall input voltage by value of resistance so that hall signal contains amplitude input within range GND~VCC -1.1. The output signal of this IC is the amplified hall input signal, therefore, the output signal depends on hall input. When the hall input is small, the output signal becomes gentle. Oppositely, when the input signal is large, the output becomes steep (See Figure 3. Differences of OUT1 Figure 3. Differences of Output Signal Depending on the output signal depending on the shape of hall input signal) .The input/output gain is 48dB (typ.). Thus, please Shape of Hall Input Signal adjust the amplitude of hall input to meet the adequate output voltage. Copyright ANPEC Electronics Corp. Rev. A.6 - Mar., 2008 7 www.anpec.com.tw APX9267 Application Information (Cont.) The value of resistor in the range of 1kΩ to 10kΩ is recommended. PWM input It is possible to change rotation speed of the motor by switching high side output transistor. The on-duty of Thermal Consideration switching depends on the input signal to PWM terminal. (See Figure 4. PWM Input Waveform) Refer to “Maximum Power Dissipation vs. Ambient Temperature”, the IC is safe to operate below the curve and it will cause the thermal protection if the operating area is above the line. For example, T A = 75°C, the maximum power dissipation is about 0.35W. IN+ The power dissipation can be calculated by the following equation: PD = (VCC - |VOUT1 - VOUT2|) x IOUT + VCC x ICC PWM For example: VCC = 5V, ICC = 4mA, IOUT = 270mA, VOUT1 = 4.83V, VOUT2 = 0.17V, then PD = 0.111W The GND pin provides an electrical connection to ground OUT1 and channeling heat away. The printed circuit board (PCB) forms a heat sink and dissipates most of the heat into ambient air. OUT2 FG Figure 4. PWM Input Waveform The input level of PWM terminal is H : High side output transistor is ON L : High side output transistor is OFF When PWM terminal is open, it is equal to H. FG Resistor The value of the FG resistor could be decided by the following equation: − RFG = V CC V FG IFG For example: VCC=5V, IFG=3mA, VFG=0.2V, RFG=1.6kΩ Copyright ANPEC Electronics Corp. Rev. A.6 - Mar., 2008 8 www.anpec.com.tw APX9267 Package Information MSOP-8 D b 0.25 A A1 A2 c L GAUGE PLANE SEATING PLANE 0 e E E1 SEE VIEW A VIEW A S Y M B O L MSOP-8 MILLIMETERS MIN. INCHES MAX. A MIN. MAX. 1.10 0.043 A1 0.00 0.15 0.000 0.006 A2 0.75 0.95 0.030 0.037 b 0.22 0.38 0.009 0.015 c 0.08 0.23 0.003 0.009 D 2.90 3.10 0.114 0.122 E 4.70 5.10 0.185 0.201 E1 2.90 3.10 0.114 0.122 e 0.65 BSC 0.026 BSC L 0.40 0.80 0.016 0.031 0 0° 8° 0° 8° Note: 1. Follow JEDEC MO-187 AA. 2. Dimension “D”does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension “E1”does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 5 mil per side. Copyright ANPEC Electronics Corp. Rev. A.6 - Mar., 2008 9 www.anpec.com.tw APX9267 Carrier Tape & Reel Dimensions P0 P2 P1 A B0 W F E1 OD0 K0 A0 A OD1 B B T SECTION A-A SECTION B-B H A d T1 Application MSOP- 8 A H T1 C d 12.4+2.00 13.0+0.50 330.0±2.00 50 MIN. 1.5 MIN. -0.00 -0.20 P0 P1 P2 D0 D1 1.5+0.10 4.00± 0.10 8.00±0.10 2.00±0.10 1.5 MIN. -0.00 D W E1 20.2 MIN. 12.0±0.30 1.75±0.10 F 5.5±0.10 T A0 B0 K0 0.6+0.00 6.70±0.20 3.30±0.20 1.40±0.20 -0.40 (mm) Devices Per Unit Package Type Unit Quantity MSOP- 8 Tape & Reel 3000 Copyright ANPEC Electronics Corp. Rev. A.6 - Mar., 2008 10 www.anpec.com.tw APX9267 Reflow Condition (IR/Convection or VPR Reflow) tp TP Critical Zone TL to TP Ramp-up Temperature TL tL Tsmax Tsmin Ramp-down ts Preheat 25 t 25°C to Peak Time Reliability Test Program Test item SOLDERABILITY HOLT PCT TST ESD Latch-Up Method MIL-STD-883D-2003 MIL-STD-883D-1005.7 JESD-22-B,A102 MIL-STD-883D-1011.9 MIL-STD-883D-3015.7 JESD 78 Description 245°C, 5 sec 1000 Hrs Bias @125°C 168 Hrs, 100%RH, 121°C -65°C~150°C, 200 Cycles VHBM > 2KV, VMM > 200V 10ms, 1tr > 100mA Classification Reflow Profiles Profile Feature Average ramp-up rate (TL to TP) Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts) Time maintained above: - Temperature (TL) - Time (tL) Peak/Classification Temperature (Tp) Time within 5°C of actual Peak Temperature (tp) Ramp-down Rate Time 25°C to Peak Temperature Sn-Pb Eutectic Assembly Pb-Free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 217°C 60-150 seconds See table 1 See table 2 10-30 seconds 20-40 seconds 6°C/second max. 6°C/second max. 6 minutes max. 8 minutes max. Note: All temperatures refer to topside of the package. Measured on the body surface. Copyright ANPEC Electronics Corp. Rev. A.6 - Mar., 2008 11 www.anpec.com.tw APX9267 Classification Reflow Profiles (Cont.) Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures 3 3 Package Thickness <2.5 mm ≥2.5 mm Volume mm ≥350 225 +0/-5°C 225 +0/-5°C Volume mm <350 240 +0/-5°C 225 +0/-5°C Table 2. Pb-free Process – Package Classification Reflow Temperatures 3 3 3 Volume mm Volume mm Volume mm <350 350-2000 >2000 <1.6 mm 260 +0°C* 260 +0°C* 260 +0°C* 1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C* ≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C* * Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level. Package Thickness Customer Service Anpec Electronics Corp. Head Office : No.6, Dusing 1st Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 2F, No. 11, Lane 218, Sec 2 Jhongsing Rd., Sindian City, Taipei County 23146, Taiwan Tel : 886-2-2910-3838 Fax : 886-2-2917-3838 Copyright ANPEC Electronics Corp. Rev. A.6 - Mar., 2008 12 www.anpec.com.tw