APX9262/3 Direct PWM Variable Speed Fan Motor Driver Features General Description • Single Phase Full Wave Fan Driver • Low Supply Current • Built-In Variable Speed Function • Include Hall Bias Circuit • Built-In Lock Protection and Auto Restart Func- The APX9262/3 is a high efficient direct PWM drive IC with single phase and CMOS drive. Such IC design is suitable for variable speed control FAN of personal computer’s power supply radiation and CPU cooler. The device is built-in lock protection. When fan is locked, the device will enter the lockup protection mode. It is also with rotation detection output and thermal shutdown function. In normal operation, supply current is 6mA. The APX9262/3 is available in SSOP-16 package. tion • FG Output and RD Output Signal available • Built-In Current Limit Circuit • Built-In Thermal Protection Circuit • SSOP-16 Package • Applications Lead Free and Green Devices Available (RoHS Compliant) • CPU Cooler • Variable Speed Control Fan Pin Configuration PGND 1 16 PGND OUT2 1 OUT2 2 15 OUT1 NC 2 15 OUT1 VCC 3 14 SGND VCC 3 14 SGND MIN 4 16 PGND 13 CT MIN 4 12 NC SET 5 OSC 6 11 IN- OSC 6 11 IN- FG 7 10 HB FG 7 10 HB RD 8 9 IN+ RD 8 9 IN+ SET 5 SSOP-16 APX9262 SSOP-16 13 CT 12 NC APX9263 ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright ANPEC Electronics Corp. Rev. A.7 - Oct., 2013 1 www.anpec.com.tw APX9262/3 Ordering and Marking Information Package Code N : SSOP-16 Operating Ambient Temperature Range I : -40 to 90 oC Handling Code TR : Tape & Reel Assembly Material G : Halogen and Lead Free Device APX9262 APX9263 Assembly Material Handling Code Temperature Range Package Code APX9262 N : APX9262 XXXXX XXXXX - Date Code APX9263 N : APX9263 XXXXX XXXXX - Date Code Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight). Absolute Maximum Ratings Symbol (Note 1) Parameter Ratings Unit -0.3 to 18 V VCC VCC Pin Supply Voltage IOUT OUT1/OUT2 Pin Output Current 0 to 1 A VOUT1/VOUT2 OUT1/OUT2 Pin Output Voltage -0.3 to 18 V IHB VSET / VMIN VRD / VFG IRD / IFG RTH,JA PD HB Pin Output Current 0 to 10 mA SET/MIN Pin Input Voltage -0.3 to 6 V RD/FG Output Voltage -0.3 to18 V 0 to 10 mA 125 ° C/W 1 W RD/FG Sink Current Thermal Resistance-Junction to Ambient SSOP-16 Power Dissipation (Note2) TJ Junction Temperature -40 to 150 °C TSTG Storage Temperature -55 to 150 °C TSDR Maximum Lead Soldering Temperature, 10 Seconds 260 °C Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Note 2: Mounted on a board (60x38x1.6t mm, Glass epoxy). Recommended Operating Conditions Symbol Parameter Rating Unit 4.5 to 15 V 0 to 6 V VCC VCC Pin Supply Voltage VSET SET Pin Input Voltage Range VMIN MIN Pin Input Voltage Range 0 to 6 V VICM Common-Mode Hall Input Voltage Range 0.2 to 3 V Ambient Temperature -40 to 90 °C TA Copyright ANPEC Electronics Corp. Rev. A.7 - Oct., 2013 2 www.anpec.com.tw APX9262/3 Electrical Characteristics Symbol (VCC = 12V, TA = 25°C, unless otherwise specified) Parameter Test Conditions APX9262/3 Min. Typ. Max. Unit SUPPLY CURRENT VHB ICC1 ICC2 HB Pin Output Voltage Operating Current IHB = 5mA 1.15 1.3 1.45 V Rotation Mode - 6 10 mA Lock Protection Mode - 6 10 mA V OSCILLATOR VOSCH OSC High Level Voltage COSC = 100pF 3.45 3.6 3.75 VOSCL OSC Low Level Voltage COSC = 100pF 1.95 2.05 2.15 V FOSC OSC Oscillation Frequency COSC = 100pF 18 25 32 kHz 3.24 3.6 3.96 V LOCK PROTECTION VCTH CT Pin High Level Voltage VCTL CT Pin Low Level Voltage CCT = 1µF 1.2 1.4 1.6 V ICT1 CT Charge Current VCT = 0V 1.5 2 2.5 µA ICT2 CT Discharge Current VCT = 3.6V 0.15 0.2 0.25 µA RCT CT Charge/Discharge Current Ratio RCT = ICT1/ICT2 8.5 10 11.5 - CCT = 1µF OUTPUT DRIVERS VOL Output Lower Side Saturation IOUT = 200mA - 0.1 0.2 V VOH Output Upper Side Saturation IOUT = 200mA - 0.25 0.5 V VRD/VFG RD/FG Pin Low Voltage IFG = 5mA - 0.2 0.3 V IRDL/IFGL RD/FG Pin Leak Current VFG = 7V - - 0.1 µA Zero to peak including offset and hysteresis - 10 25 mV Over-Temperature Shutdown Threshold - 160 - Over-Temperature Shutdown Hysteresis - 20 - 0.85 1 1.15 HALL SENSITIVITY VHN Hall Input Sensitivity THERMAL SHUTDOWN °C CURRENT LIMIT ILIM Current Limit Value Copyright ANPEC Electronics Corp. Rev. A.7 - Oct., 2013 3 A www.anpec.com.tw APX9262/3 Typical Operating Characteristics VCC Supply Current vs. VCC Supply Voltage VCC Supply Current vs. VCC Supply Voltage 7 7 Lock Protection Mode Rotation Mode 6 VCC Supply Current (mA) VCC Supply Current (mA) 6 5 4 3 2 1 0 0 2 4 6 8 10 12 14 5 4 3 2 1 0 16 0 2 VCC Supply Voltage (V) Output Saturation Voltage (V) CT Charge/Discharge Current (µA) Charge Current 1.5 1 Discharge Current 4 6 8 10 12 16 1 0.8 0.6 0.4 14 Lower Side Saturation Voltage 0.2 16 0 200 400 600 800 1000 Output Current (mA) OSC Frequency vs. RD/FG Pin Low Voltage vs. Sink Current 0.45 45 0.4 40 0.35 35 OSC Frequency (kHz) RD/FG Pin Low Voltage (V) 14 Upper Side Saturation Voltage 1.2 VCC Supply Voltage (V) 0.3 0.25 0.2 0.15 0.1 0.05 0 12 1.4 0 2 10 1.6 2 0 8 Output Saturation Voltage vs. Output Current 2.5 0 6 VCC Supply Voltage (V) CT Charge/Discharge Current vs. VCC Supply Voltage 0.5 4 VCC Supply Voltage COSC=100pF 30 25 20 15 10 5 0 2 4 6 8 0 10 RD/FG Pin Sink Current (mA) Copyright ANPEC Electronics Corp. Rev. A.7 - Oct., 2013 0 2 4 6 8 10 12 14 16 VCC Supply Voltage(V) 4 www.anpec.com.tw APX9262/3 Typical Operating Characteristics (Cont.) 6 1.1 COSC =100pF Maximum Power Dissipation (W) OSC High/Low Level Voltage (V) Maximum Power Dissipation vs. Ambient Temperature OSC High/Low Level Voltage vs. VCC Supply Voltage 5 OSC High Level 4 3 2 OSC Low Level 1 0 0 2 4 6 8 10 12 14 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 16 VCC Supply Voltage (V) Copyright ANPEC Electronics Corp. Rev. A.7 - Oct., 2013 1 0.9 0 25 50 75 90 100 125 150 Ambient Temperature (°C) 5 www.anpec.com.tw APX9262/3 Operating Waveforms Rotation Waveform 1 Rotation Waveform 2 VOSC(1v/div) V MIN(1v/div) VIN+(100mv/div) VOUT1(5V/div) VIN-(100mv/div) VSET(1v/div) VOUT2(5V/div) VOUT1(5V/div) Time (1ms/div) Time (20us/div) Rotation Waveform 3 Lock Protection Waveform 1 VOUT1(10V/div) VOUT1(10V/div) VOUT2(10V/div) VOUT2(10V/div) VOSC(1V/div) VCT(2v/div) IOUT(100mA/div) VRD(10v/div) Time (1s/div) Time (0.2ms/div) Lock Protection Waveform 2 VOUT1(10v/div) VOUT2(10v/div) V CT(2v/div) V RD (10v/div) Time (1s/div) Copyright ANPEC Electronics Corp. Rev. A.7 - Oct., 2013 6 www.anpec.com.tw APX9262/3 Pin Descriptions PIN NO. 1 2 FUNCTION NAME PGND (APX9262) Power Stage GND. OUT2 (APX9263) H-bridge Output Connection. OUT2 (APX9262) H-bridge Output Connection. NC (APX9263) 3 No Connection. VCC Supply Voltage Input Pin. 4 MIN Speed Setting. An external voltage into MIN pin to set fan speed. 5 SET Speed Setting. An external voltage into SET pin to set fan speed. 6 OSC Oscillation Frequency Setting. Connect a capacitor to GND to set oscillation frequency. 7 FG Rotation Speed Output. This is an open–collector output. 8 RD Rotation Detection Output. This is an open–collector output. 9 IN+ Hall Input +. Connect to hall element positive output. 10 HB Hall Bias. This is a 1.3V constant–voltage output for hall element bias. 11 IN- Hall Input -. Connect to hall element negative output. 12 NC No Connection. 13 CT Shutdown Time and Restart Time Setting. Connect a capacitor to GND to set shutdown time and restart time in lock mode. 14 SGND Control Stage GND. 15 OUT1 H-bridge Output Connection. 16 PGND Power Stage GND. Block Diagram CT Discharge Circuit FG RD 0.47 to 1 µ F VCC HB IN+ Level Shift Hall Bias OUT2 Controller HALL M Level Shift IN- OUT1 Thermal Shutdown Oscillation Circuit MIN SET OSC Copyright ANPEC Electronics Corp. Rev. A.7 - Oct., 2013 7 SGND PGND www.anpec.com.tw APX9262/3 Typical Application Circuit VIN D1 Pull High Voltage R1=2Ω C1=4.7µF VCC HB H RFG=10kΩ RRD=10kΩ INFG IN+ RD MIN OUT2 M SET OSC PWM Input OUT1 COSC=100pF CT CCT=0.47 to 1µF SGND PGND Note 3: In hot plug application, it’s necessary to protect against a hot plug input voltage overshoot. Placing a 2Ω resistor (R1) in series with a 4.7µF capacitor (C1) dampens the overshoot. Copyright ANPEC Electronics Corp. Rev. A.7 - Oct., 2013 8 www.anpec.com.tw APX9262/3 Truth Table Input IN- IN+ H L L H H L L H H L L H Output OSC CT OUT1 OUT2 FG RD Mode H L L L Rotation (Drive) L H OFF L PWM ON H L L OFF L L L Rotation (Re-Circulation) L OFF OFF L PWM OFF L L L L L OFF OFF Lock Mode H - Note 4: OSC-H corresponds to OSC>SET and OSC-L corresponds to OSC<SET. Application Information Input Protection Diode & Capacitor CT Capacitor The IC should be added a protection diode (D1) to prevent the damage from the power reverse connection. The capacitor that is connected from CT pin to GND determines the shutdown time and restart time. However, the protection diode will cause a voltage drop on the supply voltage. The current rating of the diode must Locked Detection Time = be greater than the maximum output current. For the noise reduction purpose, a capacitor (C1) must connect be- Restart Time = tween VCC and GND. It is the suggestion that C1 should be placed as close as possible to the device VCC pin Shutdown Time = (see Figure 3 Recommended Layout Diagram). CCT × (V CTH − 0.2V ) ICT1 CCT × (V CTH − V CTL ) ICT1 CCT × (V CTH − V CTL ) ICT2 where: CCT = CT pin capacitor For example: SET MIN VCC OUT2 VCC= 12V, CCT= 1µF R1 C1 Locked Detection Time = 1.7s Restart Time = 1.1s Shutdown Time = 11s The value of charge capacitor is recommended from 0.47µF to 1µF. FG /RD Resistor D1 The value of the FG/RD resistor could be decided by the VIN GND following equation: − RFG = V DC V FG IFG For example: Figure 3. Recommended Layout Diagram HB Pin & Hall Input VDC = 6V, IFG = 5mA, VFG = 0.2V, RFG = 1.16kΩ 1.3V voltage reference is for hall element bias. Wiring needs to be shortened to prevent carrying of the noise. Hall input amplifier has 20mV hysteresis. Then, we rec- The value of resistor in the range of 1kΩ to 10kΩ is recommended. ommend the hall input level to be 60mV or over. Copyright ANPEC Electronics Corp. Rev. A.7 - Oct., 2013 9 www.anpec.com.tw APX9262/3 Application Information (Cont.) Thermal Consideration Refer to “Maximum Power Dissipation vs. Ambient Temperature”, the IC is safe to operate below the curve, and it will cause the thermal protection if the operating area is above the line. For example, T A = 50 ο C, the SSOP-16 package maximum power dissipation is about 0.8W. Power dissipation can be calculated by the following equation: PD = (VCC - | VOUT1 + VOUT2 | ) × IOUT + VCC × ICC For example: When VCC = 12V, ICC = 4mA, I OUT = 300mA, V oUT1 = 11.7V, VOOUT2 = 0.22V, the PD = 0.204W According to the power dissipation issue, we could adapt this SSOP-16 package. The GND pin provides an electrical connection to ground and channeling heat away. The printed circuit board (PCB) forms a heat sink and dissipates most of the heat into ambient air. Copyright ANPEC Electronics Corp. Rev. A.7 - Oct., 2013 10 www.anpec.com.tw APX9262/3 Package Information SSOP-16 D h X 45 E E1 SEE VIEW A c A 0.25 b A2 A1 GAUGE PLANE SEATING PLANE L 0 e VIEW A S Y M B O L SSOP-16 MILLIMETERS MIN. INCHES MAX. A MIN. MAX. 1.75 0.069 0.004 0.25 0.010 A1 0.10 A2 1.24 b 0.20 0.30 0.008 0.012 c 0.15 0.25 0.006 0.010 D 4.80 5.00 0.189 0.197 E 5.80 6.20 0.228 0.244 E1 3.80 4.00 0.150 0.157 e 0.049 0.635 BSC 0.025 BSC L 0.40 1.27 0.016 0.050 h 0.25 0.50 0.010 0.020 0 0° 8° 0° 8° Note : 1. Follow JEDEC MO-137 AB. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension "E" does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 10 mil per side. Copyright ANPEC Electronics Corp. Rev. A.7 - Oct., 2013 11 www.anpec.com.tw APX9262/3 Carrier Tape & Reel Dimensions P0 P2 P1 A B0 W F E1 OD0 K0 A0 A OD1 B B T SECTION A-A SECTION B-B H A d T1 Application SSOP-16 A H T1 C d D W E1 F 330.0±2.00 50 MIN. 12.4+2.00 -0.00 13.0+0.50 -0.20 1.5 MIN. 20.2 MIN. 12.0±0.30 1.75±0.10 5.50±0.10 P0 P1 P2 D0 D1 T A0 B0 K0 4.00±0.10 8.00±0.10 2.00±0.05 1.5+0.10 -0.00 1.5 MIN. 0.6+0.00 -0.40 6.40±0.20 5.20±0.20 2.10±0.20 (mm) Devices Per Unit Package Type Unit Quantity SSOP- 16 Tape & Reel 2500 Copyright ANPEC Electronics Corp. Rev. A.7 - Oct., 2013 12 www.anpec.com.tw APX9262/3 Taping Direction Information SSOP-16 USER DIRECTION OF FEED Classification Profile Copyright ANPEC Electronics Corp. Rev. A.7 - Oct., 2013 13 www.anpec.com.tw APX9262/3 Classification Reflow Profiles Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly 100 °C 150 °C 60-120 seconds 150 °C 200 °C 60-120 seconds 3 °C/second max. 3°C/second max. 183 °C 60-150 seconds 217 °C 60-150 seconds See Classification Temp in table 1 See Classification Temp in table 2 Time (tP)** within 5°C of the specified classification temperature (Tc) 20** seconds 30** seconds Average ramp-down rate (Tp to Tsmax) 6 °C/second max. 6 °C/second max. 6 minutes max. 8 minutes max. Preheat & Soak Temperature min (Tsmin) Temperature max (Tsmax) Time (Tsmin to Tsmax) (ts) Average ramp-up rate (Tsmax to TP) Liquidous temperature (TL) Time at liquidous (tL) Peak package body Temperature (Tp)* Time 25°C to peak temperature * Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Table 1. SnPb Eutectic Process – Classification Temperatures (Tc) Package Thickness <2.5 mm ≥2.5 mm Volume mm <350 235 °C 220 °C 3 Volume mm ≥350 220 °C 220 °C 3 Table 2. Pb-free Process – Classification Temperatures (Tc) Package Thickness <1.6 mm 1.6 mm – 2.5 mm ≥2.5 mm Volume mm <350 260 °C 260 °C 250 °C 3 Volume mm 350-2000 260 °C 250 °C 245 °C 3 3 Volume mm >2000 260 °C 245 °C 245 °C Reliability Test Program Test item SOLDERABILITY HOLT PCT TCT HBM MM Latch-Up Method JESD-22, B102 JESD-22, A108 JESD-22, A102 JESD-22, A104 MIL-STD-883-3015.7 JESD-22, A115 JESD 78 Copyright ANPEC Electronics Corp. Rev. A.7 - Oct., 2013 14 Description 5 Sec, 245°C 1000 Hrs, Bias @ 125°C 168 Hrs, 100%RH, 2atm, 121°C 500 Cycles, -65°C~150°C VHBM≧2KV VMM≧200V 10ms, 1 tr≧100mA www.anpec.com.tw APX9262/3 Customer Service Anpec Electronics Corp. Head Office : No.6, Dusing 1st Road, SBIP, Hsin-Chu, Taiwan Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 2F, No. 11, Lane 218, Sec 2 Jhongsing Rd., Sindian City, Taipei County 23146, Taiwan Tel : 886-2-2910-3838 Fax : 886-2-2917-3838 Copyright ANPEC Electronics Corp. Rev. A.7 - Oct., 2013 15 www.anpec.com.tw