APX9262/3

APX9262/3
Direct PWM Variable Speed Fan Motor Driver
Features
General Description
•
Single Phase Full Wave Fan Driver
•
Low Supply Current
•
Built-In Variable Speed Function
•
Include Hall Bias Circuit
•
Built-In Lock Protection and Auto Restart Func-
The APX9262/3 is a high efficient direct PWM drive IC
with single phase and CMOS drive. Such IC design is
suitable for variable speed control FAN of personal
computer’s power supply radiation and CPU cooler. The
device is built-in lock protection. When fan is locked,
the device will enter the lockup protection mode. It is
also with rotation detection output and thermal shutdown function. In normal operation, supply current is
6mA. The APX9262/3 is available in SSOP-16 package.
tion
•
FG Output and RD Output Signal available
•
Built-In Current Limit Circuit
•
Built-In Thermal Protection Circuit
•
SSOP-16 Package
•
Applications
Lead Free and Green Devices Available (RoHS
Compliant)
•
CPU Cooler
•
Variable Speed Control Fan
Pin Configuration
PGND 1
16 PGND
OUT2 1
OUT2 2
15 OUT1
NC 2
15 OUT1
VCC 3
14 SGND
VCC 3
14 SGND
MIN 4
16 PGND
13 CT
MIN 4
12 NC
SET 5
OSC 6
11 IN-
OSC 6
11 IN-
FG 7
10 HB
FG 7
10 HB
RD 8
9 IN+
RD 8
9 IN+
SET 5
SSOP-16
APX9262
SSOP-16
13 CT
12 NC
APX9263
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain
the latest version of relevant information to verify before placing orders.
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Oct., 2013
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APX9262/3
Ordering and Marking Information
Package Code
N : SSOP-16
Operating Ambient Temperature Range
I : -40 to 90 oC
Handling Code
TR : Tape & Reel
Assembly Material
G : Halogen and Lead Free Device
APX9262
APX9263
Assembly Material
Handling Code
Temperature Range
Package Code
APX9262 N :
APX9262
XXXXX
XXXXX - Date Code
APX9263 N :
APX9263
XXXXX
XXXXX - Date Code
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
Absolute Maximum Ratings
Symbol
(Note 1)
Parameter
Ratings
Unit
-0.3 to 18
V
VCC
VCC Pin Supply Voltage
IOUT
OUT1/OUT2 Pin Output Current
0 to 1
A
VOUT1/VOUT2
OUT1/OUT2 Pin Output Voltage
-0.3 to 18
V
IHB
VSET / VMIN
VRD / VFG
IRD / IFG
RTH,JA
PD
HB Pin Output Current
0 to 10
mA
SET/MIN Pin Input Voltage
-0.3 to 6
V
RD/FG Output Voltage
-0.3 to18
V
0 to 10
mA
125
°
C/W
1
W
RD/FG Sink Current
Thermal Resistance-Junction to Ambient
SSOP-16
Power Dissipation (Note2)
TJ
Junction Temperature
-40 to 150
°C
TSTG
Storage Temperature
-55 to 150
°C
TSDR
Maximum Lead Soldering Temperature, 10 Seconds
260
°C
Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are
stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Note 2: Mounted on a board (60x38x1.6t mm, Glass epoxy).
Recommended Operating Conditions
Symbol
Parameter
Rating
Unit
4.5 to 15
V
0 to 6
V
VCC
VCC Pin Supply Voltage
VSET
SET Pin Input Voltage Range
VMIN
MIN Pin Input Voltage Range
0 to 6
V
VICM
Common-Mode Hall Input Voltage Range
0.2 to 3
V
Ambient Temperature
-40 to 90
°C
TA
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APX9262/3
Electrical Characteristics
Symbol
(VCC = 12V, TA = 25°C, unless otherwise specified)
Parameter
Test Conditions
APX9262/3
Min.
Typ.
Max.
Unit
SUPPLY CURRENT
VHB
ICC1
ICC2
HB Pin Output Voltage
Operating Current
IHB = 5mA
1.15
1.3
1.45
V
Rotation Mode
-
6
10
mA
Lock Protection Mode
-
6
10
mA
V
OSCILLATOR
VOSCH
OSC High Level Voltage
COSC = 100pF
3.45
3.6
3.75
VOSCL
OSC Low Level Voltage
COSC = 100pF
1.95
2.05
2.15
V
FOSC
OSC Oscillation Frequency
COSC = 100pF
18
25
32
kHz
3.24
3.6
3.96
V
LOCK PROTECTION
VCTH
CT Pin High Level Voltage
VCTL
CT Pin Low Level Voltage
CCT = 1µF
1.2
1.4
1.6
V
ICT1
CT Charge Current
VCT = 0V
1.5
2
2.5
µA
ICT2
CT Discharge Current
VCT = 3.6V
0.15
0.2
0.25
µA
RCT
CT Charge/Discharge Current Ratio
RCT = ICT1/ICT2
8.5
10
11.5
-
CCT = 1µF
OUTPUT DRIVERS
VOL
Output Lower Side Saturation
IOUT = 200mA
-
0.1
0.2
V
VOH
Output Upper Side Saturation
IOUT = 200mA
-
0.25
0.5
V
VRD/VFG
RD/FG Pin Low Voltage
IFG = 5mA
-
0.2
0.3
V
IRDL/IFGL
RD/FG Pin Leak Current
VFG = 7V
-
-
0.1
µA
Zero to peak including offset
and hysteresis
-
10
25
mV
Over-Temperature Shutdown
Threshold
-
160
-
Over-Temperature Shutdown
Hysteresis
-
20
-
0.85
1
1.15
HALL SENSITIVITY
VHN
Hall Input Sensitivity
THERMAL SHUTDOWN
°C
CURRENT LIMIT
ILIM
Current Limit Value
Copyright  ANPEC Electronics Corp.
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A
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APX9262/3
Typical Operating Characteristics
VCC Supply Current vs. VCC Supply Voltage
VCC Supply Current vs. VCC Supply Voltage
7
7
Lock Protection Mode
Rotation Mode
6
VCC Supply Current (mA)
VCC Supply Current (mA)
6
5
4
3
2
1
0
0
2
4
6
8
10
12
14
5
4
3
2
1
0
16
0
2
VCC Supply Voltage (V)
Output Saturation Voltage (V)
CT Charge/Discharge Current (µA)
Charge Current
1.5
1
Discharge Current
4
6
8
10
12
16
1
0.8
0.6
0.4
14
Lower Side
Saturation Voltage
0.2
16
0
200
400
600
800
1000
Output Current (mA)
OSC Frequency vs.
RD/FG Pin Low Voltage vs. Sink Current
0.45
45
0.4
40
0.35
35
OSC Frequency (kHz)
RD/FG Pin Low Voltage (V)
14
Upper Side
Saturation Voltage
1.2
VCC Supply Voltage (V)
0.3
0.25
0.2
0.15
0.1
0.05
0
12
1.4
0
2
10
1.6
2
0
8
Output Saturation Voltage vs. Output Current
2.5
0
6
VCC Supply Voltage (V)
CT Charge/Discharge Current vs.
VCC Supply Voltage
0.5
4
VCC Supply Voltage
COSC=100pF
30
25
20
15
10
5
0
2
4
6
8
0
10
RD/FG Pin Sink Current (mA)
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Oct., 2013
0
2
4
6
8
10
12
14
16
VCC Supply Voltage(V)
4
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APX9262/3
Typical Operating Characteristics (Cont.)
6
1.1
COSC =100pF
Maximum Power Dissipation (W)
OSC High/Low Level Voltage (V)
Maximum Power Dissipation vs.
Ambient Temperature
OSC High/Low Level Voltage vs.
VCC Supply Voltage
5
OSC High Level
4
3
2
OSC Low Level
1
0
0
2
4
6
8
10
12
14
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
16
VCC Supply Voltage (V)
Copyright  ANPEC Electronics Corp.
Rev. A.7 - Oct., 2013
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0.9
0
25
50
75
90 100
125
150
Ambient Temperature (°C)
5
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APX9262/3
Operating Waveforms
Rotation Waveform 1
Rotation Waveform 2
VOSC(1v/div)
V MIN(1v/div)
VIN+(100mv/div)
VOUT1(5V/div)
VIN-(100mv/div)
VSET(1v/div)
VOUT2(5V/div)
VOUT1(5V/div)
Time (1ms/div)
Time (20us/div)
Rotation Waveform 3
Lock Protection Waveform 1
VOUT1(10V/div)
VOUT1(10V/div)
VOUT2(10V/div)
VOUT2(10V/div)
VOSC(1V/div)
VCT(2v/div)
IOUT(100mA/div)
VRD(10v/div)
Time (1s/div)
Time (0.2ms/div)
Lock Protection Waveform 2
VOUT1(10v/div)
VOUT2(10v/div)
V CT(2v/div)
V RD (10v/div)
Time (1s/div)
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APX9262/3
Pin Descriptions
PIN
NO.
1
2
FUNCTION
NAME
PGND (APX9262)
Power Stage GND.
OUT2 (APX9263)
H-bridge Output Connection.
OUT2 (APX9262)
H-bridge Output Connection.
NC (APX9263)
3
No Connection.
VCC
Supply Voltage Input Pin.
4
MIN
Speed Setting. An external voltage into MIN pin to set fan speed.
5
SET
Speed Setting. An external voltage into SET pin to set fan speed.
6
OSC
Oscillation Frequency Setting. Connect a capacitor to GND to set oscillation frequency.
7
FG
Rotation Speed Output. This is an open–collector output.
8
RD
Rotation Detection Output. This is an open–collector output.
9
IN+
Hall Input +. Connect to hall element positive output.
10
HB
Hall Bias. This is a 1.3V constant–voltage output for hall element bias.
11
IN-
Hall Input -. Connect to hall element negative output.
12
NC
No Connection.
13
CT
Shutdown Time and Restart Time Setting. Connect a capacitor to GND to set shutdown
time and restart time in lock mode.
14
SGND
Control Stage GND.
15
OUT1
H-bridge Output Connection.
16
PGND
Power Stage GND.
Block Diagram
CT
Discharge
Circuit
FG
RD
0.47 to 1 µ F
VCC
HB
IN+
Level
Shift
Hall
Bias
OUT2
Controller
HALL
M
Level
Shift
IN-
OUT1
Thermal
Shutdown
Oscillation
Circuit
MIN SET
OSC
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SGND
PGND
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APX9262/3
Typical Application Circuit
VIN
D1
Pull High
Voltage
R1=2Ω
C1=4.7µF
VCC
HB
H
RFG=10kΩ
RRD=10kΩ
INFG
IN+
RD
MIN
OUT2
M
SET
OSC
PWM
Input
OUT1
COSC=100pF
CT
CCT=0.47 to 1µF
SGND
PGND
Note 3: In hot plug application, it’s necessary to protect against a hot plug input voltage overshoot. Placing a 2Ω resistor (R1) in
series with a 4.7µF capacitor (C1) dampens the overshoot.
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APX9262/3
Truth Table
Input
IN-
IN+
H
L
L
H
H
L
L
H
H
L
L
H
Output
OSC
CT
OUT1
OUT2
FG
RD
Mode
H
L
L
L
Rotation (Drive)
L
H
OFF
L
PWM ON
H
L
L
OFF
L
L
L
Rotation (Re-Circulation)
L
OFF
OFF
L
PWM OFF
L
L
L
L
L
OFF
OFF
Lock Mode
H
-
Note 4: OSC-H corresponds to OSC>SET and OSC-L corresponds to OSC<SET.
Application Information
Input Protection Diode & Capacitor
CT Capacitor
The IC should be added a protection diode (D1) to prevent the damage from the power reverse connection.
The capacitor that is connected from CT pin to GND determines the shutdown time and restart time.
However, the protection diode will cause a voltage drop
on the supply voltage. The current rating of the diode must
Locked Detection Time =
be greater than the maximum output current. For the noise
reduction purpose, a capacitor (C1) must connect be-
Restart Time =
tween VCC and GND. It is the suggestion that C1 should
be placed as close as possible to the device VCC pin
Shutdown Time =
(see Figure 3 Recommended Layout Diagram).
CCT × (V CTH − 0.2V )
ICT1
CCT × (V CTH − V CTL )
ICT1
CCT × (V CTH − V CTL )
ICT2
where:
CCT = CT pin capacitor
For example:
SET
MIN
VCC
OUT2
VCC= 12V, CCT= 1µF
R1 C1
Locked Detection Time = 1.7s
Restart Time = 1.1s
Shutdown Time = 11s
The value of charge capacitor is recommended from
0.47µF to 1µF.
FG /RD Resistor
D1
The value of the FG/RD resistor could be decided by the
VIN
GND
following equation:
−
RFG = V DC V FG
IFG
For example:
Figure 3. Recommended Layout Diagram
HB Pin & Hall Input
VDC = 6V, IFG = 5mA, VFG = 0.2V, RFG = 1.16kΩ
1.3V voltage reference is for hall element bias. Wiring
needs to be shortened to prevent carrying of the noise.
Hall input amplifier has 20mV hysteresis. Then, we rec-
The value of resistor in the range of 1kΩ to 10kΩ is
recommended.
ommend the hall input level to be 60mV or over.
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APX9262/3
Application Information (Cont.)
Thermal Consideration
Refer to “Maximum Power Dissipation vs. Ambient
Temperature”, the IC is safe to operate below the curve,
and it will cause the thermal protection if the operating
area is above the line. For example, T A = 50 ο C, the
SSOP-16 package maximum power dissipation is
about 0.8W.
Power dissipation can be calculated by the following
equation:
PD = (VCC - | VOUT1 + VOUT2 | ) × IOUT + VCC × ICC
For example:
When
VCC = 12V, ICC = 4mA, I OUT = 300mA, V oUT1 = 11.7V,
VOOUT2 = 0.22V, the PD = 0.204W
According to the power dissipation issue, we could adapt
this SSOP-16 package.
The GND pin provides an electrical connection to ground
and channeling heat away. The printed circuit board (PCB)
forms a heat sink and dissipates most of the heat into
ambient air.
Copyright  ANPEC Electronics Corp.
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APX9262/3
Package Information
SSOP-16
D
h X 45
E
E1
SEE VIEW A
c
A
0.25
b
A2
A1
GAUGE PLANE
SEATING PLANE
L
0
e
VIEW A
S
Y
M
B
O
L
SSOP-16
MILLIMETERS
MIN.
INCHES
MAX.
A
MIN.
MAX.
1.75
0.069
0.004
0.25
0.010
A1
0.10
A2
1.24
b
0.20
0.30
0.008
0.012
c
0.15
0.25
0.006
0.010
D
4.80
5.00
0.189
0.197
E
5.80
6.20
0.228
0.244
E1
3.80
4.00
0.150
0.157
e
0.049
0.635 BSC
0.025 BSC
L
0.40
1.27
0.016
0.050
h
0.25
0.50
0.010
0.020
0
0°
8°
0°
8°
Note : 1. Follow JEDEC MO-137 AB.
2. Dimension "D" does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion or gate burrs shall not exceed 6 mil per side.
3. Dimension "E" does not include inter-lead flash or protrusions.
Inter-lead flash and protrusions shall not exceed 10 mil per side.
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APX9262/3
Carrier Tape & Reel Dimensions
P0
P2
P1
A
B0
W
F
E1
OD0
K0
A0
A
OD1 B
B
T
SECTION A-A
SECTION B-B
H
A
d
T1
Application
SSOP-16
A
H
T1
C
d
D
W
E1
F
330.0±2.00
50 MIN.
12.4+2.00
-0.00
13.0+0.50
-0.20
1.5 MIN.
20.2 MIN.
12.0±0.30
1.75±0.10
5.50±0.10
P0
P1
P2
D0
D1
T
A0
B0
K0
4.00±0.10
8.00±0.10
2.00±0.05
1.5+0.10
-0.00
1.5 MIN.
0.6+0.00
-0.40
6.40±0.20
5.20±0.20
2.10±0.20
(mm)
Devices Per Unit
Package Type
Unit
Quantity
SSOP- 16
Tape & Reel
2500
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APX9262/3
Taping Direction Information
SSOP-16
USER DIRECTION OF FEED
Classification Profile
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APX9262/3
Classification Reflow Profiles
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-120 seconds
3 °C/second max.
3°C/second max.
183 °C
60-150 seconds
217 °C
60-150 seconds
See Classification Temp in table 1
See Classification Temp in table 2
Time (tP)** within 5°C of the specified
classification temperature (Tc)
20** seconds
30** seconds
Average ramp-down rate (Tp to Tsmax)
6 °C/second max.
6 °C/second max.
6 minutes max.
8 minutes max.
Preheat & Soak
Temperature min (Tsmin)
Temperature max (Tsmax)
Time (Tsmin to Tsmax) (ts)
Average ramp-up rate
(Tsmax to TP)
Liquidous temperature (TL)
Time at liquidous (tL)
Peak package body Temperature
(Tp)*
Time 25°C to peak temperature
* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Table 1. SnPb Eutectic Process – Classification Temperatures (Tc)
Package
Thickness
<2.5 mm
≥2.5 mm
Volume mm
<350
235 °C
220 °C
3
Volume mm
≥350
220 °C
220 °C
3
Table 2. Pb-free Process – Classification Temperatures (Tc)
Package
Thickness
<1.6 mm
1.6 mm – 2.5 mm
≥2.5 mm
Volume mm
<350
260 °C
260 °C
250 °C
3
Volume mm
350-2000
260 °C
250 °C
245 °C
3
3
Volume mm
>2000
260 °C
245 °C
245 °C
Reliability Test Program
Test item
SOLDERABILITY
HOLT
PCT
TCT
HBM
MM
Latch-Up
Method
JESD-22, B102
JESD-22, A108
JESD-22, A102
JESD-22, A104
MIL-STD-883-3015.7
JESD-22, A115
JESD 78
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Description
5 Sec, 245°C
1000 Hrs, Bias @ 125°C
168 Hrs, 100%RH, 2atm, 121°C
500 Cycles, -65°C~150°C
VHBM≧2KV
VMM≧200V
10ms, 1 tr≧100mA
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APX9262/3
Customer Service
Anpec Electronics Corp.
Head Office :
No.6, Dusing 1st Road, SBIP,
Hsin-Chu, Taiwan
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,
Sindian City, Taipei County 23146, Taiwan
Tel : 886-2-2910-3838
Fax : 886-2-2917-3838
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