APX9270 Direct PWM Variable Speed Fan Motor Driver Features General Description • Single Phase Full Wave Fan Driver The APX9270 is a single phase, DC brushless motor • Low Quiescent Current (6mA Typical) • Built-in Variable Speed Function driver with PWM variable speed control and current limit features suitable for the fan of personal computer’s power • Current Limit Circuit (includes both internal and external Current Limit) • Built-in Lock Protection and Auto Restart Function • FG (rotation speed detection) Output • Soft Switching Circuit (before phase change, enabling low-consumption, low loss and low noise drive.) • Over Voltage Protection (16.5V Typical) • Built-in Kickback Absorption Circuit • Built-in Thermal Protection Circuit • Lead Free and Green Devices Available (RoHS Compliant) supply and CPU cooler. The PWM control system includes thermistor input signal and direct PWM input signal, enabling highly silent and low vibration speed control. The device is equipped with a built-in lock protection, which protects the fan when it is locked. It also has rotation speed detection output and thermal protection function. The APX9270 is available in SSOP-20 and TSSOP-20P packages (see Pin Configurations). Applications • • CPU Coolers Variable Speed Control Fans Ordering and Marking Information Package Code N : SSOP-20 R: TSSOP-20P Operating Ambient Temperature Range I : -40 to 90 oC Handling Code TR : Tape & Reel Assembly Material L : Lead Free Device G : Halogen and Lead Free Device APX9270 Assembly Material Handling Code Temperature Range Package Code APX9270 XXXXX APX9270 N/R : XXXXX - Date Code Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight). Pin Configurations PGND 1 20 PGND PGND 1 20 PGND OUT2 2 19 PGND OUT2 2 19 PGND VM 3 VCC 4 18 OUT1 17 SGND VM 3 VCC 4 18 OUT1 17 SGND OSCH 5 SSOP-20 OSCL 6 SET 7 MIN 8 PWM 9 OSC10 16 6VREG OSCH 5 15 CT 14 IN - OSCL 6 SET 7 MIN 8 13 HB 12 IN + PWM 9 OSC10 11 FG TSSOP-20P 16 6VREG 15 CT 14 IN 13 HB 12 IN + 11 FG ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright ANPEC Electronics Corp. Rev. A.3 - Jun., 2008 1 www.anpec.com.tw APX9270 Absolute Maximum Ratings Symbol Ratings Unit VCC VCC Pin Supply Voltage (VCC to SGND) -0.3 to 18 V VM VM Pin Supply Voltage (VM to SGND) -0.3 to VCC V IOUT OUT1/OUT2 Pin Maximum Output Current 1.2 A VPGND-0.3 to VM V -0.3 to 0.3 V VOUT1/VOUT2 VPGND IHB Parameter OUT1/OUT2 Pin Output Voltage (OUT1, OUT2 to SGND) PGND to SGND Voltage HB Pin Output Current 0 to 15 mA VSET SET Pin Input Voltage (SET to SGND) -0.3 to 7 V VMIN MIN Pin Input Voltage (MIN to SGND) -0.3 to 7 V VPWM PWM Pin Input Voltage (PWM to SGND) -0.3 to VCC V VFG FG Pin Output Voltage (FG to SGND) -0.3 to VCC V IFG FG Pin Output Current 0 to 10 mA OSC Pin Input Voltage (OSC to SGND) -0.3 to 7 V CT Pin Input Voltage (CT to SGND) -0.3 to 7 V 1.2 W VOSC VCT Power Dissipation PD SSOP-20 TSSOP-20P TJ 1.5 Maximum Junction Temperature TSTG Storage Temperature Range TSDR Maximum Lead Soldering Temperature, 10 Seconds 150 °C -55 to 150 °C 260 °C Note 1: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. Thermal Characteristics Symbol Parameter Value Unit SSOP-20 104 ° C/W TSSOP-20P 83 Thermal Resistance-Junction to Ambient RTH,JA Note 2: Mounted on a board (60x38x1.6t mm, Glass epoxy). Recommended Operating Conditions Symbol Parameter Rating Unit VCC VCC Pin Supply Voltage 4.5 to 15 V VM VM Pin Supply Voltage 3.5 to 15 V VSET SET Pin Input Voltage Range 0 to 6 V VMIN MIN Pin Input Voltage Range 0 to 6 V VPWM PWM Pin Input Voltage Range 0 to VCC V VOSCH/VOSCL VICM TA 0 to 6 V Hall Input Common Phase Input Voltage Range OSC High/Low Level Input Voltage Range 0.2 to 3 V Ambient Temperature -40 to 90 °C Copyright ANPEC Electronics Corp. Rev. A.3 - Jun., 2008 2 www.anpec.com.tw APX9270 Electrical Characteristics Symbol (VCC = 12V, TA = 25°C, RL= 0Ω, unless otherwise specified) Parameter Test Conditions APX9270 Min. Typ. Max. Unit SUPPLY CURRENT V6VREG VHB ICC1 ICC2 6VREG Pin Output Voltage I6VREG = 5mA 5.85 6 6.15 V HB Pin Output Voltage IHB = 5mA 1.2 1.3 1.4 V Rotation Mode - 6 8 mA Lock Protection Mode - 6 8 mA Operating Current OSCILLATOR IOSC1 OSC Charge Current 7.5 10 12.5 µA IOSC2 OSC Discharge Current 7.5 10 12.5 µA LOCK PROTECTION VCTH CT Pin High Level Voltage CCT = 1µF 3.4 3.6 3.8 V VCTL CT Pin Low Level Voltage CCT = 1µF 1.4 1.6 1.8 V ICT1 CT Charge Current VCT = 0V 1.65 2.2 2.75 µA ICT2 CT Discharge Current VCT = 3.6V 0.165 0.22 0.275 µA RCT CT Charge/Discharge Current Ratio RCT = ICT1/ICT2 8 10 12 - IOUT = 400mA - 0.2 0.3 V OUTPUT DRIVERS VOL Output Lower Side Saturation VOH Output Upper Side Saturation IOUT = 400mA - 0.4 0.6 V VFG FG Pin Low Voltage IFG = 5mA - 0.2 0.4 V IFGL FG Pin Leak Current VFG = 7V - 0.1 1 µA Zero to peak including offset and hysteresis - 25 35 mV - 1200 - mA - 960 - mA Thermal Protection Temperature - 160 - Thermal Protection Hysteresis - 20 - - 16.5 - HALL SENSITIVITY VHN Hall Input Sensitivity CURRENT-LIMIT ILIM Internal Current-Limit IRL External Current-Limit RL= 0.5Ω THERMAL PROTECTION °C Over-Voltage Protection VOV Over-Voltage Threshold Copyright ANPEC Electronics Corp. Rev. A.3 - Jun., 2008 3 V www.anpec.com.tw APX9270 Typical Operating Characteristics VCC Supply Current vs. VCC Supply Voltage VCC Supply Current vs. VCC Supply Voltage 7 7 Rotation Mode Lock Mode 6 VCC Supply Current (mA) VCC Supply Current (mA) 6 5 4 3 2 1 0 4 3 2 1 0 0 5 10 15 0 5 10 15 VCC Supply Voltage (V) VCC Supply Voltage (V) OSC Charge/Discharge Current vs. VCC Supply Voltage CT Charge/Discharge Current vs. VCC Supply Voltage 3 CT Charge/Discharge Current (µA) 11 OSC Charge/Discharge Current (µA) 5 10.5 Charge Current 10 Discharge Current 9.5 9 0 5 10 2.5 Charge Current 2 1.5 1 0.5 Discharge Current 0 15 0 5 10 15 VCC Supply Voltage (V) VCC Supply Voltage (V) Output Saturation Voltage vs. Output Current FG Pin Low Voltage vs. Sink Current 2000 300 250 1600 1400 FG Pin Low Voltage (mV) Output Saturation Voltage (mV) 1800 Upper Side Saturation Voltage 1200 1000 800 600 400 200 Lower Side Saturation Voltage 0 0 200 400 600 800 150 100 50 0 0 1000 Output Current (mA) Copyright ANPEC Electronics Corp. Rev. A.3 - Jun., 2008 200 1 2 3 4 5 6 7 8 9 10 FG Pin Sink Current (mA) 4 www.anpec.com.tw APX9270 Typical Operating Characteristics Maximum Power Dissipation vs. Ambient Temperature Maximum Power Dissipation (W) 1.6 TSSOP-20P 1.4 1.2 1 0.8 0.6 SSOP-20 0.4 0.2 0 0 25 50 75 100 125 Ambient Temperature ( °C) 150 Operating Waveforms Rotation Waveform 1 Rotation Waveform 2 VCC VOUT1 VOUT1 1, 2 1 VOUT2 2, 3 VOUT2 VIN3, 4 4 VIN+ Ch1 : VOUT1, 5V/Div, DC Ch2 : VOUT2, 5V/Div, DC Ch3 : VIN+, 100mV/Div, AC Ch4 : VIN-, 100mV/Div, AC Time : 2ms/Div Copyright ANPEC Electronics Corp. Rev. A.3 - Jun., 2008 IIN Ch1 : VCC, 5V/Div, DC Ch2 : VOUT1, 5V/Div, DC Ch3 : VOUT2, 5V/Div, DC Ch4 : IIN, 500mA/Div, DC Time : 2ms/Div 5 www.anpec.com.tw APX9270 Operating Waveforms (Cont.) Power ON Waveform Rotation Waveform 3 VCC VOUT1 VCC VOUT2 VOUT1 1 1 2, 3 2, 3 VOUT2 4 4 IIN IIN Ch1 : VCC, 5V/Div, DC Ch2 : VOUT1, 5V/Div, DC Ch3 : VOUT2, 5V/Div, DC Ch4 : IIN, 500mA/Div, DC Time : 50ms/Div Ch1 : VCC, 5V/Div, DC Ch2 : VOUT1, 5V/Div, DC Ch3 : VOUT2, 5V/Div, DC Ch4 : IIN, 200mA/Div, DC Time : 2ms/Div Lock Protection Waveform 1 Lock Protection Waveform 2 VOUT2 1, 2 3 4 VOUT2 1, 2 VOUT1 3 VCT VCT 4 IIN Ch1 : VOUT1, 5V/Div, DC Ch2 : VOUT2, 5V/Div, DC Ch3 : VCT, 2V/Div, DC Ch4 : IIN, 1A/Div, DC Time : 1s/Div Copyright ANPEC Electronics Corp. Rev. A.3 - Jun., 2008 VOUT1 IIN Ch1 : VOUT1, 5V/Div, DC Ch2 : VOUT2, 5V/Div, DC Ch3 : VCT, 2V/Div, DC Ch4 : IIN, 1A/Div, DC Time : 1s/Div 6 www.anpec.com.tw APX9270 Pin Description PIN FUNCTION NO. NAME 1 PGND Power Stage GND. 2 OUT2 H-bridge Output Connection. The output stage is a H-bridge formed by four transistors and four-protection diode for switching applications. 3 VM Supply Voltage for Output Stage Input Pin. 4 VCC Supply Voltage Input Pin. 5 OSCH Setting of the OSC Waveform High Level Voltage. Use a voltage divider from 6VREG to set OSC waveform high-level voltage. 6 OSCL Setting of the OSC Waveform Low Level Voltage. Use a voltage divider from 6VREG to set OSC waveform low-level voltage. 7 SET Speed Setting. An external voltage into SET pin to set fan speed. 8 MIN Minimum Speed Setting. Use a voltage divider from 6VREG to set MIN pin voltage for setting minimum speed. 9 PWM PWM Signal Input Terminal. 10 OSC Oscillator Frequency Setting. Connect a capacitor to SGND to set oscillation frequency. 11 FG Rotation Speed Output. This is an open-collector output. 12 IN+ Hall Input +. Connect to hell element positive output. 13 HB Hall Bias. This is a 1.3V constant-voltage output for hall element bias. 14 IN- Hall Input -. Connect to hell element negative output. 15 CT Shutdown Time and Restart Time Setting. Connect a capacitor to SGND to set shutdown time and restart time in lock mode. 16 6VREG 6V Regulator Output. This is a 6V constant-voltage output for application circuit biases. 17 SGND Control Stage GND. 18 OUT1 H-bridge Output Connection. The output stage is a H-bridge formed by four transistors and four-protection diode for switching applications. 19 PGND Power Stage GND. 20 PGND Power Stage GND. Copyright ANPEC Electronics Corp. Rev. A.3 - Jun., 2008 7 www.anpec.com.tw APX9270 Block Diagram FG Thermal Protection VCC External Current Limiter VM 6V Regulator 6VREG Level Shift HB Hall Bias Internal Current Limiter Control circuit M IN+ HALL OUT 1 Level Shift IN - OUT 2 Oscillating circuit Charge/discharge circuit SGND CT PWM MIN SET OSCH OSCL OSC PGND Typical Application Circuits 1. With external current limiter IIN RL VIN Pull High R1=1Ω Voltage VCC CM=4.7µF /25V VM RFG=10KΩ 6VREG R6 FG PWM PWM input R7 OUT1 R2 OSCH R4 R3 M OSCL R5 OUT2 MIN HB SET Thermistor IN+ OSC COSC=100pF H IN- CT SGND PGND CCT=0.47 to 1µF Copyright ANPEC Electronics Corp. Rev. A.3 - Jun., 2008 8 www.anpec.com.tw APX9270 Typical Application Circuits (Cont.) 2. Without external current limiter IIN VIN Pull High Voltage R1=2Ω C1=4.7µF/25V VCC VM RFG=10KΩ 6VREG R6 FG PWM PWM input R7 OUT1 R2 OSCH R4 R3 M OSCL R5 OUT2 MIN HB SET IN+ OSC Thermistor COSC=100pF H IN- CT SGND PGND CCT=0.47 to 1µF Note 3: In hot plug application, it’s necessary to protect against a hot plug input voltage overshoot. Placing a resistor (R1) in series with a capacitor (C1 or CM) dampens the overshoot. Copyright ANPEC Electronics Corp. Rev. A.3 - Jun., 2008 9 www.anpec.com.tw APX9270 Function Description the fan is locked. Connecting the capacitor from CT pin to Variable Speed Control GND determines the shutdown time and restart time. As the fan is locked, the charge/discharge circuit will charge The APX9270 is designed with a variable speed controller which has two external input signals, a temperature the CT capacitor to 3.6V by a 2.2µA source current for a locked detection time, and then the circuit will switch the signal sensed by a thermistor and an external PWM signal. capacitor to discharge. During the discharging interval, the output drivers are switched off until the CT voltage is Temperature Speed Control discharged to 1.6V by a 0.22µA sink current, and the circuit will switch the capacitor to charge. In the charging Using thermistor get temperature to make SET pin voltage. The fan’s speed is decided by comparing OSC and SET pin voltage. In addition, the lowest drive duty is interval, the IC enters the restart time; one output is high and another is low, which makes a torque for fan rotation set by comparing the OSC oscillating voltage and MIN pin voltage (only for temperature speed control side). until the CT voltage is charged to 3.6V by a 2.2µA source current. If the locked condition still remains, the charge/ Temperature control system works by comparing the voltage of SET and OSC. When SET voltage is lower than discharge process will be recurred until the locked condition is released (see Figure 2: Lock/Auto Restart OSC voltage, one OUT pulled high and another OUT pulled low. On the contrary, when SET voltage is higher Waveform). than OSC voltage, upper side transistors are OFF; meanwhile, the coil current re-circulates lower side VINVIN+ transistor. Therefore, with decreasing SET voltage, the output ON-Duty will be increasing, which results in the TOFF VOUT2 TOFF increasing of the coil current and motor rotation speed. TON VOUT1 External PWM Speed Control This is a pin for the direct PWM speed control. PWM pin input is pulled down to GND when it is not used. The minimum duty is performed by R6 and R7 resistances VCT (see Typical Application Circuit). R7 is left open if you want to stop rotation when PWM duty is 0%. VFG (see Figure 1: Rotation Control Curve) Lock External PWM-Duty OUT -DUTY(%) Lock Detection Release Figure 2: Lock/Auto Restart Waveform Current Limit Duty 100% The APX9270 includes both internal and external current limiters. External current limiter value is programmed by Duty 50 % RL which is located between VCC pin and VM pin. The external current limiter works when the voltage difference Duty 0% between both sides of RL raises to be 0.48V or higher. For example, the RL=0.5Ω, the external current limiter TA (oC) value is fixed and internally set at 960mA. The internal current limiter value is different in rotation mode and lock Figure 1: Rotation Control Curve mode. It is 1.2A in rotation mode, but it decreases to 0.6A in lock mode. This feature can reduce power consump- Lockup Protection and Automatic Restart The APX9270 provides the lockup protection and auto- tion while the fan is locked. In general application, it is matic restart functions to prevent the coil burnout while Copyright ANPEC Electronics Corp. Rev. A.3 - Jun., 2008 10 www.anpec.com.tw APX9270 Function Description (Cont.) Current Limit (Cont.) Thermal Protection recommended to short RL resistance and remove CM ca- The APX9270 is designed with a thermal protection to protect the IC from the damage of over temperature. pacitor to disable external current limiter because the internal current limiter is sufficient to avoid overload. When internal junction temperature reaches 160°C, the output devices will be switched off. When the IC’s junc- FG Output tion temperature cools by 20°C, the thermal sensor will turn the output devices on again resulting in a pulsed The FG pin is an open drain output connecting a pull up resistor to a high level voltage for the speed detection output during continuous thermal overload. function. When VIN- is larger than VIN+, the VFG is low (switch on); when VIN- is smaller than VIN+, the VFG is high (switch off). Leave it open when not in using. Truth Table SET L H - PWM L L L L H H - Input INH L H L H L H L IN+ L H L H L H L H CT L H OUT1 H L OFF L OFF L OFF L Output OUT2 L H L OFF L OFF L OFF FG L OFF L OFF L OFF L OFF Mode Rotation (Drive) Rotation (Regeneration) Output Regeneration Mode by External Signal Lock Mode SET or PWM=[L], “L” means that SET or PWM voltage is smaller than OSC voltage. Also, SET or PWM=[H], “H” means that SET or PWM voltage is greater than OSC voltage. Application Information Input Protection Diode & Capacitor and then it will discharge C OSC to V OSCL by 10µA sink The input protection diode (D1) between supply voltage and VCC pin has to be used to prevent the reverse current current. The circuit can generate a triangular waveform. The triangular waveform is determinded by COSC, R2, R3, flowing into the supply power. However, the protection diode will cause a voltage drop on the supply voltage. R4, and R4. (see Typical Application Circuit) The current rating of the diode must be larger than the maximum output current. For the noise reduction purpose, a capacitor (C1/CM) must be connected between VCC/VM and SGND/PGND. The C1/CM should be placed near the VOSCH = V 6 VREG × R3 R2 + R3 VOSCL = V 6 VREG × R5 R 4 + R5 fOSC = device VCC/VM pin as close as possible. 0.5 × ISOC1 ( VOSCH − VOSCL) × COSC For example: Setting of the Oscillator Frequency and Output Voltage The oscillator is used for PWM speed control. Compare COSC=100pF, R2 = R5 = 10kΩ, the OSC and SET pin voltages can decide PWM duty and PWM frequency depends on the oscillator frequency. The R3 = R4 = 20kΩ, IOSC1=10µA VOSCH= 4V, VOSCL= 2V, fOSC=25kHz oscillator is based on internal charge/discharge circuit. The circuit charges COSC to VOSCH by a 10µA source current, Copyright ANPEC Electronics Corp. Rev. A.3 - Jun., 2008 The recommended OSC frequency range is from 22kHz to 32kHz. 11 www.anpec.com.tw APX9270 Application Information (Cont.) HB Bias Output and Hall Input Signals Thermal Pad Consideration The IC outputs a 1.3V voltage on HB pin to provide bias The thermal pad on the bottom of the TSSOP-20P pack- for the external hall element. The IC also has two pins IN+ and IN- to receive the hall signals from the hall age should be soldered down to a copper pad on the circuit board. Heat can be conducted away from the ther- element. The hall signals are very weak so the layout tracks must be short and far away from those noise mal pad through the copper plane to ambient. If the copper plane is not on the top surface of the circuit board, 8 to sources to avoid noise coupling. The hall input amplifier has 20mV hysteresis. Therefore, the recommended dif- 10 vias of 13 mil or smaller in diameter should be used to thermally couple the thermal pad to the bottom plane. For ferential hall input voltage should be more than 60mV. good thermal conduction, the vias must be plated through and solder filled. The copper plane is used to conduct CT Capacitor heat away from the thermal pad should be as large as practical. If the ambient temperature is higher than 25οC, a larger The capacitor that is connected from CT pin to GND determines the shutdown time and restart time. Locked Detection Time = Restart Time = CCT × (V CT1 − 0.2 V ) ICT1 copper plane or forced-air cooling will be required to keep the APX9270 junction temperature below the thermal pro- CCT × (V CT1 − V CT2 ) ICT1 Shutdown Time = tection temperature (160οC). Thermal Consideration CCT × (V CT1 − V CT2 ) ICT2 Refer to “Maximum Power Dissipation vs. Ambient Temperature”, the IC is safe to operate below the curve and it will cause the thermal protection if the operating where area is above the line. For example, TA= 50οC, the SSOP20 package maximum power dissipation is about 0.95W. CCT = CT pin capacitor For example: Power dissipation can be calculated by the following VCC=12V, CCT=1µF Locked Detection Time = 1.545 s equation: ( For example: When VCC = 12V, ICC = 6mA, IOUT = 300mA, VOUT1 = 11.66V, The value of charge capacitor in the range of 0.47µF to 1µF is recommended. VOUT2 = 0.13V, then PD = 0.213W According the power dissipation issue, we could adapt FG Resistor this SSOP-20 package. The value of the FG resistor could be decided by the following equation RFG = ) PD = VCC − VOUT1 − VOUT2 × IOUT + VCC × ICC Restart Time = 0.909 s Shutdown Time = 9.091 s V 6VREG − VFG IFG For example: V6VREG = 6V, IFG = 5mA, VFG = 0.2V, RFG = 1.16kΩ The value of resistor in the range of 1kΩ to 10kΩ is recommended. Copyright ANPEC Electronics Corp. Rev. A.3 - Jun., 2008 12 www.anpec.com.tw APX9270 Package Information SSOP-20 D h X 45 E E1 SEE VIEW A c A 0.25 b L 0 GAUGE PLANE SEATING PLANE A1 A2 e VIEW A S Y M B O L A SSOP-20 MILLIMETERS MIN. INCHES MAX. MIN. MAX. 0.004 0.010 1.75 0.25 0.069 A1 0.10 A2 1.24 b 0.20 0.30 0.008 0.012 0.049 c 0.15 0.25 0.006 0.010 D 8.56 8.76 0.337 0.345 E 5.80 6.20 0.228 0.244 E1 3.80 4.00 0.150 e 0.635 BSC 0.157 0.025 BSC L 0.40 1.27 0.016 0.050 h 0.25 0.50 0.010 0.020 0 0° 8° 0° 8° Note : 1. Follow JEDEC MO-137 AD. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side . 3. Dimension "E" does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 10 mil per side. Copyright ANPEC Electronics Corp. Rev. A.3 - Jun., 2008 13 www.anpec.com.tw APX9270 Package Information TSSOP-20P D SEE VIEW A b A 0.25 c GAUGE PLANE SEATING PLANE A1 A2 e VIEW A S Y M B O L L 0 EXPOSE D PAD E E2 E1 D1 TSSOP-20P INCHES MILLIMETERS MIN. MIN. MAX. A MAX. 0.047 1.20 A1 0.05 0.15 0.002 0.006 A2 0.80 1.05 0.031 0.041 b 0.19 0.30 0.007 0.012 c 0.09 0.20 0.004 0.008 D 6.40 6.60 0.252 0.260 D1 2.20 5.00 0.087 0.197 0.177 0.157 E 6.40 BSC 0.252 BSC E1 4.30 4.50 0.169 E2 1.50 4.00 0.059 0.75 0.018 e L 0 0.65 BSC 0.45 0 o 0.026 BSC 8 o 0.030 o 0 8 o Note : 1. Follow JEDEC MO-153 ACT. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side. 3. Dimension "E1" does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 10 mil per side. Copyright ANPEC Electronics Corp. Rev. A.3 - Jun., 2008 14 www.anpec.com.tw APX9270 Carrier Tape & Reel Dimensions P0 P2 P1 A B0 W F E1 OD0 K0 A0 A OD1 B B T SECTION A-A SECTION B-B H A d T1 Application SSOP-20 Application TSSOP-20P A H T1 C 16.4+2.00 13.0+0.50 -0.00 -0.20 330±2.00 50 MIN. P0 P1 P2 4.0±0.10 8.0±0.10 2.0±0.10 A H 330.0±2.00 50 MIN. P0 P1 D0 1.5+0.10 -0.00 d D 1.5 MIN. D1 1.5 MIN. T1 C d 16.4+2.00 13.0+0.50 -0.00 -0.20 1.5 MIN. P2 4.00±0.10 8.00±0.10 2.00±0.10 D0 1.5+0.10 -0.00 D1 W E1 20.2 MIN. 16.0±0.30 1.75±0.10 T 0.6+0.00 -0.40 D A0 B0 1.5 MIN. 0.30±0.05 7.5±0.1 K0 6.40±0.20 9.00±0.20 2.10±0.20 W E1 20.2 MIN. 16.0±0.30 1.75±0.10 T F A0 6.9±0.20 B0 F 7.50±0.10 K0 6.90±0.20 1.60±0.20 (mm) Devices Per Reel Package Type Unit Quantity SSOP-20 Tape & Reel 2500 TSSOP-20P Tape & Reel 2000 Copyright ANPEC Electronics Corp. Rev. A.3 - Jun., 2008 15 www.anpec.com.tw APX9270 Reflow Condition (IR/Convection or VPR Reflow) tp TP Critical Zone TL to TP Temperature Ramp-up TL tL Tsmax Tsmin Ramp-down ts Preheat t 25°C to Peak 25 Time Reliability Test Program Test item SOLDERABILITY HOLT PCT TST ESD Latch-Up Method MIL-STD-883D-2003 MIL-STD-883D-1005.7 JESD-22-B, A102 MIL-STD-883D-1011.9 MIL-STD-883D-3015.7 JESD 78 Description 245°C, 5 sec 1000 Hrs Bias @125°C 168 Hrs, 100%RH, 121°C -65°C~150°C, 200 Cycles VHBM > 2KV, VMM > 200V 10ms, 1 tr > 100mA Classification Reflow Profiles Profile Feature Average ramp-up rate (TL to TP) Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts) Time maintained above: - Temperature (TL) - Time (tL) Peak/Classification Temperature (Tp) Time within 5°C of actual Peak Temperature (tp) Ramp-down Rate Sn-Pb Eutectic Assembly Pb-Free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 217°C 60-150 seconds See table 1 See table 2 10-30 seconds 20-40 seconds 6°C/second max. 6°C/second max. 6 minutes max. 8 minutes max. Time 25°C to Peak Temperature Note: All temperatures refer to topside of the package. Measured on the body surface. Copyright ANPEC Electronics Corp. Rev. A.3 - Jun., 2008 16 www.anpec.com.tw APX9270 Classification Reflow Profiles (Cont.) Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures 3 Package Thickness Volume mm <350 <2.5 mm 240 +0/-5°C ≥2.5 mm 225 +0/-5°C 3 Volume mm ≥350 225 +0/-5°C 225 +0/-5°C Table 2. Pb-free Process – Package Classification Reflow Temperatures 3 3 3 Package Thickness Volume mm Volume mm Volume mm <350 350-2000 >2000 <1.6 mm 260 +0°C* 260 +0°C* 260 +0°C* 1.6 mm – 2.5 mm 260 +0°C* 250 +0°C* 245 +0°C* ≥2.5 mm 250 +0°C* 245 +0°C* 245 +0°C* *Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL level. Customer Service Anpec Electronics Corp. Head Office : No.6, Dusing 1st Road, SBIP, Hsin-Chu, Taiwan Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 2F, No. 11, Lane 218, Sec 2 Jhongsing Rd., Sindian City, Taipei County 23146, Taiwan Tel : 886-2-2910-3838 Fax : 886-2-2917-3838 Copyright ANPEC Electronics Corp. Rev. A.3 - Jun., 2008 17 www.anpec.com.tw