OPA211 OPA2211 OP A2 11 OP A2 11 OP A2 11 OPA 2211 OP A2 211 www.ti.com...................................................................................................................................................... SBOS377G – OCTOBER 2006 – REVISED MAY 2009 1.1nV/√Hz Noise, Low Power, Precision Operational Amplifier in Small DFN-8 Package • LOW VOLTAGE NOISE: 1.1nV/√Hz at 1kHz • INPUT VOLTAGE NOISE: 80nVPP (0.1Hz to 10Hz) • THD+N: –136dB (G = 1, f = 1kHz) • OFFSET VOLTAGE: 125µV (max) • OFFSET VOLTAGE DRIFT: 0.35µV/°C (typ) • LOW SUPPLY CURRENT: 3.6mA/Ch (typ) • UNITY-GAIN STABLE • GAIN BANDWIDTH PRODUCT: 80MHz (G = 100) 45MHz (G = 1) • SLEW RATE: 27V/µs • 16-BIT SETTLING: 700ns • WIDE SUPPLY RANGE: ±2.25V to ±18V, +4.5V to +36V • RAIL-TO-RAIL OUTPUT • OUTPUT CURRENT: 30mA • DFN-8 (3mm × 3mm), MSOP-8, AND SO-8 23 APPLICATIONS • • • • • • • • • • • • • PLL LOOP FILTER LOW-NOISE, LOW-POWER SIGNAL PROCESSING 16-BIT ADC DRIVERS DAC OUTPUT AMPLIFIERS ACTIVE FILTERS LOW-NOISE INSTRUMENTATION AMPS ULTRASOUND AMPLIFIERS PROFESSIONAL AUDIO PREAMPLIFIERS LOW-NOISE FREQUENCY SYNTHESIZERS INFRARED DETECTOR AMPLIFIERS HYDROPHONE AMPLIFIERS GEOPHONE AMPLIFIERS MEDICAL DESCRIPTION The OPA211 series of precision operational amplifiers achieves very low 1.1nV/√Hz noise density with a supply current of only 3.6mA. This series also offers rail-to-rail output swing, which maximizes dynamic range. The extremely low voltage and low current noise, high speed, and wide output swing of the OPA211 series make these devices an excellent choice as a loop filter amplifier in PLL applications. In precision data acquisition applications, the OPA211 series of op amps provides 700ns settling time to 16-bit accuracy throughout 10V output swings. This ac performance, combined with only 125µV of offset and 0.35µV/°C of drift over temperature, makes the OPA211 ideal for driving high-precision 16-bit analog-to-digital converters (ADCs) or buffering the output of high-resolution digital-to-analog converters (DACs). The OPA211 series is specified over a wide dual-power supply range of ±2.25V to ±18V, or for single-supply operation from +4.5V to +36V. The OPA211 is available in the small DFN-8 (3mm × 3mm), MSOP-8, and SO-8 packages. A dual version, the OPA2211, is available in the DFN-8 (3mm × 3mm) or an SO-8 PowerPAD™ package. This series of op amps is specified from TA = –40°C to +125°C. INPUT VOLTAGE NOISE DENSITY vs FREQUENCY 100 Voltage Noise Density (nV/ÖHz) FEATURES 1 10 1 0.1 1 10 100 1k 10k 100k Frequency (Hz) 1 2 3 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2006–2009, Texas Instruments Incorporated OPA211 OPA2211 SBOS377G – OCTOBER 2006 – REVISED MAY 2009...................................................................................................................................................... www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ABSOLUTE MAXIMUM RATINGS (1) Over operating free-air temperature range (unless otherwise noted). Supply Voltage VALUE UNIT 40 V VS = (V+) – (V–) Input Voltage (V–) – 0.5 to (V+) + 0.5 V ±10 mA Input Current (Any pin except power-supply pins) Output Short-Circuit (2) Continuous Operating Temperature (TA) –55 to +150 °C Storage Temperature (TA) –65 to +150 °C Junction Temperature (TJ) 200 °C Human Body Model (HBM) 3000 V Charged Device Model (CDM) 1000 V ESD Ratings (1) (2) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not supported. Short-circuit to VS/2 (ground in symmetrical dual supply setups), one amplifier per package. PACKAGE/ORDERING INFORMATION (1) PRODUCT PACKAGE DESIGNATOR PACKAGE MARKING ü DRG OBDQ ü DGK OBCQ D A TI OPA 211 PACKAGE-LEAD SINGLE SHUTDOWN DFN-8 (3mm × 3mm) ü MSOP-8 ü DUAL Standard Grade OPA211AI SO-8 ü ü DFN-8 (3mm × 3mm) OPA2211AI ü SO-8 PowerPAD DRG OBHQ DDA A TI OPA 2211 High Grade OPA211I (1) 2 DFN-8 (3mm × 3mm) ü ü DRG OBDQ MSOP-8 ü ü DGK OBCQ SO-8 ü D TI OPA 211 For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Submit Documentation Feedback Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s): OPA211 OPA2211 OPA211 OPA2211 www.ti.com...................................................................................................................................................... SBOS377G – OCTOBER 2006 – REVISED MAY 2009 PIN CONFIGURATIONS OPA211 SO-8 NC (1) OPA211 MSOP-8 (1) 1 8 NC -IN 2 7 V+ +IN 3 6 OUT V- 4 5 NC NC (1) 1 8 Shutdown -IN 2 7 V+ +IN 3 6 OUT V- 4 5 NC (1) OPA211 DFN-8 (3mm × 3mm) NC (1) 1 -IN 2 +IN 3 V- 4 Pad (1) OPA2211 DFN-8 (3mm × 3mm) 8 Shutdown (3) 8 V+ OUT A 1 7 V+ -IN A 2 6 OUT 5 NC (3) +IN A 3 (1) V- 4 (2) Pad 7 OUT B A B 6 -IN B 5 +IN B (2) OPA2211 SO-8 PowerPAD OUT A 1 -IN A 2 +IN A 3 V- 4 Pad A B 8 V+ 7 OUT B 6 -IN B 5 +IN B (2) (1) NC denotes no internal connection. (2) Exposed thermal die pad on underside; connect thermal die pad to V–. Soldering the thermal pad improves heat dissipation and provides specified performance. (3) Shutdown function: • Device enabled: (V–) ≤ VSHUTDOWN ≤ (V+) – 3V • Device disabled: VSHUTDOWN ≥ (V+) – 0.35V Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s): OPA211 OPA2211 Submit Documentation Feedback 3 OPA211 OPA2211 SBOS377G – OCTOBER 2006 – REVISED MAY 2009...................................................................................................................................................... www.ti.com ELECTRICAL CHARACTERISTICS: VS = ±2.25V to ±18V BOLDFACE limits apply over the specified temperature range, TA = –40°C to +125°C. At TA = +25°C, RL = 10kΩ connected to midsupply, VCM = VOUT = midsupply, unless otherwise noted. Standard Grade OPA211AI, OPA2211AI PARAMETER CONDITIONS MIN High Grade OPA211I (1) TYP MAX MIN TYP MAX UNIT ±20 ±50 µV OFFSET VOLTAGE Input Offset Voltage VOS OPA211 VS = ±15V ±30 ±125 OPA2211 VS = ±15V ±50 ±150 0.35 1.5 0.15 0.85 µV/°C 0.1 1 0.1 0.5 µV/V 3 µV/V ±125 nA ±200 nA Drift dVOS/dT vs Power Supply PSRR VS = ±2.25V to ±18V Over Temperature µV 3 INPUT BIAS CURRENT Input Bias Current IB VCM = 0V ±60 ±175 ±50 Over Temperature OPA211 ±200 OPA2211 ±250 Offset Current IOS VCM = 0V ±25 nA ±100 Over Temperature ±20 ±150 ±75 nA ±150 nA NOISE Input Voltage Noise en Input Voltage Noise Density Input Current Noise Density In f = 0.1Hz to 10Hz 80 80 nVPP f = 10Hz 2 2 nV/√Hz f = 100Hz 1.4 1.4 nV/√Hz f = 1kHz 1.1 1.1 nV/√Hz f = 10Hz 3.2 3.2 pA/√Hz f = 1kHz 1.7 1.7 pA/√Hz INPUT VOLTAGE RANGE Common-Mode Voltage Range Common-Mode Rejection Ratio VS ≥ ±5V (V–) + 1.8 (V+) – 1.4 (V–) + 1.8 (V+) – 1.4 VS < ±5V (V–) + 2 (V+) – 1.4 (V–) + 2 (V+) – 1.4 VS ≥ ±5V, (V–) + 2V ≤ VCM ≤ (V+) – 2V 114 120 114 120 dB VS < ±5V, (V–) + 2V ≤ VCM ≤ (V+) – 2V 110 120 110 120 dB VCM CMRR V V INPUT IMPEDANCE Differential 20k || 8 20k || 8 Ω || pF Common-Mode 109 || 2 109 || 2 Ω || pF OPEN-LOOP GAIN AOL (V–) + 0.2V ≤ VO ≤ (V+) – 0.2V, RL = 10kΩ 114 130 114 130 dB AOL (V–) + 0.6V ≤ VO ≤ (V+) – 0.6V, RL = 600Ω 110 114 110 114 dB OPA211 AOL (V–) + 0.6V ≤ VO ≤ (V+) – 0.6V, IO ≤ 15mA 110 110 dB OPA211 AOL (V–) + 0.6V ≤ VO ≤ (V+) – 0.6V, 15mA ≤ IO ≤ 30mA 103 103 dB OPA2211 (per channel) AOL (V–) + 0.6V ≤ VO ≤ (V+)–0.6V, IO ≤ 15mA 100 Open-Loop Voltage Gain Over Temperature dB FREQUENCY RESPONSE Gain-Bandwidth Product G = 100 80 80 MHz G=1 45 45 MHz 27 27 V/µs VS = ±15V, G = –1, 10V Step, CL = 100pF 400 400 ns 0.0015% (16-bit) VS = ±15V, G = –1, 10V Step, CL = 100pF 700 700 ns Overload Recovery Time G = –10 500 500 ns G = +1, f = 1kHz, VO = 3VRMS, RL = 600Ω 0.000015 0.000015 % –136 –136 dB Slew Rate SR Settling Time, 0.01% Total Harmonic Distortion + Noise (1) 4 GBW tS THD+N Shaded cells indicate different specifications from standard-grade version of device. Submit Documentation Feedback Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s): OPA211 OPA2211 OPA211 OPA2211 www.ti.com...................................................................................................................................................... SBOS377G – OCTOBER 2006 – REVISED MAY 2009 ELECTRICAL CHARACTERISTICS: VS = ±2.25V to ±18V (continued) BOLDFACE limits apply over the specified temperature range, TA = –40°C to +125°C. At TA = +25°C, RL = 10kΩ connected to midsupply, VCM = VOUT = midsupply, unless otherwise noted. Standard Grade OPA211AI, OPA2211AI PARAMETER CONDITIONS MIN RL = 10kΩ, AOL ≥ 114dB RL = 600Ω, AOL ≥ 110dB IO < 15mA, AOL ≥ 110dB TYP High Grade OPA211I (1) MAX MIN (V–) + 0.2 (V+) – 0.2 (V–) + 0.6 (V+) – 0.6 (V–) + 0.6 (V+) – 0.6 TYP MAX UNIT (V–) + 0.2 (V+) – 0.2 V (V–) + 0.6 (V+) – 0.6 V (V–) + 0.6 (V+) – 0.6 OUTPUT Voltage Output VOUT Short-Circuit Current Capacitive Load Drive ISC +30/–45 CLOAD Open-Loop Output Impedance +30/–45 See Typical Characteristics ZO f = 1MHz See Typical Characteristics 5 V mA pF Ω 5 SHUTDOWN Shutdown Pin Input Voltage (2) Device disabled (shutdown) (V+) – 0.35 (V+) – 0.35 Device enabled V (V+) – 3 (V+) – 3 V Shutdown Pin Leakage Current 1 1 µA Turn-On Time (3) 2 2 µs Turn-Off Time (3) 3 3 Shutdown Current Shutdown (disabled) 1 20 1 µs 20 µA ±18 V 4.5 mA 6 mA POWER SUPPLY Specified Voltage VS Quiescent Current (per channel) IQ ±2.25 IOUT = 0A ±18 3.6 Over Temperature (per channel) ±2.25 4.5 3.6 6 TEMPERATURE RANGE Specified Range TA –40 +125 –40 +125 °C Operating Range TA –55 +150 –55 +150 °C Thermal Resistance OPA211 SO-8 θ JA 150 150 °C/W MSOP-8 θ JA 200 200 °C/W (4) 65 65 °C/W θ JP 20 20 °C/W 52 52 °C/W 2 2 °C/W (4) 65 65 °C/W θ JP 10 10 °C/W DFN-8 (3mm × 3mm) θ JA OPA2211 SO-8 PowerPAD θ JA (4) θ JP DFN-8 (3mm × 3mm) (2) (3) (4) θ JA When disabled, the output assumes a high-impedance state. See Typical Characteristic graphs, Figure 41 through Figure 43. Typical θJA specification is based on the use of a high-k board. Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s): OPA211 OPA2211 Submit Documentation Feedback 5 OPA211 OPA2211 SBOS377G – OCTOBER 2006 – REVISED MAY 2009...................................................................................................................................................... www.ti.com TYPICAL CHARACTERISTICS At TA = +25°C, VS = ±18V, and RL = 10kΩ, unless otherwise noted. INPUT VOLTAGE NOISE DENSITY vs FREQUENCY INPUT CURRENT NOISE DENSITY vs FREQUENCY 100 Current Noise Density (pA/ÖHz) Voltage Noise Density (nV/ÖHz) 100 10 10 1 1 0.1 1 10 100 1k 10k 1 0.1 100k 10 100 Frequency (Hz) Figure 1. G = -1 RL = 5kW G=1 RL = 600W 0.00001 -140 100 1k 10k 20k Total Harmonic Distortion + Noise (%) Total Harmonic Distortion + Noise (%) G = 11 RL = 600W 0.1 -60 0.01 -80 G = 11 0.001 -100 0.0001 -120 G=1 0.00001 VS = ±15V RL = 600W 1kHz Signal Measurement BW = 80kHz 0.000001 0.01 0.1 1 Figure 3. THD+N RATIO vs FREQUENCY 100 1k Frequency (Hz) 10k -140 100k -80 -90 Channel Separation (dB) Total Harmonic Distortion + Noise (%) G = -1 RL = 5kW Total Harmonic Distortion + Noise (dB) -120 0.00001 10 -160 100 CHANNEL SEPARATION vs FREQUENCY -100 G = 11 RL = 600W G=1 RL = 600W 10 Figure 4. VS = ±15V VOUT = 3VRMS Measurement BW > 500kHz 0.0001 G = -1 Output Voltage Amplitude (VRMS) Frequency (Hz) 0.001 -140 Total Harmonic Distortion + Noise (dB) -120 Total Harmonic Distortion + Noise (dB) VS = ±15V VOUT = 3VRMS Measurement BW = 80kHz 10 100k THD+N RATIO vs OUTPUT VOLTAGE AMPLITUDE -100 0.0001 10k Figure 2. THD+N RATIO vs FREQUENCY 0.001 1k Frequency (Hz) -100 VS = ±15V VIN = 3.5VRMS G=1 RL = 600W -110 -120 -130 -140 RL = 2kW -150 -160 RL = 5kW -170 -180 10 100 1k 10k 100k Frequency (Hz) Figure 5. 6 Submit Documentation Feedback Figure 6. Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s): OPA211 OPA2211 OPA211 OPA2211 www.ti.com...................................................................................................................................................... SBOS377G – OCTOBER 2006 – REVISED MAY 2009 TYPICAL CHARACTERISTICS (continued) At TA = +25°C, VS = ±18V, and RL = 10kΩ, unless otherwise noted. POWER-SUPPLY REJECTION RATIO vs FREQUENCY (Referred to Input) 0.1Hz TO 10Hz NOISE 160 140 20nV/div PSRR (dB) 120 100 -PSRR 80 +PSRR 60 40 20 0 Time (1s/div) 1 10 100 1k 10k 100k 1M 10M 100M Frequency (Hz) Figure 7. Figure 8. COMMON-MODE REJECTION RATIO vs FREQUENCY OPEN-LOOP OUTPUT IMPEDANCE vs FREQUENCY 140 10k 120 1k 80 ZO (W) CMRR (dB) 100 60 100 10 40 1 20 0 0.1 100k 10k 10M 1M 100M 10 100 1k Frequency (Hz) 10k Figure 9. GAIN AND PHASE vs FREQUENCY 4 135 Phase 60 90 40 Gain 45 0 Phase (°) 80 Open-Loop Gain (mV/V) 120 Gain (dB) 10M 100M NORMALIZED OPEN-LOOP GAIN vs TEMPERATURE 5 180 20 1M Figure 10. 140 100 100k Frequency (Hz) RL = 10kW 3 2 300mV Swing From Rails 1 0 -1 200mV Swing From Rails -2 -3 -4 -20 100 1k 10k 100k 1M 10M 0 100M -5 -75 -50 -25 0 25 50 75 100 125 150 175 200 Temperature (°C) Frequency (Hz) Figure 11. Figure 12. Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s): OPA211 OPA2211 Submit Documentation Feedback 7 OPA211 OPA2211 SBOS377G – OCTOBER 2006 – REVISED MAY 2009...................................................................................................................................................... www.ti.com TYPICAL CHARACTERISTICS (continued) At TA = +25°C, VS = ±18V, and RL = 10kΩ, unless otherwise noted. OFFSET VOLTAGE DRIFT PRODUCTION DISTRIBUTION 112.5 125.0 87.5 100.0 62.5 75.0 37.5 50.0 25.0 0 12.5 -12.5 -37.5 -25.0 -62.5 -50.0 -87.5 -75.0 -112.5 -100.0 -125.0 Population Population OFFSET VOLTAGE PRODUCTION DISTRIBUTION 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 Offset Voltage Drift (mV/°C) Offset Voltage (mV) Figure 13. Figure 14. OFFSET VOLTAGE vs COMMON-MODE VOLTAGE 2000 150 1500 100 1000 +IB 50 IOS 500 VOS (mV) IB and IOS Bias Current (nA) IB AND IOS CURRENT vs TEMPERATURE 200 0 -50 0 -500 -IB -100 -1000 -150 -1500 -200 -2000 -50 -25 0 25 50 75 100 125 150 (V-)+1.0 (V-)+1.5 (V-)+2.0 (V+)-1.5 (V+)-1.0 (V+)-0.5 Ambient Temperature (°C) VCM (V) Figure 15. Figure 16. VOS WARMUP 12 10 INPUT OFFSET CURRENT vs SUPPLY VOLTAGE 100 20 Typical Units Shown 80 8 60 6 40 4 2 IOS (nA) VOS Shift (mV) 5 Typical Units Shown 0 -2 20 0 -20 -4 -40 -6 -8 -60 -10 -80 -12 0 10 20 30 40 50 60 -100 2.25 4 6 Time (s) Submit Documentation Feedback 10 12 14 16 18 VS (±V) Figure 17. 8 8 Figure 18. Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s): OPA211 OPA2211 OPA211 OPA2211 www.ti.com...................................................................................................................................................... SBOS377G – OCTOBER 2006 – REVISED MAY 2009 TYPICAL CHARACTERISTICS (continued) At TA = +25°C, VS = ±18V, and RL = 10kΩ, unless otherwise noted. INPUT OFFSET CURRENT vs COMMON-MODE VOLTAGE INPUT BIAS CURRENT vs SUPPLY VOLTAGE 100 150 VS = 36V 3 Typical Units Shown 75 3 Typical Units Shown 100 Unit 1 Unit 2 50 25 IB (nA) IOS (nA) 50 0 0 Unit 3 -25 Common-Mode Range -50 -50 -100 -IB -75 +IB -150 2.25 -100 1 5 10 15 20 25 30 35 4 6 8 10 VCM (V) Figure 19. 14 16 18 Figure 20. INPUT BIAS CURRENT vs COMMON-MODE VOLTAGE QUIESCENT CURRENT vs TEMPERATURE 6 150 VS = 36V 3 Typical Units Shown 50 -IB +IB 5 4 Unit 2 Unit 1 IQ (mA) 100 IB (nA) 12 VS (±V) 0 3 2 -50 Unit 3 1 -100 Common-Mode Range 0 -150 1 5 10 15 20 25 30 -75 -50 -25 35 0 25 50 75 100 125 150 175 200 Temperature (°C) VCM (V) Figure 21. Figure 22. QUIESCENT CURRENT vs SUPPLY VOLTAGE NORMALIZED QUIESCENT CURRENT vs TIME 4.0 0.05 3.5 0 3.0 IQ Shift (mA) -0.05 IQ (mA) 2.5 2.0 1.5 -0.10 -0.15 1.0 -0.20 0.5 -0.25 0 -0.30 Average of 10 Typical Units 0 4 8 12 16 20 24 28 32 36 0 60 120 180 240 300 360 420 480 540 600 Time (s) VS (V) Figure 23. Figure 24. Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s): OPA211 OPA2211 Submit Documentation Feedback 9 OPA211 OPA2211 SBOS377G – OCTOBER 2006 – REVISED MAY 2009...................................................................................................................................................... www.ti.com TYPICAL CHARACTERISTICS (continued) At TA = +25°C, VS = ±18V, and RL = 10kΩ, unless otherwise noted. 60 50 40 30 20 10 0 -10 -20 -30 -40 -50 SMALL-SIGNAL STEP RESPONSE (100mV) G = -1 CL = 10pF Sourcing CF 5.6pF 20mV/div ISC (mA) SHORT-CIRCUIT CURRENT vs TEMPERATURE RI 604W RF 604W +18V OPA211 CL Sinking -18V -60 -75 -50 -25 0 25 50 75 Time (0.1ms/div) 100 125 150 175 200 Temperature (°C) Figure 25. Figure 26. SMALL-SIGNAL STEP RESPONSE (100mV) SMALL-SIGNAL STEP RESPONSE (100mV) G = +1 RL = 600W CL = 10pF G = -1 CL = 100pF 20mV/div 20mV/div CF 5.6pF RF 604W RI 604W +18V OPA211 +18V OPA211 -18V RL CL CL -18V Time (0.1ms/div) Time (0.1ms/div) Figure 27. Figure 28. SMALL-SIGNAL STEP RESPONSE (100mV) SMALL-SIGNAL OVERSHOOT vs CAPACITIVE LOAD (100mV Output Step) 60 +18V OPA211 -18V G = +1 50 Overshoot (%) 20mV/div G = +1 RL = 600W CL = 100pF RL 40 G = -1 30 G = 10 20 CL 10 0 Time (0.1ms/div) 0 200 400 600 800 1000 1200 1400 Capacitive Load (pF) Figure 29. 10 Submit Documentation Feedback Figure 30. Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s): OPA211 OPA2211 OPA211 OPA2211 www.ti.com...................................................................................................................................................... SBOS377G – OCTOBER 2006 – REVISED MAY 2009 TYPICAL CHARACTERISTICS (continued) At TA = +25°C, VS = ±18V, and RL = 10kΩ, unless otherwise noted. LARGE-SIGNAL STEP RESPONSE LARGE-SIGNAL STEP RESPONSE G = -1 CL = 100pF RL = 600W G = +1 CL = 100pF RL = 600W RF = 100W 2V/div 2V/div RF = 0W Note: See the Applications Information section, Input Protection. Figure 32. LARGE-SIGNAL POSITIVE SETTLING TIME (10VPP, CL = 100pF) LARGE-SIGNAL POSITIVE SETTLING TIME (10VPP, CL = 10pF) 1.0 0.010 0.008 0.8 0.008 0.6 0.006 0.6 0.006 0.4 0.004 16-Bit Settling 0.2 0 0.002 0 -0.2 (±1/2 LSB = ±0.00075%) -0.4 -0.002 -0.004 0 0.004 0.002 0 -0.2 (±1/2 LSB = ±0.00075%) -0.4 -0.002 -0.004 -0.006 -0.8 -0.008 -0.010 700 800 900 1000 -1.0 -0.8 -1.0 400 500 600 Time (ns) 16-Bit Settling 0.2 -0.008 -0.006 200 300 0.4 -0.6 -0.6 100 D From Final Value (mV) 0.010 0.8 0 100 200 300 400 500 600 Time (ns) -0.010 700 800 900 1000 Figure 33. Figure 34. LARGE-SIGNAL NEGATIVE SETTLING TIME (10VPP, CL = 100pF) LARGE-SIGNAL NEGATIVE SETTLING TIME (10VPP, CL = 10pF) 0.010 0.8 0.008 0.6 0.006 0.6 0.006 0.4 0.004 16-Bit Settling 0.002 0 0 -0.2 (±1/2 LSB = ±0.00075%) -0.4 -0.002 -0.004 -0.6 -0.006 -0.8 -1.0 0 100 200 300 400 500 600 Time (ns) D From Final Value (mV) 1.0 0.008 0.4 16-Bit Settling 0.2 0 0.004 0.002 0 -0.2 (±1/2 LSB = ±0.00075%) -0.4 -0.002 -0.004 -0.6 -0.006 -0.008 -0.8 -0.008 -0.010 700 800 900 1000 -1.0 0 100 200 300 Figure 35. 400 500 600 Time (ns) D From Final Value (%) 0.010 0.8 D From Final Value (%) 1.0 0.2 D From Final Value (%) 1.0 0 D From Final Value (mV) Time (0.5ms/div) Figure 31. D From Final Value (%) D From Final Value (mV) Time (0.5ms/div) -0.010 700 800 900 1000 Figure 36. Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s): OPA211 OPA2211 Submit Documentation Feedback 11 OPA211 OPA2211 SBOS377G – OCTOBER 2006 – REVISED MAY 2009...................................................................................................................................................... www.ti.com TYPICAL CHARACTERISTICS (continued) At TA = +25°C, VS = ±18V, and RL = 10kΩ, unless otherwise noted. NEGATIVE OVERLOAD RECOVERY POSITIVE OVERLOAD RECOVERY G = -10 VIN G = -10 10kW VOUT 1kW 0V VOUT OPA211 VIN 5V/div 5V/div 10kW 1kW OPA211 VOUT VIN 0V VOUT VIN Time (0.5ms/div) Time (0.5ms/div) Figure 37. Figure 38. OUTPUT VOLTAGE vs OUTPUT CURRENT NO PHASE REVERSAL 20 0°C 15 5 5V/div VOUT (V) Output +85°C +125°C 10 +125°C 0 -55°C 0°C +150°C -5 +18V -10 Output +85°C -15 37VPP (±18.5V) -20 0 10 20 30 40 IOUT (mA) 50 60 -18V 0.5ms/div 70 Figure 39. Figure 40. TURN-OFF TRANSIENT TURN-ON TRANSIENT 20 20 15 15 10 10 Output Signal Shutdown Signal 5 5V/div 5 5V/div OPA211 0 -5 0 Output Signal -5 -10 -10 Shutdown Signal -15 VS = ±15V -20 12 -15 VS = ±15V -20 Time (2ms/div) Time (2ms/div) Figure 41. Figure 42. Submit Documentation Feedback Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s): OPA211 OPA2211 OPA211 OPA2211 www.ti.com...................................................................................................................................................... SBOS377G – OCTOBER 2006 – REVISED MAY 2009 TYPICAL CHARACTERISTICS (continued) At TA = +25°C, VS = ±18V, and RL = 10kΩ, unless otherwise noted. TURN-ON/TURN-OFF TRANSIENT 20 1.6 15 1.2 10 0.8 5 0.4 0 -5 0 Output -0.4 -10 -0.8 -15 Output Voltage (V) Shutdown Pin Voltage (V) Shutdown Signal -1.2 VS = ±15V -20 -1.6 Time (100ms/div) Figure 43. Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s): OPA211 OPA2211 Submit Documentation Feedback 13 OPA211 OPA2211 SBOS377G – OCTOBER 2006 – REVISED MAY 2009...................................................................................................................................................... www.ti.com APPLICATION INFORMATION The OPA211 and OPA2211 are unity-gain stable, precision op amps with very low noise. Applications with noisy or high-impedance power supplies require decoupling capacitors close to the device pins. In most cases, 0.1µF capacitors are adequate. Figure 44 shows a simplified schematic of the OPA211. This die uses a SiGe bipolar process and contains 180 transistors. OPERATING VOLTAGE OPA211 series op amps operate from ±2.25V to ±18V supplies while maintaining excellent performance. The OPA211 series can operate with as little as +4.5V between the supplies and with up to +36V between the supplies. However, some applications do not require equal positive and negative output voltage swing. With the OPA211 series, power-supply voltages do not need to be equal. For example, the positive supply could be set to +25V with the negative supply at –5V or vice-versa. The common-mode voltage must be maintained within the specified range. In addition, key parameters are assured over the specified temperature range, TA = –40°C to +125°C. Parameters that vary significantly with operating voltage or temperature are shown in the Typical Characteristics. V+ Pre-Output Driver IN- OUT IN+ V- Figure 44. OPA211 Simplified Schematic 14 Submit Documentation Feedback Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s): OPA211 OPA2211 OPA211 OPA2211 www.ti.com...................................................................................................................................................... SBOS377G – OCTOBER 2006 – REVISED MAY 2009 INPUT PROTECTION NOISE PERFORMANCE The input terminals of the OPA211 are protected from excessive differential voltage with back-to-back diodes, as shown in Figure 45. In most circuit applications, the input protection circuitry has no consequence. However, in low-gain or G = 1 circuits, fast ramping input signals can forward bias these diodes because the output of the amplifier cannot respond rapidly enough to the input ramp. This effect is illustrated in Figure 32 of the Typical Characteristics. If the input signal is fast enough to create this forward bias condition, the input signal current must be limited to 10mA or less. If the input signal current is not inherently limited, an input series resistor can be used to limit the signal input current. This input series resistor degrades the low-noise performance of the OPA211, and is discussed in the Noise Performance section of this data sheet. Figure 45 shows an example implementing a current-limiting feedback resistor. Figure 46 shows total circuit noise for varying source impedances with the op amp in a unity-gain configuration (no feedback resistor network, and therefore no additional noise contributions). Two different op amps are shown with total circuit noise calculated. The OPA211 has very low voltage noise, making it ideal for low source impedances (less than 2kΩ). A similar precision op amp, the OPA227, has somewhat higher voltage noise but lower current noise. It provides excellent noise performance at moderate source impedance (10kΩ to 100kΩ). Above 100kΩ, a FET-input op amp such as the OPA132 (very low current noise) may provide improved performance. The equation in Figure 46 is shown for the calculation of the total circuit noise. Note that en = voltage noise, In = current noise, RS = source impedance, k = Boltzmann’s constant = 1.38 × 10–23 J/K, and T is temperature in degrees Kelvin. VOLTAGE NOISE SPECTRAL DENSITY vs SOURCE RESISTANCE RF - OPA211 RI Input Output + Figure 45. Pulsed Operation Votlage Noise Spectral Density, EO 10k EO 1k RS OPA227 OPA211 100 Resistor Noise 10 2 2 2 EO = en + (in RS) + 4kTRS 1 100 1k 10k 100k 1M Source Resistance, RS (W) SHUTDOWN The shutdown (enable) function of the OPA211 is referenced to the positive supply voltage of the operational amplifier. A valid high disables the op amp. A valid high is defined as (V+) – 0.35V of the positive supply applied to the shutdown pin. A valid low is defined as (V+) – 3V below the positive supply pin. For example, with VCC at ±15V, the device is enabled at or below 12V. The device is disabled at or above 14.65V. If dual or split power supplies are used, care should be taken to ensure the valid high or valid low input signals are properly referred to the positive supply voltage. This pin must be connected to a valid high or low voltage or driven, and not left open-circuit. The enable and disable times are provided in the Typical Characteristics section (see Figure 41 through Figure 43). When disabled, the output assumes a high-impedance state. Figure 46. Noise Performance of the OPA211 and OPA227 in Unity-Gain Buffer Configuration BASIC NOISE CALCULATIONS Design of low-noise op amp circuits requires careful consideration of a variety of possible noise contributors: noise from the signal source, noise generated in the op amp, and noise from the feedback network resistors. The total noise of the circuit is the root-sum-square combination of all noise components. The resistive portion of the source impedance produces thermal noise proportional to the square root of the resistance. This function is plotted in Figure 46. The source impedance is usually fixed; consequently, select the op amp and the feedback resistors to minimize the respective contributions to the total noise. Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s): OPA211 OPA2211 Submit Documentation Feedback 15 OPA211 OPA2211 SBOS377G – OCTOBER 2006 – REVISED MAY 2009...................................................................................................................................................... www.ti.com Figure 46 depicts total noise for varying source impedances with the op amp in a unity-gain configuration (no feedback resistor network, and therefore no additional noise contributions). The operational amplifier itself contributes both a voltage noise component and a current noise component. The voltage noise is commonly modeled as a time-varying component of the offset voltage. The current noise is modeled as the time-varying component of the input bias current and reacts with the source resistance to create a voltage component of noise. Therefore, the lowest noise op amp for a given application depends on the source impedance. For low source impedance, current noise is negligible and voltage noise generally dominates. For high source impedance, current noise may dominate. Figure 47 illustrates both inverting and noninverting op amp circuit configurations with gain. In circuit configurations with gain, the feedback network resistors also contribute noise. The current noise of the op amp reacts with the feedback resistors to create additional noise components. The feedback resistor values can generally be chosen to make these noise sources negligible. The equations for total noise are shown for both configurations. Noise in Noninverting Gain Configuration Noise at the output: R2 2 2 R1 EO = 1 + R2 R1 2 2 2 2 2 2 2 en + e1 + e2 + (inR2) + eS + (inRS) EO R2 Where eS = Ö4kTRS ´ 1 + R1 1+ R2 R1 = thermal noise of RS RS R2 e1 = Ö4kTR1 ´ R1 VS = thermal noise of R1 e2 = Ö4kTR2 = thermal noise of R2 Noise in Inverting Gain Configuration Noise at the output: R2 2 2 EO R1 = 1+ R2 R 1 + RS 2 EO RS 2 2 2 en + e1 + e2 + (inR2) + eS R2 Where eS = Ö4kTRS ´ R 1 + RS 2 = thermal noise of RS VS R2 e1 = Ö4kTR1 ´ R 1 + RS = thermal noise of R1 e2 = Ö4kTR2 = thermal noise of R2 For the OPA211 series op amps at 1kHz, en = 1.1nV/ÖHz and in = 1.7pA/ÖHz. Figure 47. Noise Calculation in Gain Configurations 16 Submit Documentation Feedback Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s): OPA211 OPA2211 OPA211 OPA2211 www.ti.com...................................................................................................................................................... SBOS377G – OCTOBER 2006 – REVISED MAY 2009 TOTAL HARMONIC DISTORTION MEASUREMENTS Audio Precision System Two distortion/noise analyzer, which greatly simplifies such repetitive measurements. The measurement technique can, however, be performed with manual distortion measurement instruments. OPA211 series op amps have excellent distortion characteristics. THD + Noise is below 0.0002% (G = +1, VOUT = 3VRMS) throughout the audio frequency range, 20Hz to 20kHz, with a 600Ω load. ELECTRICAL OVERSTRESS The distortion produced by OPA211 series op amps is below the measurement limit of many commercially available distortion analyzers. However, a special test circuit illustrated in Figure 48 can be used to extend the measurement capabilities. Designers often ask questions about the capability of an operational amplifier to withstand electrical overstress. These questions tend to focus on the device inputs, but may involve the supply voltage pins or even the output pin. Each of these different pin functions have electrical stress limits determined by the voltage breakdown characteristics of the particular semiconductor fabrication process and specific circuits connected to the pin. Additionally, internal electrostatic discharge (ESD) protection is built into these circuits to protect them from accidental ESD events both before and during product assembly. Op amp distortion can be considered an internal error source that can be referred to the input. Figure 48 shows a circuit that causes the op amp distortion to be 101 times greater than that normally produced by the op amp. The addition of R3 to the otherwise standard noninverting amplifier configuration alters the feedback factor or noise gain of the circuit. The closed-loop gain is unchanged, but the feedback available for error correction is reduced by a factor of 101, thus extending the resolution by 101. Note that the input signal and load applied to the op amp are the same as with conventional feedback without R3. The value of R3 should be kept small to minimize its effect on the distortion measurements. It is helpful to have a good understanding of this basic ESD circuitry and its relevance to an electrical overstress event. See Figure 49 for an illustration of the ESD circuits contained in the OPA211 (indicated by the dashed line area). The ESD protection circuitry involves several current-steering diodes connected from the input and output pins and routed back to the internal power-supply lines, where they meet at an absorption device internal to the operational amplifier. This protection circuitry is intended to remain inactive during normal circuit operation. Validity of this technique can be verified by duplicating measurements at high gain and/or high frequency where the distortion is within the measurement capability of the test equipment. Measurements for this data sheet were made with an R1 R2 SIG. DIST. GAIN GAIN R3 OPA211 VOUT R Signal Gain = 1+ 2 R1 Distortion Gain = 1+ R2 R1 II R3 Generator Output R1 R2 R3 1 101 ¥ 1kW 10W 11 101 100W 1kW 11W Analyzer Input Audio Precision System Two(1) with PC Controller (1) Load For measurement bandwidth, see Figure 3, Figure 4, and Figure 5. Figure 48. Distortion Test Circuit Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s): OPA211 OPA2211 Submit Documentation Feedback 17 OPA211 OPA2211 SBOS377G – OCTOBER 2006 – REVISED MAY 2009...................................................................................................................................................... www.ti.com RF +V +VS OPA211 RI ESD CurrentSteering Diodes -In +In Op-Amp Core Edge-Triggered ESD Absorption Circuit ID VIN Out RL (1) -V -VS (1) VIN = +VS + 500mV. Figure 49. Equivalent Internal ESD Circuitry and Its Relation to a Typical Circuit Application An ESD event produces a short duration, high-voltage pulse that is transformed into a short duration, high-current pulse as it discharges through a semiconductor device. The ESD protection circuits are designed to provide a current path around the operational amplifier core to prevent it from being damaged. The energy absorbed by the protection circuitry is then dissipated as heat. When an ESD voltage develops across two or more of the amplifier device pins, current flows through one or more of the steering diodes. Depending on the path that the current takes, the absorption device may activate. The absorption device has a trigger, or threshold voltage, that is above the normal operating voltage of the OPA211 but below the device breakdown voltage level. Once this threshold is exceeded, the absorption device quickly activates and clamps the voltage across the supply rails to a safe level. When the operational amplifier connects into a circuit such as that illustrated in Figure 49, the ESD protection components are intended to remain inactive and not become involved in the application circuit operation. However, circumstances may arise where an applied voltage exceeds the operating voltage range of a given pin. Should this condition occur, there is a risk that some of the internal ESD protection circuits may be biased on, and conduct current. Any such current flow occurs through steering diode paths and rarely involves the absorption device. 18 Submit Documentation Feedback Figure 49 depicts a specific example where the input voltage, VIN, exceeds the positive supply voltage (+VS) by 500mV or more. Much of what happens in the circuit depends on the supply characteristics. If +VS can sink the current, one of the upper input steering diodes conducts and directs current to +VS. Excessively high current levels can flow with increasingly higher VIN. As a result, the datasheet specifications recommend that applications limit the input current to 10mA. If the supply is not capable of sinking the current, VIN may begin sourcing current to the operational amplifier, and then take over as the source of positive supply voltage. The danger in this case is that the voltage can rise to levels that exceed the operational amplifier absolute maximum ratings. In extreme but rare cases, the absorption device triggers on while +VS and –VS are applied. If this event happens, a direct current path is established between the +VS and –VS supplies. The power dissipation of the absorption device is quickly exceeded, and the extreme internal heating destroys the operational amplifier. Another common question involves what happens to the amplifier if an input signal is applied to the input while the power supplies +VS and/or –VS are at 0V. Again, it depends on the supply characteristic while at 0V, or at a level below the input signal amplitude. If the supplies appear as high impedance, then the operational amplifier supply current may be supplied by the input source via the current steering diodes. This state is not a normal bias condition; the amplifier Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s): OPA211 OPA2211 OPA211 OPA2211 www.ti.com...................................................................................................................................................... SBOS377G – OCTOBER 2006 – REVISED MAY 2009 most likely will not operate normally. If the supplies are low impedance, then the current through the steering diodes can become quite high. The current level depends on the ability of the input source to deliver current, and any resistance in the input path. THERMAL CONSIDERATIONS A primary issue with all semiconductor devices is junction temperature (TJ). The most obvious consideration is assuring that TJ never exceeds the absolute maximum rating specified for the device. However, addressing device thermal dissipation has benefits beyond protecting the device from damage. Even modest increases in junction temperature can decrease op amp performance, and temperature-related errors can accumulate. Understanding the power generated by the device within the specific application and assessing the thermal effects on the error tolerance lead to a better understanding of system performance and thermal-dissipation needs. For dual-channel products, the worst-case power resulting from both channels must be determined. Products with a thermal pad (DFN and PowerPAD devices) provide the best thermal conduction away from the junction; see the Thermal Resistance from Junction to Pad parameter (θJP) in the Electrical Characteristics section. The use of packages with a thermal pad improves thermal dissipation. The device achieves its optimal performance through careful board and system design that considers characteristics such as board thickness, metal layers, component spacing, airflow, and board orientation. Refer to these application notes (available for download at www.ti.com) for additional details: SZZA017A, SCBA017, and SPRA953A. For unusual loads and signals, see SBOA022. DFN packages are physically small, and have a smaller routing area, improved thermal performance, and improved electrical parasitics. Additionally, the absence of external leads eliminates bent-lead issues. The DFN package can be easily mounted using standard printed circuit board (PCB) assembly techniques. See Application Note QFN/SON PCB Attachment (SLUA271) and Application Report Quad Flatpack No-Lead Logic Packages (SCBA017), both available for download at www.ti.com. The exposed leadframe die pad on the bottom of the package must be connected to V–. Soldering the thermal pad improves heat dissipation and enables specified device performance. DFN LAYOUT GUIDELINES The exposed leadframe die pad on the DFN package should be soldered to a thermal pad on the PCB. A mechanical drawing showing an example layout is attached at the end of this data sheet. Refinements to this layout may be necessary based on assembly process requirements. Mechanical drawings located at the end of this data sheet list the physical dimensions for the package and pad. The five holes in the landing pattern are optional, and are intended for use with thermal vias that connect the leadframe die pad to the heatsink area on the PCB. Soldering the exposed pad significantly improves board-level reliability during temperature cycling, key push, package shear, and similar board-level tests. Even with applications that have low-power dissipation, the exposed pad must be soldered to the PCB to provide structural integrity and long-term reliability. DFN PACKAGE The OPA211 is offered in an DFN-8 package (also known as SON). The DFN package is a QFN package with lead contacts on only two sides of the bottom of the package. This leadless package maximizes board space and enhances thermal and electrical characteristics through an exposed pad. Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s): OPA211 OPA2211 Submit Documentation Feedback 19 OPA211 OPA2211 SBOS377G – OCTOBER 2006 – REVISED MAY 2009...................................................................................................................................................... www.ti.com GENERAL POWERPAD DESIGN CONSIDERATIONS The OPA2211 is available in a thermally-enhanced SO-8 PowerPAD package. This package is constructed using a downset leadframe upon which the die is mounted, as Figure 50(a) and Figure 50(b) illustrate. This arrangement results in the lead frame being exposed as a thermal pad on the underside of the package, as shown in Figure 50(c). This thermal pad has direct thermal contact with the die; thus, excellent thermal performance is achieved by providing a good thermal path away from the thermal pad. The PowerPAD package allows for both assembly and thermal management in one manufacturing operation. During the surface-mount solder operation (when the leads are being soldered), the thermal pad must be soldered to a copper area underneath the package. Through the use of thermal paths within this copper area, heat can be conducted away from the package into either a ground plane or other heat-dissipating device. Soldering the PowerPAD to the printed circuit board (PCB) is always required, even with applications that have low power dissipation. This technique provides the necessary thermal and mechanical connection between the lead frame die pad and the PCB. The PowerPAD must be connected to the most negative supply voltage on the device (V–). 1. Prepare the PCB with a top-side etch pattern. There should be etching for the leads as well as etch for the thermal pad. 2. Place recommended holes in the area of the thermal pad. Ideal thermal land size and thermal via patterns for the SO-8 DDA package can be seen in the technical brief, PowerPAD Thermally-Enhanced Package (SLMA002), available for download at www.ti.com. These holes should be 13 mils (0,33mm) in diameter. Keep them small, so that solder wicking through the holes is not a problem during reflow. An 20 Submit Documentation Feedback 3. 4. 5. 6. 7. 8. example thermal land pattern mechanical drawing is attached to the end of this data sheet. Additional vias may be placed anywhere along the thermal plane outside of the thermal pad area to help dissipate the heat generated by the OPA2211 SO-8. These additional vias may be larger than the 13-mil diameter vias directly under the thermal pad. They can be larger because they are not in the thermal pad area to be soldered; thus, wicking is not a problem. Connect all holes to the internal plane that is at the same voltage potential as the V– pin. When connecting these holes to the internal plane, do not use the typical web or spoke via connection methodology. Web connections have a high thermal resistance connection that is useful for slowing the heat transfer during soldering operations. This configuration makes the soldering of vias that have plane connections easier. In this application, however, low thermal resistance is desired for the most efficient heat transfer. Therefore, the holes under the OPA2211 PowerPAD package should make their connection to the internal plane with a complete connection around the entire circumference of the plated-through hole. The top-side solder mask should leave the terminals of the package and the thermal pad area with its six holes exposed. The bottom-side solder mask should cover the holes of the thermal pad area. This masking prevents solder from being pulled away from the thermal pad area during the reflow process. Apply solder paste to the exposed thermal pad area and all of the IC terminals. With these preparatory steps in place, simply place the OPA2211 SO-8 IC in position and run the chip through the solder reflow operation as any standard surface-mount component. This preparation results in a properly installed part. Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s): OPA211 OPA2211 OPA211 OPA2211 www.ti.com...................................................................................................................................................... SBOS377G – OCTOBER 2006 – REVISED MAY 2009 Leadframe (Copper Alloy) IC (Silicon) Mold Compound (Plastic) Die Attach (Epoxy) Leadframe Die Pad Exposed at Base of the Package (Copper Alloy) Thermal Pad (a) Cutaway View: DDA Package (SO-8) Thermal Pad Mold Compound (Plastic) DDA Package (SO-8) DRG Package (DFN-8) Die (c) Bottom View Terminal Leadframe Die Attach (Epoxy) (Copper Alloy) Exposed at Base of Package (b) Cutaway View: DRG Package (DFN-8) Figure 50. Views of Thermally-Enhanced SO-8 and DFN-8 Packages Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s): OPA211 OPA2211 Submit Documentation Feedback 21 OPA211 OPA2211 SBOS377G – OCTOBER 2006 – REVISED MAY 2009...................................................................................................................................................... www.ti.com REVISION HISTORY NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision F (November, 2008) to Revision G .......................................................................................... Page • • • • • • • • • • • • • • • • 22 Changed orderable status of OPA2211 device packages to released from product preview throughout document ............ 2 Revised description of NC pin ............................................................................................................................................... 3 Added Input Offset Voltage, Input Bias Current, Open-Loop Gain, and Thermal Resistance specifications to indicate performance for OPA2211 device ......................................................................................................................................... 4 Corrected Temperature Range parametric symbol location for specified and operating range specifications ..................... 5 Added footnote (4) to Electrical Characteristics table............................................................................................................ 5 Updated Figure 3 ................................................................................................................................................................... 6 Added information to legend in Figure 4................................................................................................................................ 6 Added Figure 5 ..................................................................................................................................................................... 6 Added Figure 6 ...................................................................................................................................................................... 6 Changed title of Figure 12 for clarification ............................................................................................................................. 7 Corrected circuit drawing in Figure 26 ................................................................................................................................. 10 Corrected circuit drawing in Figure 27 ................................................................................................................................. 10 Changed first paragraph of Total Harmonic Distortion Measurements section ................................................................... 17 Updated Figure 48 ............................................................................................................................................................... 17 Added Thermal Considerations section ............................................................................................................................... 19 Added General PowerPAD Design Considerations section ................................................................................................ 20 Submit Documentation Feedback Copyright © 2006–2009, Texas Instruments Incorporated Product Folder Link(s): OPA211 OPA2211 PACKAGE OPTION ADDENDUM www.ti.com 5-Jul-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) OPA211AID ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA211AIDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA211AIDGKR ACTIVE MSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA211AIDGKRG4 ACTIVE MSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA211AIDGKT ACTIVE MSOP DGK 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA211AIDGKTG4 ACTIVE MSOP DGK 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA211AIDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA211AIDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA211AIDRGR ACTIVE SON DRG 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA211AIDRGRG4 ACTIVE SON DRG 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA211AIDRGT ACTIVE SON DRG 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA211AIDRGTG4 ACTIVE SON DRG 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA211ID ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA211IDGKR ACTIVE MSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA211IDGKT ACTIVE MSOP DGK 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA211IDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA211IDRGR ACTIVE SON DRG 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Addendum-Page 1 Samples (Requires Login) PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 5-Jul-2012 Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) OPA211IDRGT ACTIVE SON DRG 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA2211AIDDA ACTIVE SO PowerPAD DDA 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM OPA2211AIDDAR ACTIVE SO PowerPAD DDA 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM OPA2211AIDRGR ACTIVE SON DRG 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR OPA2211AIDRGT ACTIVE SON DRG 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Samples (Requires Login) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF OPA211 : Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 5-Jul-2012 • Enhanced Product: OPA211-EP NOTE: Qualified Version Definitions: • Enhanced Product - Supports Defense, Aerospace and Medical Applications Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 5-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing OPA211AIDGKR MSOP DGK 8 OPA211AIDGKT MSOP DGK OPA211AIDR SOIC D OPA211AIDRGR SON OPA211AIDRGT SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 8 250 180.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 DRG 8 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 SON DRG 8 250 180.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 OPA211IDGKR MSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 OPA211IDGKT MSOP DGK 8 250 180.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 OPA211IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 OPA211IDRGR SON DRG 8 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 OPA211IDRGT SON DRG 8 250 180.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 OPA2211AIDDAR SO Power PAD DDA 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 OPA2211AIDRGR SON DRG 8 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 OPA2211AIDRGT SON DRG 8 250 180.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 5-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) OPA211AIDGKR MSOP DGK 8 2500 346.0 346.0 29.0 OPA211AIDGKT MSOP DGK 8 250 210.0 185.0 35.0 OPA211AIDR SOIC D 8 2500 346.0 346.0 29.0 OPA211AIDRGR SON DRG 8 3000 346.0 346.0 29.0 OPA211AIDRGT SON DRG 8 250 210.0 185.0 35.0 OPA211IDGKR MSOP DGK 8 2500 346.0 346.0 29.0 OPA211IDGKT MSOP DGK 8 250 210.0 185.0 35.0 OPA211IDR SOIC D 8 2500 346.0 346.0 29.0 OPA211IDRGR SON DRG 8 3000 346.0 346.0 29.0 OPA211IDRGT SON DRG 8 250 210.0 185.0 35.0 OPA2211AIDDAR SO PowerPAD DDA 8 2500 346.0 346.0 29.0 OPA2211AIDRGR SON DRG 8 3000 346.0 346.0 29.0 OPA2211AIDRGT SON DRG 8 250 210.0 185.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap Wireless Connectivity www.ti.com/wirelessconnectivity TI E2E Community Home Page e2e.ti.com Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2012, Texas Instruments Incorporated