TI SN74ALVC16501

SCAS261A − JANUARY 1993 − REVISED JULY 1995
D EPIC  (Enhanced-Performance Implanted
D
D
D
D
D
D
DGG OR DL PACKAGE
(TOP VIEW)
CMOS) Submicron Process
Member of the Texas Instruments
Widebus  Family
UBT  (Universal Bus Transceiver)
Combines D-Type Latches and D-Type
Flip-Flops for Operation in Transparent,
Latched, or Clocked Mode
ESD Protection Exceeds 2000 V Per
MIL-STD-883C, Method 3015; Exceeds
200 V Using Machine Model (C = 200 pF,
R = 0)
Latch-Up Performance Exceeds 250 mA
Per JEDEC Standard JESD-17
Bus Hold on Data Inputs Eliminates the
Need for External Pullup/Pulldown
Resistors
Package Options Include Plastic 300-mil
Shrink Small-Outline (DL) and Thin Shrink
Small-Outline (DGG) Packages
OEAB
LEAB
A1
GND
A2
A3
VCC
A4
A5
A6
GND
A7
A8
A9
A10
A11
A12
GND
A13
A14
A15
VCC
A16
A17
GND
A18
OEBA
LEBA
description
The SN74ALVC16501 18-bit universal bus
transceiver is designed for low-voltage (3.3-V)
VCC operation; it is tested at 2.5-V, 2.7-V, and
3.3-V VCC.
Data flow in each direction is controlled by
output-enable (OEAB and OEBA), latch-enable
(LEAB and LEBA), and clock (CLKAB and
CLKBA) inputs. For A-to-B data flow, the device
operates in the transparent mode when LEAB is
high. When LEAB is low, the A data is latched if
CLKAB is held at a high or low logic level. If LEAB
is low, the A-bus data is stored in the latch/flip-flop
on the low-to-high transition of CLKAB. When
OEAB is high, the outputs are active. When OEAB
is low, the outputs are in the high-impedance
state.
1
56
2
55
3
54
4
53
5
52
6
51
7
50
8
49
9
48
10
47
11
46
12
45
13
44
14
43
15
42
16
41
17
40
18
39
19
38
20
37
21
36
22
35
23
34
24
33
25
32
26
31
27
30
28
29
GND
CLKAB
B1
GND
B2
B3
VCC
B4
B5
B6
GND
B7
B8
B9
B10
B11
B12
GND
B13
B14
B15
VCC
B16
B17
GND
B18
CLKBA
GND
Data flow for B to A is similar to that of A to B but uses OEBA, LEBA, and CLKBA. The output enables are
complementary (OEAB is active high and OEBA is active low).
The SN74ALVC16501 is available in TI’s shrink small-outline (DL) and thin shrink small-outline (DGG)
packages, which provide twice the I/O pin count and functionality of standard small-outline packages in the
same printed-circuit-board area.
The SN74ALVC16501 is characterized for operation from − 40°C to 85°C.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
EPIC, UBT, and Widebus are trademarks of Texas Instruments Incorporated.
Copyright  1995, Texas Instruments Incorporated
!"# $ %&'# "$ (&)*%"# +"#',
+&%#$ %! # $('%%"#$ (' #-' #'!$ '."$ $#&!'#$
$#"+"+ /""#0, +&%# (%'$$1 +'$ # '%'$$"*0 %*&+'
#'$#1 "** (""!'#'$,
•
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
•
1
SCAS261A − JANUARY 1993 − REVISED JULY 1995
FUNCTION TABLE†
INPUTS
OEAB
LEAB
CLKAB
A
OUTPUT
B
Z
L
X
X
X
H
H
X
L
L
H
H
X
H
H
H
L
↑
L
L
H
L
↑
H
H
L
H
X
H
B0‡
X
B0§
† A-to-B data flow is shown: B-to-A flow is similar but
uses OEBA, LEBA, and CLKBA.
‡ Output level before the indicated steady-state input
conditions were established, provided that CLKAB is
high before LEAB goes low
§ Output level before the indicated steady-state input
conditions were established
H
L
L
logic symbol†
OEAB
CLKAB
LEAB
1
55
2
27
OEBA
CLKBA
LEBA
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
A18
30
28
3
EN1
2C3
C3
G2
EN4
5C6
C6
G5
3D
1
1
4
1
6D
5
52
6
51
8
49
9
48
10
47
12
45
13
44
14
43
15
42
16
41
17
40
19
38
20
37
21
36
23
34
24
33
26
31
† This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
2
54
•
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
•
B1
B2
B3
B4
B5
B6
B7
B8
B9
B10
B11
B12
B13
B14
B15
B16
B17
B18
SCAS261A − JANUARY 1993 − REVISED JULY 1995
logic diagram (positive logic)
OEAB
CLKAB
LEAB
LEBA
CLKBA
OEBA
A1
1
55
2
28
30
27
3
1D
C1
CLK
54
B1
1D
C1
CLK
To 17 Other Channels
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V
Input voltage range, VI (except I/O ports) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V
Input voltage range, VI (I/O ports) (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Output voltage range, VO (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 50 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 50 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 100 mA
Maximum power dissipation at TA = 55°C (in still air) (see Note 3): DGG package . . . . . . . . . . . . . . . . . . 1 W
DL package . . . . . . . . . . . . . . . . . . 1.4 W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. This value is limited to 4.6 V maximum.
3. The maximum package power dissipation is calculated using a junction temperature of 150°C and a board trace length of 750 mils.
For more information, refer to the Package Thermal Considerations application note in the 1994 ABT Advanced BiCMOS Technology
Data Book, literature number SCBD002B.
•
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
•
3
SCAS261A − JANUARY 1993 − REVISED JULY 1995
recommended operating conditions (see Note 4)
VCC
Supply voltage
VIH
High-level input voltage
VCC = 2.3 V to 2.7 V
VCC = 2.7 V to 3.6 V
VIL
Low-level input voltage
VCC = 2.3 V to 2.7 V
VCC = 2.7 V to 3.6 V
VI
VO
Input voltage
IOH
IOL
∆t /∆v
MAX
2.3
3.6
Output voltage
Low-level output current
0.7
0.8
−12
VCC = 3 V
VCC = 2.3 V
−24
VCC = 2.7 V
VCC = 3 V
12
•
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
•
VCC
VCC
VCC = 2.3 V
VCC = 2.7 V
Input transition rise or fall rate
V
V
2
0
High-level output current
UNIT
1.7
0
TA
Operating free-air temperature
NOTE 4: Unused inputs must be held high or low to prevent them from floating.
4
MIN
−12
V
V
V
mA
12
mA
24
0
10
ns / V
−40
85
°C
SCAS261A − JANUARY 1993 − REVISED JULY 1995
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
IOH = − 100 µA
IOH = − 6 mA
VOH
VOL
VIH = 1.7 V
VIH = 1.7 V
MIN to MAX
2.3 V
VCC −0.2
2
2.3 V
1.7
IOH = − 12 mA
VIH = 2 V
VIH = 2 V
2.7 V
2.2
3V
2.4
IOH = − 24 mA
IOL = 100 µA
VIH = 2 V
3V
2
MIN to MAX
0.2
IOL = 6 mA
VIL = 0.7 V
VIL = 0.7 V
2.3 V
0.4
2.3 V
0.7
VIL = 0.8 V
VIL = 0.8 V
2.7 V
0.4
3V
0.55
IOL = 12 mA
IOL = 24 mA
VI = VCC or GND
II
Ihold
2.3 V
VI = 0.8 V
VI = 2 V
3V
V
µA
45
−45
µA
75
VI = VCC or GND,
VCC = 3 V to 3.6 V,
Other inputs at VCC or GND
nICC
UNIT
V
3.6 V
VI = 0.7 V
VI = 1.7 V
VI = 0 to 3.6 V
VO = VCC or GND
IOZ§
ICC
TA = − 40°C to 85°C
MIN TYP‡
MAX
VCC†
TEST CONDITIONS
IO = 0
One input at VCC − 0.6 V,
−75
3.6 V
± 500
3.6 V
± 10
µA
3.6 V
40
µA
750
µA
Ci
Control inputs VI = VCC or GND
3.3 V
Cio
A or B ports
VO = VCC or GND
3.3 V
† For conditions shown as MIN or MAX, use the appropriate values under recommended operating conditions.
‡ All typical values are at VCC = 3.3 V.
§ For I/O ports, the parameter IOZ includes the input leakage current.
4
pF
8
pF
timing requirements over recommended operating free-air temperature range (unless otherwise
noted)
VCC = 2.5 V
± 0.2 V
fclock
Clock frequency
tw
Pulse duration
tsu
Setup time
th
Hold time
MIN
MAX
0
150
VCC = 2.7 V
MIN
MAX
0
150
VCC = 3.3 V
± 0.3 V
MIN
MAX
0
150
LE high
3.3
3.3
3.3
CLK high or low
3.3
3.3
3.3
Data before CLK↑
2.2
2.1
1.7
Data before LE↓, CLK high
1.9
1.6
1.5
Data before LE↓, CLK low
1.3
1.1
1
Data after CLK↑
0.6
0.6
0.7
Data after LE↓, CLK high or low
1.4
1.7
1.4
•
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
•
UNIT
MHz
ns
ns
ns
5
SCAS261A − JANUARY 1993 − REVISED JULY 1995
switching characteristics over recommended operating free-air temperature range, (unless
otherwise noted) (see Figures 1 and 2)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
fmax
VCC = 2.5 V
± 0.2 V
MIN
MAX
150
VCC = 2.7 V
MIN
MAX
150
VCC = 3.3 V
± 0.3 V
MIN
UNIT
MAX
150
ns
A or B
B or A
1.2
5.4
4.5
1
3.9
LE
A or B
1.6
6.3
5.3
1.3
4.6
CLK
A or B
1.7
6.7
5.6
1.4
4.9
ten
tdis
OEAB
B
1.1
6.3
5.3
1
4.6
ns
OEAB
B
2.2
6.4
5.7
1.4
5
ns
ten
tdis
OEBA
A
1.4
6.8
6
1.1
5
ns
OEBA
A
2
5.5
4.6
1.3
4.2
ns
tpd
ns
operating characteristics, TA = 25°C
PARAMETER
Cpd
6
Power dissipation capacitance
TEST CONDITIONS
Outputs enabled
CL = 50 pF,
Outputs disabled
•
f = 10 MHz
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
•
VCC = 2.5 V
± 0.2 V
VCC = 3.3 V
± 0.3 V
TYP
TYP
44
54
6
6
UNIT
pF
SCAS261A − JANUARY 1993 − REVISED JULY 1995
PARAMETER MEASUREMENT INFORMATION
VCC = 2.5 V " 0.2 V
4.6 V
S1
500 Ω
From Output
Under Test
Open
GND
CL = 50 pF
(see Note A)
500 Ω
TEST
S1
tpd
tPLZ/tPZL
tPHZ/tPZH
Open
4.6 V
GND
tw
LOAD CIRCUIT
2.3 V
Input
2.3 V
Timing
Input
VOLTAGE WAVEFORMS
PULSE DURATION
th
2.3 V
Data
Input
1.2 V
1.2 V
0V
tPHL
Output
Waveform 2
S1 at GND
(see Note B)
VOH
1.2 V
1.2 V
VOL
1.2 V
0V
tPLZ
2.3 V
Output
Waveform 1
S1 at 4.6 V
(see Note B)
1.2 V
tPLH
1.2 V
tPZL
2.3 V
1.2 V
2.3 V
Output
Control
(low-level
enabling)
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
Output
1.2 V
0V
0V
tsu
Input
1.2 V
1.2 V
1.2 V
tPZH
VOL + 0.3 V
VOL
tPHZ
1.2 V
VOH − 0.3 V
VOH
0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR v 10 MHz, ZO = 50 Ω, tr v 2.5 ns, tf v 2.5 ns.
D. The outputs are measured one at a time with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
Figure 1. Load Circuit and Voltage Waveforms
•
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
•
7
SCAS261A − JANUARY 1993 − REVISED JULY 1995
PARAMETER MEASUREMENT INFORMATION
VCC = 2.7 V AND 3.3 V " 0.3 V
6V
S1
500 Ω
From Output
Under Test
Open
GND
CL = 50 pF
(see Note A)
500 Ω
TEST
S1
tpd
tPLZ/tPZL
tPHZ/tPZH
Open
6V
GND
tw
LOAD CIRCUIT
2.7 V
Input
2.7 V
Timing
Input
VOLTAGE WAVEFORMS
PULSE DURATION
th
2.7 V
Data
Input
1.5 V
1.5 V
0V
tPHL
Output
Waveform 2
S1 at GND
(see Note B)
VOH
1.5 V
1.5 V
VOL
1.5 V
0V
tPLZ
3V
Output
Waveform 1
S1 at 6 V
(see Note B)
1.5 V
tPLH
1.5 V
tPZL
2.7 V
1.5 V
2.7 V
Output
Control
(low-level
enabling)
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
Output
1.5 V
0V
0V
tsu
Input
1.5 V
1.5 V
1.5 V
tPZH
VOL + 0.3 V
VOL
tPHZ
1.5 V
VOH − 0.3 V
VOH
0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR v 10 MHz, ZO = 50 Ω, tr v 2.5 ns, tf v 2.5 ns.
D. The outputs are measured one at a time with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
Figure 2. Load Circuit and Voltage Waveforms
8
•
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
•
PACKAGE OPTION ADDENDUM
www.ti.com
24-Jun-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74ALVC16501DL
OBSOLETE
SSOP
DL
56
TBD
Call TI
Call TI
SN74ALVC16501DLR
OBSOLETE
SSOP
DL
56
TBD
Call TI
Call TI
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001
DL (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0.025 (0,635)
0.0135 (0,343)
0.008 (0,203)
48
0.005 (0,13) M
25
0.010 (0,25)
0.005 (0,13)
0.299 (7,59)
0.291 (7,39)
0.420 (10,67)
0.395 (10,03)
Gage Plane
0.010 (0,25)
1
0°–ā8°
24
0.040 (1,02)
A
0.020 (0,51)
Seating Plane
0.110 (2,79) MAX
0.004 (0,10)
0.008 (0,20) MIN
PINS **
28
48
56
A MAX
0.380
(9,65)
0.630
(16,00)
0.730
(18,54)
A MIN
0.370
(9,40)
0.620
(15,75)
0.720
(18,29)
DIM
4040048 / E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
Falls within JEDEC MO-118
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Clocks and Timers
Interface
Logic
Power Mgmt
Microcontrollers
RFID
RF/IF and ZigBee® Solutions
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lprf
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Military
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2008, Texas Instruments Incorporated