TI TS3USB3200

TS3USB3200
www.ti.com
SCDS333 – JUNE 2012
DPDT USB 2.0 High-Speed (480Mbps) and Mobile High-Definition Link (MHL) Switch with
ID Select and Flexible Power Control
Check for Samples: TS3USB3200
FEATURES
1
•
•
•
•
•
•
•
VCC Range: 2.7V to 4.3V
Mobile High-definition Link (MHL) Switch
– Bandwidth (–3dB): 6 GHz
– Ron (Typ): 5.7Ω
– Con (Typ): 2.5pF
USB Switch
– Bandwidth (–3dB): 6 GHz
– Ron (Typ): 4.6Ω
– Con (Typ): 2.5pF
Current Consumption: 40µA Typ
Special Features
– Flexible Power Control: Device can be
Powered by VBUS Without VCC or by VCC
Alone
– IOFF Protection Prevents Current Leakage in
Powered Down State (VCC and VBUS= 0 V)
– 1.8-V Compatible Control Inputs (SEL1,
SEL2, and PSEL)
– Over-Voltage Tolerance (OVT) on all I/O
Pins up to 5.5V Without External
Components
ESD Performance:
– 3.5kV Human Body Model (A114B, Class II)
– 1kV Charged Device Model (C101)
Package:
– 16-pin QFN Package (2.6 x 1.8 mm, 0.4 mm
Pitch)
DESCRIPTION
The TS3USB3200 is a double-pole, double throw
(DPDT) multiplexer that includes a high speed Mobile
High-Definition Link (MHL) switch and a USB 2.0
High-Speed (480Mbps) switch in the same package.
Additionally included is a single-pole, double throw
(SPDT) USB/MHL ID switch for easy information
control. These configurations allow the system
designer to use a common USB or Mico-USB
connector for both MHL video signals and USB data.
The TS3USB3200 has a VCC range of 2.7V to 4.3V
and also has the option to be powered by VBUS
without VCC. The device supports a over-voltage
tolerance (OVT) feature which allows the I/O pins to
withstand over-voltage conditions (up to 5.5V). The
power-off protection feature forces all I/O pins to be in
high impedance mode when power is not present.
This allows full isolation of the signals lines without
excessive leakage current. The select pins of
TS3USB3200 are compatible with 1.8V control
voltage, allowing them to be directly interfaced with
the General Purpose I/O (GPIO) from a mobile
processor.
The TS3USB3200 comes with a small 16-pin QFN
package (2.6mm x 1.8mm in size), which makes it a
perfect candidate for mobile applications.
SWITCH DIAGRAM
USB+
D+
MHL+
USB-
D-
MHLID_MHL
ID_COM
ID_USB
SEL1
Control
Logic
SEL2
VBUS
VCC
Switch
Power
PSEL
ORDERING INFORMATION
TA
–40°C to 85°C
PACKAGE
QFN– RSV
Tape and reel
ORDERABLE PART NUMBER
TOP-SIDE MARKING
TS3USB3200RSVR
ZTO
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2012, Texas Instruments Incorporated
TS3USB3200
SCDS333 – JUNE 2012
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
VCC
VBUS
ID_COM
ID_MHL
PIN DESCRIPTION
16
15
14
13
ID_USB
D+
2
11
MHL+
D-
3
10
MHL-
PSEL
4
9
SEL2
SEL1
5
6
7
8
GND
12
USB+
1
USB-
GND
PIN FUNCTIONS
PIN
NO.
2
NAME
DESCRIPTION
TYPE
1
GND
Ground
Ground
2
D+
I/O
Data Switch Output (Differential +)
3
D–
I/O
Data Switch Output (Differential –)
4
PSEL
Input
Power Source Select Line
5
SEL1
Input
Control Input Select Line 1
6
USB–
I/O
USB Data (Differential –)
7
USB+
I/O
USB Data (Differential +)
8
GND
Ground
9
SEL2
Input
10
MHL–
I/O
MHL Data (Differential–)
11
MHL+
I/O
MHL Data (Differential +)
12
ID_USB
I/O
ID Output for USB
13
ID_MHL
I/O
ID Output for MHL
14
ID_COM
I/O
ID Common
15
VBUS
Power
Alternative Device Power
16
VCC
Power
Power supply
Ground
Control Input Select Line 2
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TS3USB3200
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SCDS333 – JUNE 2012
Table 1. Function Table (Power Source)
(1)
VCC
VBUS
PSEL (1)
POWER SOURCE
L
L
X
No Power. All I/O in High-Z
L
H
X
VBUS
H
L
X
VCC
H
H
L
VCC
H
H
H
VBUS
The PSEL pin has 6MΩ weak pull-down resistor to GND to make its default value to be LOW.
Table 2. Function Table (Signal and ID Select)
SEL1 (1)
(1)
SEL2 (1)
CONNECTION
High-Z
L
L
D+/D– to USB+/USB–, ID_COM to ID_USB
MHL+/MHL–, ID_MHL
L
H
D+/D– to USB+/USB–, ID_COM to ID_MHL
MHL+/MHL–, ID_USB
H
L
D+/D– to MHL+/MHL–, ID_COM to ID_USB
USB+/USB–, ID_MHL
H
H
D+/D– to MHL+/MHL–, ID_COM to ID_MHL
USB+/USB–, ID_USB
The SEL1 and SEL2 pins have 6MΩ weak pull-down resistor to GND to make their default value to be
LOW.
Table 3. Summary of Typical Characteristics
Number of switches
MHL PATH
USB PATH
ID PATH
2
2
2
ON-state resistance (ron)
5.7 Ω
4.6 Ω
6.5 Ω
ON-state resistance match (Δron)
<0.4 Ω
<0.4 Ω
<0.4 Ω
ON-state capacitance (CI/O,on)
2.5 pF
2.5 pF
3.0 pF
Bandwidth (BW)
6 GHz
6 GHz
2.2 GHz
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TS3USB3200
SCDS333 – JUNE 2012
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TYPICAL APPLICATION
During manufacturing test when battery power is not available, the TS3USB3200 can be configured, as shown in
the figure below, to be powered by VBUS through the microUSB connector. The control pins (SEL1 and SEL2)
have built-in 6MΩ pull-down resistors to ensure the USB paths are enabled for TS3USB3200 and allow
connectivity to the TSU5611 USB accessory switch.
To
Battery
Charger
VBAT
100Ω
VBUS
VCC
VBUS
VBUS
USB+
DP
D+
USB-
DM
USB
ID
DID
GND
D+
D-
SUPPLY
Baseband or
Application
Processor
USB DM
USB DP
UART
UART RX
ID COM
GND
AUDIO
AUDIO_
MIC
MicroUSB
Connector
TSU5611
SEL
SEL
MHL+
MHL+
PSEL
MHL-
MHL-
MHL
CBUS
HDMI
HDMI to
MHL Bridge
TS3USB3200
The TS3USB3200 can also be powered by the mobile device’s standalone battery. The diagram below shows a
typical implementation. The VBUS pin of the TS3USB3200 can simply be grounded under such conditions.
To
Battery
Charger
VBAT
VBUS
VCC
VBUS
VBUS
USB+
DP
D+
USB-
DM
USB
ID
DID
GND
D+
D-
VSUPPLY
Baseband or
Application
Processor
USB DM
USB DP
UART TX
UART RX
ID_
GND
AUDIO_
AUDIO
MIC
MicroUSB
Connector
TSU5611
SEL
SEL
MHL+
MHL+
PSEL
MHL-
MHL-
ID MHL
TS3USB3200
4
HDMI
CBUS
HDMI to
MHL Bridge
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TS3USB3200
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SCDS333 – JUNE 2012
ABSOLUTE MAXIMUM RATINGS (1) (2)
over operating free-air temperature range (unless otherwise noted)
(3)
VCC ,VBUS
Supply voltage range
VI/O
Input/Output DC voltage Range (3)
IK
Input/Output port diode current
VI
Digital input voltage range (SEL1, SEL2, PSEL)
(3)
Digital logic input clamp current
ICC
Continuous current through VCC
IGND
Continuous current through GND
Tstg
Storage temperature range
(2)
(3)
MAX
–0.3
5.5
–0.3
5.5
VI/O < 0
IIK
(1)
MIN
UNIT
V
V
–50
mA
–0.3
VI < 0
5.5
V
–50
mA
100
mA
–100
mA
–65
150
°C
Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.
All voltages are with respect to ground, unless otherwise specified.
PACKAGE THERMAL IMPEDANCE (1)
over operating free-air temperature range (unless otherwise noted)
θJA
(1)
Package thermal impedance
RSV package
TYP
UNIT
184
°C/W
The package thermal impedance is calculated in accordance with JESD 51-7.
RECOMMENDED OPERATING CONDITIONS
MIN
MAX
VCC
Supply voltage range
2.7
4.3
V
VBUS
VBUS Supply voltage range
4.3
5.5
V
VI/O (USB)
VI/O (ID)
Analog voltage range
0
3.6
V
1.6
3.4
V
0
VCC
V
VI/O (MHL)
UNIT
VI
Digital input voltage range (SEL1, SEL2, PSEL)
TRAMP (VCC)
Power supply ramp time requirement (VCC)
100
1000
μs/V
TRAMP (VBUS)
Power supply ramp time requirement (VBUS)
100
1000
μs/V
TA
Operating free-air temperature
–40
85
ºC
ELECTRICAL CHARACTERISTICS
TA =–40°C to 85°C, Typical values are at VCC = 3.3V, TA=25°C, (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
MHL SWITCH
RON
ON-state resistance
VCC = 2.7V
VI/O = 1.6V, ION = –8mA
5.7
Ω
ΔRON
ON-state resistance match
between + and –paths
VCC = 2.7V
VI/O = 1.6V, ION = –8mA
0.4
Ω
RON
ON-state resistance flatness
VCC = 2.7V
VI/O = 1.6V to 3.4V, ION = –8mA
1
Ω
IOZ
OFF leakage current
VCC = 4.3V
Switch OFF, VMHL+/MHL– = 1.6V to 3.4V,
VD+/D– = 0 V
IOFF
Power-off leakage current
VCC = 0V
Switch ON or OFF, VMHL+/MHL– = 1.6V to 3.4V,
VD+/D– = NC
ION
ON leakage current
VCC = 4.3V
Switch ON, VMHL+/MHL– = 1.6V to 3.4V,
VD+/D– = NC
RON
ON-state resistance
VCC = 2.7V
VI/O = 0.4V, ION = –8mA
4.6
Ω
ΔRON
ON-state resistance match
between + and - paths
VCC = 2.7V
VI/O = 0.4V, ION = –8mA
0.4
Ω
(FLAT)
–2
2
µA
–10
10
µA
–2
2
µA
USB SWITCH
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ELECTRICAL CHARACTERISTICS (continued)
TA =–40°C to 85°C, Typical values are at VCC = 3.3V, TA=25°C, (unless otherwise noted)
PARAMETER
RON
(FLAT)
ON-state resistance flatness
TEST CONDITIONS
MIN
VCC = 2.7V
VI/O = 0V to 0.4V, ION = –8mA
TYP
MAX
UNIT
Ω
1
IOZ
OFF leakage current
VCC = 4.3V
Switch OFF, VUSB+/USB– = 0V to 4.3V,
VD+/D– = 0V
IOFF
Power-off leakage current
VCC = 0V
Switch ON or OFF, VUSB+/USB– = 0V to 4.3V,
VD+/D– = NC
ION
ON leakage current
VCC = 4.3V
Switch ON, VUSB+/USB– = 0V to 4.3V,
VD+/D– = NC
RON
ON-state resistance
VCC = 2.7V
VI/O = 3.3V, ION = –8mA
6.5
Ω
ΔRON
ON-state resistance match
between + and - paths
VCC = 2.7V
VI/O = 3.3V, ION = –8mA
0.4
Ω
IOZ
OFF leakage current
VCC = 4.3V
Switch OFF, VID_MHL/ID_USB = 0V to 4.3V,
VID_COM = 0V
IOFF
Power-off leakage current
VCC = 0V
Switch ON or OFF, VID_MHL/ID_USB = 0V to 4.3V,
VID_COM = NC
ION
ON leakage current
VCC = 4.3V
Switch ON, VID_MHL/ID_USB = 0V to 4.3V,
VID_COM = 0V
–2
2
µA
–10
10
µA
–2
2
µA
ID SWITCH
–1
1
µA
–10
10
µA
–1
1
µA
DIGITAL CONTROL INPUTS (SEL1, SEL2, PSEL)
VIH
Input logic high
VCC = 2.7V to 4.3V
VIL
Input logic low
VCC = 2.7V to 4.3V
1.3
IIN
Input leakage current
VCC = 4.3V, VI/O = 0V to 4.3V, VIN = 0 to 2V
V
–10
0.6
V
10
μA
DYNAMIC CHARACTERISTICS
TA = –40°C to 85°C, Typical values are at VCC = 3.3V, TA=25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
MHL (1)/USB/ ID SWITCH
tpd
Propagation Delay
RL = 50 Ω, CL = 5 pF
VCC = 2.7V to 4.3V
tON
Turn-on time
RL = 50 Ω, CL = 5 pF
VCC = 2.7V to 4.3V
400
ns
tOFF
Turn-off time
RL = 50 Ω, CL = 5 pF
VCC = 2.7V to 4.3V
400
ns
tSK(P)
Skew of opposite transitions of same
VCC = 2.7 V or 3.3V
output
VCC = 2.7V to 4.3V
0.1
0.2
ns
CON(MHL)
MHL path ON capacitance
VCC = 3.3 V, VI/O = 0 or 3.3 V, f = 240 MHz
Switch ON
1.6
pF
CON(USB)
USB path ON capacitance
VCC = 3.3 V, VI/O = 0 or 3.3 V, f = 240 MHz
Switch ON
1.4
pF
COFF(MHL)
MHL path OFF capacitance
VCC = 3.3 V, VI/O = 0 or 3.3 V, f = 240 MHz
Switch OFF
1.4
pF
COFF(USB)
USB path OFF capacitance
VCC = 3.3 V, VI/O = 0 or 3.3 V, f = 240 MHz
Switch OFF
1.6
pF
CI
Digital input capacitance
VCC = 3.3 V, VI = 0 or 2V
2.2
pF
OISO
OFF Isolation
VCC = 2.7 V to 4.3 V, RL = 50 Ω,
f = 240 MHz
Switch OFF
–35
dB
XTALK
Crosstalk
VCC = 2.7 V to 4.3 V, RL = 50 Ω,
f = 240 MHz
Switch ON
–35
dB
(1)
GHz
0.1
ns
BW(MHL)
MHL path –3dB bandwidth
VCC = 2.7 V to 4.3 V, RL = 50 Ω
Switch ON
6.0
BW(USB)
USB path –3dB bandwidth
VCC = 2.7 V to 4.3 V, RL = 50 Ω
Switch ON
6.0 (1)
GHz
BW(ID)
ID path –3dB bandwidth
VCC = 2.7 V to 4.3 V, RL = 50 Ω
Switch ON
4.0
GHz
SUPPLY
VBUS
VBUS Power supply voltage
4.3
5.5
VCC
Power supply voltage
2.7
4.3
V
ICC
Positive supply current
VCC = 4.3 V, VIN = VCC or GND, VI/O = 0 V
Switch ON or OFF
70
µA
Positive supply current (VBUS Mode)
VCC = 0 V, VBUS = 5.5 V, VIN = VCC or GND,
VI/O = 0 V
Switch ON or OFF
50
µA
ICC,
(1)
6
VBUS
40
V
Specified by Design
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TYPICAL CHARACTERISTICS
8
VCC = 2.7 V
Ion = 8 mA
7.5
7
RON ID PATH (Ω)
6.5
6
5.5
5
4.5
4
3.5
3
0
0.5
1
1.5
Input Voltage (V)
2
G005
Figure 1. ON-Resistance vs. VI for MHL Switch
6
VCC = 2.7 V
Ion = 8 mA
5.5
RON USB (Ω)
5
4.5
4
3.5
3
2.5
2
0
0.5
1
1.5
Input Voltage (V)
2
G006
Figure 2. ON-Resistance vs. VI for USB Switch
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TYPICAL CHARACTERISTICS (continued)
8
VCC = 2.7 V
Ion = 8 mA
RON ID PATH (Ω)
7
6
5
4
3
1.8
2.3
2.8
3.3
Input Voltage (V)
3.8
G007
Figure 3. ON-Resistance vs. VI for ID Switch
*Gain vs. Frequency plot will be updated by July, 2012 when new characterization hardware becomes available
Figure 4. Gain vs. Frequency for MHL Switch*
8
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TYPICAL CHARACTERISTICS (continued)
*Gain vs. Frequency plot will be updated by July, 2012 when new characterization board becomes available
Figure 5. Gain vs. Frequency for USB Switch*
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TYPICAL CHARACTERISTICS (continued)
Figure 6. Off Isolation vs. Frequency for MHL Path
Figure 7. Off Isolation vs. Frequency for USB Path
10
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TYPICAL CHARACTERISTICS (continued)
Figure 8. Cross talk vs. Frequency for MHL Path
Figure 9. Cross talk vs. Frequency for USB Path
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TYPICAL CHARACTERISTICS (continued)
Figure 10. 480-Mbps USB 2.0 Eye Pattern with No Device
Figure 11. 480-Mbps USB 2.0 Eye Pattern for USB Switch
12
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TYPICAL CHARACTERISTICS (continued)
Figure 12. Eye Pattern: 0.7 Gbps MHL Eye Pattern for With No Device
Figure 13. Eye Pattern: 0.7 Gbps MHL Eye Pattern for MHL Switch
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TYPICAL CHARACTERISTICS (continued)
Figure 14. Eye Pattern: 2.2 Gbps MHL Eye Pattern for With No Device
Figure 15. Eye Pattern: 2.2 Gbps MHL Eye Pattern for MHL Switch
14
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TYPICAL CHARACTERISTICS (continued)
Figure 16. Eye Pattern: 3.0 Gbps MHL Eye Pattern for With No Device
Figure 17. Eye Pattern: 3.0 Gbps MHL Eye Pattern for MHL Switch
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PACKAGE OPTION ADDENDUM
www.ti.com
3-Jul-2012
PACKAGING INFORMATION
Orderable Device
TS3USB3200RSVR
Status
(1)
ACTIVE
Package Type Package
Drawing
UQFN
RSV
Pins
Package Qty
16
3000
Eco Plan
(2)
Green (RoHS
& no Sb/Br)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
CU NIPDAU Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
TS3USB3200RSVR
Package Package Pins
Type Drawing
UQFN
RSV
16
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
3000
180.0
12.4
Pack Materials-Page 1
2.1
B0
(mm)
K0
(mm)
P1
(mm)
2.9
0.75
4.0
W
Pin1
(mm) Quadrant
12.0
Q1
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Jul-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TS3USB3200RSVR
UQFN
RSV
16
3000
203.0
203.0
35.0
Pack Materials-Page 2
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