TPS22907 www.ti.com SLVSA44 – NOVEMBER 2009 ULTRA SMALL, LOW-INPUT VOLTAGE, LOW rON LOAD SWITCH Check for Samples: TPS22907 FEATURES APPLICATIONS • • • • • • • • • • • 1 Low Input Voltage: 1.1 V to 3.6 V Ultra-Low ON-State Resistance – rON = 44 mΩ at VIN = 3.6 V – rON = 50 mΩ at VIN = 2.5 V – rON = 58 mΩ at VIN = 1.8 V – rON = 83 mΩ at VIN = 1.2 V 1-A Maximum Continuous Switch Current Quiescent Current < 1 µA Shutdown Current < 1 µA Low Control Input Thresholds Enable Use of Low-Voltage Logic Controlled Slew Rate to Avoid Inrush Currents ESD Performance Tested Per JESD 22 – 3000-V Human-Body Model (A114-B, Class II) – 1000-V Charged-Device Model (C101) Ultra Small Four-Terminal Wafer Chip Scale Package (WCSP) – 0.9 mm × 0.9 mm, 0.5-mm Pitch, 0.5-mm Height • • • • • • • Battery Powered Equipment Portable Industrial Equipment Portable Medical Equipment Portable Media Players Point Of Sales Terminal GPS Devices Digital Cameras Portable Instrumentation Smartphones YZT PACKAGE B B A A 2 1 Laser Marking View 1 2 Bump View Table 1. TERMINAL ASSIGNMENTS B ON GND A VIN VOUT 2 1 DESCRIPTION The TPS22907 is an ultra small, low RON load switch with controlled turn on. The device contains a P-channel MOSFET that operates over an input voltage range of 1.1 V to 3.6 V. The switch is controlled by an on/off input (ON), which is capable of interfacing directly with low-voltage control signals. The TPS22907 is available in a space-saving 4-terminal WCSP with 0.5-mm pitch (YZT). The device is characterized for operation over the free-air temperature range of –40°C to 85°C. DEVICE rON (TYP at 1.8 V) SLEW RATE (TYP at 1.8 V) MAXIMUM OUTPUT CURRENT ENABLE TPS22907 58 mΩ 36 μs 1000 mA Active high ORDERING INFORMATION TA –40°C to 85°C (1) (2) (3) PACKAGE (1) WCSP – YZT (0.5-mm pitch) (2) ORDERABLE PART NUMBER Tape and reel TPS22907YZTR TOP-SIDE MARKING _ _ _ 5K_ (3) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2009, Texas Instruments Incorporated TPS22907 SLVSA44 – NOVEMBER 2009 www.ti.com FUNCTIONAL BLOCK DIAGRAM A2 VIN Turn-On Slew Rate Controlled Driver ON Control Logic B2 A1 VOUT ESD Protection B1 GND FUNCTION TABLE ON (Control Input) VIN to VOUT L OFF H ON TERMINAL FUNCTIONS TERMINAL 2 BALL NO. NAME A1 VOUT A2 VIN B1 GND B2 ON DESCRIPTION Switch output Switch input. Bypass this input with a ceramic capacitor to ground. Ground Switch control input. Active high, do not leave floating Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPS22907 TPS22907 www.ti.com SLVSA44 – NOVEMBER 2009 ABSOLUTE MAXIMUM RATINGS (1) VIN Input voltage range VOUT Output voltage range VON Input voltage range IMAX Maximum continuous switch current, TA = -40°C to 85°C IPLS Maximum pulsed current (100-µs pulse, 2% duty cycle), TA = -40°C to 85°C TA Operating free-air temperature range Tstg Storage temperature range ESD (1) MIN MAX –0.3 4 V VIN + 0.3 V 4 V 1 A –0.3 2.7 A 85 °C 150 °C –40 –65 Electrostatic discharge protection UNIT Human-Body Model (HBM) 3000 Charged-Device Model (CDM) 1000 V Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. DISSIPATION RATINGS BOARD High-K (1) (1) PACKAGE RθJC RθJA DERATING FACTOR ABOVE TA = 25°C TA < 25°C TA = 70°C TA = 85°C YZT 28.6°C/W 116.32°C/W -8.5969 mW/°C 859.69 mW 472.83 mW 343.87 mW The JEDEC high-K (2s2p) board used to derive this data was a 3- × 3-inch, multilayer board with 1-ounce internal power and ground planes and 2-ounce copper traces on top and bottom of the board. RECOMMENDED OPERATING CONDITIONS MIN VIN Input voltage range VOUT Output voltage range VIH High-level input voltage, ON VIL Low-level input voltage, ON CIN Input capacitor (1) 1.1 0.85 MAX UNIT 3.6 V VIN V 3.6 V 0.4 1 (1) V μF See Application Information. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPS22907 3 TPS22907 SLVSA44 – NOVEMBER 2009 www.ti.com ELECTRICAL CHARACTERISTICS VIN = 1.1 V to 3.6 V (unless otherwise noted) PARAMETER TEST CONDITIONS TA (1) MIN TYP (2) MAX UNIT IIN Quiescent current IOUT = 0, VIN = VON 0.07 1 µA IIN(OFF) Off supply current VON = GND, OUT = Open 0.05 1 µA IIN(LEAKAGE) Leakage current VON = GND, VOUT = 0 0.05 1 µA 44 60 VIN = 3.6 V, IOUT = -200 mA VIN = 2.5 V, IOUT = -200 mA rON ON-state resistance VIN = 1.8 V, IOUT = -200 mA VIN = 1.2 V, IOUT = -200 mA VIN = 1.1 V, IOUT = -200 mA ION (1) (2) ON input leakage current VON = 1.1 V to 3.6 V or GND 25°C Full range 67 25°C 50 63 Full range 70 25°C 58 72 Full range 80 25°C 83 Full range mΩ 106 117 25°C 97 Full range 125 140 Full range 0.005 1 µA Full range TA = –40°C to 85°C Typical values are at the specified VIN and TA = 25°C. SWITCHING CHARACTERISTICS VIN = 3.6 V, TA = 25°C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT tON Turn-ON time RL = 500 Ω CL = 0.1 μF 28 μs tOFF Turn-OFF time RL = 500 Ω CL = 0.1 μF 40 μs tr VOUT rise time RL = 500 Ω CL = 0.1 μF 25 μs tf VOUT fall time RL = 500 Ω CL = 0.1 μF 116 μs SWITCHING CHARACTERISTICS VIN = 1.8 V, TA = 25°C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT tON Turn-ON time RL = 500 Ω CL = 0.1 μF 48 μs tOFF Turn-OFF time RL = 500 Ω CL = 0.1 μF 40 μs tr VOUT rise time RL = 500 Ω CL = 0.1 μF 36 μs tf VOUT fall time RL = 500 Ω CL = 0.1 μF 113 μs SWITCHING CHARACTERISTICS VIN = 1.1 V, TA = 25°C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT tON Turn-ON time RL = 500 Ω CL = 0.1 μF 81 μs tOFF Turn-OFF time RL = 500 Ω CL = 0.1 μF 42 μs tr VOUT rise time RL = 500 Ω CL = 0.1 μF 57 μs tf VOUT fall time RL = 500 Ω CL = 0.1 μF 113 μs 4 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPS22907 TPS22907 www.ti.com SLVSA44 – NOVEMBER 2009 TYPICAL CHARACTERISTICS ON-STATE RESISTANCE vs INPUT VOLTAGE ON-STATE RESISTANCE vs TEMPERATURE 0.06 0.14 V IN = 3.6 V IOUT = 200 m A IOUT = -200 m A 0.05 r ON - ON-State Resistance - W ð W r ON - ON-State Resistance - W 0.12 0.1 0.08 TA = 85°C 0.06 0.04 TA = 25°C TA = -40°C 0.04 0.03 0.02 0.01 0.02 0 1 1.5 2 2.5 3 3.5 0 -40 4 -15 35 Figure 1. Figure 2. QUIESCENT CURRENT vs INPUT VOLTAGE QUIESCENT CURRENT vs TEMPERATURE 60 85 60 85 0.30 0.25 V ON = V IN IOUT = 0 0.25 IIN - Quiescent Current - µA 0.20 IIN - Quiescent Current - µA 10 TA - Tem perature - °C V IN - Input Voltage - V 0.15 0.10 0.20 0.15 0.10 0.05 0.05 0.00 0.00 -40 1 1.5 2 2.5 3 3.5 4 V IN = 3.6 V IOUT = 0 V IN = V ON -15 10 35 TA - Tem perature - °C V IN - Input Voltage - V Figure 3. Figure 4. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPS22907 5 TPS22907 SLVSA44 – NOVEMBER 2009 www.ti.com TYPICAL CHARACTERISTICS (continued) OFF SUPPLY CURRENT vs INPUT VOLTAGE OFF SUPPLY CURRENT vs TEMPERATURE 0.14 0.12 V IN = 3.6 V V ON = 0 V 0.12 IIN(OFF) - Off Supply Current - µA IIN(off) - Off Supply Current - µA 0.10 0.08 0.06 0.04 0.02 0.10 0.08 0.06 0.04 0.02 0.00 -40 0.00 1 1.5 2 2.5 3 3.5 4 -15 10 V IN - Input Voltage - V Figure 5. Figure 6. LEAKAGE CURRENT vs INPUT VOLTAGE LEAKAGE CURRENT vs TEMPERATURE 0.18 0.45 85 60 85 V IN = 3.6 V IOUT = 0 V ON = 0 0.40 0.14 IIN(leakage) - Leakage Current - µA IIN(leakage) - Leakage Current - µA 60 0.50 IOUT = 0 V ON = 0 0.16 0.12 0.10 0.08 0.06 0.04 0.02 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0.00 1 1.5 2 2.5 3 3.5 4 0.00 -40 V IN - Input Voltage - V -15 10 35 TA - Tem perature - °C Figure 7. 6 35 TA - Tem perature - °C Figure 8. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPS22907 TPS22907 www.ti.com SLVSA44 – NOVEMBER 2009 TYPICAL CHARACTERISTICS (continued) ON INPUT THRESHOLD 4.0 3.5 V OUT - Output Voltage - V 3.0 TA = 85°C 2.5 TA = 25°C 2.0 TA = -40C 1.5 1.0 V IN = 3.6 V IOUT = 500 m A 0.5 0.0 0 0.5 1 1.5 2 V ON - ON Voltage - V Figure 9. ON TIME vs TEMPERATURE OFF TIME vs TEMPERATURE 41.0 40 V IN = 3.6 V CL = 0.1 µF RL = 500 W 35 40.0 t OFF - Off Time - µs t ON - On Time - µs 30 25 20 15 10 39.5 39.0 38.5 38.0 37.5 5 0 -40 V IN = 3.6 V CL = 0.1 µF RL = 500 W 40.5 37.0 -15 10 35 60 85 36.5 -40 -15 10 35 60 85 TA - Tem perature - °C TA - Tem perature - °C Figure 10. Figure 11. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPS22907 7 TPS22907 SLVSA44 – NOVEMBER 2009 www.ti.com TYPICAL CHARACTERISTICS (continued) RISE TIME vs TEMPERATURE FALL TIME vs TEMPERATURE 30.5 122 V IN = 3.6 V CL = 0.1 µF RL = 500 W 30.0 120 118 t f - Fall Time - µs 29.5 t r - Rise Time - µs V IN = 3.6 V CL = 0.1 µF RL = 500 W 29.0 28.5 28.0 116 114 112 27.5 110 27.0 108 26.5 -40 -15 10 35 60 85 106 -40 TA - Tem perature - °C -15 10 35 60 85 TA - Tem perature - °C Figure 12. Figure 13. VIN = 3.6 V CIN = 1 µF CL = 0.1 µF RL = 36 W TA = 25°C IOUT VON VON IOUT VIN = 3.6 V CIN = 1 µF CL = 0.1 µF RL = 36 W TA = 25°C Figure 14. tON RESPONSE 8 Figure 15. tOFF RESPONSE Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPS22907 TPS22907 www.ti.com SLVSA44 – NOVEMBER 2009 TYPICAL CHARACTERISTICS (continued) VIN = 1.1 V CIN = 1 µF CL = 0.1 µF RL = 11 W TA = 25°C IOUT VON VON IOUT VIN = 1.1 V CIN = 1 µF CL = 0.1 µF RL = 11 W TA = 25°C Figure 16. tON RESPONSE Figure 17. tOFF RESPONSE VIN = 3.6 V CIN = 1 µF CL = 10 µF RL = 36 W TA = 25°C IOUT VON VON IOUT VIN = 3.6 V CIN = 1 µF CL = 10 µF RL = 36 W TA = 25°C Figure 18. tON RESPONSE Figure 19. tOFF RESPONSE VIN = 1.1 V CIN = 1 µF CL = 10 µF RL = 11 W TA = 25°C IOUT VON VON IOUT VIN = 1.1 V CIN = 1 µF CL = 10 µF RL = 11 W TA = 25°C Figure 20. tON RESPONSE Figure 21. tOFF RESPONSE Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPS22907 9 TPS22907 SLVSA44 – NOVEMBER 2009 www.ti.com PARAMETER MEASUREMENT INFORMATION VIN VOUT ON (A) RL CL + – OFF DUT CIN = 1 µF GND GND TEST CIRCUIT GND 1.8 V VON VON VON/2 VON/2 tr 0V tf 0V tOFF tON 90% VOUT VOH VOUT VOUT/2 10% 90% 10% VOUT/2 VOL tON/tOFF WAVEFORMS A. trise and tfall of the control signal is 100 ns. Figure 22. Test Circuit and tON/tOFF Waveforms 10 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPS22907 TPS22907 www.ti.com SLVSA44 – NOVEMBER 2009 APPLICATION INFORMATION On/Off Control The ON pin controls the state of the switch. Activating ON continuously holds the switch in the on state so long as there is no fault. ON is active high and has a low threshold, making it capable of interfacing with low-voltage signals. The ON pin is compatible with standard GPIO logic threshold. It can be used with any microcontroller with 1.2-V, 1.8-V, 2.5-V, or 3.3-V GPIOs. Input Capacitor To limit the voltage drop on the input supply caused by transient in-rush currents when the switch turns on into a discharged load capacitor or short-circuit, a capacitor needs to be placed between VIN and GND. A 1-μF ceramic capacitor, CIN, place close to the pins is usually sufficient. Higher values of CIN can be use to further reduce the voltage drop during high-current application. When switching heavy loads, it is recommended to have an input capacitor approximately ten times higher than the output capacitor to avoid excessive voltage drop. Output Capacitor Due to the integral body diode in the PMOS switch, a CIN greater than CL is highly recommended. A CL greater than CIN can cause VOUT to exceed VIN when the system supply is removed. This could result in current flow through the body diode from VOUT to VIN. Board Layout For best performance, all traces should be as short as possible. To be most effective, the input and output capacitors should be placed close to the device to minimize the effects that parasitic trace inductances may have on normal and short-circuit operation. Using wide traces for VIN, VOUT, and GND helps minimize the parasitic electrical effects along with minimizing the case to ambient thermal impedance. Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TPS22907 11 PACKAGE OPTION ADDENDUM www.ti.com 23-Dec-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TPS22907YZTR ACTIVE DSBGA YZT 4 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM TPS22907YZTT ACTIVE DSBGA YZT 4 250 SNAGCU Level-1-260C-UNLIM Green (RoHS & no Sb/Br) Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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