TS3USB221 www.ti.com....................................................................................................................................... SCDS220F – NOVEMBER 2006 – REVISED NOVEMBER 2008 HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH WITH SINGLE ENABLE FEATURES 1 • • • • • • • • • • VCC Operation at 2.5 V and 3.3 V VI/O Accepts Signals up to 5.5 V 1.8-V Compatible Control-Pin Inputs Low-Power Mode When OE Is Disabled (1 µA) rON = 6 Ω Maximum ΔrON = 0.2 Ω Typical Cio(on) = 6 pF Maximum Low Power Consumption (30 µA Maximum) ESD > 2000-V Human-Body Model (HBM) High Bandwidth (1.1 GHz Typical) DRC PACKAGE (TOP VIEW) 1D+ 1 10 VCC 1D– 2 9 S 2D+ 3 8 D+ 2D– 4 7 D– GND 5 6 OE RSE PACKAGE (TOP VIEW) APPLICATIONS • • Routes Signals for USB 1.0, 1.1, and 2.0 Mobile Industry Processor Interface (MIPI) Signal Routing DESCRIPTION/ ORDERING INFORMATION The TS3USB221 is a high-bandwidth switch specially designed for the switching of high-speed USB 2.0 signals in handset and consumer applications, such as cell phones, digital cameras, and notebooks with hubs or controllers with limited USB I/Os. The wide bandwidth (1.1 GHz) of this switch allows signals to pass with minimum edge and phase distortion. The device multiplexes differential outputs from a USB host device to one of two corresponding outputs. The switch is bidirectional and offers little or no attenuation of the high-speed signals at the outputs. It is designed for low bit-to-bit skew and high channel-to-channel noise isolation, and is compatible with various standards, such as high-speed USB 2.0 (480 Mbps). VCC 1D+ 1 1D– 10 9 S 2 8 D+ 2D+ 3 7 D– 2D– 4 6 OE 5 GND RSE PACKAGE (BOTTOM VIEW) VCC S 9 D+ 10 1 1D+ 8 2 1D– D– 7 3 2D+ OE 6 4 2D– 5 GND 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2006–2008, Texas Instruments Incorporated TS3USB221 SCDS220F – NOVEMBER 2006 – REVISED NOVEMBER 2008....................................................................................................................................... www.ti.com ORDERING INFORMATION TA –40°C to 85°C (1) (2) PACKAGE (1) (2) ORDERABLE PART NUMBER TOP-SIDE MARKING QFN – RSE Reel of 3000 TS3USB221RSER L5O SON – DRC Reel of 3000 TS3USB221DRCR ZWG Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. PIN DESCRIPTION NAME DESCRIPTION OE Bus-switch enable S Select input D Bus A nD Bus B TRUTH TABLE S OE FUNCTION X H Disconnect L L D = 1D H L D = 2D BLOCK DIAGRAM D+ 1D+ D− 1D− 2D+ 2D− S OE SIMPLIFIED SCHEMATIC, EACH FET SWITCH (SW) A B VCC Charge Pump EN (see Note A) A. 2 EN is the internal enable signal applied to the switch. Submit Documentation Feedback Copyright © 2006–2008, Texas Instruments Incorporated Product Folder Link(s): TS3USB221 TS3USB221 www.ti.com....................................................................................................................................... SCDS220F – NOVEMBER 2006 – REVISED NOVEMBER 2008 ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range –0.5 4.6 V VIN Control input voltage range (2) (3) –0.5 7 V (2) (3) (4) VI/O Switch I/O voltage range IIK Control input clamp current VIN < 0 –50 mA II/OK I/O port clamp current VI/O < 0 –50 mA ±120 mA ±100 mA II/O ON-state switch current –0.5 (5) Continuous current through VCC or GND θJA Package thermal impedance (6) Tstg Storage temperature range (1) (2) (3) (4) (5) (6) 7 UNIT DRC package 48.7 RSE package 243 –65 150 V °C/W °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to ground, unless otherwise specified. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. VI and VO are used to denote specific conditions for VI/O. II and IO are used to denote specific conditions for II/O. The package thermal impedance is calculated in accordance with JESD 51-7. RECOMMENDED OPERATING CONDITIONS (1) VCC Supply voltage VIH High-level control input voltage VIL Low-level control input voltage VI/O Data input/output voltage TA Operating free-air temperature (1) MIN MAX UNIT 2.3 3.6 VCC = 2.3 V to 2.7 V 0.46 × VCC 5.5 V VCC = 2.7 V to 3.6 V 0.46 × VCC 5.5 VCC = 2.3 V to 2.7 V 0 0.25 × VCC VCC = 2.7 V to 3.6 V 0 0.25 × VCC 0 5.5 V –40 85 °C V V All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. Submit Documentation Feedback Copyright © 2006–2008, Texas Instruments Incorporated Product Folder Link(s): TS3USB221 3 TS3USB221 SCDS220F – NOVEMBER 2006 – REVISED NOVEMBER 2008....................................................................................................................................... www.ti.com ELECTRICAL CHARACTERISTICS (1) over operating free-air temperature range (unless otherwise noted) PARAMETER VIK TEST CONDITIONS UNIT –1.8 V VIN = 0 V to 3.6 V ±1 µA VIN = VCC or GND, Switch OFF ±1 µA VI/O = 0 V to 3.6 V ±2 VI/O = 0 V to 2.7 V ±1 VCC = 3.6 V, 2.7 V, VIN = VCC or GND, II/O = 0 V, Switch ON or OFF 30 µA VCC = 3.6 V, 2.7 V, VIN = VCC or GND Switch disabled (OE in high state) 1 µA II = –18 mA VCC = 3.6 V, 2.7 V, 0 V, IOZ (3) VCC = 3.6 V, 2.7 V, VO = 0 V to 3.6 V, VI = 0 V, I(OFF) VCC = 0 V ICC ICC (low power mode) Control inputs IIN TYP (2) MAX VCC = 3.6 V, 2.7 V, MIN ΔICC (4) Control inputs One input at 1.8 V, Other inputs at VCC or GND VCC = 3.6 V 20 VCC = 2.7 V 0.5 Cin Control inputs VCC = 3.3 V, 2.5 V, VIN = 3.3 V or 0 V Cio(OFF) VCC = 3.3 V, 2.5 V, VI/O = 3.3 V or 0 V, Cio(ON) VCC = 3.3 V, 2.5 V, VI/O = 3.3 V or 0 V, VI = 0 V, IO = 30 mA 6 VI = 2.4 V, IO = –15 mA 6 VI = 0 V, IO = 30 mA 0.2 VI = 1.7, IO = –15 mA 0.2 VI = 0 V, IO = 30 mA 1 VI = 1.7, IO = –15 mA 1 ron (5) VCC = 3 V, 2.3 V Δron VCC = 3 V, 2.3 V ron(flat) VCC = 3 V, 2.3 V (1) (2) (3) (4) (5) µA µA 1 2 pF Switch OFF 3 4 pF Switch ON 5 6 pF Ω Ω Ω VIN and IIN refer to control inputs. VI, VO, II, and IO refer to data pins. All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C. For I/O ports, the parameter IOZ includes the input leakage current. This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND. Measured by the voltage drop between the A and B terminals at the indicated current through the switch. ON-state resistance is determined by the lower of the voltages of the two (A or B) terminals. DYNAMIC ELECTRICAL CHARACTERISTICS over operating range, TA = –40°C to 85°C, VCC = 3.3 V ± 10%, GND = 0 V PARAMETER TEST CONDITIONS TYP (1) UNIT XTALK Crosstalk RL = 50 Ω, f = 250 MHz –40 OIRR OFF isolation RL = 50 Ω, f = 250 MHz –41 dB BW Bandwidth (–3 dB) RL = 50 Ω 1.1 GHz (1) 4 dB For Max or Min conditions, use the appropriate value specified under Electrical Characteristics for the applicable device type. Submit Documentation Feedback Copyright © 2006–2008, Texas Instruments Incorporated Product Folder Link(s): TS3USB221 TS3USB221 www.ti.com....................................................................................................................................... SCDS220F – NOVEMBER 2006 – REVISED NOVEMBER 2008 DYNAMIC ELECTRICAL CHARACTERISTICS over operating range, TA = –40°C to 85°C, VCC = 2.5 V ± 10%, GND = 0 V PARAMETER TYP (1) TEST CONDITIONS UNIT XTALK Crosstalk RL = 50 Ω, f = 250 MHz –39 dB OIRR OFF isolation RL = 50 Ω, f = 250 MHz –40 dB BW Bandwidth (–3 dB) RL = 50 Ω 1.1 GHz (1) For Max or Min conditions, use the appropriate value specified under Electrical Characteristics for the applicable device type. SWITCHING CHARACTERISTICS over operating range, TA = –40°C to 85°C, VCC = 3.3 V ± 10%, GND = 0 V PARAMETER tpd Propagation delay MIN (2) (3) TYP (1) MAX 0.25 UNIT ns S to D, nD 30 OE to D, nD 17 S to D, nD 12 OE to D, nD 10 tON Line enable time tOFF Line disable time tSK(O) Output skew between center port to any other port (2) 0.1 0.2 ns tSK(P) Skew between opposite transitions of the same output (tPHL – tPLH) (2) 0.1 0.2 ns (1) (2) (3) ns ns For Max or Min conditions, use the appropriate value specified under Electrical Characteristics for the applicable device type. Specified by design The bus switch contributes no propagational delay other than the RC delay of the on resistance of the switch and the load capacitance. The time constant for the switch alone is of the order of 0.25 ns for 10-pF load. Since this time constant is much smaller than the rise/fall times of typical driving signals, it adds very little propagational delay to the system. Propagational delay of the bus switch, when used in a system, is determined by the driving circuit on the driving side of the switch and its interactions with the load on the driven side. SWITCHING CHARACTERISTICS over operating range, TA = –40°C to 85°C, VCC = 2.5 V ± 10%, GND = 0 V PARAMETER tpd Propagation delay MIN (2) (3) TYP (1) MAX 0.25 UNIT ns S to D, nD 50 OE to D, nD 32 S to D, nD 23 OE to D, nD 12 tON Line enable time tOFF Line disable time tSK(O) Output skew between center port to any other port (2) 0.1 0.2 ns tSK(P) Skew between opposite transitions of the same output (tPHL – tPLH) (2) 0.1 0.2 ns (1) (2) (3) ns ns For Max or Min conditions, use the appropriate value specified under Electrical Characteristics for the applicable device type. Specified by design The bus switch contributes no propagational delay other than the RC delay of the on resistance of the switch and the load capacitance. The time constant for the switch alone is of the order of 0.25 ns for 10-pF load. Since this time constant is much smaller than the rise/fall times of typical driving signals, it adds very little propagational delay to the system. Propagational delay of the bus switch, when used in a system, is determined by the driving circuit on the driving side of the switch and its interactions with the load on the driven side. Submit Documentation Feedback Copyright © 2006–2008, Texas Instruments Incorporated Product Folder Link(s): TS3USB221 5 TS3USB221 SCDS220F – NOVEMBER 2006 – REVISED NOVEMBER 2008....................................................................................................................................... www.ti.com APPLICATION INFORMATION 0 0 –1 –20 VCC = 3.3 V VCC = 2.5 V Attenuation (dB) Gain (dB) –2 –3 –4 –40 –60 –80 –5 –100 VCC = 3.3 V VCC = 2.5 V –6 –120 –7 100.0E+3 1.0E+6 10.0E+6 100.0E+6 1.0E+9 100.0E+3 10.0E+9 1.0E+6 10.0E+6 100.0E+6 1.0E+9 10.0E+9 Frequency (Hz) Frequency (Hz) Figure 1. Gain vs Frequency Figure 2. OFF Isolation vs Frequency 3.5 0 3.4 –20 ron (Ω) Attenuation (dB) 3.3 –40 –60 3.2 3.1 –80 3.0 –100 VCC = 3.3 V VCC = 2.5 V 2.9 –120 VCC = 3.0 V VCC = 2.3 V 2.8 100.0E+3 1.0E+6 10.0E+6 100.0E+6 1.0E+9 10.0E+9 0.0 0.5 1.0 1.5 Frequency (Hz) 2.0 2.5 3.0 3.5 VIN (V) Figure 3. Crosstalk vs Frequency Figure 4. ron vs VIN (IOUT = –15 mA) 3.5 3.4 ron (Ω) 3.3 3.2 3.1 3.0 2.9 VCC = 3.0 V VCC = 2.3 V 2.8 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 VIN (V) Figure 5. ron vs VIN (IOUT = –30 mA) 6 Submit Documentation Feedback Copyright © 2006–2008, Texas Instruments Incorporated Product Folder Link(s): TS3USB221 TS3USB221 0.5 0.5 0.4 0.4 0.3 0.3 Differential Signal (V) Differential Signal (V) www.ti.com....................................................................................................................................... SCDS220F – NOVEMBER 2006 – REVISED NOVEMBER 2008 0.2 0.1 0.0 –0.1 –0.2 0.2 0.1 0.0 –0.1 –0.2 –0.3 –0.3 –0.4 –0.4 –0.5 –0.5 0.0 0.2 0.4 0.5 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0.0 0.2 0.4 0.5 –9 0.8 1.0 1.2 1.4 1.6 1.8 2.0 –9 Time (X 10 ) (s) Time (X 10 ) (s) Figure 6. Eye Pattern: 480-Mbps USB Signal With No Switch (Through Path) Figure 7. Eye Pattern: 480-Mbps USB Signal With Switch NC Path 0.5 0.4 Differential Signal (V) 0.3 0.2 0.1 0.0 –0.1 –0.2 –0.3 –0.4 –0.5 0.0 0.2 0.4 0.5 0.8 1.0 1.2 1.4 1.6 1.8 2.0 –9 Time (X 10 ) (s) Figure 8. Eye Pattern: 480-Mbps USB Signal With Switch NO Path Submit Documentation Feedback Copyright © 2006–2008, Texas Instruments Incorporated Product Folder Link(s): TS3USB221 7 TS3USB221 SCDS220F – NOVEMBER 2006 – REVISED NOVEMBER 2008....................................................................................................................................... www.ti.com PARAMETER MEASUREMENT INFORMATION VCC 1D or 2D VOUT1 or VOUT2 VIN RL CL VCOM tON 500 Ω 50 pF V+ tOFF 500 Ω 50 pF V+ D CL(2) 1D or 2D VCTRL TEST RL S CL(2) Logic Input(1) RL GND 1.8 V Logic Input (VI) 50% 50% 0 tON Switch Output (VOUT1 or VOUT2) (1) (2) tOFF 90% 90% VOH VOL All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr < 5 ns, tf < 5 ns. CL includes probe and jig capacitance. Figure 9. Turn-On (tON) and Turn-Off Time (tOFF) VCC Network Analyzer Channel OFF: 1D to D 50 W VOUT1 1D VCTRL = VCC or GND D Source Signal 50 W VIN 2D Network Analyzer Setup Source Power = 0 dBm (632-mV P-P at 50-W load) VCTRL S 50 W + GND DC Bias = 350 mV Figure 10. OFF Isolation (OISO) 8 Submit Documentation Feedback Copyright © 2006–2008, Texas Instruments Incorporated Product Folder Link(s): TS3USB221 TS3USB221 www.ti.com....................................................................................................................................... SCDS220F – NOVEMBER 2006 – REVISED NOVEMBER 2008 PARAMETER MEASUREMENT INFORMATION (continued) VCC Network Analyzer Channel ON: 1D to D 50 W VOUT1 1D Channel OFF: 2D to D VIN Source Signal VCTRL = VCC or GND VOUT2 2D 50 W Network Analyzer Setup 50 W VCTRL S + Source Power = 0 dBm (632-mV P-P at 50-W load) GND DC Bias = 350 mV Figure 11. Crosstalk (XTALK) VCC Network Analyzer 50 W VOUT1 1D Channel ON: 1D to D D Source Signal VIN VCTRL = VCC or GND 2D Network Analyzer Setup 50 W VCTRL + Source Power = 0 dBm (632-mV P-P at 50-W load) S GND DC Bias = 350 mV Figure 12. Bandwidth (BW) 400 mV Figure 13. Propagation Delay Submit Documentation Feedback Copyright © 2006–2008, Texas Instruments Incorporated Product Folder Link(s): TS3USB221 9 TS3USB221 SCDS220F – NOVEMBER 2006 – REVISED NOVEMBER 2008....................................................................................................................................... www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) 800 mV 50% 50% Input 400 mV tPLH tPHL VOH 50% Output VOL tSK(P) = | tPHL – tPLH | PULSE SKEW tSK(P) 800 mV 50% 50% Input 400 mV tPLH1 tPHL1 VOH 50% 50% Output 1 VOL tSK(O) tSK(O) VOH 50% 50% Output 2 tPLH2 VOL tPHL2 tSK(O) = | tPLH1 – tPLH2 | or | tPHL1 – tPHL2 | OUTPUT SKEW tSK(P) Figure 14. Skew Test VCC VOUT1 1D + D VIN Channel ON VOUT2 2D r on + VCTRL IIN S VIN * VOUT2 or VOUT1 W IIN VCTRL = VIH or VIL + GND Figure 15. ON-State Resistance (ron) 10 Submit Documentation Feedback Copyright © 2006–2008, Texas Instruments Incorporated Product Folder Link(s): TS3USB221 TS3USB221 www.ti.com....................................................................................................................................... SCDS220F – NOVEMBER 2006 – REVISED NOVEMBER 2008 PARAMETER MEASUREMENT INFORMATION (continued) VCC VOUT1 1D VIN D + VOUT2 2D VCTRL + S OFF-State Leakage Current Channel OFF VCTRL = VIH or VIL + GND Figure 16. OFF-State Leakage Current VCC VOUT1 1D Capacitance Meter VBIAS VBIAS = VCC or GND VOUT2 2D VCTRL = VCC or GND VIN D Capacitance is measured at 1D, 2D, D, and S inputs during ON and OFF conditions. VCTRL S GND Figure 17. Capacitance Submit Documentation Feedback Copyright © 2006–2008, Texas Instruments Incorporated Product Folder Link(s): TS3USB221 11 PACKAGE OPTION ADDENDUM www.ti.com 5-Jan-2010 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TS3USB221DRCR ACTIVE SON DRC 10 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TS3USB221DRCRG4 ACTIVE SON DRC 10 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TS3USB221RSER ACTIVE UQFN RSE 10 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TS3USB221RSERG4 ACTIVE UQFN RSE 10 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 8-Dec-2009 TAPE AND REEL INFORMATION *All dimensions are nominal Device TS3USB221DRCR Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 3.3 1.1 8.0 12.0 Q2 SON DRC 10 3000 330.0 12.4 TS3USB221DRCR SON DRC 10 3000 330.0 12.4 3.3 3.3 1.0 8.0 12.0 Q2 TS3USB221RSER UQFN RSE 10 3000 179.0 8.4 1.75 2.25 0.65 4.0 8.0 Q1 Pack Materials-Page 1 3.3 B0 (mm) PACKAGE MATERIALS INFORMATION www.ti.com 8-Dec-2009 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TS3USB221DRCR SON DRC 10 3000 346.0 346.0 29.0 TS3USB221DRCR SON DRC 10 3000 370.0 355.0 55.0 TS3USB221RSER UQFN RSE 10 3000 220.0 205.0 50.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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