TI CD74FCT652M

CD74FCT651,
CD74FCT652
Data sheet acquired from Harris Semiconductor
SCHS262
D
ENDE
M
M
O
S
EC
IGN
NOT R NEW DES ology
n
Tech
FOR
January 1997
Features
MOS
Use C
• CD74FCT652
- Noninverting
• Family Features
- SCR Latchup Resistant BiCMOS Process and
Circuit Design
- Speed of Bipolar FAST™/AS/S
- 64mA Output Sink Current
- Output Voltage Swing Limited to 3.7V at VCC = 5V
- Controlled Output Edge Rates
- Input/Output Isolation to VCC
- BiCMOS Technology with Low Quiescent Power
Ordering Information
TEMP.
RANGE (oC)
PACKAGE
Description
The CD74FCT651 and CD74FCT652 three-state, octal bus
transceivers/registers use a small geometry BiCMOS technology. The output stage is a combination of bipolar and CMOS
transistors that limits the output HIGH level to two diode drops
below VCC. This resultant lowering of output swing (0V to
3.7V) reduces power bus ringing (a source of EMI) and minimizes VCC bounce and ground bounce and their effects during simultaneous output switching. The output configuration
also enhances switching speed and is capable of sinking 64
milliamperes.
• Buffered Inputs
• Typical Propagation Delay: 6.8ns at VCC = 5V,
TA = 25oC, CL = 50pF
• CD75FCT651
- Inverting
PART NUMBER
BiCMOS FCT Interface Logic, Octal Bus
Transceivers/Registers, Three-State
PKG.
NO.
CD74FCT651EN
0 to 70
24 Ld PDIP
E24.3
CD74FCT652EN
0 to 70
24 Ld PDIP
E24.3
CD74FCT651M
0 to 70
24 Ld SOIC
M24.3
CD74FCT652M
0 to 70
24 Ld SOIC
M24.3
NOTE: When ordering the suffix M packages, use the entire part
number. Add the suffix 96 to obtain the variant in the tape and reel.
These devices consist of bus transceiver circuits, D-Type flipflops, and control circuitry arranged for multiplexed transmission of data directly from the data bus or from the internal storage registers. Output Enables OEAB and OEBA are provided
to control the transceiver functions. SAB and SBA control pins
are provided to select whether real-time or stored data is
transferred. The circuitry used for select control will eliminate
the typical decoding glitch that occurs in a multiplexer during
the transition between stored and real-time data. A LOW input
level selects real-time data and a HIGH selects stored data.
The following examples demonstrate the four fundamental
bus management functions that can be performed with the
octal bus transceivers and registers.
Data on the A or B data bus, or both, can be stored in the internal D flip-flops by low to high transitions at the appropriate clock
pins (CAB or CBA) regardless of the select or enable control
pins. When SAB and SBA are in the real-time transfer mode, it
is also possible to store data without using the internal D-Type
flip-flops by simultaneously enabling OEAB and OEBA. In this
configuration, each output reinforces its input. Thus, when all
other data sources to the two sets of bus lines are at high
impedance, each set of bus lines will remain at its last state.
Pinouts
CD74FCT651 (PDIP, SOIC)
TOP VIEW
CD74FCT652 (PDIP, SOIC)
TOP VIEW
CAB 1
24 VCC
CAB 1
24 VCC
SAB 2
23 CBA
SAB 2
23 CBA
OEAB 3
22 SBA
OEAB 3
22 SBA
A0 4
21 OEBA
A0 4
21 OEBA
A1 5
20 B0
A1 5
20 B0
A2 6
19 B1
A2 6
19 B1
A3 7
18 B2
A3 7
18 B2
A4 8
17 B3
A4 8
17 B3
A5 9
16 B4
A5 9
16 B4
A6 10
15 B5
A6 10
15 B5
A7 11
14 B6
A7 11
14 B6
GND 12
13 B7
GND 12
13 B7
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
FAST™ is a trademark of Fairchild Semiconductor.
Copyright © Harris Corporation 1997
8-1
File Number
2394.2
CD74FCT651, CD74FCT652
Functional Diagram
A0
A1
A2
A3
A DATA PORT
A4
A5
A6
A7
FLIP-FLOP
CLOCKS
4
20
5
19
6
18
7
17
8
16
9
15
10
14
11
13
OEBA
OEAB
CAB CLOCK
CBA CLOCK
21
3
1
23
2
22
B0
B1
B2
B3
B DATA PORT
B4
B5
B6
B7
SAB SOURCE
SBA SOURCE
DATA SOURCE
SELECTION
INPUTS
GND = PIN 12
VCC = PIN 24
TRUTH TABLE
INPUTS
OEAB OEBA
CAB
CBA
H or L H or L
↑
↑
DATA I/O
SBA
X
X
X
X
Input
Input
Input
Input
Input
Input
Unspecified (2) Store A, Hold B
Output
Store A in both registers
L
L
H
H
X
H
H
H
↑
↑
H or L
↑
X
X (3)
X
X
L
L
X
L
H or L
↑
↑
↑
X
X
X
X (3)
L
L
L
L
X
X
X
H or L
X
X
H
H
H
H
X
H or L
X
X
H
L
H or L H or L
A0 THRU A7
B0 THRU B7
OPERATION OR FUNCTION
SAB
CD74FCT651
Isolation (Note 1)
Store A and B Data
CD74FCT652
Isolation (Note 1)
Store A and B Data
Store A, Hold B
Store A in both registers
Unspecified (2) Input
Output
Input
Hold A, Store B
Store B in both registers
Hold A, Store B
Store B in both registers
L
H
Output
Output
Input
Input
Real-Time B Data to A Bus Real-Time B Data to A Bus
Stored B Data to A Bus
Stored B Data to A Bus
L
H
X
X
Input
Input
Output
Output
Real-Time A Data to B Bus Real-Time A Data to B Bus
Stored A Data to B Bus
Stored A Data to B Bus
H
H
Output
Output
Stored A Data to B Bus
Stored B Data to A Bus
Stored A Data to B Bus
Stored B Data to A Bus
NOTES:
1. To prevent excess currents in the High-Z (isolation) modes, all I/O terminals should be terminated with 10kΩ to 1MΩ resistors.
2. The data output functions may be enabled or disabled by various signals at the OEAB or OEBA inputs. Data input functions are always
enabled, i.e., data at the bus pins will be stored on every low-to-high transition on the clock inputs.
3. Select control = L; clocks can occur simultaneously. Select control = H; clocks must be staggered in order to load both registers.
8-2
CD74FCT651, CD74FCT652
IEC Logic Symbol
CD74FCT651
21
3
22
2
23
1
3EN1
3EN2
G6
G7
>C4
>C5
1 ≥1 6
6
4
CD74FCT652
5D
21
3
22
2
23
1
1 ≥1 6
6
4D
7 ≥1
2
7
3EN1
3EN2
G6
G7
>C4
>C5
20
4
5D
4D
7 ≥1
2
7
20
5
19
5
19
6
18
6
7
8
9
10
18
17
16
15
14
7
17
8
16
9
15
10
14
11
13
11
13
8-3
CD74FCT651, CD74FCT652
Absolute Maximum Ratings
Thermal Information
DC Supply Voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 6V
DC Input Diode Current, IIK (For VI < -0.5V) . . . . . . . . . . . . . -20mA
DC Output Diode Current, IOK (for VO < -0.5V) . . . . . . . . . . . -50mA
DC Output Sink Current per Output Pin, IO . . . . . . . . . . . . . . . 70mA
DC Output Source Current per Output Pin, IO . . . . . . . . . . . . -30mA
DC VCC Current (ICC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140mA
DC Ground Current (IGND). . . . . . . . . . . . . . . . . . . . . . . . . . . 528mA
Thermal Resistance (Typical, Note 4)
θJA (oC/W)
PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
75
SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
75
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC
(SOIC-Lead Tips Only)
Operating Conditions
Operating Temperature Range (TA) . . . . . . . . . . . . . . . .0oC to 70oC
Supply Voltage Range, VCC . . . . . . . . . . . . . . . . . . . .4.75V to 5.25V
DC Input Voltage, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 to VCC
DC Output Voltage, VO . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 to ≤ VCC
Input Rise and Fall Slew Rate, dt/dv. . . . . . . . . . . . . . . . 0 to 10ns/V
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
4. θJA is measured with the component mounted on an evaluation PC board in free air.
Electrical Specifications Commercial Temperature Range 0oC to 70oC, VCC Max = 5.25V, VCC Min = 4.75V
AMBIENT TEMPERATURE (TA)
25oC
TEST CONDITIONS
PARAMETER
SYMBOL
VI (V)
IO (mA)
0oC TO 70oC
VCC (V)
MIN
MAX
MIN
MAX
UNITS
High Level Input Voltage
VIH
4.75 to
5.25
2
-
2
-
V
Low Level Input Voltage
VIL
4.75 to
5.25
-
0.8
-
0.8
V
High Level Output Voltage
VOH
VIH or VIL
-15
Min
2.4
-
2.4
-
V
Low Level Output Voltage
VOL
VIH or VIL
64
Min
-
0.55
-
0.55
V
High Level Input Current
IIH
VCC
Max
-
0.1
-
1
µA
Low Level Input Current
IIL
GND
Max
-
-0.1
-
-1
µA
IOZH
VCC
Max
-
0.5
-
10
µA
IOZL
GND
Max
-
-0.5
-
-10
µA
Input Clamp Voltage
VIK
VCC or
GND
Min
-
-1.2
-
-1.2
V
Short Circuit Output Current
(Note 5)
IOS
VO = 0
VCC or
GND
Max
-60
-
-60
-
mA
Quiescent Supply Current,
MSI
ICC
VCC or
GND
Max
-
8
-
80
µA
∆ICC
3.4V
(Note 6)
Max
-
1.6
-
1.6
mA
Three-State Leakage Current
Additional Quiescent Supply
Current per Input Pin
TTL Inputs High, 1 Unit Load
-18
0
NOTES:
5. Not more than one output should be shorted at one time. Test duration should not exceed 100ms.
6. Inputs that are not measured are at VCC or GND.
7. FCT Input Loading: All inputs are 1 unit load. Unit load is ∆ICC limit specified in Electrical Specifications table, e.g., 1.6mA Max. at 70oC.
8-4
CD74FCT651, CD74FCT652
Switching Specifications Over Operating Range FCT Series tr, tf = 2.5ns, CL = 50pF, RL (Figure 4)
PARAMETER
25oC
0oC TO 70oC
SYMBOL
VCC (V)
TYP
MIN
MAX
UNITS
Propagation Delays
Stored An → Bn
CD74FCT651
tPLH, tPHL
5
6.8
2
9
ns
Stored An → Bn
CD74FCT652
tPLH, tPHL
5
6.8
2
9
ns
Stored Bn → An
CD74FCT651
tPLH, tPHL
5
6.8
2
9
ns
Stored Bn → An
CD74FCT652
tPLH, tPHL
5
6.8
2
9
ns
An → Bn
CD74FCT651
tPLH, tPHL
5
6.8
2
9
ns
An → Bn
CD74FCT652
tPLH, tPHL
5
6.8
2
9
ns
Bn → An
CD74FCT651
tPLH, tPHL
5
6.8
2
9
ns
Bn → An
CD74FCT652
tPLH, tPHL
5
6.8
2
9
ns
Select to Data
CD74FCT651,
CD74FCT652
tPLH, tPHL
5
8.3
2
11
ns
Three-State Enabling Time,
Bus to Output or Register to Output
CD74FCT651,
CD74FCT652
tPZL, tPZH
5
7.5
2
10
ns
Three-State Disabling Time,
Bus to Output or Register to Output
CD74FCT651,
CD74FCT652
tPLZ, tPHZ
5
7.5
2
10
ns
CPD
(Note 8)
−
Minimum (Valley) VOHV During Switching of
Other Outputs (Output Under Test Not Switching)
VOHV
5
0.5 Typical at 25oC
V
Maximum (Peak) VOLP During Switching of
Other Outputs (Output Under Test Not Switching)
VOLP
5
1 Typical at 25oC
V
CI
-
-
-
10
pF
CI/O
-
-
-
15
pF
Power Dissipation Capacitance
Input Capacitance
Input/Output Capacitance
pF
NOTE:
8. CPD, measured per flip-flop, is used to determine the dynamic power consumption.
PD (per package) = VCC ICC + Σ(VCC2 fI CPD + VO2 fO CL + VCC ∆ICC D) where:
VCC = supply voltage
∆ICC = flow through current x unit load
CL = output load capacitance
D = duty cycle of input high
fO = output frequency
fI = input frequency
Prerequisite for Switching
25oC
PARAMETER
0oC TO 70oC
SYMBOL
VCC (V)
TYP
MIN
MAX
UNITS
fMAX
5
(Note 9)
-
85
-
MHz
tSU
5
-
4
-
ns
Data to Clock Hold Time
tH
5
-
2
-
ns
Clock Pulse Width
tW
5
-
6
-
ns
Maximum Frequency
Data to Clock Setup Time
NOTE:
9. 5V: Minimum is at 4.75V for 0oC to 70oC, Typical is at 5V.
8-5
Test Circuits and Waveforms
VCC
tr, tf = 2.5ns
(NOTE 10)
VI
3V
0
PULSE ZO
GEN
SWITCH POSITION
7V
500Ω
RL
V0
DUT
CL
50pF
RT
RT = ZO
500Ω
RL
10. Pulse Generator for All Pulses: Rate ≤ 1.0MHz; ZOUT ≤ 50Ω;
tf, tr ≤ 2.5ns.
FIGURE 1. TEST CIRCUIT
tPLZ, tPZL, Open Drain
Closed
tPHZ, tPZH, tPLH, tPHL
Open
3V
1.5V
0V
DATA
INPUT
tH
3V
1.5V
0V
TIMING
INPUT
tREM
ASYNCHRONOUS CONTROL
SWITCH
DEFINITIONS:
CL = Load capacitance, includes jig and probe
capacitance.
RT = Termination resistance, should be equal to ZOUT of
the Pulse Generator.
VIN = 0V to 3V.
Input: tr = tf = 2.5ns (10% to 90%), unless otherwise specified
NOTE:
tSH
TEST
3V
1.5V
0V
LOW-HIGH-LOW
PULSE
1.5V
tW
SYNCHRONOUS CONTROL
PRESET CLEAR
CLOCK ENABLE
ETC.
3V
1.5V
0V
tH
tSH
HIGH-LOW-HIGH
PULSE
FIGURE 2. SETUP, HOLD, AND RELEASE TIMING
ENABLE
1.5V
FIGURE 3. PULSE WIDTH
DISABLE
3V
3V
SAME PHASE
INPUT TRANSITION
1.5V
CONTROL INPUT
0V
3.5V
OUTPUT
NORMALLY LOW
SWITCH
CLOSED
SWITCH
OPEN
tPHL
3.5V
VOH
1.5V
1.5V
VOL
OUTPUT
0.3V
tPZH
OUTPUT
NORMALLY HIGH
tPLH
tPLZ
tPZL
1.5V
tPHZ
0.3V
VOL
tPLH
tPHL
VOH
3V
OPPOSITE PHASE
INPUT TRANSITION
1.5V
0V
0V
0V
1.5V
0V
FIGURE 4. ENABLE AND DISABLE TIMING
FIGURE 5. PROPAGATION DELAY
8-6
Test Circuits and Waveforms
(Continued)
VOH
OTHER
OUTPUTS
VOL
VOH
OUTPUT
UNDER
TEST
VOHV
VOLP
VOL
NOTES:
11. VOLP is measured with respect to a ground reference near the output under test. VOHV is measured with respect to VOH.
12. Input pulses have the following characteristics:
PRR ≤ 1MHz, tr = 2.5ns, tf = 2.5ns, skew 1ns.
13. R.F. fixture with 700MHz design rules required. IC should be soldered into test board and bypassed with 0.1µF capacitor. Scope and
probes require 700MHz bandwidth.
FIGURE 6. SIMULTANEOUS SWITCHING TRANSIENT WAVEFORMS
8-7
PACKAGE OPTION ADDENDUM
www.ti.com
7-Jun-2010
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
CD74FCT651EN
OBSOLETE
PDIP
NT
24
TBD
Call TI
Call TI
Samples Not Available
CD74FCT651M
OBSOLETE
SOIC
DW
24
TBD
Call TI
Call TI
Samples Not Available
CD74FCT652EN
OBSOLETE
PDIP
NT
24
TBD
Call TI
Call TI
Samples Not Available
CD74FCT652M
OBSOLETE
SOIC
DW
24
TBD
Call TI
Call TI
Samples Not Available
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
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Addendum-Page 1
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