CYStech Electronics Corp. Spec. No. : C320A3 Issued Date : 2007.11.06 Revised Date : Page No. : 1/7 N-CHANNEL MOSFET MTN7000ZHA3 Description The MTN7000ZHA3 is a N-channel enhancement-mode MOSFET. Features • Low on-resistance • High ESD • High speed switching • Low-voltage drive(4V) • Easily designed drive circuits • Easy to use in parallel • Pb-free package Symbol Outline MTN7000ZHA3 D TO-92 G S MTN7002ZHA3 G：Gate S：Source D：Drain SGD CYStek Product Specification CYStech Electronics Corp. Spec. No. : C320A3 Issued Date : 2007.11.06 Revised Date : Page No. : 2/7 Absolute Maximum Ratings (Ta=25°C) Parameter Drain-Source Voltage Gate-Source Voltage Drain Current Drain Reverse Current Symbol VDSS Limits 60 ±20 115 700 115 700 400 +150 -55~+150 VGSS ID IDP IDR IDRP PD TCH Tstg Continuous Pulsed Continuous Pulsed Total Power Dissipation Channel Temperature Storage Temperature *1 *1 *1 Unit V V mA mA mA mA mW °C °C Note : *1. Pulse Width ≤ 300μs, Duty cycle ≤2% Electrical Characteristics (Ta=25°C) Symbol Min. Typ. Max. BVDSS* 60 VGS(th) 1 2.5 IGSS ±10 IDSS 1 3.6 5.5 RDS(ON)* 3 5 GFS 100 Ciss 7.32 Coss 3.42 Crss 7.63 - Unit V V μA μA mS Test Conditions VGS=0, ID=10μA VDS=VGS, ID=250μA VGS=±20V, VDS=0 VDS=60V, VGS=0 ID=100mA, VGS=5V ID=100mA, VGS=10V VDS=10V, ID=100mA pF VDS=10V, VGS=0, f=1MHz Ω *Pulse Test : Pulse Width ≤380μs, Duty Cycle≤2% Ordering Information Device MTN7000ZHA3 MTN7002ZHA3 Package TO-92 (Pb-free) Shipping Marking 2000 pcs / Tape & Box 7000 CYStek Product Specification Spec. No. : C320A3 Issued Date : 2007.11.06 Revised Date : Page No. : 3/7 CYStech Electronics Corp. Characteristic Curves Typical Output Characteristics Typical Transfer Characteristics 0.3 0.3 4V 6V 0.2 0.15 VDS=10V 0.25 3.5V Drain Current -ID(A) Drain Current - ID(A) 0.25 3V 0.1 0.2 0.15 0.1 0.05 0.05 VGS=2.2V 0 0 0 1 2 3 Drain-Source Voltage -VDS(V) 0 4 4 Static Drain-Source On-State resistance vs Drain Current Static Drain-Source On-State resistance vs Drain Current 10 10 Static Drain-Source On-State Resistance-RDS(on)(Ω) Static Drain-Source On-State Resistance-RDS(on)(Ω) VGS=5V VGS=10V 1 1 0.01 0.1 Drain Current-ID(A) 0.01 1 0.1 1 Drain Current-ID(A) Static Drain-Source On-State Resistance vs Gate-Source Voltage Reverse Drain Current vs Source-Drain Voltage 10 Source-Drain Voltage-VSD(V) 7 Static Drain-Source On-State Resistance-RDS(ON)(Ω) 1 2 3 Gate-Source Voltage-VGS(V) 6 5 4 ID=100mA 3 ID=50mA 2 1 1 0.1 0.01 0.001 0 0 MTN7002ZHA3 5 10 15 20 Gate-Source Voltage-VGS(V) 25 0 0.2 0.4 0.6 0.8 Reverse Drain Current -IDR(A) 1 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C320A3 Issued Date : 2007.11.06 Revised Date : Page No. : 4/7 Characteristic Curves(Cont.) Power Derating Curve Capacitance vs Drain-to-Source Voltage 450 100 10 Power Dissipation---PD(mW) Capacitance---(pF) 400 Crss Ciss 350 300 250 200 150 100 50 C oss 0 1 0.1 MTN7002ZHA3 1 10 Drain-Source Voltage -VDS(V) 100 0 50 100 150 Ambient Temperature---TA(℃) 200 CYStek Product Specification Spec. No. : C320A3 Issued Date : 2007.11.06 Revised Date : Page No. : 5/7 CYStech Electronics Corp. TO-92 Taping Outline H2 H2A H2A H2 D2 A L H3 H4 H L1 H1 D1 F1F2 T2 T T1 DIM A D D1 D2 F1,F2 F1,F2 H H1 H2 H2A H3 H4 L L1 P P1 P2 T T1 T2 W W1 - MTN7002ZHA3 P1 P Item Component body height Tape Feed Diameter Lead Diameter Component Body Diameter Component Lead Pitch F1-F2 Height Of Seating Plane Feed Hole Location Front To Rear Deflection Deflection Left Or Right Component Height Feed Hole To Bottom Of Component Lead Length After Component Removal Lead Wire Enclosure Feed Hole Pitch Center Of Seating Plane Location 4 Feed Hole Pitch Over All Tape Thickness Total Taped Package Thickness Carrier Tape Thickness Tape Width Adhesive Tape Width 20 pcs Pitch W1 W D P2 Millimeters Min. 4.33 3.80 0.36 4.33 2.40 15.50 8.50 2.50 12.50 5.95 50.30 0.36 17.50 5.00 253 Max. 4.83 4.20 0.53 4.83 2.90 ±0.3 16.50 9.50 1 1 27 21 11 12.90 6.75 51.30 0.55 1.42 0.68 19.00 7.00 255 CYStek Product Specification Spec. No. : C320A3 Issued Date : 2007.11.06 Revised Date : Page No. : 6/7 CYStech Electronics Corp. TO-92 Dimension Marking: α2 A Product Name N7000Z B □□ 1 2 3 Date Code: Year+Month Year: 4→2004, 5→2005 α3 Month: 1→1, 2→2, ‧‧‧, C D 9→9, A→10, B→11, C→12 H I G α1 Style: Pin 1.Source E F 2.Gate 3.Drain 3-Lead TO-92 Plastic Package CYStek Package Code: A3 *: Typical Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480 DIM A B C D E F Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76 DIM G H I α1 α2 α3 Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5° *2° *2° Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5° *2° *2° Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: 42 Alloy ; solder plating • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Recommended wave soldering condition Product Pb-free devices MTN7002ZHA3 Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds CYStek Product Specification CYStech Electronics Corp. Spec. No. : C320A3 Issued Date : 2007.11.06 Revised Date : Page No. : 7/7 Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6 minutes max. 6°C/second max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. MTN7002ZHA3 CYStek Product Specification