TI THS7319IZSVT

THS7319
www.ti.com.............................................................................................................................................................. SBOS468A – JUNE 2009 – REVISED JULY 2009
3-Channel, Very Low Power Video Amplifiers with EDTV Filters and 6-dB Gain
FEATURES
DESCRIPTION
1
• Very Low Total Quiescent Current:
3.4 mA at 3.3 V
• 0.15-µA Total Disabled Supply Current
• Third-Order Butterworth Low-Pass Filters:
–1 dB at 17 MHz
–3 dB at 20 MHz
21-dB Attenuation at 43 MHz
Supports 480p/576p Y’P’BP’R or R’G’B’ Video
Supports CVBS, S-Video, 480i/576i Y’P’BP’R, or
Y’U’V’ in Oversampled Systems
• DC-Coupled Input with 150-mV Output Shift
• Built-in 6-dB Gain (2 V/V)
• +2.6-V to +5-V Single-Supply Operation
• Rail-to-Rail Output Allows AC or DC Output
Coupling
• Low Differential Gain/Phase of 0.05%/0.03°
• Ultra-Small, MicrostarCSP™ 9-Ball Package
– Tiny PCB Area: 1,5 mm × 1,5 mm
– Very Low Profile Height: 0,45 mm (max)
Fabricated using the revolutionary, complementary
Silicon-Germanium (SiGe) BiCom3X process, the
THS7319 is a very low-power, 2.6-V to 5-V
single-supply, three-channel, integrated filter video
buffer. This device is ideal for battery-powered
applications where size and power are critical
parameters. Total quiescent current is only 3.4 mA at
3.3 V and can be reduced to 0.15 µA while disabled.
23
The THS7319 incorporates three enhanced definition
(ED) filter channels with third-order Butterworth
characteristics. These filters are useful as
digital-to-analog converter (DAC) reconstruction filters
or as analog-to-digital converter (ADC) anti-aliasing
filters supporting 480p/576p Y’P’BP’R and R'G'B'
video. The THS7319 is also ideal for oversampled
systems that produce standard-definition (SD) signals
including CVBS, S-Video, 480i/576i Y’P’BP’R, Y’U’V’,
and R’G’B’.
The THS7319 is designed for dc-coupled inputs. To
mitigate any DAC/encoder termination interaction, the
input impedance is a very high 2.4 MΩ. The 150-mV
output level shift allows for a full sync dynamic range
at the output with a 0-V input that prevents sync
crushing. The rail-to-rail output stage supports both
ac and dc line driving.
APPLICATIONS
•
•
•
•
Personal Media Players
Digital Cameras
Cellular Phone Video Output Buffering
USB/Portable Low-Power Video Buffering
The THS7319 is offered in a RoHS-compliant
ultra-small MicrostarCSP 9-ball package.
Level
Shift
3-Pole
20-MHz
75 W
x1
Channel 1
Out 1
6 dB
LPF
75 W
DAC/Encoder
R
Level
Shift
3-Pole
20-MHz
75 W
x1
Channel 2
Out 2
6 dB
LPF
75 W
R
Level
Shift
x1
Channel 3
3-Pole
20-MHz
75 W
Out 3
6 dB
LPF
75 W
R
+2.6 V to +5 V
Enable
Single-Supply DC-Input/DC-Output Coupled Video Line Driver
1
2
3
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
MicrostarCSP is a trademark of Texas Instruments, Incorporated.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2009, Texas Instruments Incorporated
THS7319
SBOS468A – JUNE 2009 – REVISED JULY 2009.............................................................................................................................................................. www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION (1)
PRODUCT
PACKAGE-LEAD
THS7319IZSVT
MicrostarCSP
9-Ball
THS7319IZSVR
(1)
(2)
PACKAGE
DESIGNATOR
ZSV
TRANSPORT MEDIA,
QUANTITY
Small Tape and Reel, 250
Tape and Reel, 3000
ECO STATUS (2)
Pb-Free, Green
For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
These packages conform to Lead (Pb)-free and green manufacturing specifications. Additional details including specific material content
can be accessed at www.ti.com/leadfree.
GREEN: TI defines Green to mean Lead (Pb)-Free and in addition, uses less package materials that do not contain halogens, including
bromine (Br), or antimony (Sb) above 0.1% of total product weight. N/A: Not yet available Lead (Pb)-Free; for estimated conversion
dates, go to www.ti.com/leadfree. Pb-FREE: TI defines Lead (Pb)-Free to mean RoHS compatible, including a lead concentration that
does not exceed 0.1% of total product weight, and, if designed to be soldered, suitable for use in specified lead-free soldering
processes.
ABSOLUTE MAXIMUM RATINGS (1)
Over operating free-air temperature range, unless otherwise noted.
THS7319
UNIT
5.5
V
Supply voltage, VS+ to GND
Input voltage, VI
–0.4 to VS+
V
±75
mA
Output current, IO
Continuous power dissipation
See Dissipation Ratings Table
Maximum junction temperature, any condition
(2)
, TJ
+150
°C
+125
°C
–65 to +150
°C
Human body model (HBM)
2000
V
Charge device model (CDM)
1000
V
Machine model (MM)
200
V
Maximum junction temperature, continuous operation, long-term reliability (3), TJ
Storage temperature range, TSTG
ESD rating:
(1)
(2)
(3)
Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
The absolute maximum junction temperature under any condition is limited by the constraints of the silicon process.
The absolute maximum junction temperature for continuous operation is limited by the package constraints. Operation above this
temperature may result in reduced reliability and/or lifetime of the device.
DISSIPATION RATINGS
PACKAGE
MicrostarCSP 9-Ball
(ZSV)
(1)
(2)
2
θJC
(°C/W)
100
θJA
(°C/W)
250
(2)
POWER RATING (1)
(TJ = +125°C)
AT TA = +25°C
AT TA = +85°C
400 mW
160 mW
Power rating is determined with a junction temperature of +125°C. This temperature is the point where performance starts to degrade
and long-term reliability starts to be reduced. Thermal management of the final printed circuit board (PCB) should strive to keep the
junction temperature at or below +125°C for best performance and reliability.
These data were measured with the JEDEC High-K test PCB. For the JEDEC low-K test PCB, θJA is +550°C/W.
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RECOMMENDED OPERATING CONDITIONS
MIN
NOM
MAX
UNIT
Supply voltage, VS+
2.6
5
V
Ambient temperature, TA
–40
+85
°C
ELECTRICAL CHARACTERISTICS: VS+ = +3.3 V
At TA = +25°C, load = 150 Ω || 6.2 pF to GND, and dc-coupled input/output, unless otherwise noted.
THS7319
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
TEST
LEVEL (1)
AC PERFORMANCE
–0.1 dB; relative to 1 MHz
Passband bandwidth
–3-dB bandwidth
Normalized stop band gain
Group delay
Group delay variation
11
MHz
C
±1 dB; relative to 1 MHz
14
17
MHz
A
Relative to 1 MHz
17
20
MHz
B
f = 43 MHz, relative to 1 MHz
–21
dB
A
f = 54 MHz, relative to 1 MHz
–27
dB
C
f = 100 kHz
19
ns
C
f = 11 MHz, relative to 1 MHz
4
ns
C
0.3
ns
C
NTSC/PAL
0.05
%
C
Channel-to-channel delay
Differential gain
Differential phase
–12
NTSC/PAL
0.03
°
C
f = 1 MHz, VO = 2 VPP
–81
dB
C
100 kHz to 13.5 MHz, non-weighted
69
dB
C
100 kHz to 13.5 MHz, unified weighting
79
dB
C
Rise/fall time
VOUT = 2-V step
20
ns
C
Slew rate
VOUT = 2-V step
80
V/µs
C
f = 12 MHz
1.3
Ω
C
Total harmonic distortion
Signal-to-noise ratio
Output impedance
Crosstalk
f = 12 MHz, return loss
41
dB
C
Disabled
20 || 3
kΩ || pF
C
f = 5 MHz
–54
dB
C
DC PERFORMANCE
Biased output voltage
Input voltage range
VIN = 0 V
110
Linear dc input, limited by output
Input bias current
–1000
Input resistance
(1)
250
–130
–40
2.4 || 2
Voltage gain
Gain matching
150
–0.06/1.5
Channel-to-channel
mV
A
V
C
nA
A
MΩ || pF
C
1.99
2.01
2.03
V/V
A
–1
±0.14
+1
%
A
Test levels: (A) 100% tested at +25°C. Over temperature limits set by characterization and simulation. (B) Limits set by characterization
and simulation only. (C) Typical value only for information.
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THS7319
SBOS468A – JUNE 2009 – REVISED JULY 2009.............................................................................................................................................................. www.ti.com
ELECTRICAL CHARACTERISTICS: VS+ = +3.3 V (continued)
At TA = +25°C, load = 150 Ω || 6.2 pF to GND, and dc-coupled input/output, unless otherwise noted.
THS7319
PARAMETER
TYP
MAX
UNIT
TEST
LEVEL (1)
TEST CONDITIONS
MIN
High output voltage swing
RL = 150 Ω to GND
2.85
3.1
V
A
Low output voltage swing
RL = 150 Ω to GND
0.01
V
C
Short-circuit
70
mA
C
OUTPUT CHARACTERISTICS
Output current
POWER SUPPLY
Operating voltage
Total quiescent current, no load
Enable pin = 3.3 V, no load, VIN = 0 V
2.5
3.3
5.5
V
B
2.7
3.4
4.5
mA
A
0.15
1
µA
A
dB
A
Enable pin = 0 V, no load, VIN = 0 V
Power-supply rejection ratio
(PSRR)
At dc
46
51
VIH
Enabled
2
1.8
V
A
VIL
Disabled
0.7
0.65
V
A
IIH
Enable pin = 3.3 V
0.1
1
µA
A
IIL
Enable pin = 0 V
0.1
1
LOGIC CHARACTERISTICS (2)
µA
A
Disable time
80
ns
C
Enable time
100
ns
C
(2)
4
The logic input pin (Enable pin) should not be left floating. It must be connected to logic low (or GND) or logic high (or VS+).
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THS7319
www.ti.com.............................................................................................................................................................. SBOS468A – JUNE 2009 – REVISED JULY 2009
PIN CONFIGURATION
ZSV PACKAGE
MicrostarCSP 9-BALL
(TOP VIEW)
1
2
3
Ch 1 IN
GND
Ch 1 OUT
ZSV PACKAGE
MicrostarCSP 9-BALL
(TOP VIEW)
Device Code
NXN
YM
A
Ch 2 IN
EN
Ch 2 OUT
Ch 3 IN
VS+
Ch 3 OUT
B
Year and Month
of Assembly
Pin A1 Index
C
Table 1. TERMINAL FUNCTIONS
TERMINAL
NAME
NO.
I/O
Channel 1 Input
A1
I
Video input, channel 1
DESCRIPTION
GND
A2
I
Ground pin for all internal circuitry
Channel 1 Output
A3
O
Video output, channel 1
Channel 2 Input
B1
I
Video input, channel 2
Enable
B2
I
Enable pin. Logic high enables the THS7319; logic low disables the THS7319.
This pin must not be left floating.
Channel 2 Output
B3
O
Video output, channel 2
Channel 3 Input
C1
I
Video Input, channel 3
VS+
C2
I
Positive power-supply pin; connect to +2.6 V or +5 V.
Channel 3 Output
C3
O
Video output, channel 3
FUNCTIONAL BLOCK DIAGRAM
3-Pole
20-MHz
Level
Shift
Channel 1 Input
x1
LPF
x1
LPF
Level
Shift
Channel 3 Input
Channel 1 Output
6 dB
Channel 2 Output
6 dB
Channel 3 Output
3-Pole
20-MHz
Level
Shift
Channel 2 Input
6 dB
3-Pole
20-MHz
x1
LPF
VS+
Enable
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THS7319
SBOS468A – JUNE 2009 – REVISED JULY 2009.............................................................................................................................................................. www.ti.com
TYPICAL CHARACTERISTICS
3-Pole
20-MHz
Level
Shift
x1
6 dB
LPF
R
x1
150 W
CLOAD
150 W
CLOAD
150 W
6 dB
LPF
R
RSOURCE
CLOAD
3-Pole
20-MHz
Level
Shift
3-Pole
20-MHz
Level
Shift
VSOURCE
x1
VBIAS
+
-
6 dB
LPF
R
0.1 mF
Enable
+
100 mF
+VS
Figure 1. Standard Test Circuit
Table of Graphs: VS+ = 2.6 V
TITLE
Signal Gain vs Frequency
FIGURE
Figure 2, Figure 3
Phase vs Frequency
Figure 4
Group Delay vs Frequency
Figure 5
Small-Signal Frequency Response vs Capacitive Loading
Figure 6
Crosstalk vs Frequency
Figure 7
Second-Order Harmonic Distortion vs Frequency
Figure 8
Third-Order Harmonic Distortion vs Frequency
Figure 9
Small-Signal Pulse Responses vs Time
Figure 10
Large-Signal Pulse Responses vs Time
Figure 11
Slew Rate vs Output Voltage
Figure 12
Enable/Disable Response vs Time
Figure 13
6
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Table of Graphs: VS+ = 3.3 V
TITLE
Signal Gain vs Frequency
FIGURE
Figure 14, Figure 15
Phase vs Frequency
Figure 16
Group Delay vs Frequency
Figure 17
Small-Signal Frequency Response vs Capacitive Loading
Figure 18
Crosstalk vs Frequency
Figure 19
Second-Order Harmonic Distortion vs Frequency
Figure 20
Third-Order Harmonic Distortion vs Frequency
Figure 21
Small-Signal Pulse Responses vs Time
Figure 22
Large-Signal Pulse Responses vs Time
Figure 23
Slew Rate vs Output Voltage
Figure 24
Enable/Disable Response vs Time
Figure 25
Input Bias Current vs Temperature
Figure 26
Output Offset Voltage vs Temperature
Figure 27
Maximum Output Voltage vs Temperature
Figure 28
Attenuation at 14 MHz vs Temperature
Figure 29
Attenuation at 43 MHz vs Temperature
Figure 30
Table of Graphs: VS+ = 5 V
TITLE
Signal Gain vs Frequency
FIGURE
Figure 31, Figure 32
Phase vs Frequency
Figure 33
Group Delay vs Frequency
Figure 34
Small-Signal Frequency Response vs Capacitive Loading
Figure 35
Crosstalk vs Frequency
Figure 36
Second-Order Harmonic Distortion vs Frequency
Figure 37
Third-Order Harmonic Distortion vs Frequency
Figure 38
Small-Signal Pulse Responses vs Time
Figure 39
Large-Signal Pulse Responses vs Time
Figure 40
Slew Rate vs Output Voltage
Figure 41
Enable/Disable Response vs Time
Figure 42
Table of Graphs: General
TITLE
Differential Gain vs Supply Voltage
FIGURE
Figure 43, Figure 44
Total Quiescent Current vs Temperature
Figure 45
Output Impedance vs Frequency
Figure 46
S22 Output Reflection Ratio vs Frequency
Figure 47
Disabled Output Impedance vs Frequency
Figure 48
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THS7319
SBOS468A – JUNE 2009 – REVISED JULY 2009.............................................................................................................................................................. www.ti.com
TYPICAL CHARACTERISTICS: VS+ = 2.6 V
At TA = +25°C, load = 150 Ω || 6.2 pF to GND, and dc-coupled input/output, unless otherwise noted.
SIGNAL GAIN vs FREQUENCY
SIGNAL GAIN vs FREQUENCY
10
6.5
VS+ = 2.6 V
Input Bias = 0.5 VDC
VOUT = 0.2 VPP to 2 VPP
6.0
5.5
-10
-20
Signal Gain (dB)
Signal Gain (dB)
0
VOUT = 0.2 VPP
-30
-40
4.5
4.0
3.5
VOUT = 2 VPP
-50
5.0
VS+ = 2.6 V
Input Bias = 0.5 VDC
3.0
VOUT = 1 VPP
-60
2.5
1M
10M
1G
100M
1M
Frequency (Hz)
Figure 2.
Figure 3.
PHASE vs FREQUENCY
GROUP DELAY vs FREQUENCY
45
30
VS+ = 2.6 V
VOUT = 200 mVPP
Input Bias = 0.5 VDC
0
25
Group Delay (ns)
-45
Phase (°)
-90
-135
-180
-225
-270
-315
VS+ = 2.6 V
VOUT = 200 mVPP
Input Bias = 0.5 VDC
-360
100k
20
15
10
5
1M
10M
100M
1M
Frequency (Hz)
Figure 4.
Figure 5.
SMALL-SIGNAL FREQUENCY RESPONSE
vs CAPACITIVE LOADING
CROSSTALK vs FREQUENCY
10
-20
0
CL = 10 pF
Crosstalk (dB)
Signal Gain (dB)
-10
-20
CL = 6.2 pF
-30
VS+ = 2.6 V
Load = 150 W || CL
VOUT = 200 mVPP
Input Bias = 0.5 VDC
Channel 1 or 2
Into Channel 3
-40
Channel 1 or 3
Into Channel 2
-50
-60
-70
Channel 2 or 3
Into Channel 1
CL = 18 pF
-80
-60
1M
8
VS+ = 2.6 V
Input-Referred
-30
CL = Stray (2 pF)
-50
100 M
10 M
Frequency (Hz)
-40
100 M
10 M
Frequency (Hz)
10M
100M
1G
1M
10 M
Frequency (Hz)
Frequency (Hz)
Figure 6.
Figure 7.
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TYPICAL CHARACTERISTICS: VS+ = 2.6 V (continued)
At TA = +25°C, load = 150 Ω || 6.2 pF to GND, and dc-coupled input/output, unless otherwise noted.
-40
THIRD-ORDER HARMONIC DISTORTION
vs FREQUENCY
VS+ = 2.6 V
Input Bias = 0.5 VDC
-50
-60
VOUT = 2 VPP
-70
VOUT = 1 VPP
-40
Third-Order Harmonic Distortion (dBc)
Second-Order Harmonic Distortion (dBc)
SECOND-ORDER HARMONIC DISTORTION
vs FREQUENCY
VOUT = 0.5 VPP
-80
-90
VOUT = 0.25 VPP
-100
VS+ = 2.6 V
Input Bias = 0.5 VDC
-50
-60
VOUT = 0.5 VPP
-70
VOUT = 2 VPP
-80
VOUT = 0.25 VPP
-90
VOUT = 1 VPP
-100
1M
10 M
1M
10 M
Frequency (Hz)
Frequency (Hz)
Figure 8.
Figure 9.
SMALL-SIGNAL PULSE RESPONSES vs TIME
1.5
LARGE-SIGNAL PULSE RESPONSES vs TIME
4.5
0.6
1.5
Input tR/tF = 70 ns
Input tR/tF = 70 ns
3.5
0.4
Input tR/tF = 70 ns
1.2
0.3
Input tR/tF = 1 ns
1.1
0
50
Input Voltage Waveforms
2.5
-0.5
Input tR/tF = 70 ns
1.5
-1.5
Input tR/tF = 1 ns
0.2
0.5
0.1
400
-0.5
-2.5
Output Voltage Waveforms
VS+ = 2.6 V
1.0
-50
0.5
Input tR/tF = 1 ns
100
150
200
300
250
350
VS+ = 2.6 V
-50
0
Output Voltage Waveforms
50
100
Time (ns)
200
250
300
350
-3.5
400
Figure 11.
SLEW RATE vs OUTPUT VOLTAGE
ENABLE/DISABLE RESPONSE vs TIME
100
1.4
VS = 2.6 V
Positive and Negative Slew Rate
3
VS+ = 2.6 V
Enable Input Voltage
1.2
2
Output Voltage (V)
60
40
1.0
1
Disabled
0.8
0
0.6
-1
0.4
-2
Output Voltage
0.2
-3
0
-4
20
-0.2
0
1.0
1.5
2.0
Enable Input Voltage (V)
Enabled
80
Slew Rate (V/ms)
150
Time (ns)
Figure 10.
0.5
Input Voltage (V)
Input Voltage Waveforms
1.3
Output Voltage (V)
0.5
Input tR/tF = 1 ns
Input Voltage (V)
Output Voltage (V)
1.4
-5
-50
Output Voltage (VPP)
50
150
250
350
450
550
650
Time (ns)
Figure 12.
Figure 13.
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TYPICAL CHARACTERISTICS: VS+ = 3.3 V
At TA = +25°C, load = 150 Ω || 6.2 pF to GND, and dc-coupled input/output, unless otherwise noted.
SIGNAL GAIN vs FREQUENCY
10
VS+ = 3.3 V
Input Bias = 0.65 VDC
0
VOUT = 0.2 VPP to 2.5 VPP
6.0
5.5
-10
Signal Gain (dB)
Signal Gain (dB)
SIGNAL GAIN vs FREQUENCY
6.5
VOUT = 0.2 VPP
-20
-30
VOUT = 2.5 VPP
-40
5.0
4.5
4.0
3.5
VOUT = 2 VPP
-50
VS+ = 3.3 V
Input Bias = 0.65 VDC
3.0
VOUT = 1 VPP
-60
2.5
1M
10M
1G
100M
1M
Frequency (Hz)
Figure 14.
Figure 15.
PHASE vs FREQUENCY
GROUP DELAY vs FREQUENCY
45
30
VS+ = 3.3 V
VOUT = 200 mVPP
Input Bias = 0.65 VDC
0
25
Group Delay (ns)
-45
Phase (°)
-90
-135
-180
-225
-270
-315
VS+ = 3.3 V
VOUT = 200 mVPP
Input Bias = 0.65 VDC
-360
100k
20
15
10
5
1M
10M
100M
1M
Frequency (Hz)
Figure 16.
Figure 17.
SMALL-SIGNAL FREQUENCY RESPONSE
vs CAPACITIVE LOADING
CROSSTALK vs FREQUENCY
10
-20
0
CL = 10 pF
Crosstalk (dB)
Signal Gain (dB)
-10
-20
CL = 6.2 pF
-30
VS+ = 3.3 V
Load = 150 W || CL
VOUT = 200 mVPP
Input Bias = 0.65 VDC
Channel 1 or 2
Into Channel 3
-40
Channel 1 or 3
Into Channel 2
-50
-60
-70
Channel 2 or 3
Into Channel 1
CL = 18 pF
-80
-60
1M
10
VS+ = 3.3 V
Input-Referred
-30
CL = Stray (2 pF)
-50
100 M
10 M
Frequency (Hz)
-40
100 M
10 M
Frequency (Hz)
10M
100M
1G
1M
10 M
Frequency (Hz)
Frequency (Hz)
Figure 18.
Figure 19.
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TYPICAL CHARACTERISTICS: VS+ = 3.3 V (continued)
At TA = +25°C, load = 150 Ω || 6.2 pF to GND, and dc-coupled input/output, unless otherwise noted.
-40
THIRD-ORDER HARMONIC DISTORTION
vs FREQUENCY
VS+ = 3.3 V
Input Bias = 0.65 VDC
-50
VOUT = 1 VPP
VOUT = 2.5 VPP
-60
VOUT = 2 VPP
VOUT = 0.5 VPP
-40
Third-Order Harmonic Distortion (dBc)
Second-Order Harmonic Distortion (dBc)
SECOND-ORDER HARMONIC DISTORTION
vs FREQUENCY
-70
-80
-90
VOUT = 0.25 VPP
VS+ = 3.3 V
Input Bias = 0.65 VDC
-50
VOUT = 0.25 VPP
-60
VOUT = 0.5 VPP
-70
VOUT = 2.5 VPP
-80
VOUT = 2 VPP
-90
VOUT = 1 VPP
-100
-100
1M
10 M
1M
10 M
Frequency (Hz)
Frequency (Hz)
Figure 20.
Figure 21.
SMALL-SIGNAL PULSE RESPONSES vs TIME
1.8
LARGE-SIGNAL PULSE RESPONSES vs TIME
0.75
4.5
1.65
Input tR/tF = 70 ns
Input tR/tF = 70 ns
3.5
0.55
Input tR/tF = 70 ns
1.5
0.45
Input tR/tF = 1 ns
1.4
VS+ = 3.3 V
50
-0.35
Input tR/tF = 70 ns
1.5
-1.35
Input tR/tF = 1 ns
-2.35
Output Voltage Waveforms
Output Voltage Waveforms
1.3
0
Input Voltage Waveforms
2.5
0.5
0.35
-50
0.65
Input tR/tF = 1 ns
100
150
200
250
300
350
VS+ = 3.3 V
-0.5
0.25
400
-50
0
50
100
150
200
250
300
350
-3.35
400
Time (ns)
Time (ns)
Figure 22.
Figure 23.
SLEW RATE vs OUTPUT VOLTAGE
ENABLE/DISABLE RESPONSE vs TIME
100
4
1.6
VS = 3.3 V
Positive and Negative Slew Rates
VS+ = 3.3 V
Enable Input Voltage
3
1.4
Enabled
2
Output Voltage (V)
1.2
60
40
1
1.0
Disabled
0.8
0
0.6
-1
-2
0.4
Output Voltage
20
0.2
-3
0
-4
0
-0.2
0.5
1.0
1.5
2.0
2.5
Enable Input Voltage (V)
80
Slew Rate (V/ms)
Input Voltage (V)
Input Voltage Waveforms
1.6
Output Voltage (V)
0.65
Input tR/tF = 1 ns
Input Voltage (V)
Output Voltage (V)
1.7
-5
-50
Output Voltage (VPP)
50
150
250
350
450
550
650
Time (ns)
Figure 24.
Figure 25.
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TYPICAL CHARACTERISTICS: VS+ = 3.3 V (continued)
At TA = +25°C, load = 150 Ω || 6.2 pF to GND, and dc-coupled input/output, unless otherwise noted.
INPUT BIAS CURRENT vs TEMPERATURE
OUTPUT OFFSET VOLTAGE vs TEMPERATURE
153
-100
VS+ = 3.3 V
VS+ = 3.3 V
Output Offset Voltage (mV)
Input Bias Current (nA)
-110
-120
-130
-140
-150
-160
152
151
150
149
148
147
-40
-15
10
35
60
85
10
-15
-40
Ambient Temperature (°C)
Figure 26.
60
85
Figure 27.
MAXIMUM OUTPUT VOLTAGE vs TEMPERATURE
ATTENUATION AT 14 MHz vs TEMPERATURE
3.3
0.9
VS+ = 3.3 V
VS+ = 3.3 V
RLOAD = 150 W
0.8
Attenuation at 14 MHz (dB)
Maximum Output Voltage (V)
35
Ambient Temperature (°C)
3.2
3.1
3.0
0.7
0.6
0.5
0.4
0.3
0.2
0.1
2.9
0
-40
-15
10
35
60
85
10
-15
-40
35
Ambient Temperature (°C)
Ambient Temperature (°C)
Figure 28.
Figure 29.
60
85
ATTENUATION AT 43 MHz vs TEMPERATURE
25
Attenuation at 43 MHz (dB)
VS+ = 3.3 V
24
23
22
21
20
19
18
-40
-15
10
35
60
85
Ambient Temperature (°C)
Figure 30.
12
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TYPICAL CHARACTERISTICS: VS+ = 5 V
At TA = +25°C, load = 150 Ω || 6.2 pF to GND, and dc-coupled input/output, unless otherwise noted.
SIGNAL GAIN vs FREQUENCY
10
VS+ = 5 V
Input Bias = 1 VDC
0
VOUT = 0.2 VPP to 2.5 VPP
6.0
5.5
-10
-20
Signal Gain (dB)
Signal Gain (dB)
SIGNAL GAIN vs FREQUENCY
6.5
VOUT = 0.2 VPP
-30
VOUT = 2.5 VPP
-40
5.0
4.5
4.0
3.5
VOUT = 2 VPP
-50
VS+ = 5 V
Input Bias = 1 VDC
3.0
VOUT = 1 VPP
-60
2.5
1M
10M
1G
100M
1M
Frequency (Hz)
Figure 31.
Figure 32.
PHASE vs FREQUENCY
GROUP DELAY vs FREQUENCY
45
30
VS+ = 5 V
VOUT = 200 mVPP
Input Bias = 1 VDC
0
25
Group Delay (ns)
-45
Phase (°)
-90
-135
-180
-225
-270
-315
VS+ = 5 V
VOUT = 200 mVPP
Input Bias = 1 VDC
-360
100k
20
15
10
5
1M
10M
100M
1M
Frequency (Hz)
Figure 33.
Figure 34.
SMALL-SIGNAL FREQUENCY RESPONSE
vs CAPACITIVE LOADING
CROSSTALK vs FREQUENCY
10
-20
0
Crosstalk (dB)
Signal Gain (dB)
-10
CL = 6.2 pF
-20
CL = 10 pF
-30
VS+ = 5 V
Load = 150 W || CL
VOUT = 200 mVPP
Input Bias = 1 VDC
VS+ = 5 V
Input-Referred
-30
CL = Stray (2 pF)
-50
100 M
10 M
Frequency (Hz)
-40
100 M
10 M
Frequency (Hz)
Channel 1 or 2
Into Channel 3
-40
Channel 1 or 3
Into Channel 2
-50
-60
-70
Channel 2 or 3
Into Channel 1
CL = 18 pF
-80
-60
1M
10M
100M
1G
1M
10 M
Frequency (Hz)
Frequency (Hz)
Figure 35.
Figure 36.
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TYPICAL CHARACTERISTICS: VS+ = 5 V (continued)
At TA = +25°C, load = 150 Ω || 6.2 pF to GND, and dc-coupled input/output, unless otherwise noted.
SECOND-ORDER HARMONIC DISTORTION
vs FREQUENCY
VS+ = 5 V
Input Bias = 1 VDC
-50
VOUT = 0.5 VPP
VOUT = 3 VPP
-60
VOUT = 1 VPP
VOUT = 2 VPP
-40
Third-Order Harmonic Distortion (dBc)
2nd-Order Harmonic Distortion (dBc)
-40
THIRD-ORDER HARMONIC DISTORTION
vs FREQUENCY
-70
-80
-90
VOUT = 0.25 VPP
-100
VS+ = 5 V
Input Bias = 1 VDC
VOUT = 3 VPP
-50
VOUT = 2 VPP
-60
VOUT = 0.25 VPP
-70
VOUT = 0.5 VPP
-80
VOUT = 1 VPP
-90
-100
1M
10 M
1M
10 M
Frequency (Hz)
Frequency (Hz)
Figure 37.
Figure 38.
SMALL-SIGNAL PULSE RESPONSES vs TIME
LARGE-SIGNAL PULSE RESPONSES vs TIME
5.5
1.1
2.5
2
Input tR/tF = 70 ns
Input tR/tF = 70 ns
0.9
Input tR/tF = 70 ns
0.8
2.2
Input tR/tF = 1 ns
VS+ = 5 V
0
50
100
150
200
250
300
350
0
Input tR/tF = 70 ns
2.5
-1
Input tR/tF = 1 ns
1.5
0.6
400
0.5
Output Voltage Waveforms
2.0
-50
Input Voltage Waveforms
3.5
0.7
2.1
1
Input tR/tF = 1 ns
-2
VS+ = 5 V
-50
0
Output Voltage Waveforms
50
100
150
200
250
300
350
-3
400
Time (ns)
Time (ns)
Figure 39.
Figure 40.
SLEW RATE vs OUTPUT VOLTAGE
ENABLE/DISABLE RESPONSE vs TIME
4
1.6
120
VS = 5 V
Positive and Negative Slew Rates
VS+ = 5 V
Enable Input Voltage
1.4
100
3
Enabled
Output Voltage (V)
Slew Rate (V/ms)
80
60
40
1
1.0
Disabled
0.8
0
0.6
-1
-2
0.4
Output Voltage
0.2
-3
0
-4
20
0
-5
-0.2
0.5
1.0
1.5
2.0
2.5
3.0
Enable Input Voltage (V)
2
1.2
-50
Output Voltage (VPP)
50
150
250
350
450
550
650
Time (ns)
Figure 41.
14
Input Voltage (V)
Input Voltage Waveforms
2.3
Output Voltage (V)
Input tR/tF = 1 ns
Input Voltage (V)
Output Voltage (V)
4.5
1.0
2.4
Figure 42.
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TYPICAL CHARACTERISTICS: GENERAL
At TA = +25°C, load = 150 Ω || 6.2 pF to GND, and dc-coupled input/output, unless otherwise noted.
DIFFERENTIAL GAIN vs SUPPLY VOLTAGE
DIFFERENTIAL PHASE vs SUPPLY VOLTAGE
0.25
0.30
5-Step Modulated Signal
VINPUT = 1.15 VPP
Differential Phase (°)
Differential Gain (%)
0.20
0.15
0.10
NTSC
PAL
5-Step Modulated Signal
VINPUT = 1.15 VPP
0.25
0.05
0.20
0.15
0.10
PAL
NTSC
0.05
0
0
2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4 4.6 4.8 5.0
2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4 4.6 4.8 5.0
Supply Voltage (V)
Supply Voltage (V)
Figure 43.
Figure 44.
TOTAL QUIESCENT CURRENT vs TEMPERATURE
OUTPUT IMPEDANCE vs FREQUENCY
10
VS+ = 5 V
3.7
3.6
3.5
VS+ = 3.3 V
3.4
1
3.3
3.2
-40
10
-15
35
60
0.1
100k
85
1M
10M
Ambient Temperature (°C)
Frequency (Hz)
Figure 45.
Figure 46.
S22 OUTPUT REFLECTION RATIO vs FREQUENCY
-10
VS+ = 2.6 V to 5 V
-20
-30
-40
-50
100M
DISABLED OUTPUT IMPEDANCE vs FREQUENCY
100k
Output Impedance (W)
Output Reflection Ratio (dB)
VS+ = 2.6 V to 5 V
3.8
Output Impedance (W)
Total Quiescent Current (mA)
3.9
VS+ = 2.6 V to 5 V
Disable Mode
10k
1k
-60
-70
100k
1M
10M
100M
1
100k
1M
10M
Frequency (Hz)
Frequency (Hz)
Figure 47.
Figure 48.
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APPLICATION INFORMATION
The THS7319 is targeted for triple-channel video
output
applications
that
require
three
enhanced-definition (ED) video and/or RGB video
output buffers. The THS7319 also supports standard
definition (SD) video for oversampled systems with
DAC sampling frequency of 54-MHz or greater.
Although the THS7319 can be used for numerous
other applications, the needs and requirements of the
video signal are the most important design
parameters.
Built
on
the
revolutionary,
complementary Silicon Germanium (SiGe) BiCom3X
process, the THS7319 incorporates many features
not typically found in integrated video parts while
consuming very low power. The THS7319 includes
the following features:
• Single-supply 2.6-V to 5-V operation with low total
quiescent current of 3.4 mA at 3.3 V and 3.7 mA
at 5 V
• Enable mode for shutting down the THS7319
amplifiers
to
save
system
power
in
power-sensitive applications
• DC input configuration with internal 150-mV dc
level shifting to prevent sync crushing and
saturation effects
• Third-order 20-MHz (–3-dB) low-pass filter for
DAC reconstruction or ADC image rejection ideal
for:
– NTSC/PAL 480p/576p Y’P’BP’R or G’B’R’
(R’G’B’) signals
– NTSC/PAL/SECAM composite video (CVBS),
S-Video Y’/C’, 480i/576i Y’P’BP’R, and G’B’R’
(R’G’B’) signals for oversampled systems
• Internally-fixed gain of 2-V/V (+6 dB) amplifiers
that allows for dc-coupling or traditional
ac-coupling
• Flow-through configuration using an ultra-small
MicrostarCSP package
A 0.1-µF capacitor should be placed as close as
possible to the power-supply pins to avoid potential
ringing or oscillation. Additionally, a large capacitor
(such as 22 µF to 100 µF) should be placed on the
power-supply line to minimize interference with
50-/60-Hz line frequencies.
INPUT VOLTAGE
The THS7319 input range allows for an input signal
range from –0.06 V to approximately (VS+ – 1.5 V).
However, because of the internal fixed gain of 2 V/V
(+6 dB) and the internal output level shift of 150 mV
(typical), the output is generally the limiting factor for
the allowable linear input range. For example, with a
5-V supply, the linear input range is from –0.06 V to
3.5 V. However, because of the gain and level shift,
the linear output range limits the allowable linear
input range to approximately –0.06 V to 2.3 V.
INPUT OVERVOLTAGE PROTECTION
The THS7319 is built using a very high-speed,
complementary, bipolar, and CMOS process. The
internal junction breakdown voltages are relatively
low for these very small geometry devices. These
breakdowns are reflected in the Absolute Maximum
Ratings table. All input and output device pins are
protected with internal ESD protection diodes to the
power supplies, as shown in Figure 49.
These diodes provide moderate protection to input
overdrive voltages above and below the supplies as
well. The protection diodes can typically support
30 mA of continuous current when overdriven.
+VS
External
Input/Output
Pin
OPERATING VOLTAGE
The THS7319 is designed to operate from 2.6 V to
5 V over a –40°C to +85°C temperature range. The
impact on performance over the entire temperature
range is negligible as a result of the implementation
of thin film resistors and high-quality, low-temperature
coefficient capacitors. The design of the THS7319
allows operation down to 2.5 V, but it is
recommended to use at least a 2.7 V supply to
ensure that no issues arise with headroom or clipping
with 100% color-saturated CVBS signals. If only 75%
color saturated CVBS is supported, then the output
voltage requirements are reduced to 2 VPP on the
output, allowing a 2.6-V supply to be used without
issues.
16
Internal
Circuitry
Figure 49. Internal ESD Protection
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TYPICAL CONFIGURATION AND VIDEO
TERMINOLOGY
A typical application circuit using the THS7319 as a
video buffer is shown in Figure 50. It shows a DAC or
encoder dc-coupled to the input channels of the
THS7319 and the output of the THS7319 dc-coupled
to the video line. These signals can be NTSC, PAL,
or SECAM signals including composite video
baseband signal (CVBS), S-Video Y'C', component
Y'P'BP'R video, broadcast G'B'R' video, or computer
R'G'B' video signals.
Note that the Y’ term is used for the luma channels
throughout this document rather than the more
common luminance (Y) term. This usage accounts for
the definition of luminance as stipulated by the
International Commission on Illumination (CIE). Video
departs from true luminance because a nonlinear
term, gamma, is added to the true RGB signals to
form R’G’B’ signals. These R’G’B’ signals are then
used to mathematically create luma (Y’). Thus,
luminance (Y) is not maintained, providing a
difference in terminology.
R’G’B’ (commonly mislabeled RGB) is also called
G’B’R’ (again commonly mislabeled as GBR) in
professional video systems. The Society of Motion
Picture
and
Television
Engineers
(SMPTE)
component standard stipulates that the luma
information is placed on the first channel, the blue
color difference is placed on the second channel, and
the red color difference signal is placed on the third
channel. This practice is consistent with the Y'P'BP'R
nomenclature. Because the luma channel (Y') carries
the sync information and the green channel (G') also
carries the sync information, it makes logical sense
that G' be placed first in the system. Because the
blue color difference channel (P'B) is next and the red
color difference channel (P'R) is last, then it also
makes logical sense to place the B' signal on the
second channel and the R' signal on the third
channel, respectfully. Thus, hardware compatibility is
better achieved when using G'B'R' rather than R'G'B'.
Note that for many G'B'R' systems, sync is embedded
on all three channels, but this configuration may not
always be the case in all systems.
This rationale is also used for the chroma (C’) term.
Chroma is derived from the nonlinear R’G’B’ terms
and, thus, it is nonlinear. Chominance (C) is derived
from linear RGB, giving the difference between
chroma (C’) and chrominance (C). The color
difference signals (P’B/P’R/U’/V’) are also referenced
in this manner to denote the nonlinear (gamma
corrected) signals.
Level
Shift
3-Pole
20-MHz
75 W
x1
Channel 1
Out 1
6 dB
LPF
75 W
DAC/Encoder
R
Level
Shift
3-Pole
20-MHz
75 W
x1
Channel 2
Out 2
6 dB
LPF
75 W
R
Level
Shift
3-Pole
20-MHz
75 W
x1
Channel 3
Out 3
6 dB
LPF
75 W
R
+2.6 V to +5 V
Enable
Figure 50. Typical THS7319 System with DC-Coupled Encoder/DAC and DC-Coupled Line Driving
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INPUT OPERATION
The inputs to the THS7319 allow for dc-coupled
inputs. Most DACs or video encoders can be
dc-connected to the THS7319 with essentially any
DAC termination resistance desired for the system.
One of the potential drawbacks to dc-coupling is
when 0 V is applied to the input from the DAC.
Although the input of the THS7319 allows for a 0-V
input signal without issue, the output swing of a
traditional amplifier cannot yield a 0-V signal that
results in possible clipping of the signal. This
limitation is true for any single-supply amplifier
because of the characteristics of the output
transistors. Neither CMOS nor bipolar transistors can
achieve 0 V while sinking current. This transistor
characteristic is also the same reason why the
highest output voltage is always less than the
power-supply voltage when sourcing current.
This output clipping can reduce the sync amplitudes
(both horizontal and vertical sync) on the video
signal. A problem occurs if the video signal receiver
uses an automatic gain control (AGC) loop to account
for losses in the transmission line. Some video AGC
circuits derive gain from the horizontal sync
amplitude. If clipping occurs on the sync amplitude,
then the AGC circuit can increase the gain too
much—resulting in too much luma and/or chroma
amplitude gain correction. This correction may result
in a picture with an overly bright display with too
much color saturation.
Other AGC circuits may use the chroma burst
amplitude for amplitude control. For this situation,
reduction in the sync signals does not alter the proper
gain setting. However, it is good engineering design
practice to ensure that saturation/clipping does not
take place. Transistors always take a finite amount of
time to come out of saturation. This saturation could
possibly result in timing delays or other aberrations
on the signals that may not be desirable.
To eliminate saturation or clipping problems, the
THS7319 has a 150-mV output level shift feature.
This feature takes the input voltage and adds an
internal +75-mV shift to the input signal. Because of
the 6-dB (2 V/V) gain, the resulting output with a 0-V
applied input signal is approximately 150 mV. The
THS7319 rail-to-rail output stage can create this
output level while connected to a typical video load.
This configuration ensures the sync signal clipping or
saturation does not occur. This shift is constant,
regardless of the input signal. The equation for this is
VOUT = (VIN × 2 V/V) + 0.15 V. For example, if a 1-V
input is applied, the output is (1 V × 2 V/V) + 0.15 V =
2.15 V.
18
Because the internal gain is fixed at +6 dB (2 V/V), it
dictates the allowable linear input voltage range. For
example, if the power supply is set to 3 V, the
maximum output is approximately 2.9 V while driving
a significant amount of current. Thus, to avoid
clipping, the allowable input is ([2.9 V – 0.15 V]/2) =
1.375 V. This range is valid for up to the maximum
recommended 5-V power supply that allows
approximately a ([4.9 V – 0.15 V]/2) = 2.375 V input
range while avoiding clipping on the output.
The input impedance of the THS7319 is dictated by
the internal high-impedance unity-gain buffer as
shown in Figure 51. This buffer has a very high
2.4 MΩ || 2 pF input impedance that is effectively
transparent to the source with no interactions. Unlike
other products where the filter elements are tied
directly to the input pin without buffering, there are no
filter performance changes or interaction with the
DAC termination resistance. Note that the internal
voltage shift does not appear at the input pin; it only
shows at the output pin.
While ac-coupling with dc-biasing using external
resistor dividers can be done, it is generally not
recommended because of the large resistor values
required. These large resistor values coupled with the
input bias current of the THS7319 input can cause a
significant voltage shift to appear on the input. If ac
coupling is necessary for a system, several elements
must be taken into account for a proper design: the
high-pass corner frequency (typically desired to be
about 2.5-Hz); the size of the input capacitor value;
the parallel input resistance of the voltage divider;
and the input bias current. Contact Texas Instruments
for design support if ac coupling is necessary in the
design.
+VS
Internal
Circuitry
Input
Pin
Level
Shift
Figure 51. Equivalent DC Input Mode Circuit
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DC-COUPLED OUTPUT
The THS7319 incorporates a rail-to-rail output stage
that can drive the line directly without the need for
large ac-coupling capacitors. This design offers the
best line tilt and field tilt (droop) performance because
no ac-coupling occurs. Keep in mind that if the input
is ac-coupled, then the resulting tilt as a result of the
input ac-coupling continues to be seen on the output,
regardless of the output coupling. The 70-mA output
current drive capability of the THS7319 is designed to
drive the video line while keeping the output dynamic
range as wide as possible.
One concern of dc-coupling, however, arises if the
line is terminated to ground. If an ac-bias input
configuration is used or if a dc reference from the
DAC is applied, such as S-Video C'/component P'B/or
component P'R signals, the output of the THS7319
will have a dc bias on the output, such as 1 V. This
configuration allows a dc current path to flow, such as
1 V/150 Ω = 6.67 mA. The result of this configuration
is a slightly decreased high output voltage swing and
an increase in power dissipation of the THS7319.
While the THS7319 was designed to operate with a
junction temperature of up to +125°C, care must be
taken to ensure that the junction temperature does
not exceed this level or else long-term reliability could
suffer. Using a 5-V supply, this configuration can
result in an additional power dissipation of
(5 V – 1 V) × 6.67 mA = 26.7 mW per channel. With a
3.3-V supply, this dissipation reduces to 15.3 mW per
channel. The overall low quiescent current of the
THS7319 design minimizes potential thermal issues
even when used at high ambient temperatures, but
power and thermal analysis should always be
examined in any system to ensure that no issues
arise. Be sure to use RMS power and not
instantaneous power when evaluating the thermal
performance.
Note that the THS7319 can drive the line with
dc-coupling regardless of the input mode of
operation. The only requirement is to make sure the
video line has proper termination in series with the
output (typically 75 Ω). This requirement helps isolate
capacitive loading effects from the THS7319 output.
Failure to properly isolate capacitive loads may result
in ringing or oscillation. The stray capacitance
appearing directly at the THS7319 output pins should
be kept below 18-pF. One method to ensure this
condition is to make sure the 75-Ω source resistor is
placed next to each THS7319 output pin.
There are many reasons dc-coupling is desirable,
including reduced costs, printed circuit board (PCB)
area, and no line tilt or field tilt. A common question is
whether or not there are any drawbacks to using
dc-coupling. There are a few potential issues that
must be examined, such as the dc current bias as
discussed above. Another potential risk is whether
this configuration meets industry standards. EIA-770
stipulates that the back-porch shall be 0 V ± 1 V as
measured at the receiver. With a double-terminated
load system, this requirement implies a 0-V ± 2-V
level at the video amplifier output. The THS7319 can
easily meet this requirement without issue. However,
in Japan, the EIAJ CP-1203 specification stipulates a
0-V ± 0.1-V level with no signal. This requirement can
be met with the THS7319 in disable mode, but while
active it cannot meet this specification without output
ac-coupling.
AC-COUPLED OUTPUT
A very common method of coupling the video signal
to the line is with a large capacitor. This capacitor is
typically between 220 µF and 1000 µF, although
470 µF is very typical. The value of this capacitor
must be large enough to minimize the line tilt (droop)
and/or field tilt associated with ac-coupling as
described previously in this document. AC-coupling is
performed for several reasons, but the most common
is to ensure full interoperability with the receiving
video system. This approach ensures that regardless
of the reference dc voltage used on the transmitting
side, the receiving side re-establishes the dc
reference voltage to its own requirements.
In the same way as the dc output mode of operation
discussed previously, each line should have a 75-Ω
source termination resistor in series with the
ac-coupling capacitor. This 75-Ω series resistor
should be placed next to the THS7319 output to
minimize capacitive loading effects.
Because of the edge rates and frequencies of
operation, it is recommended (but not required) to
place a 0.1-µF to 0.01-µF capacitor in parallel with
the large 220-µF to 1000-µF capacitor. These large
value capacitors are most commonly aluminum
electrolytic. It is well-known that these capacitors
have significantly large equivalent series resistance
(ESR), and the impedance at high frequencies is
rather large as a result of the associated inductances
involved with the leads and construction. The small
0.1-µF to 0.01-µF capacitors help pass these
high-frequency signals (greater than 1 MHz) with
much lower impedance than the large capacitors.
Although it is common to use the same capacitor
values for all the video lines, the frequency bandwidth
of the chroma signal in a S-Video system is not
required to go as low (or as high of a frequency) as
the luma channels. Thus, the capacitor values of the
chroma line(s) can be smaller, such as 0.1 µF.
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Figure 52 shows a typical configuration where the
input is dc-coupled and the output is also ac-coupled.
AC-coupled inputs are generally required when
current-sink DACs are used or the input is connected
to an unknown source, such as when the THS7319 is
used as an input device.
change in phase (radians/second) divided by a
change in frequency. An increase in group delay
corresponds to a time domain pulse response that
has overshoot and some possible ringing associated
with the overshoot.
The use of other type of filters, such as elliptic or
chebyshev, are not recommended for video
applications because of the very large group delay
variations near the corner frequency resulting in
significant overshoot and ringing. While these filters
may help meet the video standard specifications with
respect to amplitude attenuation, the group delay is
well beyond the standard specifications. Considering
this group delay with the fact that video can go from a
white pixel to a black pixel over and over again, it is
easy to see that ringing can occur. Ringing typically
causes a display to have ghosting or fuzziness
appear on the edges of a sharp transition. On the
other hand, a Bessel filter has ideal group delay
response, but the rate of attenuation is typically too
low for acceptable image rejection. Thus, the
Butterworth filter is a respectable compromise for
both attenuation and group delay.
LOW-PASS FILTER
Each channel of the THS7319 incorporates a
third-order low-pass filter. These video reconstruction
filters minimize DAC images from being passed onto
the video receiver. Depending on the receiver design,
failure to eliminate these DAC images can cause
picture quality problems as a result of aliasing of the
ADC in the receiver. Another benefit of the filter is to
smooth out aberrations in the signal that DACs
typically have associated with the digital stepping of
the signal. This benefit helps with picture quality and
ensures that the signal meets video bandwidth
requirements.
Each filter has an associated Butterworth
characteristic. The benefit of the Butterworth
response is that the frequency response is flat with a
relatively steep initial attenuation at the corner
frequency. The concern with the Butterworth
characteristic is that the group delay rises near the
corner frequency. Group delay is defined as the
Level
Shift
3-Pole
20-MHz
75 W
x1
Channel 1
330 mF
Out 1
6 dB
LPF
75 W
DAC/Encoder
R
Level
Shift
3-Pole
20-MHz
75 W
x1
Channel 2
330 mF
Out 2
6 dB
LPF
75 W
R
Level
Shift
3-Pole
20-MHz
75 W
x1
Channel 3
330 mF
Out 3
6 dB
LPF
75 W
R
+2.6 V to +5 V
Enable
Figure 52. Typical DC Input System Driving AC-Coupled Video Lines
20
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The THS7319 filters have a nominal corner (–3 dB)
frequency at 20-MHz and a –1 dB passband typically
at 17-MHz. This 20-MHz filter is ideal for enhanced
definition (ED) NTSC or PAL 480p/576p Y’P’BP’R or
G'B'R'/R'G'B' signals. For oversampled systems, the
THS7319 works well for passing standard definition
(SD) NTSC, PAL, or SECAM composite video
(CVBS), S-Video signals (Y’C’), 480i/576i Y’P’BP’R,
Y’U’V’, broadcast G’B’R’ signals, and R'G'B' video
signals. The 20-MHz, –3-dB corner frequency was
designed to achieve 27-dB of attenuation at
54 MHz—a common sampling frequency between the
DAC/ADC second and third Nyquist zones found in
many video systems. This consideration is important
because any signal that appears around this
frequency can also appear in the baseband as a
result of aliasing effects of an ADC found in a
receiver. Another specification ensured for the
THS7319 is attenuation at 43 MHz. This frequency is
derived from the fact that the ED Y' signal has an
11-MHz bandwidth. Following standard sampling
theory, this means that the second Nyquist zone
image starts at 54 MHz – 11 MHz = 43 MHz.
Keep in mind that images do not stop at the DAC
sampling frequency, fS (for example, 54 MHz for
traditional ED DACs); they continue around the
sampling frequency harmonics of 2× fS, 3× fS, 4× fS,
and so on (that is, 108-MHz, 162-MHz, 216-MHz,
etc.). Because of these multiple images, an ADC can
fold down into the baseband signal, meaning that the
low-pass filter must also eliminate these higher-order
images. The THS7319 filters are designed to
attenuate all of these higher frequencies without
bounce effect that some filters can allow.
The filter frequencies were chosen to account for
process variations in the THS7319. To ensure the
required video frequencies are effectively passed, the
filter corner frequency must be high enough to allow
component variations. The other consideration is that
the attenuation must be large enough to ensure the
anti-aliasing/reconstruction filtering is sufficient to
meet the system demands. Thus, the selection of the
filter frequencies was not arbitrarily selected and is a
good compromise that should meet the demands of
most systems.
BENEFITS OVER PASSIVE FILTERING
Two key benefits of using an integrated filter system,
such as the THS7319, over a passive system are
PCB area and filter variations. The ultra-small
MicrostarCSP 9-ball package is much smaller over a
passive RLC network, especially a three-pole passive
network for three channels. Additionally, consider that
inductors have at best ±10% tolerances (normally,
±15% to ±20% is common) and capacitors typically
have ±10% tolerances. A Monte Carlo analysis shows
that the filter corner frequency (–3 dB), flatness (–1
dB), Q factor (or peaking), and channel-to-channel
delay have wide variations. These variances can lead
to potential performance and quality issues in
mass-production environments. The THS7319 solves
most of these problems with the corner frequency
being essentially the only variable.
Another concern about passive filters is the use of
inductors. Inductors are magnetic components, and
are therefore susceptible to electromagnetic
coupling/interference (EMC/EMI). Some common
coupling can occur because of other video channels
nearby using inductors for filtering, or it can come
from nearby switched-mode power supplies. Some
other forms of coupling could be from outside sources
with strong EMI radiation and can cause failure in
EMC testing such as required for CE compliance.
One concern about an active filter in an integrated
circuit is the variation of the filter characteristics when
the ambient temperature and the subsequent die
temperature change. To minimize temperature
effects, the THS7319 uses low-temperature
coefficient resistors and high-quality, low-temperature
coefficient capacitors found in the BiCom3X process.
These filters have been specified by design to
account for process variations and temperature
variations to maintain proper filter characteristics.
This approach maintains a low channel-to-channel
time delay that is required for proper video signal
performance.
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Another benefit of the THS7319 over a passive RLC
filter is the input and output impedance. With a
passive filter, the input impedance presented to the
DAC varies significantly, from 35 Ω to over 1.5 kΩ,
and may cause voltage variations over frequency.
The THS7319 input impedance is 2.4 MΩ, and only
the 2-pF input capacitance plus the PCB trace
capacitance impact the input impedance. As such,
the voltage variation appearing at the DAC output is
better controlled with a fixed termination resistor and
the high input impedance buffer of the THS7319.
On the output side of the filter, a passive filter again
has a large impedance variation over frequency. The
EIA770 specifications require the return loss to be at
least 25 dB over the video frequency range of use.
For a video system, this requirement implies that the
source impedance (which includes the source, series
resistor, and the filter) must be better than 75 Ω,
+9/–8 Ω. The THS7319 is an operational amplifier
that approximates an ideal voltage source, which is
desirable because the output impedance is very low
and can source and sink current. To properly match
the transmission line characteristic impedance of a
video line, a 75-Ω series resistor is placed on the
output. To minimize reflections and to maintain a
good return loss meeting EIA specifications, this
output impedance must maintain a 75-Ω impedance.
A wide impedance variation of a passive filter cannot
ensure this level of performance. On the other hand,
the THS7319 has approximately 1 Ω of output
impedance, or a return loss of 40 dB, at 11 MHz.
Thus, the system is matched significantly better with
a THS7319 compared to a passive filter.
22
One final benefit of the THS7319 over a passive filter
is power dissipation. A DAC driving a video line must
be able to drive a 37.5-Ω load: the receiver 75-Ω
resistor and the 75-Ω impedance matching resistor
next to the DAC to maintain the source impedance
requirement. This requirement forces the DAC to
drive at least 1.25 VP (100% saturation CVBS)/37.5 Ω
= 33.3 mA. A DAC is a current-steering element, and
this amount of current flows internally to the DAC
even if the output is 0 V. Thus, power dissipation in
the DAC may be very high, especially when three
channels are being driven.
Using the THS7319 with a high input impedance can
reduce DAC power dissipation significantly. This
outcome is possible because the resistance that the
DAC drives can be substantially increased. It is
common to set this resistance in a DAC by a
current-setting resistor on the DAC itself. Thus, the
resistance can be 300 Ω or more, substantially
reducing the current drive demands from the DAC
and saving significant amounts of power. For
example, a 3.3-V, three-channel DAC dissipates
330 mW alone for the steering current capability
(three channels × 33.3 mA × 3.3 V) if it must drive a
37.5-Ω load. With a 300-Ω load, the DAC power
dissipation as a result of current steering current
would only be 41 mW (three channels × 4.16 mA ×
3.3 V), or over eight times lower power. For overall
system power, this scenario must also account for the
THS7319 power. The THS7319 only consumes
3.4 mA total quiescent current. The quiescent power
added is then 3.3 V × 3.4 mA = 11.2 mW. The total
system power is then 41 mW + 11 mW = 52 mW, or
a factor of six times lower power compared to the
DAC driving the line directly. Saving power by adding
the THS7319 in a system is easy to see and
accomplish, not to mention the added benefit of a
three-pole filter on each channel.
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PRINTED WIRING BOARD (PWB) DESIGN GUIDE
When designing the pad size for the MicrostarCSP, it
is recommended that the layout use a non-solder
mask defined (NSMD) landing pad. With this method,
the solder mask opening is made larger than the
desired land area, and the opening size is defined by
the copper pad width. Figure 53 and Table 2 define
the land pattern recommendations. Figure 54 and
Table 3 show a trace width example.
Copper Trace
Width
Solder Pad Width
Solder Mask Opening
Copper Trace Thickness
Solder Mask Thickness
Figure 53. Land Pattern Recommendations
Table 2. Definitions for Figure 53
SOLDER PAD
COPPER PAD
SOLDER MASK
OPENING
Non-solder mask defined
(NSMD)
200 µm to 275 µm
Copper pad + 50µm
STENCIL OPENING
STENCIL THICKNESS
250 µm × 250 µm square
(rounded corners)
100 µm
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X Pitch
Metal Diameter
See Dimension
A or C
Y Pitch
T Trace Width
Min Space S
(1) Circuit traces from the NSMD-defined PWB lands should be 75-µm to 100-µm wide in the exposed area inside the solder mask opening.
Wider trace widths reduce device stand-off and impact reliability.
(2) Best reliability results are achieved when the PWB laminate glass transition temperature is greater than the operating temperature range
of the intended application.
(3) For a PWB using a Ni/Au surface-finish, the Au thickness should be less than 0.5 µm to avoid a reduction in thermal fatigue performance.
(4) Solder mask thickness should be less than 20 µm above the copper circuit pattern.
(5) Best solder stencil performance is achieved using laser-cut stencils with electro-polishing. Use of chemically-etched stencils results in
inferior solder-paste volume control.
(6) Trace routing away from the MicrostarCSP device should be balanced in X and Y directions to avoid unintentional component movement
because of solder wetting forces.
Figure 54. Trace Width/Spacing Example
Table 3. Definitions for Figure 54
24
PAD
PACKAGE PITCH
(A or C) METAL DIAMETER
(S or T) TRACE
WIDTH/SPACING
NSMD
0.50 mm
0.25 mm
0.08 mm
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Solder Paste
TI recommends using a Type 3 or finer solder paste
when mounting the MicrostarCSP. This paste offers
the following advantages:
• It acts as a flux to aid wetting of the solder ball to
the PCB land.
• The adhesive properties of the paste hold the
component in place during the reflow process.
• Solder paste selection is normally driven by the
overall system-assembly requirements. In general,
the no clean compositions are preferred because
of the difficulty in cleaning below the mounted
components. Customers should check with the
solder-paste vendors regarding electrical issues
from residues left on the board.
Maximum 235°C, Minimum 195°C
Temperature (°C)
183
165
135
Minimum 30s
Maximum 90s
Minimum 60s
Maximum 120s
Time
Figure 55. SnPb Temperature Profile Example
TI recommends a pressure safety zone in mounting
the MicrostarCSP package. The recommended force
should be controlled to 5N maximum for static and
2.5N for impact.
Maximum 260°C, Minimum 230°C
Temperature (°C)
220
EXAMPLE REFLOW PROFILE
The MicrostarCSP package solder ball is compatible
with lead and lead-free pastes. Example reflow
profiles for SnPb and Pb-free are shown in Figure 55
and Figure 56. Table 4 lists the profiles for SnPb and
Pb-free reflow.
180
150
Minimum 30s
Maximum 90s
Minimum 60s
Maximum 120s
TI recommends that the solder-paste manufacturer
temperature profile be used to optimize flux activity
within the MSL guidelines for the most
thermally-sensitive component. Refer to J-STD-033
for more details on the MSL classification.
Time
Figure 56. Pb-Free Temperature Profile Example
Table 4. SnPb and Pb-Free Example Reflow Profiles
PARAMETER
SnPb
Pb-FREE
Ramp rate
3°C/second, maximum
3°C/second, maximum
Preheat
Time above liquids
135°C to 165°C
150°C to 180°C
60 to 120 seconds
60 to 120 seconds
183°C
220°C
30 to 90 seconds
30 to 90 seconds
Peak temperature
235°C
260°C +0/–5°C
Time within 5°C peak temperature
10 to 20 seconds
10 to 20 seconds
Ramp down rate
6°C/second, maximum
6°C/second, maximum
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EVALUATION MODULE
To evaluate the THS7319, an evaluation module
(EVM) is available. The EVM allows dc-coupled input
and output configurations. Inputs and outputs include
BNC connectors commonly found in video systems
along with 75-Ω input termination resistors, 75-Ω
series source termination resistors, and 75-Ω
characteristic impedance traces. This EVM is
designed to be used with a single supply from 2.6 V
up to 5 V.
The EVM input configuration sets all channels for dc
input coupling. The input signal must be within 0 V to
approximately 1.5 V for proper operation. Failure to
be within this range saturates and/or clips the output
signal. Refer to the Application Information section for
further information.
The THS7319 incorporates an easy method to
configure the enable mode. JP1 controls the enable
feature. Connecting JP1 to GND applies 0 V to the
enable pin and the THS7319 is placed into shutdown
mode consuming nominally 0.15 µA of quiescent
current. Moving JP1 to +VS causes the THS7319 to
be in normal operation mode where the quiescent
current should be nominally 3.4 mA for the entire
EVM. This quiescent current is with no load or no
signal applied on the input. Adding a load and/or
input signal causes the quiescent current to vary
accordingly.
Figure 57 shows the EVM schematic. Figure 58 and
Figure 59 illustrate the two layers of the EVM PCB,
incorporating standard high-speed layout practices.
Table 5 lists the bill of materials as the board comes
supplied from Texas Instruments.
VS+
GND
J7
J8
FB1
C3
0.1mF
J1
R4
75W
J4
R6
75W
J6
R5
75W
J5
C2
0.1mF
+
C1
100mF, 10V
U1
A1
A2
C1
R1
75W
J3
A3
C2
C3
B3
B1
R3
75W
B2
J2
R7
1kW
R2
75W
1
JP1
Figure 57. THS7319 EVM Schematic
26
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Figure 58. THS7319 EVM PCB Top Layer
Figure 59. THS7319 EVM PCB Bottom Layer
THS7319EVM Bill of Materials
Table 5. THS7319 EVM
ITEM
REF DES
QTY
DESCRIPTION
1
FB1
1
Bead, Ferrite, 2.5 A, 330 Ω
SMD SIZE
0805
MANUFACTURER
PART NUMBER
DISTRIBUTOR
PART NUMBER
(TDK) MPZ2012S331A
(Digi-Key) 445-1569-1-ND
(AVX) TPSD107K010R0100
(Garrett)
TPSD107K010R0100
2
C1
1
Capacitor, 100 µF, Tantalum, 10 V, 10%,
Low-ESR
3
C2, C3
2
Capacitor, 0.01 µF, Ceramic, 16 V, X7R, 10%
0603
(AVX) 0603YC104KAT2A
(Garrett)
0603YC104KAT2A
4
R1-R6
6
Resistor, 75 Ω, 1/10 W, 1%
0603
(ROHM) MCR03EZPFX75R0
(Digi-Key)
RHM75.0HCT-ND
5
R7
1
Resistor, 1 kΩ, 1/10 W, 1%
0603
(ROHM) MCR03EZPFX1001
(Digi-Key)
RHM1.00KHCT-ND
6
J7, J8
2
Jack, Banana Receptance, 0.25" dia. hole
(SPC) 813
(Newark) 39N867
7
J1-J6
6
Connector, BNC, Jack, 75 Ω
(Amphenol) 31-5329-72RFX
(Newark) 93F7554
8
JP1
1
Header, 0.1" CTRS, 0.025" sq. pins
(Sullins) PBC36SAAN
(Digi-Key) S1011E-36-ND
9
JP1
1
Shunts
(Sullins) SSC02SYAN
(Digi-Key) S9002-ND
10
U1
1
IC, THS7319
11
4
Standoff, 4-40 HEX, 0.625" length
(Keystone) 1808
(Digi-Key) 1808K-ND
12
4
Screw, Phillips, 4-40, 0.250"
(BF) PMS 440 0031 PH
(Digi-Key) H343-ND
13
1
Printed Circuit Board
(TI) Edge# 6505721 Rev. A
D
3 possible
ZSV
(TI) THS7319ZSV
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Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (June 2009) to Revision A ......................................................................................................... Page
•
•
•
•
28
Changed last Features bullet ................................................................................................................................................. 1
Changed last sentence of Description ................................................................................................................................... 1
Changed last bullet of Application Information section........................................................................................................ 16
Added Printed Wiring Board (PWB) Design Guide section ................................................................................................. 23
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EVALUATION BOARD/KIT IMPORTANT NOTICE
Texas Instruments (TI) provides the enclosed product(s) under the following conditions:
This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR EVALUATION PURPOSES
ONLY and is not considered by TI to be a finished end-product fit for general consumer use. Persons handling the product(s) must have
electronics training and observe good engineering practice standards. As such, the goods being provided are not intended to be complete
in terms of required design-, marketing-, and/or manufacturing-related protective considerations, including product safety and environmental
measures typically found in end products that incorporate such semiconductor components or circuit boards. This evaluation board/kit does
not fall within the scope of the European Union directives regarding electromagnetic compatibility, restricted substances (RoHS), recycling
(WEEE), FCC, CE or UL, and therefore may not meet the technical requirements of these directives or other related directives.
Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/kit may be returned within 30 days from
the date of delivery for a full refund. THE FOREGOING WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO BUYER
AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OF
MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE.
The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claims
arising from the handling or use of the goods. Due to the open construction of the product, it is the user’s responsibility to take any and all
appropriate precautions with regard to electrostatic discharge.
EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE, NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY
INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES.
TI currently deals with a variety of customers for products, and therefore our arrangement with the user is not exclusive.
TI assumes no liability for applications assistance, customer product design, software performance, or infringement of patents or
services described herein.
Please read the User’s Guide and, specifically, the Warnings and Restrictions notice in the User’s Guide prior to handling the product. This
notice contains important safety information about temperatures and voltages. For additional information on TI’s environmental and/or
safety programs, please contact the TI application engineer or visit www.ti.com/esh.
No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, or
combination in which such TI products or services might be or are used.
FCC Warning
This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT, DEMONSTRATION, OR EVALUATION PURPOSES
ONLY and is not considered by TI to be a finished end-product fit for general consumer use. It generates, uses, and can radiate radio
frequency energy and has not been tested for compliance with the limits of computing devices pursuant to part 15 of FCC rules, which are
designed to provide reasonable protection against radio frequency interference. Operation of this equipment in other environments may
cause interference with radio communications, in which case the user at his own expense will be required to take whatever measures may
be required to correct this interference.
EVM WARNINGS AND RESTRICTIONS
It is important to operate this EVM within the input voltage range of 2.5 V to 5.5 V and the output voltage range of 0 V to 5.5 V.
Exceeding the specified input range may cause unexpected operation and/or irreversible damage to the EVM. If there are questions
concerning the input range, please contact a TI field representative prior to connecting the input power.
Applying loads outside of the specified output range may result in unintended operation and/or possible permanent damage to the EVM.
Please consult the EVM User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification,
please contact a TI field representative.
During normal operation, some circuit components may have case temperatures greater than +85°C. The EVM is designed to operate
properly with certain components above +85°C as long as the input and output ranges are maintained. These components include but are
not limited to linear regulators, switching transistors, pass transistors, and current sense resistors. These types of devices can be identified
using the EVM schematic located in the EVM User's Guide. When placing measurement probes near these devices during operation,
please be aware that these devices may be very warm to the touch.
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Copyright © 2009, Texas Instruments Incorporated
Submit Documentation Feedback
Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s): THS7319
29
PACKAGE OPTION ADDENDUM
www.ti.com
9-Jul-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
THS7319IZSVR
ACTIVE
uCSP
ZSV
9
2500 Green (RoHS &
no Sb/Br)
Call TI
Level-2-260C-1 YEAR
THS7319IZSVT
ACTIVE
uCSP
ZSV
9
250
Call TI
Level-2-260C-1 YEAR
Green (RoHS &
no Sb/Br)
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Jul-2009
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
THS7319IZSVR
uCSP
ZSV
9
2500
330.0
8.4
1.7
1.7
0.76
4.0
8.0
Q1
THS7319IZSVT
uCSP
ZSV
9
250
330.0
8.4
1.7
1.7
0.76
4.0
8.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Jul-2009
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
THS7319IZSVR
uCSP
ZSV
9
2500
340.5
333.0
20.6
THS7319IZSVT
uCSP
ZSV
9
250
340.5
333.0
20.6
Pack Materials-Page 2
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