ULN2002A, ULN2003A, ULN2003AI, ULN2004A ULQ2003A, ULQ2004A www.ti.com SLRS027M – DECEMBER 1976 – REVISED FEBRUARY 2013 HIGH-VOLTAGE, HIGH-CURRENT DARLINGTON TRANSISTOR ARRAYS Check for Samples: ULN2002A, ULN2003A, ULN2003AI, ULN2004A, ULQ2003A, ULQ2004A FEATURES 1 • • • • • 500-mA-Rated Collector Current (Single Output) High-Voltage Outputs: 50 V Output Clamp Diodes Inputs Compatible With Various Types of Logic Relay-Driver Applications ULN2002A . . . N PACKAGE ULN2003A . . . D, N, NS, OR PW PACKAGE ULN2004A . . . D, N, OR NS PACKAGE ULQ2003A, ULQ2004A . . . D OR N PACKAGE (TOP VIEW) 1B 2B 3B 4B 5B 6B 7B E 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 1C 2C 3C 4C 5C 6C 7C COM DESCRIPTION The ULN2002A, ULN2003A, ULN2003AI, ULN2004A, ULQ2003A, and ULQ2004A are high-voltage high-current Darlington transistor arrays. Each consists of seven npn Darlington pairs that feature high-voltage outputs with common-cathode clamp diodes for switching inductive loads. The collector-current rating of a single Darlington pair is 500 mA. The Darlington pairs can be paralleled for higher current capability. Applications include relay drivers, hammer drivers, lamp drivers, display drivers (LED and gas discharge), line drivers, and logic buffers. For 100-V (otherwise interchangeable) versions of the ULN2003A and ULN2004A, see the SN75468 and SN75469, respectively. The ULN2002A is designed specifically for use with 14-V to 25-V PMOS devices. Each input of this device has a Zener diode and resistor in series to control the input current to a safe limit. The ULN2003A and ULQ2003A have a 2.7-kΩ series base resistor for each Darlington pair for operation directly with TTL or 5-V CMOS devices. The ULN2004A and ULQ2004A have a 10.5-kΩ series base resistor to allow operation directly from CMOS devices that use supply voltages of 6 V to 15 V. The required input current of the ULN/ULQ2004A is below that of the ULN/ULQ2003A, and the required voltage is less than that required by the ULN2002A. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1976–2013, Texas Instruments Incorporated ULN2002A, ULN2003A, ULN2003AI, ULN2004A ULQ2003A, ULQ2004A SLRS027M – DECEMBER 1976 – REVISED FEBRUARY 2013 www.ti.com ORDERING INFORMATION (1) PACKAGE (2) TA PDIP – N –20°C to 70°C SOIC – D SOP – NS TSSOP – PW PDIP – N ULN2002AN ULN2003AN ULN2003AN ULN2004AN ULN2004AN Tube of 40 ULN2003AD Reel of 2500 ULN2003ADR Reel of 2500 ULN2003ADRG3 Tube of 40 ULN2004AD Reel of 2500 ULN2004ADRG3 Reel of 2000 ULN2003A ULN2003ANSR ULN2003A ULN2004ANSR ULN2004A Tube of 90 ULN2003APW Reel of 2000 ULN2003APWR Tube of 25 ULN2004A UN2003A ULQ2003AN ULQ2003A ULQ2004AN ULQ2004AN Reel of 2500 ULQ2003ADR Tube of 40 ULQ2004AD Reel of 2500 ULQ2004ADR SOP – NS Reel of 2000 ULN2003AINSR ULN2003AI PDIP – N Tube of 425 ULN2003AIN ULN2003AIN Tube of 40 ULN2003AID Reel of 2500 ULN2003AIDR Reel of 2500 ULN2003AIPWR SOIC – D TSSOP – PW (2) ULN2002AN ULQ2003AD SOIC – D (1) Tube of 25 TOP-SIDE MARKING Tube of 40 –40°C to 85°C –40°C to 105°C ORDERABLE PART NUMBER ULQ2003A ULQ2004A ULN2003AI UN2003AI For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. LOGIC DIAGRAM 9 COM 1 16 1C 1B 2 15 2C 2B 3 14 3C 3B 4 13 4C 4B 5 12 5C 5B 6 11 6C 6B 7 7B 2 Submit Documentation Feedback 10 7C Copyright © 1976–2013, Texas Instruments Incorporated Product Folder Links: ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A ULN2002A, ULN2003A, ULN2003AI, ULN2004A ULQ2003A, ULQ2004A www.ti.com SLRS027M – DECEMBER 1976 – REVISED FEBRUARY 2013 SCHEMATICS (EACH DARLINGTON PAIR) 10.5 kW 7.2 kW 3 kW ULN2002A RB ULN/ULQ2003A: RB = 2.7 kW ULN2003AI: RB = 2.7 kW 7.2 kW 3 kW ULN/ULQ2004A: RB = 10.5 kW ULN2003A, ULN2003AI, ULN2004A, ULQ2003A, ULQ2004A All resistor values shown are nominal. The collector-emitter diode is a parasitic structure and should not be used to conduct current. If the collector(s) go below ground an external Schottky diode should be added to clamp negative undershoots. Copyright © 1976–2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A 3 ULN2002A, ULN2003A, ULN2003AI, ULN2004A ULQ2003A, ULQ2004A SLRS027M – DECEMBER 1976 – REVISED FEBRUARY 2013 www.ti.com ABSOLUTE MAXIMUM RATINGS (1) at 25°C free-air temperature (unless otherwise noted) MIN VCC VI TA 50 V Clamp diode reverse voltage (2) 50 V Input voltage (2) 30 V 500 mA Output clamp current 500 mA Total emitter-terminal current –2.5 A See Figure 14 and Figure 15 Operating free-air temperature range Package thermal impedance (3) θJA UNIT Collector-emitter voltage Peak collector current IOK MAX (4) –20 70 ULN200xAI –40 105 ULQ200xA –40 85 ULQ200xAT –40 105 D package 73 N package 67 NS package 64 PW package 108 D package 36 N package 54 °C °C/W θJC Package thermal impedance (5) TJ Operating virtual junction temperature 150 °C Lead temperature for 1.6 mm (1/16 inch) from case for 10 seconds 260 °C 150 °C Tstg (1) (2) (3) (4) (5) (6) (6) ULN200xA Storage temperature range –65 Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to the emitter/substrate terminal E, unless otherwise noted. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. The package thermal impedance is calculated in accordance with JESD 51-7. Maximum power dissipation is a function of TJ(max), θJC, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/θJC. Operating at the absolute maximum TJ of 150°C can affect reliability. The package thermal impedance is calculated in accordance with MIL-STD-883. ELECTRICAL CHARACTERISTICS TA = 25°C PARAMETER VI(on) On-state input voltage TEST FIGURE Figure 6 TEST CONDITIONS ULN2002A MIN TYP MAX VCE = 2 V, IC = 300 mA II = 250 μA, IC = 100 mA 0.9 1.1 13 II = 350 μA, IC = 200 mA 1 1.3 II = 500 μA, IC = 350 mA 1.2 1.6 VCE(sat) Collector-emitter saturation voltage Figure 4 VF Clamp forward voltage Figure 7 IF = 350 mA Figure 1 VCE = 50 V, II = 0 50 Figure 2 VCE = 50 V, TA = 70°C II = 0 100 VI = 6 V 500 IC = 500 μA ICEX Collector cutoff current II(off) Off-state input current Figure 2 VCE = 50 V, II Input current Figure 3 VI = 17 V IR Clamp reverse current Ci Input capacitance 4 Submit Documentation Feedback Figure 6 VR = 50 V VI = 0, 1.7 50 1.25 100 50 f = 1 MHz V V V μA μA 65 0.82 TA = 70°C 2 UNIT 25 mA μA pF Copyright © 1976–2013, Texas Instruments Incorporated Product Folder Links: ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A ULN2002A, ULN2003A, ULN2003AI, ULN2004A ULQ2003A, ULQ2004A www.ti.com SLRS027M – DECEMBER 1976 – REVISED FEBRUARY 2013 ELECTRICAL CHARACTERISTICS TA = 25°C PARAMETER TEST FIGURE TEST CONDITIONS ULN2003A MIN TYP ULN2004A MAX MIN TYP IC = 125 mA VI(on) On-state input voltage Figure 6 VCE = 2 V 2.4 IC = 250 mA 2.7 6 IC = 275 mA 7 ICEX Collector cutoff current 8 II = 250 μA, IC = 100 mA 0.9 1.1 0.9 1.1 II = 350 μA, IC = 200 mA 1 1.3 1 1.3 II = 500 μA, IC = 350 mA 1.2 1.6 1.2 1.6 Figure 1 VCE = 50 V, II = 0 50 50 Figure 2 VCE = 50 V, TA = 70°C II = 0 100 100 Figure 5 VF Clamp forward voltage Figure 8 IF = 350 mA II(off) Off-state input current Figure 3 VCE = 50 V, TA = 70°C, VI = 6 V 50 VI = 3.85 V II Input current Figure 4 2 65 1.7 50 0.93 Clamp reverse current Ci Input capacitance Figure 7 VI = 5 V VR = 50 V VI = 0, μA TA = 70°C f = 1 MHz 2 V μA 65 1.35 VI = 12 V IR V 500 1.7 IC = 500 μA V 3 IC = 350 mA Collector-emitter saturation voltage UNIT 5 IC = 200 mA IC = 300 mA VCE(sat) MAX 15 0.35 0.5 1 1.45 50 50 100 100 25 15 25 mA μA pF ELECTRICAL CHARACTERISTICS TA = 25°C PARAMETER VI(on) On-state input voltage TEST FIGURE Figure 6 ULN2003AI TEST CONDITIONS VCE = 2 V MIN TYP IC = 200 mA 2.4 IC = 250 mA 2.7 IC = 300 mA VCE(sat) Collector-emitter saturation voltage Figure 5 II = 250 μA, IC = 100 mA II = 350 μA, II = 500 μA, II = 0 ICEX Collector cutoff current Figure 1 VCE = 50 V, VF Clamp forward voltage Figure 8 IF = 350 mA II(off) Off-state input current Figure 3 VCE = 50 V, II Input current Figure 4 VI = 3.85 V IR Clamp reverse current Figure 7 VR = 50 V Ci Input capacitance Copyright © 1976–2013, Texas Instruments Incorporated VI = 0, MAX V 3 0.9 1.1 IC = 200 mA 1 1.3 IC = 350 mA 1.2 1.6 50 1.7 IC = 500 μA UNIT 50 15 V 1.35 mA 50 μA 25 pF Submit Documentation Feedback Product Folder Links: ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A μA μA 65 0.93 f = 1 MHz 2 V 5 ULN2002A, ULN2003A, ULN2003AI, ULN2004A ULQ2003A, ULQ2004A SLRS027M – DECEMBER 1976 – REVISED FEBRUARY 2013 www.ti.com ELECTRICAL CHARACTERISTICS TA = –40°C to 105°C PARAMETER VI(on) VCE(sat) TEST FIGURE On-state input voltage Figure 6 Collector-emitter saturation voltage VCE = 2 V Figure 5 ULN2003AI TEST CONDITIONS MIN TYP MAX IC = 200 mA 2.7 IC = 250 mA 2.9 IC = 300 mA 3 II = 250 μA, IC = 100 mA 0.9 1.2 II = 350 μA, IC = 200 mA 1 1.4 II = 500 μA, IC = 350 mA 1.2 1.7 II = 0 ICEX Collector cutoff current Figure 1 VCE = 50 V, VF Clamp forward voltage Figure 8 IF = 350 mA II(off) Off-state input current Figure 3 VCE = 50 V, II Input current Figure 4 VI = 3.85 V IR Clamp reverse current Figure 7 VR = 50 V Ci Input capacitance 100 1.7 IC = 500 μA 30 f = 1 MHz 15 V V μA V μA 65 0.93 VI = 0, 2.2 UNIT 1.35 mA 100 μA 25 pF ELECTRICAL CHARACTERISTICS over recommended operating conditions (unless otherwise noted) PARAMETER TEST FIGURE TEST CONDITIONS ULQ2003A MIN TYP ULQ2004A MAX MIN TYP IC = 125 mA VI(on) On-state input voltage Figure 6 VCE = 2 V IC = 200 mA 2.7 IC = 250 mA 2.9 6 IC = 275 mA 7 ICEX Collector cutoff current VF Clamp forward voltage Figure 5 IC = 100 mA 0.9 1.2 0.9 1.1 II = 350 μA, IC = 200 mA 1 1.4 1 1.3 1.2 1.7 1.2 1.6 II = 500 μA, IC = 350 mA VCE = 50 V, II = 0 Figure 2 VCE = 50 V, TA = 70°C II = 0 Figure 8 IF = 350 mA VCE = 50 V, TA = 70°C, II(off) Off-state input current Figure 3 II Input current Figure 4 8 II = 250 μA, Figure 1 100 2.3 65 0.93 1.7 50 Clamp reverse current Ci Input capacitance 6 Figure 7 Submit Documentation Feedback VR = 50 V VI = 0, TA = 25°C f = 1 MHz 15 2 V μA 65 1.35 VI = 5 V VI = 12 V IR μA 500 1.7 VI = 3.85 V V 50 100 VI = 6 V IC = 500 μA V 3 IC = 350 mA Collector-emitter saturation voltage UNIT 5 IC = 300 mA VCE(sat) MAX 0.35 0.5 1 1.45 100 50 100 100 25 15 25 mA μA pF Copyright © 1976–2013, Texas Instruments Incorporated Product Folder Links: ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A ULN2002A, ULN2003A, ULN2003AI, ULN2004A ULQ2003A, ULQ2004A www.ti.com SLRS027M – DECEMBER 1976 – REVISED FEBRUARY 2013 SWITCHING CHARACTERISTICS TA = 25°C PARAMETER ULN2002A, ULN2003A, ULN2004A TEST CONDITIONS MIN TYP MAX UNIT tPLH Propagation delay time, low- to high-level output See Figure 9 0.25 1 μs tPHL Propagation delay time, high- to low-level output See Figure 9 0.25 1 μs VOH High-level output voltage after switching VS = 50 V, IO = 300 mA, See Figure 10 VS – 20 mV SWITCHING CHARACTERISTICS TA = 25°C PARAMETER ULN2003AI TEST CONDITIONS MIN tPLH Propagation delay time, low- to high-level output See Figure 9 tPHL Propagation delay time, high- to low-level output See Figure 9 VOH High-level output voltage after switching VS = 50 V, IO ≈ 300 mA, See Figure 10 TYP MAX 0.25 1 0.25 1 VS – 20 UNIT μs μs mV SWITCHING CHARACTERISTICS TA = –40°C to 105°C PARAMETER ULN2003AI TEST CONDITIONS MIN TYP MAX tPLH Propagation delay time, low- to high-level output See Figure 9 1 10 tPHL Propagation delay time, high- to low-level output See Figure 9 1 10 VOH High-level output voltage after switching VS = 50 V, IO ≈ 300 mA, See Figure 10 VS – 50 UNIT μs μs mV SWITCHING CHARACTERISTICS over recommended operating conditions (unless otherwise noted) PARAMETER ULQ2003A, ULQ2004A TEST CONDITIONS MIN TYP MAX UNIT tPLH Propagation delay time, low- to high-level output See Figure 9 1 10 μs tPHL Propagation delay time, high- to low-level output See Figure 9 1 10 μs VOH High-level output voltage after switching VS = 50 V, IO = 300 mA, See Figure 10 Copyright © 1976–2013, Texas Instruments Incorporated VS – 20 Submit Documentation Feedback Product Folder Links: ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A mV 7 ULN2002A, ULN2003A, ULN2003AI, ULN2004A ULQ2003A, ULQ2004A SLRS027M – DECEMBER 1976 – REVISED FEBRUARY 2013 www.ti.com PARAMETER MEASUREMENT INFORMATION Open Open VCE ICEX VCE ICEX Open VI Figure 1. ICEX Test Circuit Open Figure 2. ICEX Test Circuit Open VCE II(off) II(on) IC Open VI Figure 3. II(off) Test Circuit A. Figure 4. II Test Circuit II is fixed for measuring VCE(sat), variable for measuring hFE. Open Open hFE = IC II VCE II Figure 5. hFE, VCE(sat) Test Circuit VI(on) IC VCE IC Figure 6. VI(on) Test Circuit VR IR VF IF Open Open Figure 7. IR Test Circuit 8 Submit Documentation Feedback Figure 8. VF Test Circuit Copyright © 1976–2013, Texas Instruments Incorporated Product Folder Links: ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A ULN2002A, ULN2003A, ULN2003AI, ULN2004A ULQ2003A, ULQ2004A www.ti.com SLRS027M – DECEMBER 1976 – REVISED FEBRUARY 2013 PARAMETER MEASUREMENT INFORMATION (continued) Figure 9. Propagation Delay-Time Waveforms 200 W ≤10 ns ≤5 ns 90% 1.5 V Input VIH (see Note C) 90% 1.5 V 10% 10% 0V 40 µs VOH Output VOL VOLTAGE WAVEFORMS A. The pulse generator has the following characteristics: PRR = 12.5 kHz, ZO = 50 Ω. B. CL includes probe and jig capacitance. C. For testing the ULN2003A, ULN2003AI, and ULQ2003A, VIH = 3 V; for the ULN2002A, VIH = 13 V; for the ULN2004A and the ULQ2004A, VIH = 8 V. Figure 10. Latch-Up Test Circuit and Voltage Waveforms Copyright © 1976–2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A 9 ULN2002A, ULN2003A, ULN2003AI, ULN2004A ULQ2003A, ULQ2004A SLRS027M – DECEMBER 1976 – REVISED FEBRUARY 2013 www.ti.com TYPICAL CHARACTERISTICS VCE(sat) VCE(sat) - Collector-Emitter Saturation Voltage - V 2.5 TA = 25°C 2 II = 250 µA II = 350 µA II = 500 µA 1.5 1 0.5 0 0 100 200 300 400 500 600 700 800 VCE(sat) VCE(sat) - Collector-Emitter Saturation Voltage - V COLLECTOR-EMITTER SATURATION VOLTAGE vs COLLECTOR CURRENT (ONE DARLINGTON) COLLECTOR-EMITTER SATURATION VOLTAGE vs TOTAL COLLECTOR CURRENT (TWO DARLINGTONS IN PARALLEL) 2.5 TA = 25°C II = 350 µA 1.5 II = 500 µA 1 0.5 0 0 100 300 400 500 600 700 Figure 11. Figure 12. COLLECTOR CURRENT vs INPUT CURRENT D PACKAGE MAXIMUM COLLECTOR CURRENT vs DUTY CYCLE 800 600 500 IIC C - Maximum Collector Current - mA RL = 10 Ω TA = 25°C 450 IC IC - Collector Current - mA 200 IC(tot) - Total Collector Current - mA IC - Collector Current - mA 400 VS = 10 V 350 VS = 8 V 300 250 200 150 100 50 0 500 N=1 400 N=4 N=3 300 N=2 N=6 200 N = 7 N=5 100 TA = 70°C N = Number of Outputs Conducting Simultaneously 0 0 25 50 75 100 125 II - Input Current - µA Figure 13. 10 II = 250 µA 2 Submit Documentation Feedback 150 175 200 0 10 20 30 40 50 60 70 80 90 100 Duty Cycle - % Figure 14. Copyright © 1976–2013, Texas Instruments Incorporated Product Folder Links: ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A ULN2002A, ULN2003A, ULN2003AI, ULN2004A ULQ2003A, ULQ2004A www.ti.com SLRS027M – DECEMBER 1976 – REVISED FEBRUARY 2013 TYPICAL CHARACTERISTICS (continued) N PACKAGE MAXIMUM COLLECTOR CURRENT vs DUTY CYCLE MAXIMUM AND TYPICAL INPUT CURRENT vs INPUT VOLTAGE 600 2000 TJ = -40°C to 105°C 500 1600 N=1 N=3 N=2 400 N=4 300 N=5 N=6 N=7 Input Current – µA IIC C - Maximum Collector Current - mA 1800 200 1400 1200 1000 Maximum 800 600 400 100 0 Typical TA = 85°C N = Number of Outputs Conducting Simultaneously 0 10 20 30 40 50 60 70 200 0 80 2 90 100 2.5 Duty Cycle - % Figure 15. 3 3.5 4 Input Voltage – V 4.5 5 Figure 16. MAXIMUM AND TYPICAL SATURATED VCE vs OUTPUT CURRENT MINIMUM OUTPUT CURRENT vs INPUT CURRENT 500 2.1 V CE = 2 V TJ = -40°C to 105°C TJ = -40°C to 105°C 450 400 Output Current – mA Maximum VCE(sat) Voltage – V 1.9 1.7 1.5 Maximum 1.3 350 300 250 Minimum 200 1.1 150 Typical 0.9 100 200 300 400 500 100 250 350 450 Output Current – mA Input Current – µA Figure 17. Figure 18. Copyright © 1976–2013, Texas Instruments Incorporated 550 650 Submit Documentation Feedback Product Folder Links: ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A 11 ULN2002A, ULN2003A, ULN2003AI, ULN2004A ULQ2003A, ULQ2004A SLRS027M – DECEMBER 1976 – REVISED FEBRUARY 2013 www.ti.com APPLICATION INFORMATION ULN2002A VSS V 1 P-MOS Output ULQ2003A VCC 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 V 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 Lam Test TTL Output Figure 19. P-MOS to Load ULN2004A ULQ2004A VDD Figure 20. TTL to Load VCC V V ULQ2003A 1 16 1 16 2 15 2 15 3 14 3 14 4 13 4 13 5 12 5 12 6 11 6 11 7 10 7 10 8 9 8 9 RP CMOS Output TTL Output Figure 21. Buffer for Higher Current Loads 12 Submit Documentation Feedback Figure 22. Use of Pullup Resistors to Increase Drive Current Copyright © 1976–2013, Texas Instruments Incorporated Product Folder Links: ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A ULN2002A, ULN2003A, ULN2003AI, ULN2004A ULQ2003A, ULQ2004A www.ti.com SLRS027M – DECEMBER 1976 – REVISED FEBRUARY 2013 REVISION HISTORY Changes from Revision K (August 2011) to Revision L • Page Removed reference to obsolete ULN2001 part .................................................................................................................... 1 Changes from Revision L (March 2012) to Revision M • Page Updated temperature rating for ULN2003AI in the ORDERING INFORMATION table. ...................................................... 2 Copyright © 1976–2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A 13 PACKAGE OPTION ADDENDUM www.ti.com 10-Feb-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Qty Drawing Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) ULN2001AD OBSOLETE SOIC D 16 TBD Call TI Call TI ULN2001ADR OBSOLETE SOIC D 16 TBD Call TI Call TI ULN2001AN OBSOLETE PDIP N 16 TBD Call TI Call TI ULN2002AD OBSOLETE SOIC D 16 TBD Call TI Call TI ULN2002AN ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -20 to 70 ULN2002AN ULN2002ANE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -20 to 70 ULN2002AN ULN2003AD ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -20 to 70 ULN2003A ULN2003ADE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -20 to 70 ULN2003A ULN2003ADG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -20 to 70 ULN2003A ULN2003ADR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -20 to 70 ULN2003A ULN2003ADRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -20 to 70 ULN2003A ULN2003ADRG3 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -20 to 70 ULN2003A ULN2003ADRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -20 to 70 ULN2003A ULN2003AID ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 105 ULN2003AI ULN2003AIDE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 105 ULN2003AI ULN2003AIDG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 105 ULN2003AI ULN2003AIDR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 105 ULN2003AI ULN2003AIDRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 105 ULN2003AI ULN2003AIDRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 105 ULN2003AI Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 10-Feb-2013 Orderable Device Status (1) Package Type Package Pins Package Qty Drawing Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) ULN2003AIN ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 105 ULN2003AIN ULN2003AINE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -40 to 105 ULN2003AIN ULN2003AINSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 ULN2003AI ULN2003AIPW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 105 UN2003AI ULN2003AIPWE4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 105 UN2003AI ULN2003AIPWG4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 105 UN2003AI ULN2003AIPWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 105 UN2003AI ULN2003AIPWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 105 UN2003AI ULN2003AIPWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 105 UN2003AI TBD Call TI Call TI -55 to 125 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -20 to 70 ULN2003AJ OBSOLETE CDIP J 16 ULN2003AN ACTIVE PDIP N 16 25 ULN2003ANE3 PREVIEW PDIP N 16 25 TBD Call TI Call TI -20 to 70 ULN2003ANE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -20 to 70 ULN2003AN ULN2003ANSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -20 to 70 ULN2003A ULN2003ANSRE4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -20 to 70 ULN2003A ULN2003ANSRG4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -20 to 70 ULN2003A ULN2003APW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -20 to 70 UN2003A ULN2003APWE4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -20 to 70 UN2003A ULN2003APWG4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -20 to 70 UN2003A Addendum-Page 2 ULN2003AN Samples PACKAGE OPTION ADDENDUM www.ti.com 10-Feb-2013 Orderable Device Status (1) Package Type Package Pins Package Qty Drawing Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) ULN2003APWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -20 to 70 UN2003A ULN2003APWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -20 to 70 UN2003A ULN2003APWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -20 to 70 UN2003A ULN2004AD ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -20 to 70 ULN2004A ULN2004ADE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -20 to 70 ULN2004A ULN2004ADG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -20 to 70 ULN2004A ULN2004ADR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -20 to 70 ULN2004A ULN2004ADRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -20 to 70 ULN2004A ULN2004ADRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -20 to 70 ULN2004A ULN2004AN ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -20 to 70 ULN2004AN ULN2004ANE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type -20 to 70 ULN2004AN ULN2004ANSR ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -20 to 70 ULN2004A ULN2004ANSRG4 ACTIVE SO NS 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -20 to 70 ULN2004A ULQ2003AD ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 ULQ2003A ULQ2003ADG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ULQ2003ADR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ULQ2003ADRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ULQ2003AN ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type Addendum-Page 3 ULQ2003A -40 to 85 ULQ2003A ULQ2003A -40 to 85 ULQ2003A Samples PACKAGE OPTION ADDENDUM www.ti.com 10-Feb-2013 Orderable Device Status (1) Package Type Package Pins Package Qty Drawing Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) ULQ2004AD ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ULQ2004ADG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ULQ2004ADR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ULQ2004ADRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM ULQ2004AN ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type (4) -40 to 85 ULQ2004A ULQ2004A -40 to 85 ULQ2004A ULQ2004A -40 to 85 ULQ2004AN (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Only one of markings shown within the brackets will appear on the physical device. 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Addendum-Page 4 Samples PACKAGE OPTION ADDENDUM www.ti.com 10-Feb-2013 OTHER QUALIFIED VERSIONS OF ULQ2003A, ULQ2004A : • Automotive: ULQ2003A-Q1, ULQ2004A-Q1 NOTE: Qualified Version Definitions: • Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 5 PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant ULN2003ADR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 ULN2003ADRG4 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 ULN2003AIDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 ULN2003AIDRG4 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 ULN2003AIPWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 ULN2003AIPWR TSSOP PW 16 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1 ULN2003AIPWRG4 TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 ULN2003APWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 ULN2003APWR TSSOP PW 16 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1 ULN2003APWRG4 TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 ULN2004ADR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 ULN2004ADR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 ULN2004ADRG4 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 ULN2004ADRG4 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 ULQ2003ADR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) ULN2003ADR SOIC D 16 2500 333.2 345.9 28.6 ULN2003ADRG4 SOIC D 16 2500 333.2 345.9 28.6 ULN2003AIDR SOIC D 16 2500 333.2 345.9 28.6 ULN2003AIDRG4 SOIC D 16 2500 333.2 345.9 28.6 ULN2003AIPWR TSSOP PW 16 2000 367.0 367.0 35.0 ULN2003AIPWR TSSOP PW 16 2000 364.0 364.0 27.0 ULN2003AIPWRG4 TSSOP PW 16 2000 367.0 367.0 35.0 ULN2003APWR TSSOP PW 16 2000 367.0 367.0 35.0 ULN2003APWR TSSOP PW 16 2000 364.0 364.0 27.0 ULN2003APWRG4 TSSOP PW 16 2000 367.0 367.0 35.0 ULN2004ADR SOIC D 16 2500 333.2 345.9 28.6 ULN2004ADR SOIC D 16 2500 367.0 367.0 38.0 ULN2004ADRG4 SOIC D 16 2500 367.0 367.0 38.0 ULN2004ADRG4 SOIC D 16 2500 333.2 345.9 28.6 ULQ2003ADR SOIC D 16 2500 333.2 345.9 28.6 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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