Technical Reference Note Embedded Power for Business-Critical Continuity SXX06E Rev. 08.010.6 Page 1 of 2 Rev. 12.07.09 LGA C Series of 28 LGA C Series 3/6/10/20 A Total Power: 15-100 Watts No. of Outputs:Single Special Features •3,6,10 and 20 A output current rating •Wide input voltage range: up to 14 Vdc •Adjustable output voltage: 0.59-5.1 V •Excellent transient response •High efficiency •Output margining •Power enable •Minimal airflow requirement •Termination voltage capability •Ultra compact profile and footprint •RoHS compliant •Remote sense Standards Designed to meet EN60950 when utilized in end use equipment. International Standards for Solderability: J-STD-002B IEC-60068-2-58 Product Family: Function: Usage: LGA C Series Embedded Power Device ASIC, Memory, FPGAs, Telecom and Networking Equipment, Servers, Industrial Equipment, POLRegulation Definition: The LGA C Series is a new high density, non-isolated converter for space sensitive applications. This Embedded Power Device (EPD) has a wide input range up to14.0 V and offers a 0.59-5.1 V adjustable output with 3, 6, 10 and 20 A capability without derating. This EPD offers a complete feature set of of enable, remote sense, and power good inclusive of a wide adjustable output range. Technical Reference Note Embedded Power for Business-Critical Continuity Rev. 12.07.09 LGA C Series of 28 Electrical Description Electrical Description The LGA C Series is implemented using a voltage mode single-phase synchronous buck topology. A block diagram of the converter is shown in Figure 1. The output voltage is adjustable over a range of 0.59 - 5.1 V by using a resistor or voltage as described on Page 5. (Factory preset is 0.591Vout.) Vin Trim Vout +Sense -Sense The converter can be shut down via the remote ON/ OFF. The remote ON/OFF operates with positive logic that is compatible with popular logic devices. Positive logic implies that the converter is enabled if the remote ON/OFF input is high (or floating), and disabled if it is low. + - Fixed Frequency Voltage Mode Controlled PWM ∩∩∩ Vout Remote ON/OFF GND PGood Figure 1 - Electrical Block Diagram The power good signal is an open collector output that is pulled low by the PWM controller when it detects the output is not within ±10% of its set value. The output is monitored for overcurrent and short-circuit conditions. When the PWM controller detects an overcurrent condition, it forces the module into hiccup mode. A typical application is shown in Figure 2. Rofs+ Rofs- Wide Operating Temperature Range The LGA C Series's ability to accommodate a wide range of ambient temperatures is the result of its extremely high power conversion efficiency and resultant low power dissipation, combined with the excellent thermal performance of the thermally enhanced cover. The maximum output power that the module delivers will depend on a number of parameters, primarily: • • • • Input voltage range Output load current Air velocity (forced or natural convection) Addition of heatisnk Rmargin Margin Control 23 Enable On/Off 12 21 LGA C Series 9-10 5-8 Cin GND 22 Power Good Vout 1-4 Ruvlo Vin 13 15 14 24 +Sense R L O A D Cout Rtrim -Sense GND Figure 2 - Standard Application Drawing The LGA C Series module has an operating temperature range of -40 °C to 85 °C with suitable derating. Technical Reference Note Embedded Power for Business-Critical Continuity Rev. 12.07.09 LGA C Series of 28 Features and Functions Output Voltage Adjustment The output voltage on all models is adjustable from 0.59 - 5.1 V. Undervoltage Lockout The default undervoltage lockout is set as follows: LGA 03/06/10C: 2.9 V LGA20C: 4.3 V Current Limit and Short-Circuit Protection The LGA C models have a built-in non-latching current limit function and full continuous short-circuit protection. The module monitors current through the top and bottom FET. When an overcurrent condition occurs, the module goes into hiccup mode, where it attempts to power up periodically to determine if the problem persists. The output current level is sensed through the voltage drop across the top and bottom FETs during their on time. This type of sensing is affected by temperature due to the change in Rdson. At higher temperatures, the Rdson increases, which lowers the overcurrent point. Note that the module specifications are not guaranteed when the unit is operated in an overcurrent condition. Remote ON/OFF The remote ON/OFF input allows external circuitry to put the LGA C Series converter into a low dissipation sleep mode. Positive logic remote ON/OFF is available as standard. The EPD is turned on if the remote ON/OFF pin is high or floating. Pulling the pin low will turn off the EPD. To guarantee turn-on, the enable voltage must be above 0.50 V. To turn off the enable voltage, it must be pulled below 0.2 V. Figures illustrating the response of the unit to switching on and off using the remote ON/OFF feature are included on pages 13, 16, 20 and 25. Figures 3 and 4 show various circuits for driving the remote ON/OFF feature. The remote ON/OFF input can be driven through a discrete device (e.g. a bipolar signal transistor) or directly from a logic gate output. The output of the logic gate may be an open-collector (or opendrain) device. Please note the remote ON/OFF pin should only be driven in the following range: If, Vin ≤ 5 V, Von/off (max) = Vin If, Vin > 5 V, Von/off (max) = 5 V Technical Reference Note Embedded Power for Business-Critical Continuity Rev. 12.07.09 LGA C Series of 28 Features and Functions (cont'd) Remote ON/OFF (cont'd) LGA C Series Vout Vin Remote ON/OFF LGA C Series 5V PGood Ground Figure 3 - Remote ON/OFF Input Drive Circuit for Non-Isolated Biopolar Vout Vin Remote ON/OFF PGood Ground Figure 4 - Remote ON/OFF Input Drive Circuit for Logic Driver Power Good The LGA C modules have a power good indicator output. This output pin uses positive logic and is opencollector. Also, the power good output is able to sink 10 mA. When the output of the module is within ±10% of the nominal set point, the Power Good pin can be pulled high. Note that Power Good should not be pulled higher than the following conditions: If, Vin ≤ 5 V, Vpgood (max) = Vin If, Vin > 5 V, Vpgood (max) = 5 V Current Sink Capabilities The LGA C series of dc-dc converters is able to current sink as well as current source. The EPD operates over the full output current range at any specified output voltage. This feature allows the LGA C to fit into any voltage termination application. Setting Output Voltage The output of the module can be adjusted from 0.59 V to 5.1 V. This is accomplished by connecting an external resistor between Trim and -Sense as shown in Figure 5 and graphed in Figure 8 or by driving the Trim pin with an external voltage as shown in Figure 6. High accuracy setpoints can be achieved with the use of a potentiometer as shown in Figure 7. Technical Reference Note Embedded Power for Business-Critical Continuity Rev. 12.07.09 LGA C Series of 28 Applications Setting Output Voltage (cont'd) Setting Output Voltage (cont'd) LGA C Series LGA C Series Vout Vout Vin Vin Vt Trim Trim Remote ON/OFF Rtrim Remote ON/OFF Rtrim 2 Rtrim 1 -Sense -Sense Figure 5 - Output Voltage Trim Figure 6 - Output Voltage Trim with Voltage Source The trim equation for the basic configuration shown in Figure 5 is: Rtrim (kΩ) = 1.182 (Vout - 0.591) Where Vout is the desired output voltage and Rtrim is the resistance required between the Trim pin and -Sense. The trim equation for the external voltage configuration shown in Figure 6 is: Rtrim2 (kΩ) = Rtrim1 (1.182 - 2Vt) Rtrim1 (Vout - 0.591) - 1.182 Where Vout is the desired output voltage, Rtrim1 (kΩ) and Rtrim2 (kΩ) are the resistors in Figure 6 and Vt is the applied external output voltage. Note: If, Vin ≤ 5 V, Vpin24 (max) = Vin If, Vin > 5 V, Vpin24 (max) = 5 V Technical Reference Note Embedded Power for Business-Critical Continuity Rev. 12.07.09 LGA C Series of 28 Applications (cont'd) Setting Output Voltage (cont'd) The trim equation for the potentiometer configuration show in Figure 7. 0.591 Vout = (2Rtrim2 + 2Rpot + Rtrim1Rtrim2 + Rtrim1Rpot + 2Rtrim1) (Rtrim2 + Rpot)Rtrim1 * Where Vout is the desired output voltage, Rtrim1(kΩ) and Rtrim2(kΩ) are the resistors in Figure 7 and Rpot is the resistance of the potentiometer. LGA C Series Vout Vin Trim Rtrim1 Remote Rtrim2 Rpot ON/OFF -Sense REQUIRED TRIM RESISTOR (Ω) 1000000 100000 10000 1000 100 10 0 1 2 3 4 5 DESIRED OUTPUT VOLTAGE SETPOINT (V) Figure 7 - Output Voltage Trim with Potentiometer Figure 8 - Typical Trim Curves Undervoltage Lockout These EPD's have built-in undervoltage lockout to ensure reliable output power. The lockout prevents the unit from operating when the input voltage is too low. The UVLO for the LGA03/06/10C can be adjusted with the following equation: 14.8 * 6.81 Ruvlo(kΩ) = 6.81 * Vturn_on - 18.16 The UVLO for the LGA20C can be adjusted with the following equation: 30.1 * 4.22 Ruvlo(kΩ) = 8.577 * Vturn_on - 34.32 Technical Reference Note Applications (cont'd) Embedded Power for Business-Critical Continuity Rev. 12.07.09 LGA C Series of 28 Output Capacitance The LGA C Series has output capacitors inside the converter. Limited output capacitance, 10uF for the 3 A/6A/10A and 50 uF for the 20A, is required for stable operation. When powering loads with large dynamic current requirements, improved voltage regulation is obtained by inserting low ESR capacitors as close as possible to the load. Low ESR ceramic capacitors will handle the short duration high frequency components of the dynamic current requirement. In addition, higher values of electrolytic capacitors should be used to handle the mid-frequency components. It is equally important to use good design practices when configuring the dc distribution system. Low resistance and low inductance PCB layout traces should be utilized, particularly in the high current output section. Remember that the capacitance of the distribution system and the associated ESR are within the feedback loop of the power capabilities, thus affecting the stability and dynamic response of the module. Note that the maximum rated value of output capacitance varies between models and for each output voltage setpoint. A stability vs. Load Capacitance calculator, (see your sales representative), details how an external load capacitance influences the gain and phase margins of the LGA C Series modules. Setting Margin Control To margin the output voltage up, pull the margin control pin high. To margin down, pull the margin control pin low. If the pin is left floating, the feature is disabled. The maximum margining range is ±33% of the output voltage setting, with maximum output at 5.5 V. The equations for margining up and down are as follows: Vmargin_up = 0.1182 * Rmargin * Rtrim + 2k Rtrim Rofs+ Vmargin_down = 0.1182 * Rmargin * Rtrim + 2k Rtrim Rofs Note: The margin control pin cannot be pulled in the following range: If, Vin ≤ 5V then Vmargin(max) = Vin If, Vin > 5V then Vmargin(max) = 5V See Table 1 for suggested margining values. Technical Reference Note Embedded Power for Business-Critical Continuity Rev. 12.07.09 LGA C Series of 28 Applications (cont'd) Setting Margin Control (cont'd) Margin Up and Down 5% Vout_nom (V) Rtrim (kΩ) Rmargin (kΩ) Rofs- (kΩ) Rofs+ (kΩ) Vmargin_down (V) Vout _down (V) Vmargin_up (V) Vout_up (V) 0.9 3.83 2.49 10.0 10.0 0.045 0.855 0.045 0.945 1.2 1.96 2.49 10.0 10.0 0.059 1.141 0.059 1.259 1.8 0.976 2.49 10.0 10.0 0.090 1.710 0.090 1.890 2.5 0.619 2.49 10.0 10.0 0.125 2.375 0.125 2.625 3.3 0.432 2.49 10.0 10.0 0.166 3.134 0.166 3.466 5.0 0.267 2.49 10.0 10.0 0.250 4.750 0.250 5.250 Margin Up and Down 10% 0.9 3.83 4.99 10.0 10.0 0.090 0.810 0.090 0.990 1.2 1.96 4.99 10.0 10.0 0.119 1.081 0.199 1.319 1.8 0.976 4.99 10.0 10.0 0.180 1.620 0.180 1.980 2.5 0.619 4.99 10.0 10.0 0.250 2.250 0.250 2.750 3.3 0.432 4.99 10.0 10.0 0.332 2.968 0.332 3.632 5.0 0.267 4.99 10.0 10.0 0.501 4.499 0.501 5.501 Table 1 - Suggested Margin Values Water Washing Water-washing is not recommended. Interface Finish Electroless Nickel Immersion Gold (ENIG). Solder Paste Solderballs are caused between LGA and substrate due to printing an excessive amount of solderpaste. Stencil apertures should be windowpaned; dividing them into quadrants rather than printing a continuous deposit over the entire pad. This will control the amount of solder available to form a joint between LGA and customer board. Additionally, this will also reduce the formation of voids. Solder Paste Window Paning Figure 9: Window Paning Figure 10: Window Paning Technical Reference Note Embedded Power for Business-Critical Continuity Rev. 12.07.09 LGA C Series of 28 Applications (cont'd) Recommend Placement Method Use of a placement machine with front lighting and pad recognition is recommended. For best results, place the LGA based on the centerpoint of the pad array (case silhouetting is not recommended for placement). Reflow Guidelines For a SnPb process: pads should be above 183 °C (liquidus) for 90 seconds max (60-75 seconds typical) with a peak temperature of 225 °C. For a leadfree SAC305 process: pads should be above 217 °C (liquidus) for 90 seconds max (60-75 seconds typical) with a peak temperature of 250 °C. The LGA Series products passed solderability testing per J-STD-002B and IEC-60068-2-58. The test was conducted by Process Sciences, Inc in August, 2007 Thermal Hotspot The electrical operating conditions of the LGA (shown below) determine how much power is dissipated within the converter. • Input voltage (Vin) • Output voltage (Vo) • Output current (Io) The following parameters further influence the thermal stresses experienced by the converter: • Ambient temperature • Air velocity 1 • Thermal efficiency of the end system application • Parts mounted on system PCB that may block airflow • Real airflow characteristics at the converter location In order to simplify the thermal design, a number of thermal derating plots are provided in this Technical Reference Note. These derating graphs show the load current of the LGA versus the ambient air temperature and forced air velocity. However, since the thermal performance is heavily dependent upon the final system application, the user needs to ensure the thermal reference point temperatures are kept within the recommended temperature rating. It is recommended that the thermal reference point temperatures are measured using a thermocouple or an IR camera. In order to comply with stringent Emerson Network Power derating criteria the ambient temperature should never exceed 85 °C. The case maximum recommended temperature is 100 °C. Please contact Emerson Network Power for further support. 2 LGAXXX-0XSADJJ Figure 11: Thermal Hotspots 1: With Heatsink 2: Without Heatsink Technical Reference Note Embedded Power for Business-Critical Continuity Rev. 12.07.09 LGA C Series 10 of 28 Applications (cont'd) Heatsink Accessory System should be reflowed before attaching heatsink. 1. Clean the top surface of the case with isopropyl alcohol and ensure the case surface is air-dried. 2. Remove clear plastic liner from bottom of the heatsink to expose the adhesive. 3. Align heatsink with case and apply even pressure (10-15 PSI) for 10-20 seconds. Recommended Air flow direction Liner Heatsink Number System with Options Product Family LGA Product - HTSK Product HTSK = Heatsink Package - KIT Package KIT = Heatsink and Adhesive Height* - XXX LGA20 + Heatsink 045 = 0.45" 048 = 0.48" 050 = 0.50" *Height is the total height of the LGA20C-00SADJJ with heatsink attached. Technical Reference Note Embedded Power for Business-Critical Continuity Rev. 12.07.09 LGA C Series 11 of 28 All Models Parameter Test Conditions Min Typ Max Units Absolute Maximums Input Voltage 0 14.0 V Enable Voltage 0 5 V Operating Ambient Temperature -40 85 °C Non-Operating Ambient Temperature -40 125 °C 100 °C 0.591 5.1 V Output Setpoint Accuracy -1.0 +1.0 % Output Regulation (Line) -0.2 +0.2 % Case Temperature Output Specifications Ouput Voltage Duty Cycle 90 % Turn On Specifications Turn On Delay (with Vin) Turn On Delay (with Enable) Output Rise TIme 10% - 90% 2 3 ms 2.0 3 ms 1.5 ms Enable Specifications Signal Low (Unit Off) Signal Low Current Signal High (Unit On) Signal High Current 0 12 Vin 0 0.4 400 15 Moisture Sensitivity Level Material Type 1 UL94V-0 3 FR4 PCB International Standards Solderability uA V Material Ratings Flammability V J-STD-002B IEC-60068-2-58 uA Technical Reference Note Embedded Power for Business-Critical Continuity Rev. 12.07.09 LGA C Series 12 of 28 LGA03C Parameter Test Conditions Min Internal input capacitance rated 16 Vdc max. 3 Typ Max Units 14.0 V 3 A Input Specifications Input Voltage Input Current (Max) Input Current (No Load) 12.0 Vin, 2.5 Vout, 0 Aout 55 mA Input Current (Standby) 12.0 Vin, Module disabled 14 mA 10 uF 1 uF Input Capacitance (Internal) Input Capacitance (External) Required for input ripple current Output Specifications Output Current 0 Output Capacitance (Internal) Output Capacitance (External) Output Ripple/Noise (Peak/Peak) 3 20 A uF 12 Vin, 0.9 Vout (Startup capacitance) 10 3,000 uF 12 Vin, 2.5 Vout (Startup capacitance) 10 1,100 uF 12 Vin, 5.0 Vout (Startup capacitance) 10 450 uF 5 Vin, 0.9 Vout, 10 uF Cout 15 mV 12 Vin, 2.5 Vout, 10 uF Cout 20 mV 12 Vin, 5 Vout, 10 uF Cout 30 mV 5 Vin, 0.9 Vout, 3 Aout 79.1 % 12 Vin, 2.5 Vout, 3 Aout 86.4 % 12 Vin, 5 Vout, 3 Aout 91.8 % Dynamic Load Response (Peak Deviation) 12 Vin, 0.9 Vout, 1.5-3 at 5 A/us, 10 uF Cout 85 mV Dynamic Load Response (Setting Time) 12 Vin, 0.9 Vout, 1.5-3 at 5 A/us, 10 uF Cout 8 us Dynamic Load Response (Peak Deviation) 12 Vin, 2.5 Vout, 1.5-3 at 5 A/us, 10 uF Cout 95 mV Dynamic Load Response (Setting Time) 12 Vin, 2.5 Vout, 1.5-3 at 5 A/us, 10 uF Cout 15 us Hiccup Mode 6 A Telcordia SR-332, Method II, Parts Stress, 40 °C Ambient, 400 LFM, 100% Load 28,037,062 Hours 0.1 oz 1,000 kHz 3 °C/W Efficiency Protection Specification Over Current Protection General Specifications MTBF Weight Switching Frequency Junction to Case Thermal Resistance Technical Reference Note Embedded Power for Business-Critical Continuity Rev. 12.07.09 LGA C Series 13 of 28 LGA03C Output Current (A) All Inputs and Outputs 2.50V Efficiency 4 3.8 3.6 3.4 3.2 0.95 3 Vin 5 Vin 7 Vin 12 Vin 13.8 Vin 0.9 3 2.8 2.6 2.4 2.2 2 100 LFM 0.85 0.8 0.75 0 30 35 40 45 50 55 60 65 70 75 80 1 2 3 85 Output Current (A) Ambient (C) Figure 12: Thermal Derating Curve for All Inputs and Outputs Figure 13: 2.5 V Efficiency vs. Load 5.00V Efficiency 1 0.95 7 Vin 12 Vin 13.8 Vin 0.9 0.85 0.8 0 1 2 3 Output Current (A) Figure 14: 5 V Efficiency vs. Load Figure 15: Remote On/Off (Channel 1: Output Voltage, Channel 2: PGood, Channel 3: Enable) Figure 16: Typical Output Ripple Figure 17: Transient Response 100% - 50% (Channel 4: Current Step at 1 A/div, Channel 1: Output Voltage Deviation) Technical Reference Note LGA03C Figure 18: Transient Response 50% - 100% (Channel 4: Current Step at 1 A/div, Channel 1: Output Voltage Deviation) Embedded Power for Business-Critical Continuity Rev. 12.07.09 LGA C Series 14 of 28 Technical Reference Note Embedded Power for Business-Critical Continuity Rev. 12.07.09 LGA C Series 15 of 28 LGA06C Parameter Test Conditions Min Internal input capacitance rated 16 Vdc max. 3 Typ Max Units 14.0 V 6 A Input Specifications Input Voltage Input Current (Max) Input Current (No Load) 12.0 Vin, 2.5 Vout, 0 Aout 94 mA Input Current (Standby) 12.0 Vin, Module disabled 14 mA 10 uF 1 uF Input Capacitance (Internal) Input Capacitance (External) Required for input ripple current Output Specifications Output Current 0 Output Capacitance (Internal) Output Capacitance (External) Output Ripple/Noise (Peak/Peak) 6 20 A uF 12 Vin, 0.9 Vout (Startup capacitance) 10 7,500 uF 12 Vin, 2.5 Vout (Startup capacitance) 10 1,500 uF 12 Vin, 5.0 Vout (Startup capacitance) 10 750 uF 5 Vin, 0.9 Vout, 10 uF Cout 20 mV 12 Vin, 2.5 Vout, 10 uF Cout 35 mV 12 Vin, 5 Vout, 10 uF Cout 50 mV 5 Vin, 0.9 Vout, 6 Aout 80.1 % 12 Vin, 2.5 Vout, 6 Aout 86.5 % 12 Vin, 5 Vout, 6 Aout 92.1 % Dynamic Load Response (Peak Deviation) 12 Vin, 0.9 Vout, 3-6 at 5 A/us, 10 uF Cout 125 mV Dynamic Load Response (Setting Time) 12 Vin, 0.9 Vout, 3-6 at 5 A/us, 10 uF Cout 8 us Dynamic Load Response (Peak Deviation) 12 Vin, 2.5 Vout, 3-6 at 5 A/us, 10 uF Cout 175 mV Dynamic Load Response (Setting Time) 12 Vin, 2.5 Vout, 3-6 at 5 A/us, 10 uF Cout 8 us Hiccup Mode 11 A Telcordia SR-332, Method II, Parts Stress, 40 °C Ambient, 400 LFM, 100% Load 27,141,984 Hours 0.1 oz 1,000 kHz 3 °C/W Efficiency Protection Specification Over Current Protection General Specifications MTBF Weight Switching Frequency Junction to Case Thermal Resistance Technical Reference Note Embedded Power for Business-Critical Continuity Rev. 12.07.09 LGA C Series 16 of 28 LGA06C Output Current (A) All Inputs and Outputs 2.50V Efficiency 6.1 6.08 6.06 6.04 6.02 0.95 3 Vin 5 Vin 7 Vin 12 Vin 13.8 Vin 0.9 6 5.98 5.96 5.94 5.92 5.9 30 100 LFM 0.85 0.8 35 40 45 50 55 60 65 70 75 80 0 85 2 4 6 Output Current (A) Ambient (C) Figure 19: Thermal Derating Curve for All Inputs and Outputs Figure 20: 2.5 V Efficiency vs. Load 5.01V Efficiency 1 0.95 7 Vin 12 Vin 13.8 Vin 0.9 0.85 0.8 0 2 4 6 Figure 21: 5 V Efficiency vs. Load Figure 22: Remote On/Off (Channel 1: Output Voltage, Channel 2: PGood, Channel 3: Enable) Figure 23: Typical Output Ripple Figure 24: Transient Response 100% - 50% (Channel 4: Current Step at 2 A/div, Channel 1: Output Voltage Deviation) Technical Reference Note LGA06C Figure 25: Transient Response 50% - 100% (Channel 4: Current Step at 2 A/div, Channel 1: Output Voltage Deviation) Embedded Power for Business-Critical Continuity Rev. 12.07.09 LGA C Series 17 of 28 Technical Reference Note Embedded Power for Business-Critical Continuity Rev. 12.07.09 LGA C Series 18 of 28 LGA10C Parameter Test Conditions Min Internal input capacitance rated 16 Vdc max. 3 Typ Max Units 14.0 V 10 A Input Specifications Input Voltage Input Current (Max) Input Current (No Load) 12.0 Vin, 2.5 Vout, 0 Aout 100 mA Input Current (Standby) 12.0 Vin, Module disabled 14 mA 10 uF 1 uF Input Capacitance (Internal) Input Capacitance (External) Required for input ripple current Output Specifications Output Current 0 Output Capacitance (Internal) Output Capacitance (External) Output Ripple/Noise (Peak/Peak) 10 20 A uF 12 Vin, 0.9 Vout (Startup capacitance) 10 7,500 uF 12 Vin, 2.5 Vout (Startup capacitance) 10 2,400 uF 12 Vin, 5.0 Vout (Startup capacitance) 10 1,200 uF 5 Vin, 0.9 Vout, 10 uF Cout 30 mV 12 Vin, 2.5 Vout, 10 uF Cout 40 mV 12 Vin, 5 Vout, 10 uF Cout 45 mV 5 Vin, 0.9 Vout, 10 Aout 76.6 % 12 Vin, 2.5 Vout, 10 Aout 85.9 % 12 Vin, 5 Vout, 10 Aout 91.7 % Dynamic Load Response (Peak Deviation) 12 Vin, 0.9 Vout, 5-10 at 5 A/us, 10 uF Cout 90 mV Dynamic Load Response (Setting Time) 12 Vin, 0.9 Vout, 5-10 at 5 A/us, 10 uF Cout 8 us Dynamic Load Response (Peak Deviation) 12 Vin, 2.5 Vout, 5-10 at 5 A/us, 10 uF Cout 135 mV Dynamic Load Response (Setting Time) 12 Vin, 2.5 Vout, 5-10 at 5 A/us, 10 uF Cout 8 us Hiccup Mode 20 A Telcordia SR-332, Method II, Parts Stress, 40 °C Ambient, 400 LFM, 100% Load 27,141,984 Hours 0.1 oz 1,000 kHz 9 °C/W Efficiency Protection Specification Over Current Protection General Specifications MTBF Weight Switching Frequency Junction to Case Thermal Resistance Technical Reference Note Embedded Power for Business-Critical Continuity Rev. 12.07.09 LGA C Series 19 of 28 LGA10C 0.9V 5Vin 10 9.5 9 8.5 8 100LF M 200LF M 7.5 7 6.5 6 5.5 5 300LF M 400LF M 30 40 50 60 70 Output Current (A) Output Current (A) 0.9V 3.3Vin 10 9.5 9 8.5 8 7.5 7 6.5 6 5.5 5 80 100LF M 30 40 50 0.9V 12Vin 2.5V 3.3Vin 200LF M 9 8.8 8.6 8.4 8.2 8 300LF M 400LF M 40 50 60 70 10 9.5 9 8.5 8 7.5 7 6.5 100LF M 200LF M 300LF M 400LF M 6 5.5 5 80 30 40 50 Ambient (C) 60 70 80 Ambient (C) Figure 28: Thermal Derating Curve - 0.9 V Figure 29: Thermal Derating Curve - 2.5 V 2.5V 5Vin 2.5V 12Vin 10 9.5 9 8.5 8 7.5 7 6.5 100LF M 200LF M 300LF M 400LF M 6 5.5 5 40 50 60 70 80 Ambient (C) Figure 30: Thermal Derating Curve - 2.5 V Output Current (A) Output Current (A) 80 Figure 27: 2 Thermal Derating Curve - 0.9 V 100LF M 30 70 Figure 26: Thermal Derating Curve - 0.9 V 10 9.8 9.6 9.4 9.2 30 60 Ambient (C) Output Current (A) Output Current (A) Ambient (C) 10 9.8 9.6 9.4 9.2 100LF M 200LF M 9 8.8 8.6 8.4 8.2 8 300LF M 400LF M 30 40 50 60 70 80 Ambient (C) Figure 31: Thermal Derating Curve - 2.5 V Technical Reference Note Embedded Power for Business-Critical Continuity Rev. 12.07.09 LGA C Series 20 of 28 Output Current (A) 5V 12Vin 2.5V Efficiency 10 9.8 9.6 0.95 9.4 9.2 9 8.8 8.6 100LF M 200LF M 300LF M 400LF M 8.4 8.2 8 3 Vin 5 Vin 7 Vin 12 Vin 13.8 Vin 0.9 0.85 0.8 30 40 50 60 70 0 80 5 10 Output Current (A) Ambient (C) Figure 32: Thermal Derating Curve - 5 V Figure 33: 2.5 V Efficiency vs. Load 5.0V Efficiency 1 7 Vin 12 Vin 13.8 Vin 0.95 0.9 0.85 0 5 10 Output Current (A) Figure 34: 5 V Efficiency vs. Load Figure 36: Typical Output Ripple Figure 35: Remote On/Off (Channel 1: Output Voltage, Channel 2: PGood, Channel 3: Enable) Figure 37: Transient Response 100% - 50% (Channel 1: Output Voltage Deviation, Channel 2: Current Step at 2 A/div) Technical Reference Note LGA10C Figure 38: Transient Response 50% - 100% (Channel 1: Output Voltage Deviation, Channel 2: Current Step at 2 A/div) Embedded Power for Business-Critical Continuity Rev. 12.07.09 LGA C Series 21 of 28 Technical Reference Note Embedded Power for Business-Critical Continuity Rev. 12.07.09 LGA C Series 22 of 28 LGA20C Parameter Test Conditions Min Internal input capacitance rated 16 Vdc max. 4.5 Typ Max Units 14.0 V 20 A Input Specifications Input Voltage Input Current (Max) Input Current (No Load) 12.0 Vin, 2.5 Vout, 0 Aout 87 mA Input Current (Standby) 12.0 Vin, Module disabled 13 mA 10 uF 10 uF Input Capacitance (Internal) Input Capacitance (External) Required for input ripple current Output Specifications Output Current 0 Output Capacitance (Internal) Output Capacitance (External) Output Ripple/Noise (Peak/Peak) 20 20 A uF 12 Vin, 0.9 Vout (Startup capacitance) 50 7,500 uF 12 Vin, 2.5 Vout (Startup capacitance) 50 2,400 uF 12 Vin, 5.0 Vout (Startup capacitance) 50 500 uF 5 Vin, 0.9 Vout, 10 uF Cout 25 mV 12 Vin, 2.5 Vout, 10 uF Cout 45 mV 12 Vin, 5 Vout, 10 uF Cout 70 mV 5 Vin, 0.9 Vout, 20 Aout 77.3 % 12 Vin, 2.5 Vout, 20 Aout 86.6 % 12 Vin, 5 Vout, 20 Aout 91.2 % Dynamic Load Response (Peak Deviation) 12 Vin, 0.9 Vout, 10-20 at 5 A/us, 50 uF Cout 95 mV Dynamic Load Response (Setting Time) 12 Vin, 0.9 Vout, 10-20 at 5 A/us, 50 uF Cout 12 us Dynamic Load Response (Peak Deviation) 12 Vin, 2.5 Vout, 10-20 at 5 A/us, 50 uF Cout 175 mV Dynamic Load Response (Setting Time) 12 Vin, 2.5 Vout, 10-20 at 5 A/us, 50 uF Cout 20 us Hiccup Mode 27 A Telcordia SR-332, Method II, Parts Stress, 40 °C Ambient, 400 LFM, 100% Load 28,388,596 Hours Weight 0.1 oz Switching Frequency 800 kHz 2 °C/W Efficiency Protection Specification Over Current Protection General Specifications MTBF Junction to Case Thermal Resistance Technical Reference Note Embedded Power for Business-Critical Continuity Rev. 12.07.09 LGA C Series 23 of 28 LGA20C 0.9Vout 12Vin 20 20 18 18 16 14 100LF M 12 200LF M 10 300LF M 8 400LF M 6 Output Current (A) Output Current (A) 0.9Vout 5Vin 16 14 100LFM 12 200LFM 10 300LFM 8 400LFM 6 4 4 2 2 30 40 50 60 70 30 80 40 50 Figure 39: Thermal Derating Curve (5 Vin - 0.9 Vout) 80 2.5Vout 12Vin 20 20 18 18 16 14 100LF M 12 200LF M 10 300LF M 8 400LF M 6 Output Current (A) Output Current (A) 70 Figure 40: Thermal Derating Curve (12 Vin - 0.9 Vout) 2.5Vout 5Vin 16 14 100LFM 12 200LFM 10 300LFM 8 400LFM 6 4 4 2 2 30 40 50 60 70 30 80 40 50 60 70 80 Ambient (C) Ambient (C) Figure 41: Thermal Derating Curve (5 Vin - 2.5 Vout) Figure 42: Thermal Derating Curve (12 Vin - 2.5 Vout) 5Vout 12Vin 0.9Vout 5Vin 20 20 18 18 16 14 100LF M 12 200LF M 10 300LF M 8 400LF M 6 4 Output Current (A) Output Current (A) 60 Ambient (C) Ambient (C) 16 14 12 100LFM 10 200LFM 8 6 4 2 2 30 40 50 60 70 80 Ambient (C) Figure 43: Thermal Derating Curve (12 Vin - 5 Vout) 30 40 50 60 70 80 Ambient (C) Figure 44: Thermal Derating Curve (5 Vin - 0.9 Vout) with 0.5" Heatsink Technical Reference Note Embedded Power for Business-Critical Continuity Rev. 12.07.09 LGA C Series 24 of 28 LGA20C 2.5Vout 5Vin 20 20 18 18 16 16 14 100LFM 12 200LFM 10 300LFM 8 6 Output Current (A) Output Current (A) 0.9Vout 12Vin 14 100LFM 12 200LFM 10 300LFM 8 400LFM 6 4 4 2 2 30 40 50 60 70 30 80 40 50 70 80 Figure 46: Thermal Derating Curve (5 Vin - 2.5 Vout) with 0.5" Heatsink Figure 45: Thermal Derating Curve (12 Vin - 0.9 Vout) with 0.5" Heatsink 2.5Vout 12Vin 5Vout 12Vin 20 20 18 18 16 14 100LFM 12 200LFM 10 300LFM 8 400LFM 6 4 Output Current (A) Output Current (A) 60 Ambient (C) Ambient (C) 16 14 100LFM 12 200LFM 10 300LFM 8 400LFM 6 4 2 2 30 40 50 60 70 80 30 40 50 Ambient (C) 60 70 80 Ambient (C) Figure 47: Thermal Derating Curve (12 Vin - 2.5 Vout) with 0.5" Heatsink Figure 48: Thermal Derating Curve (12 Vin - 5 Vout) with 0.5" Heatsink 2.51V Efficiency 5.06V Efficiency 0.95 1 5 Vin 7 Vin 12 Vin 13.8 Vin 0.9 0.85 0.8 0.95 7 Vin 12 Vin 13.8 Vin 0.9 0.85 0.8 0.75 0 5 10 15 20 Output Current (A) Figure 49: 2.5 V Efficiency vs. Load 0 5 10 15 20 Output Current (A) Figure 50: 5 V Efficiency vs. Load Technical Reference Note Embedded Power for Business-Critical Continuity Rev. 12.07.09 LGA C Series 25 of 28 LGA20C Figure 51: Remote On/Off (Channel 1: Output Voltage, Channel 2: PGood, Channel 3: Enable) Figure 52: Typical Output Ripple Figure 53 Transient Response 50% - 100% (Channel 1: Output Voltage Deviation, Channel 4: Current Step at 5 A/div ) Figure 54: Transient Response 100% - 50% (Channel 1: Output Voltage Deviation, Channel 4: Current Step at 5 A/div) Technical Reference Note Embedded Power for Business-Critical Continuity Rev. 12.07.09 LGA C Series 26 of 28 Mechanical drawings .139 3.53 MAX SECTION A-A SCALE 4 : 1 A A.139 3.53 MAX A .020±.003 0.51±0.08 SECTION A-A SCALE 4 : 1 A .031 0.79 PCB .020 REF ±.003 0.51±0.08 .102 2.59 REF A Component Height .031 0.79 PCB REF Model # DIM A in (mm) .102 2.59 REF A .650 16.51 MAX .650 16.51 MAX A .008 A .650 16.51 MAX LGA03 LGA06 LGA10 0.129 (3.27) LGA20 0.210 (5.33) .008 A .650 16.51 MAX Recommended Application System Board Footprint Solder Paste Stencil PIN 16 PIN 1 PIN 4 0 (0) MODULE OUTLINE 0.690 (17.53) 0.564 (14.33) 0.418 (10.62) 0.272 (6.91) 0.126 (3.20) 0 (0) 0 (0) 0 0 .049 1.24 .098 2.49 .147 3.73 .245 6.22 .294 7.47 .196 4.98 .045 1.14 .090 2.29 .114 2.90 .177 4.50 0.114" X 0.104" 2X .135 3.43 .024 0.61 .180 4.57 .225 5.72 0.114" X 0.114" 8X .317 8.05 .487 12.37 .114 2.90 .114 2.90 KEEP OUT AREA Tolerance Note: ± 0.010 (0.25) .048 1.22 PIN 9 .024 0.61 .340 8.64 PIN 15 0.612 (15.55) 0.567 (14.40) 0.522 (13.26) 0.477 (12.12) 0.432 (10.97) 0.387 (9.83) PIN 11 PIN 8 0.295 (7.50) PIN 5 8X .120 X .120 .343 8.71 .042 1.07 0.570 (14.48) PIN 10 0.125 (3.18) 0.024" X.024" 14X 13X .104 2.64 0 0 0.690 (17.53) 0.435 (11.05) .392 9.96 .487 12.37 14X .025 X .025 PIN 24 .194 4.93 2X .120 X .110 0.220 (5.59) 0.269 (6.83) 0.318 (8.08) 0.367 (9.32) 0.416 (10.57) 0.465 (11.81) 0.514 (13.06) 0.563 (14.30) 0.612 (15.54) 0 (0) Recommend Stencil thickness of 6 mil (see window paning on page 9) Technical Reference Note Embedded Power for Business-Critical Continuity Rev. 12.07.09 LGA C Series 27 of 28 Packaging LGA03C, 06C, 10C EIA DIMENSIONS W 32.0 ±0.30 E 1.75 ±0.10 F 14.2 ±0.10 So 28.4 ±0.10 P 24.0 ±0.10 Po 4.0 ±0.10 P2 2.0 ±0.10 Do Ø 1.5 +0.10 -0.00 D1 Ø 2.0 MIN T 0.40 ±0.05 Ao 16.6 ±0.10 Bo 16.7 ±0.10 Ko 3.7 ±0.10 LGA20C LGA20C EIA DIMENSIONS Notes: a) b) c) d) e) T&R packaging comes in Standard 13" reel size. Tape material: Black, Anti-static Polystyrene Amine free. Surface Resistivity: <1012 Ohms/Sq Module quanity/reel: LGA03C, LGA06C, LGA10 C = 600 pcs LGA20C = 450pcs. Products are MSL 3. W 32.0 ±0.30 E 1.75 ±0.10 F 14.2 ±0.10 So 28.4 ±0.10 P 24.0 ±0.10 Po 4.0 ±0.10 P2 2.0 ±0.10 Do Ø 1.5 +0.10 -0.00 D1 Ø 2.0 MIN T 0.40 ±0.05 Ao 16.8 ±0.10 Bo 16.8 ±0.10 Ko 5.8 ±0.10 Technical Reference Note Embedded Power for Business-Critical Continuity Rev. 12.07.09 LGA C Series 28 of 28 Model Number System with Options Product Family Rated Output Current LGA Land Grid Array Performance XX C Rated Output Current 03 = 3 Amp 06 = 6 Amp 10 = 10 Amp 20 = 20 Amp Performance C = Cost Optimized Input Voltage - Type of Output Americas Options RoHS Compliance XX SADJ X J Input Voltage 00 = 3-14.0 V 01 = 4.5-14.0 V Type of Output Single Adjustable Output Options X = Various Options (see Sales Rep) RoHS Compliance J = Pb free (RoHS 6/6 compliant) LGA Package Product - HTSK - Land Grid Array Product HTSK = Heatsink KIT Asia (HK) Height* - Package Heatsink and Adhesive XXX 16th - 17th Floors, Lu Plaza 2 Wing Yip Street, Kwun Tong Kowloon, Hong Kong Telephone: +852 2176 3333 Facsimile: +852 2176 3888 LGA20 + Heatsink 045 = 0.45" 048 = 0.48" 050 = 0.50" *Height is the total height of the LGA20C-00SADJJ with heatsink attached. For global contact, visit: Operating Information Output Power (Max.) Input Voltage Europe (UK) Waterfront Business Park Merry Hill, Dudley West Midlands, DY5 1LX United Kingdom Telephone: +44 (0) 1384 842 211 Facsimile: +44 (0) 1384 843 355 Heatsink Number System with Options Product Family 5810 Van Allen Way Carlsbad, CA 92008 USA Telephone: +1 760 930 4600 Facsimile: +1 760 930 0698 Output Voltage Output Current (Min.) Output Current (Max.) Efficiency (Typical) Regulation Load Standard Model Numbers 15 W 3-14.0 Vdc 0.59-5.1 Vdc 0A 3A 92% ±0.5% LGA03C-00SADJJ 30 W 3-14.0 Vdc 0.59-5.1 Vdc 0A 6A 92% ±0.5% LGA06C-00SADJJ 50 W 3-14.0 Vdc 0.59-5.1 Vdc 0A 10 A 92% ±0.5% LGA10C-00SADJJ 100 W 4.5-14.0 Vdc 0.59-5.1 Vdc 0A 20 A 91% ±0.5% LGA20C-01SADJJ NA NA NA NA NA NA NA LGA-HTSK-KIT-XXX www.PowerConversion.com techsupport.embeddedpower @emerson.com While every precaution has been taken to ensure accuracy and completeness in this literature, Emerson Network Power assumes no responsibility, and disclaims all liability for damages resulting from use of this information or for any errors or omissions. Emerson Network Power. The global leader in enabling business-critical continuity. AC Power Pin Chart Connectivity Pin Assignments Embedded Computing Single Output 1 Vout 2 Vout 3 Vout 4 Vout 5 GND 6 GND 7 GND 8 GND Embedded Power DC Power 9 10 11 12 13 14 15 16 This is a Preliminary Datasheet. Emerson Network Power reserves the right to make changes to the information contained herein without notice and assumes no liability as a result of its use or application. Vin Vin NC - Offset + Offset - Sense + Sense NC 17 18 19 20 21 22 23 24 NC NC NC NC Enable Power Good Margin Control Trim Monitoring Outside Plant Power Switching & Controls Precision Cooling Racks & Integrated Cabinets Services Surge Protection EmersonNetworkPower.com Emerson Network Power and the Emerson Network Power logo are trademarks and service marks of Emerson Electric Co. ©2009 Emerson Electric Co.