TI HD3SS3415

HD3SS3415
www.ti.com
SLAS840 – MARCH 2012
4-Channel High-Performance Differential Switch
GND
A1C1+
C1-
NC
GND
Top View
RUA
Package
VDD
A2+
A2-
SEL
GND
B2+
C2+
B2-
C2-
VDD
NC
A3+
A3-
B3+
NC
21
18
21
GND
22
B3GND
17
22
C3+
C3-
1
B0NC
VDD
B1+
B1-
38
39
42
B0+
C0+
C0A1+
18
Desktop and Notebook PCs
Server/Storage Area Networks
PCI Express Backplanes
Shared I/O Ports
GND
A0-
17
•
•
•
•
38
39
APPLICATIONS
A0+
1
•
•
•
42
•
•
Compatible with Multiple Interface Standards
Operating up to 12Gbps Including PCI Express
Gen III and USB 3.0
Wide –3dB Differential BW of over 8GHz
Excellent Dynamic Characteristics (at 4GHz)
– Crosstalk = –35dB
– Off Isolation = –19dB
– Insertion Loss = –1.5dB
– Return Loss = –11dB
VDD Operating Range 3.3 V ±10%
Small 3.5 mm x 9.0 mm, 42-Pin TQFN Package
Common Industry Standard Pinout
GND
VDD
•
NC
FEATURES
1
VDD
GND
Check for Samples: HD3SS3415
Figure 1. HD3SS3415 Pinout & Switch Flow
Through Routing
DESCRIPTION
The HD3SS3415 is a high-speed passive switch capable of switching four differential channels, including
applications such as two full PCI Express x1 lanes from one source to one of two target locations in a PC/server
application. With its bidirectional capability the HD3SS3415 will also support applications that allow connections
between one target and two source devices, such as a shared peripheral between two platforms. The
HD3SS3415 has a single control line (SEL Pin) which can be used to control the signal path between Port A and
either Port B or Port C.
The HD3SS3415 is offered in an industry standard 42-pin QFN package available in a common footprint shared
by several other vendors. The device is specified to operate from a single supply voltage of 3.3V over the full
industrial temperature range of –40°C to 85ºC
The HD3SS3415 is a generic 4-CH high speed mux/demux type of switch that can be used for routing highspeed signals between two different locations on a circuit board. Although it was designed specifically to address
PCI Express Gen III applications, the HD3SS3415 will also support several other high-speed data protocols with
a differential amplitude of <1800mVpp and a common mode voltage of <2.0V, as with USB 3.0 and DisplayPort
1.2. The device’s one select input (SEL) pin can easily be controlled by an available GPIO pin within a system or
from a micro-controller.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2012, Texas Instruments Incorporated
HD3SS3415
SLAS840 – MARCH 2012
www.ti.com
ORDERING INFORMATION (1)
(1)
PART NUMBER
PART MARKING
PACKAGE
HD3SS3415RUAR
HD3SS3415
42-pin RUA Reel (Large)
HD3SS3415RUAT
HD3SS3415
42-pin RUA Reel (Small)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com
Table 1. HD3SS3415 Control Logic
CONTROL PIN (SEL)
PORT A TO PORT B CONNECTION STATUS
PORT A TO PORT C CONNECTION STATUS
L (Default State)
Connected
Disconnected
H
Disconnected
Connected
FUNCTIONAL DIAGRAM
VDD
MUX 0
B0+
B0C0+
C0-
A0+
A0SEL
SEL
100kO
C1+
C1-
SEL
MUX 1
B1+
B1-
A1+
A1-
SEL
C2+
C2-
MUX 2
B2+
B2A2+
A2-
C3+
C3-
MUX 3
SEL
B3+
B3-
A3+
A3-
GND
PIN FUNCTIONS
PIN
PIN NAME
I/O
DESCRIPTION
1
2
A0+
A0–
I/O
Port A, Channel 0, High Speed Positive Signal
Port A, Channel 0, High Speed Negative Signal
5
6
A1+
A1–
I/O
Port A, Channel 1, High Speed Positive Signal
Port A, Channel 1, High Speed Negative Signal
SWITCH PORT A
2
Copyright © 2012, Texas Instruments Incorporated
HD3SS3415
www.ti.com
SLAS840 – MARCH 2012
PIN FUNCTIONS (continued)
PIN
PIN NAME
10
11
A2+
A2–
I/O
I/O
Port A, Channel 2, High Speed Positive Signal
Port A, Channel 2, High Speed Negative Signal
DESCRIPTION
14
15
A3+
A3–
I/O
Port A, Channel 3, High Speed Positive Signal
Port A, Channel 3, High Speed Negative Signal
37
36
B0+
B0–
I/O
Port B, Channel 0, High Speed Positive Signal
lPort B, Channel 0, High Speed Negative Signal
33
32
B1+
B1–
I/O
Port B, Channel 1, High Speed Positive Signal
Port B, Channel 1, High Speed Negative Signal
28
27
B2+
B2–
I/O
Port B, Channel 2, High Speed Positive Signal
Port B, Channel 2, High Speed Negative Signal
24
23
B3+
B3–
I/O
Port B, Channel 3, High Speed Positive Signal
Port B, Channel 3, High Speed Negative Signal
3
4
C0+
C0–
I/O
Port C, Channel 0, High Speed Positive Signal
Port C, Channel 0, High Speed Negative Signal
7
8
C1+
C1–
I/O
Port C, Channel 1, High Speed Positive Signal
Port C, Channel 1, High Speed Negative Signal
12
13
C2+
C2–
I/O
Port C, Channel 2, High Speed Positive Signal
Port C, Channel 2, High Speed Negative Signal
16
17
C3+
C3–
I/O
Port C, Channel 3, High Speed Positive Signal
Port C, Channel 3, High Speed Negative Signal
30
SEL
I
9, 19, 26, 34, 41
VDD
Supply
Positive power supply voltage
18, 20, 22, 29,
38, 40, 42,
Center Pad
GND
Supply
Negative power supply voltage
21, 25, 31, 35, 39
NC
SWITCH PORT B
SWITCH PORT C
CONTROL, SUPPLY, AND NO CONNECT
Select between port B or port C. Internally tied to GND via 100kΩ resistor
Electrically not connected
Table 2. MUX Pin Connections (1)
PORT A CHANNEL
A0+
(1)
PORT B OR PORT C CHANNEL
CONNECTED TO PORT A CHANNEL
SEL = L
SEL = H
B0+
C0+
A0–
B0–
C0–
A1+
B1+
C1+
A1–
B1–
C1–
A2+
B2+
C2+
A2–
B2–
C2–
A3+
B3+
C3+
A3–
B3–
C3–
The HD3SS3415 can tolerate polarity inversions for all differential signals on Ports A, B and C. Care
should be taken to ensure the same polarity is maintained on Port A vs. Port B/C.
Copyright © 2012, Texas Instruments Incorporated
3
HD3SS3415
SLAS840 – MARCH 2012
www.ti.com
HD3SS3415
Chipset
Memory/GPU
Hub
Port B
x2
Port C
x2
Port B
x2
Port C
x2
x8
x16
HD3SS3415
Chipset
I/O Hub
HD3SS3415
iGPU
GPIO
Port B
x2
Port C
x2
x8 Graphics Card Slot
Port A
x2
x16 Graphics Card Slot
Microprocessor
HD3SS3415
TYPICAL APPLICATION
Port B
x2
Port C
x2
SEL Pins
ABSOLUTE MAXIMUM RATINGS (1) (2)
Over operating free-air temperature range (unless otherwise noted)
VALUE
Supply voltage range (VDD)
Voltage range
Electrostatic discharge
(1)
(2)
(3)
(4)
MIN
MAX
Absolute minimum/maximum supply voltage range
–0.5
4
Differential I/O
–0.5
4
Control pin (SEL)
–0.5
VDD+0.5
Human body model (3)
±4,000
Charged-device model (4)
±1,500
UNIT
V
V
V
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any conditions beyond those indicated under recommended operating conditions
is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltage values, except differential voltages, are with respect to network ground terminal.
Tested in accordance with JEDEC/ESDA JS-001-2011
Tested in accordance with JEDEC JESD22 C101-E
THERMAL INFORMATION
THERMAL METRIC (1)
HD3SS3415
42-PIN TQFN (RUA)
θJA
Junction-to-ambient thermal resistance
53.8
θJCtop
Junction-to-case (top) thermal resistance
38.2
θJCbot
Junction-to-case (bottom) thermal resistance
21.9
θJB
Junction-to-board thermal resistance
27.4
ψJT
Junction-to-top characterization parameter
5.6
ψJB
Junction-to-board characterization parameter
Device Power Dissipation (PD)
(1)
4
UNITS
°C/W
27.3
15.5 (Typ)
21.6 (Max)
mW
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s) :HD3SS3415
HD3SS3415
www.ti.com
SLAS840 – MARCH 2012
RECOMMENDED OPERATING CONDITIONS
Typical values for all parameters are at VDD = 3.3V and TA = 25°C. (Temperature limits are specified by design)
MIN
TYP
3.3
MAX
UNIT
VDD
Supply voltage
3.0
3.6
V
VIH
Input high voltage (SEL Pin)
2.0
VDD
V
VIL
Input low voltage (SEL Pin)
–0.1
0.8
V
VI/O_Diff
Differential voltage (differential pins) Switch I/O diff voltage
0
1.8
VPP
VI/O_CM
Common voltage (differential pins)
Switch I/O common mode voltage
0
2.0
TA
Operating free-air temperature
Ambient temperature
–40
85
V
o
C
ELECTRICAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
DEVICE PARAMETERS
IIH
Input High Voltage (SEL)
VDD = 3.6 V; VIN = VDD
95
µA
IIL
Input Low Voltage (SEL)
VDD = 3.6 V; VIN = GND
1
µA
ILK
Leakage Current (Differential
I/O pins)
VDD = 3.6 V; VIN = 0 V; VOUT = 2 V
(ILK On OPEN outputs) [Ports B and C]
130
µA
VDD = 3.6 V, VIN = 2 V; VOUT = 0 V
(ILK On OPEN outputs) [Port A]
4
IDD
Supply Current
VDD = 3.6 V; SEL = VDD/GND; Outputs Floating
4.7
CON
Outputs ON Capacitance
VIN = 0 V; Outputs Open; Switch ON
1.5
COFF
Outputs OFF Capacitance
VIN = 0 V; Outputs Open, Switch OFF
1
RON
Output ON resistance
VDD = 3.3 V; VCM = 0.5 V to 1.5 V ; IO = –8 mA
5
On resistance match between
channels
ΔRON
RFLAT_ON
6
mA
pF
pF
8
Ω
VDD = 3.3 V ; –0.35 V ≤ VIN ≤ 1.2 V; IO = –8 mA
2
Ω
On resistance match between
pairs of the same channel
VDD = 3.3 V; –0.35 V ≤ VIN ≤ 1.2 V; IO = –8 mA
0.7
Ω
On resistance flatness
(RON(MAX) – RON(MAIN)
VDD = 3.3 V; –0.35 V ≤ VIN ≤ 1.2 V
1.15
Ω
85
ps
DEVICE PARAMETERS (Continued) RSC and RLOAD = 50Ω and CL = 50 pF unless otherwise noted
tPD
Switch propagation delay
SEL-to-switch Ton
SEL-to-switch Toff
TSKEW_Inter
Inter-pair output skew (CHCH)
Rsc and RLOAD = 50Ω
Rsc and RLOAD = 50Ω
70
250
70
250
Rsc and RLOAD = 50Ω
TSKEW_Intra Intra-pair output skew (bit-bit)
RL
XTALK
OIRR
IL
BW
Differential return loss (VCM = f = 0.3 MHz
0V)
f = 2500 MHz
Also see typical plots section
f = 4000 MHz
ns
20
ps
8
ps
–28
–12
dB
–11
Differential Crosstalk(VCM =
0V)
Also see typical plots section
f = 0.3 MHz
–90
f = 2500 MHz
–39
f = 4000 MHz
–35
Differential Off-Isolation(VCM
= 0V)
Also see typical plots section
f = 0.3 MHz
–75
f = 2500 MHz
–22
f = 4000 MHz
–19
Differential Insertion Loss
(VCM = 0V)
Also see typical plots section
f = 0.3 MHz
–0.5
f = 2500 MHz
–1.1
f = 4000 MHz
–1.5
Band Width
At –3 dB
8
dB
dB
dB
GHz
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Product Folder Link(s) :HD3SS3415
5
HD3SS3415
SLAS840 – MARCH 2012
www.ti.com
TEST TIMING DIAGRAMS
Select to Switch Output On (TON) and Off (TOFF)
50%
SEL
90%
VOUT
10%
Toff
Ton
Figure 2. Switch On/Off Timing Diagram
Propagation Delay and Skew
VDD
RSC = 50W
An+
RSC = 50W
HD3SS3415
Bn+/Cn+
RL = 50W
An-
Bn-/CnRL = 50W
SEL
VDD
VIN+
50%
50%
50%
50%
0V
VDD
VIN-
0V
VDD
VOUT+
50%
50%
50%
50%
0V
VDD
VOUT+
0V
tP1
tP1
TSKEWInter = Difference between tPD for any two pairs of outputs
TSKEWIntra = Difference between tP1 and tP2 of same pair
Figure 3. Propagation Delay Timing Diagram and Test Setup
6
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Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s) :HD3SS3415
HD3SS3415
www.ti.com
SLAS840 – MARCH 2012
TYPICAL PERFORMANCE PLOTS
m1
m2m3
5
m1
freq= 300.0kHz
dB(SDD21)=-0.361
d B (SD D 2 1 )
m4
-5
m2
freq= 2.514GHz
dB(SDD21)=-0.951
-10
-15
-5
m7
m6
-10
freq, Hz
Figure 4. Differential Insertion Loss
Figure 5. Differential Return Loss
0
0
m1
freq= 300.0kHz
dB(SDD21)=-86.588
-40
m2
freq= 2.514GHz
dB(SDD21)=-33.793
-60
m1
m3
freq= 3.985GHz
dB(SDD21)=-29.900
-100
m1
freq= 300.0kHz
dB(SDD21)=-78.265
m2m3
-20
d B ( S D D 2 1)
m2m3
-20
d B ( S D D 2 1)
2E 10
1E 10
-30
m7
freq= 3.985GHz
dB(SDD11)=-10.275
m5
1E 9
m4
freq= 8.724GHz
dB(SDD21)=-3.019
-25
1E 8
-20
1 E7
2E 10
1E 10
1E 9
1E 8
1E 7
1E 6
m3
freq= 3.985GHz
dB(SDD21)=-1.413
freq, Hz
-80
m6
freq= 2.514GHz
dB(SDD11)=-13.591
-15
1E 6
-20
m5
freq= 300.0kHz
dB(SDD11)=-28.295
0
d B(S D D 1 1 )
0
m2
freq= 2.514GHz
dB(SDD21)=-22.547
-40
-60
m3
freq= 3.985GHz
dB(SDD21)=-19.244
m1
-80
-100
-120
2E 10
1E 10
1E 9
1E 8
1 E7
1E 6
2E 10
1E 10
1E 9
1E 8
1 E7
1E 6
freq, Hz
freq, Hz
Figure 6. Differential Crosstalk
Figure 7. Differential Off Isolation
SOURCE EYE DIAGRAM
A
3.1 Inches Rogers
Microstrip
Oscilloscope
10Gbps PRBS 2 7- 1
Vi=0.8Vpp ; Vcm =0V
Figure 8. Source Eye Diagram Test Setup
Figure 9. 10Gbps Source Eye Diagram at A: VID = 800mVpp; 27-1 PRBS; VCM=0V
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7
HD3SS3415
SLAS840 – MARCH 2012
www.ti.com
TYPICAL PERFORMANCE PLOTS (continued)
A
1.4 Inches
Rogers
Microstrip
1.7 Inches
Rogers
Microstrip
7
10Gbps PRBS 2 - 1
Vi=0.8Vpp ; Vcm =0V
Oscilloscope
Figure 10. Output Eye Diagram Test Setup
Figure 11. 10Gbps Output Eye Diagram at A: VID = 800mVpp; 27-1 PRBS; VCM= 0V; VDD= 3.3v; SEL= 0V
CROSS TALK MEASUREMENT SETUP
Network
Analyzer
P2
P1
VDD
A0+
B0+
100 W
A0B0HD3SS3415
SEL
A1+
B1+
100 W
A1B1-
8
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Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s) :HD3SS3415
HD3SS3415
www.ti.com
SLAS840 – MARCH 2012
TYPICAL PERFORMANCE PLOTS (continued)
OFF ISOLATION MEASUREMENT SETUP
Network
Analyzer
P2
P1
VDD
A0+
B0+
A0-
100 W
B0-
HD3SS3415
SEL
B1+
B1-
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Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s) :HD3SS3415
9
PACKAGE OPTION ADDENDUM
www.ti.com
23-Mar-2012
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
HD3SS3415RUAR
ACTIVE
WQFN
RUA
42
3000
Green (RoHS
& no Sb/Br)
CU NIPDAUAGLevel-2-260C-1 YEAR
HD3SS3415RUAT
ACTIVE
WQFN
RUA
42
250
Green (RoHS
& no Sb/Br)
CU NIPDAUAGLevel-2-260C-1 YEAR
Samples
(Requires Login)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
HD3SS3415RUAR
WQFN
RUA
42
3000
330.0
16.4
3.8
9.3
1.0
8.0
16.0
Q1
HD3SS3415RUAT
WQFN
RUA
42
250
180.0
16.4
3.8
9.3
1.0
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
HD3SS3415RUAR
WQFN
RUA
42
3000
367.0
367.0
38.0
HD3SS3415RUAT
WQFN
RUA
42
250
210.0
185.0
35.0
Pack Materials-Page 2
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components to meet such requirements.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Mobile Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
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