TS3DV421 www.ti.com SCDS264D – JANUARY 2008 – REVISED JANUARY 2010 4-CHANNEL DIFFERENTIAL 8:16 MULTIPLEXER SWITCH FOR DVI/HDMI APPLICATIONS Check for Samples: TS3DV421 FEATURES 1 • • • • • APPLICATIONS • • DVI/HDMI Signal Switching Differential DVI, HDMI Signal Multiplexing for Audio/Video Receivers and High-Definition Televisions (HDTVs) VSS VDD VSS 40 39 VDD 42 41 38 ATMDS2+ 2 37 ATMDS2– TMDS2+ 3 36 ATMDS1+ TMDS2– 4 35 ATMDS1– VSS 5 34 ATMDS0+ TMDS1+ 6 33 ATMDS0– TMDS1– VDD 7 32 ATMDSCLK+ 31 ATMDSCLK– SEL VSS 9 30 VDD 10 29 BTMDS2+ TMDS0+ 11 28 BTMDS2– TMDS0– 12 27 BTMDS1+ VSS 13 26 BTMDS1– TMDSCLK+ 14 25 BTMDS0+ TMDSCLK– VDD 15 24 BTMDS0– 16 23 BTMDSCLK+ VSS 17 22 BTMDSCLK– 8 20 21 VSS Exposed Center Pad VDD • 1 19 • VSS VDD 18 • • • RUA PACKAGE (TOP VIEW) VSS • Compatible With HDMI v1.3 DVI 1.0 High-Speed Digital Interface – Wide Bandwidth of Over 3.8 Gbps – Serial Data Stream at 10× Pixel Clock Rate – Supports All Video Formats up to 1080p and SXGA (1280 × 1024 at 75 Hz) – High Bandwidth of 4.95 Gbps (Single Link) – HDCP Compatible Low Crosstalk (XTALK = –50 dB Typ at 1.65 Gbps) Off Isolation (OIRR = –50 dB Typ at 1.65 Gbps) Low Bit-to-Bit Skew (tsk(o) = 0.1 ns Max) Low and Flat ON-State Resistance (rON = 12.5 Ω Max, rON(flat) = 0.5 Ω Typ) Low Input/Output Capacitance (CON = 4.5 pF Max) Enables Application-Specific Operating Voltage Selection – VDD Operating Range From 1.5 V to 2.1 V When VSS = GND – VDD Operating Range From 3.0 V to 3.6 V When VSS = 1.5 V Ioff Supports Partial-Power-Down Mode Operation Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Performance Tested Per JESD 22 – 2000-V Human-Body Model (A114-B, Class II) – 1000-V Charged-Device Model (C101) For DisplayPort Applications: VDD = 1.8 V , VSS = GND For HDMI /DVI Applications: VDD = 3.3 V , VSS = 1.5 V VDD • 2 For RUA, the exposed center pad must be connected to VSS or electronically open. For this part to be used in HDMI/TMDS applications, VSS can be elevated to 1.5 V. See Figure 1. DGV PACKAGE (TOP VIEW) VSS VDD VSS VDD VSS TMDS2+ TMDS2– VSS TMDS1+ TMDS1– VSS VDD SEL VSS TMDS0+ TMDS0– VSS TMDSCLK+ TMDSCLK– VSS VDD VSS VDD VSS 1 48 2 47 3 46 4 45 5 44 6 43 7 42 8 41 9 40 10 39 11 38 12 37 13 36 14 35 15 34 16 33 17 32 18 31 19 30 20 29 21 28 22 27 23 26 24 25 VDD VSS ATMDS2+ ATMDS2– ATMDS1+ ATMDS1– VSS ATMDS0+ ATMDS0– ATMDSCLK+ ATMDSCLK– VSS VDD BTMDS2+ BTMDS2– BTMDS1+ BTMDS1– VSS BTMDS0+ BTMDS0– BTMDSCLK+ BTMDSCLK– VSS VDD 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2008–2010, Texas Instruments Incorporated TS3DV421 SCDS264D – JANUARY 2008 – REVISED JANUARY 2010 www.ti.com DESCRIPTION/ORDERING INFORMATION The TS3DV421 is a 4-channel differential 2:1 multiplexer/demultiplexer digital video switch controlled with one select input (SEL). SEL controls the data path of the multiplexer/demultiplexer and can be connected to any GPIO in the system, using an external voltage divider system. The device provides high bandwidth necessary for DVI and HDMI applications. This device expands the high-speed physical link interface from a single HDMI port to two HDMI ports (A or B port). The unselected channel is set to a high-impedance state. The most common application for the TS3DV421 is in the sink application. In this case, there are two sources (i.e., DVD, set-top box, or game console) that must be routed to one HDMI receiver. The TS3DV421 can route the signals where one HDMI receiver (in a DLP, LCD TV, PDP, or other high-definition display) can be expanded to three ports. The HDMI application calls for a 100-Ω differential impedance between the differential lines (TMDSn+ and TMDSn–). Additionally, because the TS3DV421 is a high-bandwidth, low-rON pass transistor-type switch, a properly designed board retains a 100-Ω differential impedance through the switch. The unselected port is in the high-impedance mode, such that the receiver receives information from only one source. HDCP encryption is passed through the switch for the HDMI receiver to decode. Table 1. ORDERING INFORMATION PACKAGE (1) TA –40°C to 85°C (1) (2) (2) ORDERABLE PART NUMBER TOP-SIDE MARKING QFN – RUA Tape and reel TS3DV421RUAR SD421 TVSOP – DGV Tape and reel TS3DV421DGVR SD421 Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. TYPICAL APPLICATION DDC/CEC/+5V HDMI Transmitter 1 ATMDS0+ ATMDS0– ATMDS1+ ATMDS1– ATMDS2+ ATMDS2– ATMDSCLK+ ATMDSCLK– ATMDS0+ ATMDS0– ATMDS1+ ATMDS1– ATMDS2+ ATMDS2– ATMDSCLK+ ATMDSCLK– TS3DV421 HDMI Switch HDMI Transmitter 2 BTMDS0+ BTMDS0– BTMDS1+ BTMDS1– BTMDS2+ BTMDS2– BTMDSCLK+ BTMDSCLK– BTMDS0+ BTMDS0– BTMDS1+ BTMDS1– BTMDS2+ BTMDS2– BTMDSCLK+ BTMDSCLK– TMDS0+ TMDS0– TMDS1+ TMDS1– TMDS2+ TMDS2– TMDSCLK+ TMDSCLK– HDMI Receiver HDMI Scalar/ Video Decoder Display (DLP, LCD, TV, PDP, HDTV) DDC/CEC/+5V 2 Submit Documentation Feedback Copyright © 2008–2010, Texas Instruments Incorporated Product Folder Link(s): TS3DV421 TS3DV421 www.ti.com SCDS264D – JANUARY 2008 – REVISED JANUARY 2010 Table 2. FUNCTION TABLE SEL FUNCTION OUTPUT L TMDSn+ = ATMDSn+ TMDSn– = ATMDSn– TMDSCLK+ = ATMDSCLK+ TMDSCLK– = ATMDSCLK– BTMDSn+ = High impedance BTMDSn– = High impedance BTMDSCLK+ = High impedance BTMDSCLK– = High impedance TMDSn+ TMDSn– TMDSCLK+ TMDSCLK– H TMDSn+ = BTMDSn+ TMDSn– = BTMDSn– TMDSCLK+ = BTMDSCLK+ TMDSCLK– = BTMDSCLK– ATMDSn+ = High impedance ATMDSn– = High impedance ATMDSCLK+ = High impedance ATMDSCLK– = High impedance TMDSn+ TMDSn– TMDSCLK+ TMDSCLK– FUNCTIONAL DIAGRAM TMDS2+ 3 (6) 38 (46) 4 (7) 37 (45) TMDS2– 29 (35) 28 (34) TMDS1+ TMDS1– 6 (9) 36 (44) 7 (10) 35 (43) 27 (33) 26 (32) TMDS0+ TMDS0– 11 (15) 34 (41) 12 (16) 33 (40) 25 (30) 24 (29) TMDSCLK+ TMDSCLK– 14 (18) 32 (39) 15 (19) 31 (38) 23 (28) 22 (27) SEL A. ATMDS2+ ATMDS2– BTMDS2+ BTMDS2– ATMDS1+ ATMDS1– BTMDS1+ BTMDS1– ATMDS0+ ATMDS0– BTMDS0+ BTMDS0– ATMDSCLK+ ATMDSCLK– BTMDSCLK+ BTMDSCLK– 9 (13) Control Logic TVSOP package pin identification in parenthesis. Submit Documentation Feedback Copyright © 2008–2010, Texas Instruments Incorporated Product Folder Link(s): TS3DV421 3 TS3DV421 SCDS264D – JANUARY 2008 – REVISED JANUARY 2010 www.ti.com TERMINAL FUNCTIONS TERMINAL NAME 4 NO. TYPE QFN (RUA) TVSOP (DGV) DESCRIPTION ATMDS0– 33 40 I/O Port A, channel 0, TMDS negative signal ATMDS0+ 34 41 I/O Port A, channel 0, TMDS positive signal ATMDS1– 35 43 I/O Port A, channel 1, TMDS negative signal ATMDS1+ 36 44 I/O Port A, channel 1, TMDS positive signal ATMDS2– 37 45 I/O Port A, channel 2, TMDS negative signal ATMDS2+ 38 46 I/O Port A, channel 2, TMDS positive signal ATMDSCLK– 31 38 I/O Port A TMDS negative clock ATMDSCLK+ 32 39 I/O Port A TMDS positive clock BTMDS0– 24 29 I/O Port B, channel 0, TMDS negative signal BTMDS0+ 25 30 I/O Port B, channel 0, TMDS positive signal BTMDS1– 26 32 I/O Port B, channel 1, TMDS negative signal BTMDS1+ 27 33 I/O Port B, channel 1, TMDS positive signal BTMDS2– 28 34 I/O Port B, channel 2, TMDS negative signal BTMDS2+ 29 35 I/O Port B, channel 2, TMDS positive signal BTMDSCLK– 22 27 I/O Port B TMDS negative clock BTMDSCLK+ 23 28 I/O Port B TMDS positive clock SEL 9 13 I Select pin to choose between port A or port B. Referenced to VSS TMDS0– 12 16 I/O TMDS channel 0 negative signal TMDS0+ 11 15 I/O TMDS channel 0 positive signal TMDS1– 7 10 I/O TMDS channel 1 negative signal TMDS1+ 6 9 I/O TMDS channel 1 positive signal TMDS2– 4 7 I/O TMDS channel 2 negative signal TMDS2+ 3 6 I/O TMDS channel 2 positive signal TMDSCLK– 15 19 I/O TMDS negative clock TMDS positive clock TMDSCLK+ 14 18 I/O VDD 2, 8, 16, 18, 20, 30, 40, 42 2, 4, 12, 21, 23, 25, 36, 48 Power Positive power supply voltage VSS 1, 5, 10, 13, 17, 19, 21, 39, 41 1, 3, 5, 8, 14, 17, 20, 22, 24, 26, 31, 37, 42, 47 Power Negative power supply voltage Submit Documentation Feedback Copyright © 2008–2010, Texas Instruments Incorporated Product Folder Link(s): TS3DV421 TS3DV421 www.ti.com SCDS264D – JANUARY 2008 – REVISED JANUARY 2010 ABSOLUTE MINIMUM AND MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted), - All voltages are with respect to VSS MIN MAX VDD Supply voltage range –0.5 2.5 V VIN Control input voltage range (2) –0.5 2.5 V VI/O Switch I/O voltage range (2) –0.5 2.5 V IIK Control input clamp current VIN < VSS 50 mA II/OK I/O port clamp current VI/O < VSS 50 mA II/O ON-state switch current (4) 100 mA IDD Continuous current through VDD 100 mA ISS Continuous current through VSS 100 mA (3) θJA Package thermal impedance (5) Tstg Storage temperature range (1) (2) (3) (4) (5) DGV package 58.0 RUA package 51.2 –65 150 UNIT °C/W °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. VI and VO are used to denote specific conditions for VI/O. II and IO are used to denote specific conditions for II/O. The package thermal impedance is calculated in accordance with JESD 51-7. RECOMMENDED OPERATING CONDITIONS over operating free-air temperature range (unless otherwise noted) MIN TYP MAX VSS = GND 1.5 1.8 2.1 VSS = 1.5 V 3 3.3 3.6 UNIT VDD Supply voltage VIH High-level input voltage 3 V < VDD < 3.6 V, VSS = 1.5 V VIL Low-level input voltage 1.5 V < VDD < 2.1 V, VSS = 0 V VIO Switch input/output voltage 0 VDD V TA Operating free-air temperature 0 85 °C 0.65(VDD – VSS) + VSS V 0.35(VDD – VSS) + VSS Submit Documentation Feedback Copyright © 2008–2010, Texas Instruments Incorporated Product Folder Link(s): TS3DV421 V V 5 TS3DV421 SCDS264D – JANUARY 2008 – REVISED JANUARY 2010 www.ti.com ELECTRICAL CHARACTERISTICS FOR 1.8-V SUPPLY (1) VDD = 1.5 V to 2.1 V, VSS = 0 V, TA = –40°C to 85°C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP (2) MAX –0.7 –1.2 V UNIT VIK SEL VDD = 2.1 V, IIN = –18 mA IIH SEL VDD = 2.1 V, VIN = VDD ±1 μA IIL SEL VDD = 2.1 V, VIN = VSS ±1 μA Ioff VDD = 0, VO = 0 to 2.1 V, VI = 0 ICC VDD = 2.1 V, II/O = 0, Switch ON or OFF CIN SEL f = 1 MHz, VIN = 0 COFF B port 1 μA 230 450 μA 0.7 1 pF VI = 0, f = 1 MHz, Outputs open, Switch OFF 1 1.5 pF CON VI = 0, f = 1 MHz, Outputs open, Switch ON 4 4.5 pF ron VDD = 1.8 V, VSS ≤ VI ≤ VDD, IO = –40 mA 12.5 20 Ω VDD = 1.8 V, VI = 1.65 V to 1.8 V IO = –40 mA 0.5 VDD = 1.8 V, VSS ≤ VI ≤ VDD, IO = –40 mA –0.1 XTALK RL = 50 Ω, f = 825 MHz See Figure 7 –50 OIRR RL = 50 Ω, f = 825 MHz ron(flat) (3) (4) Δron Ω 0.2 Ω Dynamic dB See Figure 8 –50 dB BW See Figure 6 1.9 GHz Max data rate See Figure 6 3.8 Gbps (1) (2) (3) (4) VI, VO, II, and IO refer to I/O pins. VIN refers to the control inputs. All typical values are at VDD = 1.8 V (unless otherwise noted), TA = 25°C. ron(flat) is the difference of ron in a given channel at specified voltages. Δron is the difference of ron from centerports to any other port. SWITCHING CHARACTERISTICS over recommended operating free-air temperature range, VDD = 1.5 V to 2.1 V, VSS = 0 V, RL = 200 Ω, CL = 10 pF (unless otherwise noted) FROM (INPUT) TO (OUTPUT) TMDSn or xTMDSn xTMDSn or TMDSn tPZH, tPZL SEL TMDSn or xTMDSn 0.5 9 ns tPHZ, tPLZ SEL TMDSn or xTMDSn 0.5 5 ns TMDSn or xTMDSn xTMDSn or TMDSn PARAMETER tpd (1) (2) (3) (4) 6 (2) tsk(o) (3) tsk(p) (4) MIN TYP (1) MAX 0.25 ns 0.06 0.06 UNIT ns 0.1 ns All typical values are at VDD = 1.8 V (unless otherwise noted), TA = 25°C. The propagation delay is the calculated RC time constant of the typical ON-state resistance of the switch and the specified load capacitance when driven by an ideal voltage source (zero output impedance). Output skew between center port to any other port Skew between opposite transitions of the same output in a given device |tPHL – tPLH| Submit Documentation Feedback Copyright © 2008–2010, Texas Instruments Incorporated Product Folder Link(s): TS3DV421 TS3DV421 www.ti.com SCDS264D – JANUARY 2008 – REVISED JANUARY 2010 VDD = 3.3 V VDD = 3.3 V R SEL R SEL From system GPIO VSS = 1.5 V This example circuit shows connecting control inputs to GPIOs of an application using VSS = 1.5 V, which allows the device to pass TMDS signal levels Figure 1. Example Voltage Divider Circuit 0 –1 –20 –2 –40 Attenuation (dB) Gain (dB) TYPICAL CHARACTERISTICS 0 –3 –4 –5 –60 –80 –100 –6 1 10 100 1000 10000 –120 1 Frequency (MHz) Figure 2. Insertion Loss 10 100 1000 10000 Frequency (MHz) Figure 3. Crosstalk Submit Documentation Feedback Copyright © 2008–2010, Texas Instruments Incorporated Product Folder Link(s): TS3DV421 7 TS3DV421 SCDS264D – JANUARY 2008 – REVISED JANUARY 2010 www.ti.com TYPICAL CHARACTERISTICS (continued) 0 16 14 –20 12 rON (Ω) 10 Attenuation (dB) –40 8 6 –60 4 2 –80 0 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 VCOM (V) –100 –120 1 10 100 1000 10000 Frequency (MHz) Figure 4. Off Isolation vs Frequency 8 Submit Documentation Feedback Figure 5. rON vs VCOM Copyright © 2008–2010, Texas Instruments Incorporated Product Folder Link(s): TS3DV421 TS3DV421 www.ti.com SCDS264D – JANUARY 2008 – REVISED JANUARY 2010 PARAMETER MEASUREMENT INFORMATION A0 0B1 SEL VSEL Figure 6. Test Circuit for Frequency Response (BW) Frequency response is measured at the output of the ON channel. For example, when VSEL is low and A0 is the input, the output is measured at 0B1. All unused analog I/O ports are left open. HP8753ES setup Average = 4 RBW = 3 kHz VBIAS = 0.35 V ST = 2 s P1 = 0 dBM Submit Documentation Feedback Copyright © 2008–2010, Texas Instruments Incorporated Product Folder Link(s): TS3DV421 9 TS3DV421 SCDS264D – JANUARY 2008 – REVISED JANUARY 2010 www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) EXT TRIGGER BIAS VBIAS Network Analyzer (HP8753ES) P1 P2 VCC A0 0B1 RL = 50 Ω A1 1B1 0B2 DUT A2 1B2 2B1 RL = 50 Ω A3 3B1 2B2 3B2 SEL VSEL Figure 7. Test Circuit for Crosstalk (XTALK) Crosstalk is measured at the output of the nonadjacent ON channel. For example, when VSEL is low and A0 is the input, the output is measured at 1B1. All unused analog input (A) ports are connected to GND, and output (B) ports are connected to GND through 50-Ω pulldown resistors. HP8753ES setup Average = 4 RBW = 3 kHz VBIAS = 0.35 V ST = 2 s P1 = 0 dBM 10 Submit Documentation Feedback Copyright © 2008–2010, Texas Instruments Incorporated Product Folder Link(s): TS3DV421 TS3DV421 www.ti.com SCDS264D – JANUARY 2008 – REVISED JANUARY 2010 PARAMETER MEASUREMENT INFORMATION (continued) EXT TRIGGER BIAS VBIAS Network Anal yzer (HP8753ES) P1 P2 VCC A0 0B 1 RL = 50 Ω A1 1B 1 DUT 0B 2 1B 2 SEL VSEL Figure 8. Test Circuit for OFF Isolation (OIRR) OFF isolation is measured at the output of the OFF channel. For example, when VSEL is low and A0 is the input, the output is measured at 0B2. All unused analog input (A) ports are left open, and output (B) ports are connected to GND through 50-Ω pulldown resistors. HP8753ES setup Average = 4 RBW = 3 kHz VBIAS = 0.35 V ST = 2 P1 = 0 dBM Submit Documentation Feedback Copyright © 2008–2010, Texas Instruments Incorporated Product Folder Link(s): TS3DV421 11 TS3DV421 SCDS264D – JANUARY 2008 – REVISED JANUARY 2010 www.ti.com APPLICATION INFORMATION 3.3 V 1.5 V C1 39 41 40 42 0.1 mF U1 18 VSS VDD A0 A1 A2 A3 A4 A5 A8 A9 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 HDMI_CON JP3 A0 A1 A2 A3 A4 A5 A8 A9 VSS R1 1.8 kW VDD VDD 3.3 V 21 HDMI_RX VSS TMDS2+ TMDS2– TMDS1+ TMDS1– TMDS0+ TMDS0– TMDSCLK+ TMDSCLK– ATMDS2+ ATMDS2– ATMDS1+ ATMDS1– ATMDS0+ ATMDS0– ATMDSCLK+ ATMDSCLK– VDD BTMDS2+ BTMDS2– BTMDS1+ BTMDS1– BTMDS0+ BTMDS0– BTMDSCLK+ BTMDSCLK– 20 JP1 VSS VDD TMDS2+ TMDS2– VSS TMDS1+ TMDS1– VDD SEL VSS TMDS0+ TMDS0– VSS TMDSCLK+ TMDSCLK– VDD VSS 19 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 VSS VDD JP2 HDMI_CON TS3DV421RUA R2 1.5 kW 3.3 V GPIO Figure 9. Reference Circuit for HDMI Application 12 Submit Documentation Feedback Copyright © 2008–2010, Texas Instruments Incorporated Product Folder Link(s): TS3DV421 PACKAGE OPTION ADDENDUM www.ti.com 17-Jul-2010 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) TS3DV421DGVR ACTIVE TVSOP DGV 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Request Free Samples TS3DV421DGVRG4 ACTIVE TVSOP DGV 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Request Free Samples TS3DV421RUAR ACTIVE WQFN RUA 42 3000 TBD Call TI Call TI Request Free Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. 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Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 20-Jul-2010 TAPE AND REEL INFORMATION *All dimensions are nominal Device TS3DV421DGVR Package Package Pins Type Drawing TVSOP DGV 48 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2000 330.0 16.4 Pack Materials-Page 1 7.1 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 10.2 1.6 12.0 16.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 20-Jul-2010 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TS3DV421DGVR TVSOP DGV 48 2000 346.0 346.0 33.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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