TPD4S009 TPD4S010 www.ti.com SLVS817D – MAY 2008 – REVISED MARCH 2010 4-CHANNEL ESD SOLUTION FOR HIGH-SPEED DIFFERENTIAL INTERFACE Check for Samples: TPD4S009, TPD4S010 FEATURES 1 • • • • Supports High-Speed Differential Data Rates (3-dB Bandwidth > 4 GHz) Ultra-low Matching Capacitance Between Differential Signal Pairs Low 0.8-pF Line Capacitance for Each Data Line to GND Flow-Through Single-in-Line Pin Mapping for High-Speed Lines Ensures No Additional Board Layout Burden While Placing ESD Protection Chip Near Connector 1 6 D1– D1+ D1– GND 2 5 VCC D2+ 3 4 D2– • • • • IEC 61000-4-2 (Level 4) System-Level ESD Compliance 2.5-A Peak Pulse Current (8/20-ms Pulse) Ioff Feature for the TPD4S009 Industrial Temperature Range: –40°C to 85°C Space-Saving Package Options TPD4S009...DGS PACKAGE (TOP VIEW) TPD4S009...DBV OR DCK PACKAGE (TOP VIEW) D1+ • 1 10 2 9 TPD4S010...DQA PACKAGE (TOP VIEW) N.C. N.C. D1+ D1– 1 2 10 9 N.C. D1+ 1 6 D1– N.C. GND 2 5 VCC D2+ 3 4 D2– GND 3 8 VCC GND 3 8 GND D2+ 4 7 N.C. D2+ 4 7 N.C. 6 N.C. D2– 5 6 N.C. D2– 5 TPD4S009...DRY PACKAGE (TOP VIEW) DESCRIPTION/ORDERING INFORMATION The TPD4S009 and TPD4S010 provide system level electrostatic discharge (ESD) solution for high-speed differential lines. These devices offer four ESD clamp circuits for dual pair differential lines. The TPD4S009 offers an optional VCC supply pin which can be connected to system supply plane. There is a blocking diode at the VCC pin to enable the Ioff feature for the TPD4S009. The TPD4S009 can handle live signal at the D+, D- pins when the VCC pin is connected to zero volt. The VCC pin allows all the internal circuit nodes of the TPD4S009 to be at known potential during start up time. However, connecting the optional VCC pin to board supply plane doesn't affect the system level ESD performance of the TPD4S009. The TPD4S010 does not offer the VCC pin. The TPD4S009 is offered in DBV, DCK, DGS, and DRY packages. The TPDS4010 is offered in DQA package. The TPD4S009DRYR is the most space saving package option available for dual pair high-speed differential lines. The TPD4S009DGSR and TPD4S010DQAR offer flow-through board layout option to reduce signal glitches due to mismatch between the D+ and D- signal pair routing. The monolithic silicon technology allows matching between the differential signal pairs. The excellent matching between the differential pair signal lines (0.05-pF line-line capacitance for the TPD4S009DRY) enables this device to operate at high-speed differential data rates (3-dB bandwidth > 4 GHz). The TPD4S009 and TPD4S010 are suitable for high-speed differential applications, such as high-definition multimedia interface (HDMI), low-voltage differential signaling (LVDS), serial advanced technology attachment (SATA), Ethernet, 1394 ( FireWire®), etc. TPD4S009/TPD4S010 comply with IEC 61000-4-2 (Level 4) ESD. TPD4S009/TPD4S010 are characterized for operation over the ambient air temperature range of –40°C to 85°C. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2008–2010, Texas Instruments Incorporated TPD4S009 TPD4S010 SLVS817D – MAY 2008 – REVISED MARCH 2010 www.ti.com ORDERING INFORMATION TA –40°C to 85°C (1) (2) (3) PACKAGE (1) (2) NOMINAL DIMENSIONS (mm) ORDERABLE PART NUMBER TOP-SIDE MARKING (3) MSOP – DGS Reel of 3000 W = 4.9, L = 3, H < 1.1, Pitch = 0.5 TPD4S009DGSR 3HR SON – DQA Reel of 3000 W = 1, L = 2.5, H < 1.1, Pitch = 0.5 TPD4S010DQAR 4UR SON – DRY Reel of 5000 W = 1, L = 1.45, H = 0.55, Pitch = 0.5 TPD4S009DRYR 3H SOT (SC-70) – DCK Reel of 3000 W = 2.1, L = 2, H = 0.95, Pitch = 0.65 TPD4S009DCKR 3H_ SOT (SOT-23) – DBV Reel of 3000 W = 2.9, L = 2.8, H < 1.45, Pitch = 0.95 TPD4S009DBVR NFJK Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. DCK: The actual top-side marking has one additional character that designates wafer fab/assembly site. CIRCUIT DIAGRAMS TPD4S009 VCC D2+ D1+ D1– D2– GND TPD4S010 D1+ D2+ D1– D2– GND 2 Submit Documentation Feedback Copyright © 2008–2010, Texas Instruments Incorporated Product Folder Link(s): TPD4S009 TPD4S010 TPD4S009 TPD4S010 www.ti.com SLVS817D – MAY 2008 – REVISED MARCH 2010 TERMINAL FUNCTIONS DBV, DCK, OR DRY PIN NO. DGS PIN NO. DQA PIN NO. NAME I/O 1, 6, 3, 4 1, 2, 4, 5 1, 2, 4, 5 D1+, D1–, D2+, D2– ESD port 2 3 3, 8 GND GND – 6, 7, 9, 10 6, 7, 9, 10 N.C. – 5 8 – VCC Power DESCRIPTION High-speed ESD clamp provides ESD protection to the high-speed differential data lines. Ground Not internally connected Supply Copyright © 2008–2010, Texas Instruments Incorporated Product Folder Link(s): TPD4S009 TPD4S010 Submit Documentation Feedback 3 TPD4S009 TPD4S010 SLVS817D – MAY 2008 – REVISED MARCH 2010 www.ti.com ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) MIN MAX –0.3 6 0 VCC V Storage temperature range –65 125 °C Characterized free-air operating temperature range –40 85 °C VCC Supply voltage range for TPD4S009 VIO IO signal voltage range Tstg TA Lead temperature, 1.6 mm (1/16 in) from case for 10 s) UNIT V 260 °C ±8 kV IEC 61000-4-2 Air-Gap Discharge ±9 kV Peak pulse power (tp = 8/20 ms) 25 W Peak pulse current (tp = 8/20 ms) 2.5 A IEC 61000-4-2 Contact Discharge ELECTRICAL CHARACTERISTICS over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VRWM Reverse standoff voltage Any IO pin to ground VBR Breakdown voltage IIO = 1 mA Any IO pin to ground IIO IO port current VIO = 3.3 V, VCC = 5 V Any IO pin 0.01 0.1 mA Ioff Current from IO port to supply pins VIO = 3.3 V, VCC = 5 V Any IO pin 0.01 0.1 mA VD Diode forward voltage IIO = 8 mA Lower clamp diode 0.8 0.95 V RDYN Dynamic resistance I=1A Any IO pin 1.1 Ω CIO IO capacitance VCC = 5 V, VIO = 2.5 V Any IO pin 0.8 pF ICC Operating supply current VIO = Open, VCC = 5 V VCC pin 0.1 4 Submit Documentation Feedback 5.5 9 0.6 V V 1 mA Copyright © 2008–2010, Texas Instruments Incorporated Product Folder Link(s): TPD4S009 TPD4S010 TPD4S009 TPD4S010 www.ti.com SLVS817D – MAY 2008 – REVISED MARCH 2010 TYPICAL CHARACTERISTICS 2 70 D1+ Leakage Current (pA) Insertion Loss (dB) 0 D2+ -2 -4 -6 -8 60 50 40 30 20 10 -10 100k 1.E+05 1M 1.E+06 10M 1.E+07 100M 1.E+08 1G 1.E+09 0 10G 1.E+10 55 25 Temperature, TA (°C) –40 Frequency (Hz) Figure 1. Insertion Loss S21 – I/O to GND 85 Figure 2. Leakage Current vs Temperature (VIO = 2.5 V) 220 5.0 200 180 160 140 3.0 Amplitude (V) IO Capacitance (pF) 4.0 2.0 1.0 120 100 80 60 40 20 0 0.0 1 2 3 4 5 –20 0 25 50 IO Voltage (V) Figure 3. IO Capacitance vs Input Voltage (VCC = 5 V) 75 100 125 150 175 200 225 250 Time (nS) Figure 4. IEC Clamping Waveforms (8-kV Contact, Average of Ten Waveforms) Copyright © 2008–2010, Texas Instruments Incorporated Product Folder Link(s): TPD4S009 TPD4S010 Submit Documentation Feedback 5 TPD4S009 TPD4S010 SLVS817D – MAY 2008 – REVISED MARCH 2010 www.ti.com TYPICAL CHARACTERISTICS (continued) 3.0 30 2.5 25 20 Current (A) 1.5 15 1.0 PPP (W) IPP (A) 2.0 10 Power (W) 5 0.5 0.0 0 0 6 5 10 15 20 25 30 35 Time (µs) 40 45 50 Figure 5. Pulse Waveform (8/20 ms Pulse) Figure . Figure 6. Eye Diagram Without TPD4S009 Figure 7. Eye Diagram With TPD4S009 Submit Documentation Feedback Copyright © 2008–2010, Texas Instruments Incorporated Product Folder Link(s): TPD4S009 TPD4S010 PACKAGE OPTION ADDENDUM www.ti.com 31-Jul-2010 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) TPD4S009DBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Request Free Samples TPD4S009DBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Request Free Samples TPD4S009DCKR ACTIVE SC70 DCK 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Request Free Samples TPD4S009DCKRG4 ACTIVE SC70 DCK 6 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Request Free Samples TPD4S009DGSR ACTIVE MSOP DGS 10 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Request Free Samples TPD4S009DRYR ACTIVE SON DRY 6 5000 TBD TPD4S010DQAR ACTIVE SON DQA 10 3000 Green (RoHS & no Sb/Br) Call TI Call TI Request Free Samples CU NIPDAU Level-1-260C-UNLIM Request Free Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 20-Jul-2010 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ TPD4S009DBVR SOT-23 6 3000 180.0 9.2 3.23 TPD4S009DCKR SC70 DCK 6 3000 180.0 8.4 TPD4S010DQAR SON DQA 10 3000 180.0 8.4 DBV Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) Pack Materials-Page 1 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 3.17 1.37 4.0 8.0 Q3 2.25 2.4 1.22 4.0 8.0 Q3 1.3 2.83 0.65 4.0 8.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 20-Jul-2010 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPD4S009DBVR SOT-23 DBV 6 3000 205.0 200.0 33.0 TPD4S009DCKR SC70 DCK 6 3000 202.0 201.0 28.0 TPD4S010DQAR SON DQA 10 3000 202.0 201.0 28.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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