TI TS3USB31RSER

TS3USB31
HIGH-SPEED USB 2.0 (480-Mbps) 1-PORT SWITCH
WITH SINGLE ENABLE
www.ti.com
SCDS242C – JULY 2007 – REVISED AUGUST 2007
FEATURES
1
N.C.
HSD–
D–
6
5
8
2
HSD+
3
D+
RSE PACKAGE
(BOTTOM VIEW)
1
2
3
Routes Signals for USB 1.0, 1.1, and 2.0
PACKAGE (1) (2)
TA
–40°C to 85°C
QFN – RSE
4
7
6
5
N.C. - No internal connection
ORDERABLE PART NUMBER
Tape and reel
GND
D–
The TS3USB31 is a high-bandwidth switch specially
designed for the switching of high-speed USB 2.0
signals in handset and consumer applications, such
as cell phones, digital cameras, and notebooks with
hubs or controllers with limited USB I/Os. The wide
bandwidth (750 MHz) of this switch allows signals to
pass with minimum edge and phase distortion. The
switch is bidirectional and offers little or no
attenuation of the high-speed signals at the outputs. It
is designed for low bit-to-bit skew and high
channel-to-channel noise isolation, and is compatible
with various standards, such as high-speed USB 2.0
(480 Mbps).
ORDERING INFORMATION
8
HSD–
VCC
N.C.
DESCRIPTION/ORDERING INFORMATION
(1)
(2)
GND
D+
1
APPLICATIONS
•
4
HSD+
•
•
VCC
7
OE
•
•
•
•
•
RSE PACKAGE
(TOP VIEW)
VCC Operation at 3 V and 4.3 V
1.8-V Compatible Control-Pin Inputs
IOFF Supports Partial Power-Down Mode
Operation
ron = 10 Ω Maximum
Δron <0.35 Ω Typical
Cio(ON) = 6 pF Typical
Low Power Consumption (1 μA Maximum)
ESD Performance Tested Per JESD 22
– 6000-V Human-Body Model
(A114-B, Class II)
– 1000-V Charged-Device Model (C101)
– 250-V Machine Model (A115-A)
Wide –3-dB Bandwidth = 1220 MHz Typical
Packaged in 8-Pin TQFN (1.5 mm × 1.5 mm)
OE
•
•
•
TS3USB31RSER
TOP-SIDE MARKING
L9
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
PIN DESCRIPTION
NAME
DESCRIPTION
OE
Bus-switch enable
D+, D–,
HSD+, HSD–
Data ports
NC
No connect
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007, Texas Instruments Incorporated
TS3USB31
HIGH-SPEED USB 2.0 (480-Mbps) 1-PORT SWITCH
WITH SINGLE ENABLE
www.ti.com
SCDS242C – JULY 2007 – REVISED AUGUST 2007
TRUTH TABLE
OE
FUNCTION
H
Disconnect
L
D+, D– = HSD+, HSD–
BLOCK DIAGRAM
HSD1+
D+
HSD1–
D–
OE
Control
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
VCC
VIN
Supply voltage range
Control input voltage range
(2) (3)
MIN
MAX
–0.5
7
V
–0.5
7
V
HSD+, HSD–
–0.5 VCC + 0.3
D+, D– when VCC > 0
–0.5 VCC + 0.3
UNIT
VI/O
Switch I/O voltage range (2) (3) (4)
D+, D– when VCC = 0
5.25
IIK
Control input clamp current
VIN < 0
–50
mA
II/OK
I/O port clamp current
VI/O < 0
–50
mA
II/O
ON-state switch current (5)
±64
mA
±100
mA
150
°C
Continuous current through VCC or GND
Tstg
(1)
(2)
(3)
(4)
(5)
Storage temperature range
–65
V
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to ground, unless otherwise specified.
The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
VI and VO are used to denote specific conditions for VI/O.
II and IO are used to denote specific conditions for II/O.
Package Thermal Impedance
θJA
(1)
2
Package thermal impedance (1)
RSE package
TYP
UNIT
253
°C/W
The package thermal impedance is calculated in accordance with JESD 51-7.
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Product Folder Link(s): TS3USB31
TS3USB31
HIGH-SPEED USB 2.0 (480-Mbps) 1-PORT SWITCH
WITH SINGLE ENABLE
www.ti.com
SCDS242C – JULY 2007 – REVISED AUGUST 2007
Recommended Operating Conditions (1)
VCC
Supply voltage
VIH
High-level control input voltage
VIL
Low-level control input voltage
VI/O
Data input/output voltage
TA
Operating free-air temperature
(1)
MIN
MAX
3.0
4.3
VCC = 3 V to 3.6 V
1.3
VCC = 4.3 V
1.7
UNIT
V
V
VCC = 3 V to 3.6 V
0.5
VCC = 4.3 V
0.7
V
0
VCC
V
–40
85
°C
All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
Electrical Characteristics (1)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
VIK
TEST CONDITIONS
MIN
VCC = 3 V,
II = –18 mA
VCC = 4.3 V,
VIN = 0 to 4.3 V,
VCC = 0 V
VCC = 4.3 V,
VO = 0 to 3.6 V,
VI = 0,
Switch OFF
VCC = 0 V,
VO = 0 to 4.3 V,
VI = 0,
VIN = VCC or GND
VCC = 4.3 V,
II/O = 0,
Switch ON or OFF
Control inputs
VCC = 4.3 V,
VIN = 2.6 V
Control inputs
VCC = 0 V,
VIN = VCC or GND
Cio(OFF)
VCC = 3.3 V,
VI/O = 3.3 V or 0,
Cio(ON)
VCC = 3.3 V,
ron (5)
VCC = 3 V,
Δron
ron(flat)
IIN
Control inputs
IOZ (3)
IOFF
D+ and D–
ICC
ΔICC
(4)
Cin
(1)
(2)
(3)
(4)
(5)
TYP (2)
MAX
UNIT
–1.2
V
±1
μA
±1
μA
±2
μA
1
μA
10
μA
1
pF
Switch OFF
2
pF
VI/O = 3.3 V or 0,
Switch ON
6
VI = 0.4 V,
IO = –8 mA
6
VCC = 3 V,
VI = 0.4 V,
IO = –8 mA
0.35
Ω
VCC = 3 V,
VI = 0 V or 1 V,
IO = –8 mA
2
Ω
pF
Ω
10
VIN and IIN refer to control inputs. VI, VO, II, and IO refer to data pins.
All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C.
For I/O ports, the parameter IOZ includes the input leakage current.
This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND.
Measured by the voltage drop between the A and B terminals at the indicated current through the switch. ON-state resistance is
determined by the lower of the voltages of the two (A or B) terminals.
Dynamic Electrical Characteristics
over operating range, TA = –40°C to 85°C, VCC = 3.3 V ± 10%, GND = 0 V
PARAMETER
TEST CONDITIONS
TYP (1)
–53
XTALK
Crosstalk
RL = 50 Ω, f = 240 MHz, See Figure 7
OIRR
OFF isolation
RL = 50 Ω, f = 240 MHz, See Figure 6
BW
Bandwidth (–3 dB)
RL = 50 Ω, CL = 5 pF, See Figure 8
(1)
UNIT
dB
–30
dB
1220
MHz
For Max or Min conditions, use the appropriate value specified under Electrical Characteristics for the applicable device type.
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Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): TS3USB31
3
TS3USB31
HIGH-SPEED USB 2.0 (480-Mbps) 1-PORT SWITCH
WITH SINGLE ENABLE
www.ti.com
SCDS242C – JULY 2007 – REVISED AUGUST 2007
Switching Characteristics
over operating range, TA = –40°C to 85°C, VCC = 3.3 V ± 10%, GND = 0 V
PARAMETER
TEST CONDITIONS
MIN
RL = 50 Ω, CL = 5 pF,
See Figure 9
(2) (3)
TYP (1)
MAX
tpd
Propagation delay
tON
Line enable time, OE to D, nD
RL = 50 Ω, CL = 5 pF,
See Figure 5
30
ns
tOFF
Line disable time, OE to D, nD
RL = 50 Ω, CL = 5 pF,
See Figure 5
25
ns
tSK(O)
Output skew between center port to any other port (2)
RL = 50 Ω, CL = 5 pF,
See Figure 10
50
ps
tSK(P)
Skew between opposite transitions of the same output
(tPHL – tPLH) (2)
RL = 50 Ω, CL = 5 pF,
See Figure 10
20
ps
tJ
Total jitter (2)
RL = 50 Ω, CL = 5 pF,
tR = tF = 500 ps at 480 Mbps
(PRBS = 215 – 1)
200
ps
(1)
(2)
(3)
4
0.25
UNIT
ns
For Max or Min conditions, use the appropriate value specified under Electrical Characteristics for the applicable device type.
Specified by design
The bus switch contributes no propagational delay other than the RC delay of the on resistance of the switch and the load capacitance.
The time constant for the switch alone is of the order of 0.25 ns for 10-pF load. Since this time constant is much smaller than the rise/fall
times of typical driving signals, it adds very little propagational delay to the system. Propagational delay of the bus switch, when used in
a system, is determined by the driving circuit on the driving side of the switch and its interactions with the load on the driven side.
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Product Folder Link(s): TS3USB31
TS3USB31
HIGH-SPEED USB 2.0 (480-Mbps) 1-PORT SWITCH
WITH SINGLE ENABLE
www.ti.com
SCDS242C – JULY 2007 – REVISED AUGUST 2007
APPLICATION INFORMATION
0
-1
Magnitude (dB)
-2
-3
-4
-5
-6
-7
-8
1.0E+06
1.0E+07
1.0E+08
1.0E+09
1.0E+10
Frequency (Hz)
Figure 1. Insertion Loss
0
–10
Attenuation (dB)
–20
–30
–40
–50
–60
–70
–80
–90
100.0E+3
1.0E+6
10.0E+6
100.0E+6
1.0E+9
10.0E+9
Frequency (Hz)
Figure 2. OFF Isolation
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Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): TS3USB31
5
TS3USB31
HIGH-SPEED USB 2.0 (480-Mbps) 1-PORT SWITCH
WITH SINGLE ENABLE
www.ti.com
SCDS242C – JULY 2007 – REVISED AUGUST 2007
0
Attenuation (dB)
–20
–40
–60
–80
–100
–120
100.0E+3
1.0E+6
10.0E+6
100.0E+6
1.0E+9
10.0E+9
Frequency (Hz)
Figure 3. Crosstalk
VCC
TS3USB31
USB
Connector
Base Band
Processor
or FS USB
Controller
HS USB
Controller
Figure 4. Application Diagram
6
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Copyright © 2007, Texas Instruments Incorporated
Product Folder Link(s): TS3USB31
TS3USB31
HIGH-SPEED USB 2.0 (480-Mbps) 1-PORT SWITCH
WITH SINGLE ENABLE
www.ti.com
SCDS242C – JULY 2007 – REVISED AUGUST 2007
PARAMETER MEASUREMENT INFORMATION
VCC
1D or 2D VOUT1
VIN
TEST
RL
CL
VIN
tON
50 Ω
5 pF
VCC
tOFF
50 Ω
5 pF
VCC
D
1D or 2D VOUT2
CL(2)
RL
S
OE
VSEL(1)
GND
(2)
50%
50%
0
tON
VOE(1)
(1)
1.8 V
Logic
RL
Input
(VSEL or V OE)
CL(2)
Switch
Output
(VOUT1 or V OUT2)
tOFF
90%
90%
VOH
VOL
All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z O = 50 Ω, t r < 5 ns, tf < 5 ns.
CL includes probe and jig capacitance.
Figure 5. Turn-On (tON) and Turn-Off Time (tOFF)
VCC
Network Analyzer
Channel OFF: 1D to D
50 W
VOUT1 1D
VSEL = VCC
D
Source
Signal
50 W
VIN
2D
Network Analyzer Setup
Source Power = 0 dBm
(632-mV P-P at 50-W load)
VSEL S
50 W
+
GND
DC Bias = 350 mV
Figure 6. OFF Isolation (OIRR)
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Product Folder Link(s): TS3USB31
7
TS3USB31
HIGH-SPEED USB 2.0 (480-Mbps) 1-PORT SWITCH
WITH SINGLE ENABLE
www.ti.com
SCDS242C – JULY 2007 – REVISED AUGUST 2007
PARAMETER MEASUREMENT INFORMATION (continued)
VCC
Network Analyzer
Channel ON: 1D to D
50 W
VOUT1 1D
Channel OFF: 2D to D
VIN
Source
Signal
VSEL = VCC
VOUT2 2D
50 W
Network Analyzer Setup
50 W
VSEL S
+
Source Power = 0 dBm
(632-mV P-P at 50-W load)
GND
DC Bias = 350 mV
Figure 7. Crosstalk (XTALK)
VCC
Network Analyzer
50 W
VOUT1
1D
Channel ON: 1D to D
D
Source
Signal
VIN
VCTRL = GND
2D
Network Analyzer Setup
50 W
VSEL
Source Power = 0 dBm
(632-mV P-P at 50-W load)
S
GND
GND
DC Bias = 350 mV
Figure 8. Bandwidth (BW)
400 mV
Figure 9. Propagation Delay
8
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Product Folder Link(s): TS3USB31
TS3USB31
HIGH-SPEED USB 2.0 (480-Mbps) 1-PORT SWITCH
WITH SINGLE ENABLE
www.ti.com
SCDS242C – JULY 2007 – REVISED AUGUST 2007
PARAMETER MEASUREMENT INFORMATION (continued)
VOH
VOL
Pulse Skew tSK(P)
VOH
VOL
VOH
VOL
Output Skew tSK(P)
Figure 10. Skew Test
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Product Folder Link(s): TS3USB31
9
TS3USB31
HIGH-SPEED USB 2.0 (480-Mbps) 1-PORT SWITCH
WITH SINGLE ENABLE
www.ti.com
SCDS242C – JULY 2007 – REVISED AUGUST 2007
PARAMETER MEASUREMENT INFORMATION (continued)
VCC
VOUT1 1D
D
+
VIN
Channel ON
VOUT2 2D
r on +
VSEL
IIN
S
VIN * VOUT2 or VOUT1
W
IIN
VSEL = VIH or VIL
+
GND
Figure 11. ON-State Resistance (ron)
VCC
VOUT1 1D
VIN
D
+
VOUT2 2D
VSEL
+
S
OFF-State Leakage Current
Channel OFF
VSEL = VIH or VIL
+
GND
Figure 12. OFF-State Leakage Current
VCC
VOUT1 1D
Capacitance
Meter
VBIAS
VBIAS = VCC or GND
VOUT2 2D
VSEL = VCC or GND
VIN D
Capacitance is measured at 1D,
2D, D, and S inputs during ON
and OFF conditions.
VSEL S
GND
Figure 13. Capacitance
10
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Product Folder Link(s): TS3USB31
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TS3USB31RSER
ACTIVE
QFN
RSE
8
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TS3USB31RSERG4
ACTIVE
QFN
RSE
8
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
TAPE AND REEL BOX INFORMATION
Device
TS3USB31RSER
Package Pins
RSE
8
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
SITE 48
179
8
1.7
1.7
0.6
4
Pack Materials-Page 1
W
Pin1
(mm) Quadrant
8
Q2
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
TS3USB31RSER
RSE
8
SITE 48
220.0
205.0
50.0
Pack Materials-Page 2
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