TI THS4001IDG4

THS4001
270-MHz HIGH-SPEED AMPLIFIER
SLOS206A– DECEMBER 1997 – REVISED MARCH 1999
D
D
D
D
D
D
D PACKAGE
(TOP VIEW)
Very High Speed
– 270 MHz Bandwidth (Gain = 1, – 3 dB)
– 400 V/µsec Slew Rate
– 40-ns Settling Time (0.1%)
High Output Drive, IO = 100 mA
Excellent Video Performance
– 60 MHz Bandwidth (0.1 dB, G = 1)
– 0.04% Differential Gain
– 0.15° Differential Phase
Very Low Distortion
– THD = –72 dBc at f = 1 MHz
Wide Range of Power Supplies
VCC = ± 2.5 V to ± 15 V,
ICC = 7.5 mA
Evaluation Module Available
NULL
IN –
IN +
VCC –
1
8
2
7
3
6
4
5
NULL
VCC+
OUT
NC
NC – No internal connection
CLOSED-LOOP GAIN
vs
FREQUENCY
8
6
VCC = ±15 V
Gain = 1
4
Closed-Loop Gain – dB
description
The THS4001 is a very high-performance,
voltage-feedback operational amplifier especially
suited for a wide range of video applications. The
device is specified to operate over a wide range of
supply voltages from ± 15 V to ± 2.5 V. With a
bandwidth of 270 MHz, a slew rate of over
400 V/µs, and settling times of less than 30 ns, the
THS4001 offers the unique combination of high
performance in an easy to use voltage feedback
configuration over a wide range of power supply
voltages.
2
0
–2
3.9 pF
–4
–6
200 Ω
–
–8
–10
+
50 Ω
–12
–14
100M
300k 1M
10M
1G
3G
The THS4001 is stable at all gains for both
inverting and noninverting configurations. It has a
f – Frequency – Hz
high output drive capability of 100 mA and draws
only 7.5 mA of quiescent current. Excellent professional video results can be obtained with the differential
gain/phase performance of 0.04%/0.15° and 0.1 dB gain flatness to 60 MHz. For applications requiring low
distortion, the THS4001 is ideally suited with total harmonic distortion of –72 dBc at f = 1 MHz.
HIGH-SPEED AMPLIFIER FAMILY
DEVICE
ARCH.
VFB
THS4031/32
THS4061/62
CFB
5V
•
THS3001
THS4001
SUPPLY
VOLTAGE
•
•
•
•
±5 V
±15 V
•
•
•
•
•
•
•
•
BW
(MHz)
SR
(V/µs)
THD
f = 1 MHz
(dB)
ts
0.1%
(ns)
DIFF.
GAIN
DIFF.
PHASE
420
6500
–96
40
0.01%
0.02°
1.6
270
400
–72
40
0.04%
0.15°
12.5
100
100
–72
60
0.02%
0.03°
1.6
180
400
–72
40
0.02%
0.02°
14.5
Vn
(nV/√Hz)
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  1999, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
THS4001
270-MHz HIGH-SPEED AMPLIFIER
SLOS206A– DECEMBER 1997 – REVISED MARCH 1999
AVAILABLE OPTIONS
PACKAGED DEVICES
TA
SMALL OUTLINE†
(D)
EVALUATION
MODULE
0°C to 70°C
THS4001CD
THS4001EVM
– 40°C to 85°C
THS4001ID
—
† The D packages are available taped and reeled. Add an R suffix to the
device type (i.e., THS4001CDR).
symbol
NULL
NULL
IN –
IN +
_
VCC +
OUT
+
VCC –
NC
absolute maximum ratings over operating free-air temperature (unless otherwise noted)†
Supply voltage, VCC– to VCC+ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 V
Input voltage, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± VCC
Output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175 mA
Differential input voltage, VID . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 4 V
Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Ratings Table
Operating free air temperature, TA: C suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70 °C
I suffix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 40°C to 85 °C
Storage temperature, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 65°C to 150 °C
Lead temperature 1,6 mm (1/16 Inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
DISSIPATION RATING TABLE
PACKAGE
TA ≤ 25°C
POWER RATING
DERATING FACTOR
ABOVE TA = 25°C
TA = 70°C
POWER RATING
TA = 85°C
POWER RATING
D
740 mW
6 mW/°C
mW/ C
475 mW
385 mW
CAUTION: The THS4001 provides ESD protection circuitry. However, permanent damage can still occur if this device is
subjected to high-energy electrostatic discharges. Proper ESD precautions are recommended to avoid any performance
degradation or loss of functionality
2
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• DALLAS, TEXAS 75265
THS4001
270-MHz HIGH-SPEED AMPLIFIER
SLOS206A– DECEMBER 1997 – REVISED MARCH 1999
recommended operating conditions
MIN
Dual supply
Supply voltage
voltage, VCC
5
32
± 15 V
7.8
9.5
± 5 V, ± 2.5 V
6.7
8
C suffix
Operating free-air
free air temperature,
temperature TA
MAX
±16
Single supply
current ICC
Quiescent current,
TYP
± 2.5
I suffix
0
70
– 40
85
UNIT
V
mA
°C
electrical characteristics, VCC = ±15 V, RL = 150 Ω, TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
Differential gain error
Gain = 2,,
f = 3.58 MHz
RL = 150 Ω,,
Differential phase error
VIO
Input offset voltage
IIB
Input
In
ut bias current
IOS
Input
In
ut offset current
Common mode rejection ratio
Common-mode
PSRR
Power supply rejection ratio
VICR
VO
IO
0.01%
±15 V
0.15°
±5 V
0.08°
2
TA = 25°C
±15 V,
±5 V
2.6
±15 V,
±5 V
35
TA = 25°C
VO = ±10 V,
RL = 1 kΩ
TA = 25°C
TA = full range
VO = ± 2.5 V,
RL = 500 Ω
TA = 25°C
TA = full range
V(CM) = ± 12 V
TA = 25°C
TA = full range
±15 V
±5 V
±15 V
±15 V,
±5 V
TA = 25°C
TA = full range
Output current
THD
Total harmonic distortion
RI
Input resistance
CI
Input capacitance
RO
Output resistance
RL = 500 Ω
Gain =+ 2,
VI = 1 V(PP),
RL = 20 Ω
f = 1 MHz
Open loop
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
8
10
5
6
UNIT
200
mV
µA
nA
500
5
10
3
3
6
V/mV
2
85
100
dB
75
75
85
dB
70
±15 V
13.5
to
–13
14.8
to
–14
±5 V
3.6
to
– 2.7
4.4
to
– 3.6
±15 V
± 13
± 13.5
±5 V
± 3.3
± 3.8
± 2.5 V
± 0.8
± 1.3
± 15 V
50
100
±5 V
50
100
± 2.5 V
50
100
±15 V
MAX
0.04%
±5 V
Common mode input voltage range
Common-mode
Output voltage swing
TYP
±15 V,,
±5 V
TA = full range
CMRR
MIN
TA = 25°C
TA = full range
TA = full range
Open loop gain
Open-loop
VCC
±15 V
V
V
mA
– 72
dBc
10
MΩ
1.5
pF
10
Ω
3
THS4001
270-MHz HIGH-SPEED AMPLIFIER
SLOS206A– DECEMBER 1997 – REVISED MARCH 1999
operating characteristics, VCC = ±15 V, RL = 150 Ω, TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
Slew rate
Gain = –1
Settling time to 0.1%
0 1%
MIN
TYP
±5 V
400
± 2.5 V
350
Gain = –1
±15 V
40
– 2.5 V to 2.5 V step,
Gain = –1
±5 V
30
Ω
RL = 150 Ω,
±15 V
270
G i = +1,
1
Gain
Rf = 150 Ω
Gain
G
i = –1,
1
Rf = 150 Ω
RL = 150 Ω,
Ω
Gain = +1
MAX
UNIT
400
10 V step (0 to 10 V),
– 3 dB Bandwidth
Bandwidth for 0.1 dB flatness
VCC
±15 V
±5 V
220
± 2.5 V
180
±15 V
80
±5 V
75
± 2.5 V
70
±15 V
60
±5 V
50
± 2.5 V
40
V/µs
ns
MHz
MHz
MHz
Vn
Equivalent input noise voltage
f = 10 kHz
±15 V,
±5 V
12.5
nV/√Hz
In
Equivalent input noise current
f = 10 kHz
±15 V,
±5 V
1.5
pA/√Hz
TYPICAL CHARACTERISTICS
Table of Graphs
FIGURE
IIB
VIO
CMRR
PSRR
VO(PP)
Input bias current
vs Free-air temperature
1
Input offset voltage
vs Free-air temperature
2
Open-loop gain
vs Frequency
3
Phase
vs Frequency
3
Differential gain
vs DC voltage
4, 5
Differential phase
vs DC voltage
4, 5
Closed-loop gain
vs Frequency
6, 7
Common-mode rejection ratio
vs Frequency
8
vs Frequency
9
vs Free-air temperature
10
Power supply rejection ratio
Power-supply
Output voltage swing
Bandwidth (– 3 dB)
4
vs Supply voltage
11
vs Load resistance
12
vs Feedback resistance
13, 14
vs Supply voltage
15
vs Free-air temperature
16
ICC
Supply current
Env
THD
Noise spectral density
vs Frequency
17
Total harmonic distortion
vs Frequency
18
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
THS4001
270-MHz HIGH-SPEED AMPLIFIER
SLOS206A– DECEMBER 1997 – REVISED MARCH 1999
TYPICAL CHARACTERISTICS
INPUT OFFSET VOLTAGE
vs
FREE-AIR TEMPERATURE
1.5
2.75
1
VIO – Input Offset Voltage – mV
3
2.5
VCC = ±15 V
2.25
VCC = ±5 V
2
VCC = ±2.5 V
1.75
–20
0
20
40
60
80
0.5
0
VCC = ±5 V
– 0.5
–1
– 1.5
–40
100
VCC = ±15 V
–20
TA – Free-Air Temperature – °C
0
20
40
60
80
100
TA – Free-Air Temperature – °C
Figure 1
Figure 2
OPEN-LOOP GAIN AND PHASE
vs
FREQUENCY
90
VCC = ±15 V
80
70
60
0°
50
40
45°
30
20
Phase
1.5
–40
Open-Loop Gain – dB
I IB – Input Bias Current – µ A
INPUT BIAS CURRENT
vs
FREE-AIR TEMPERATURE
90°
10
0
135
°
–10
–20
1k
10k
100k
1M
10M
100M
180
1G5°
f – Frequency – Hz
Figure 3
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• DALLAS, TEXAS 75265
5
THS4001
270-MHz HIGH-SPEED AMPLIFIER
SLOS206A– DECEMBER 1997 – REVISED MARCH 1999
TYPICAL CHARACTERISTICS
DIFFERENTIAL GAIN AND
DIFFERENTIAL PHASE
vs
DC VOLTAGE
0.048
0.1°
VCC = ±5
0.08°
0.036
0.06°
0.012
0.04°
0
0.02°
0°
–0.012
Gain
–0.024
–0.02°
–0.036
–0.04°
–0.048
0
0.1
0.2
0.3
0.4
0.5
0.6
Differential Phase
Differential Gain – (%/div)
Phase
0.024
–0.06°
0.7
DC Voltage – V
Figure 4
DIFFERENTIAL GAIN AND
DIFFERENTIAL PHASE
vs
DC VOLTAGE
0.048
0.12°
Phase
0.036
0.1°
0.024
0.08°
0.012
0.06°
Gain
0
0.04°
–0.012
0.02°
–0.024
0°
–0.036
–0.02°
–0.048
–0.04°
–0.06
0
0.1
0.2
0.3
0.4
0.5
0.6
DC Voltage – V
Figure 5
6
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• DALLAS, TEXAS 75265
–0.06°
0.7
Differential Phase
Differential Gain – (%/div)
VCC = ±15
THS4001
270-MHz HIGH-SPEED AMPLIFIER
SLOS206A– DECEMBER 1997 – REVISED MARCH 1999
TYPICAL CHARACTERISTICS
CLOSED-LOOP GAIN
vs
FREQUENCY
8
6
CLOSED-LOOP GAIN
vs
FREQUENCY
5
VCC = ±15 V
Gain = 1
0
–5
2
Closed-Loop Gain – dB
Closed-Loop Gain – dB
4
0
–2
3.9 pF
–4
200 Ω
–6
–
–8
–15
– 20
– 25
50 Ω
+
– 40
1M
10M
100M
1G
– 45
300k
3G
Figure 6
Figure 7
3G
100
PSRR – Power Supply Rejection Ratio – dB
80
60
40
20
10k
1G
POWER SUPPLY REJECTION RATIO
vs
FREQUENCY
100
1k
100M
f – Frequency – Hz
VCC = ±15 V to ±2.5 V
100
10M
1M
f – Frequency – Hz
120
CMRR – Common-Mode Rejection Ratio – dB
–
– 35
COMMON-MODE REJECTION RATIO
vs
FREQUENCY
0
10
1 kΩ
– 30
50 Ω
–12
–14
300k
–10
1 kΩ
+
–10
VCC = ±15 V
Gain = –1
100k
1M
10M
100M
90
80
–VCC
+VCC
70
60
50
40
30
20
10
0
10
VCC = ±15 V to ±2.5 V
100
f – Frequency – Hz
1k
10k
100k
1M
10M
100M
f – Frequency – Hz
Figure 8
Figure 9
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• DALLAS, TEXAS 75265
7
THS4001
270-MHz HIGH-SPEED AMPLIFIER
SLOS206A– DECEMBER 1997 – REVISED MARCH 1999
TYPICAL CHARACTERISTICS
OUTPUT VOLTAGE SWING
vs
SUPPLY VOLTAGE
120
30
110
25
100
VO(PP) – Output Voltage Swing – V
PSRR – Power Supply Rejection Ratio – dB
POWER SUPPLY REJECTION RATIO
vs
FREE-AIR TEMPERATURE
VCC = –15 V
90
VCC = 15 V
80
70
60
–40
–20
0
20
40
60
80
RL = 1 kΩ
20
15
RL = 150 Ω
10
5
0
100
2
4
6
TA – Free-Air Temperature – °C
Figure 10
VCC = ±15 V
20
15
VCC = ±5 V
VCC = ±2.5 V
5
1000
10000
RL – Load Resistance – Ω
1700
1900
VCC = ±15 V
VCC = ±5 V
70
VCC = ±2.5 V
60
50
40
30
20
0
500
Gain = –1
f = –3 dB
RL = 150 Ω
700
900
1100
1300
Figure 13
POST OFFICE BOX 655303
1500
R(FB) – Feedback Resistance – Ω
Figure 12
8
16
80
10
100
14
90
BW – Bandwidth (–3 dB) – MHz
VO(PP) – Output Voltage Swing – V
100
10
12
BANDWIDTH (–3 dB)
vs
FEEDBACK RESISTANCE
30
25
10
Figure 11
OUTPUT VOLTAGE SWING
vs
LOAD RESISTANCE
0
10
8
VCC – Supply Voltage – V
• DALLAS, TEXAS 75265
THS4001
270-MHz HIGH-SPEED AMPLIFIER
SLOS206A– DECEMBER 1997 – REVISED MARCH 1999
TYPICAL CHARACTERISTICS
BANDWIDTH (–3 dB)
vs
FEEDBACK RESISTANCE
SUPPLY CURRENT
vs
SUPPLY VOLTAGE
300
9
8
I CC – Supply Current – mA
VCC = ±15 V
250
BW – Bandwidth (–3 dB) – MHz
Gain = 1
f = –3 dB
RL = 150 Ω
200
150
VCC = ±5 V
VCC = ±2.5 V
100
7
6
5
4
3
2
50
1
0
100 200 300
400 500 600 700
0
800 900 1000
2
R(FB) – Feedback Resistance – Ω
4
10
12
14
Figure 15
SUPPLY CURRENT
vs
FREE-AIR TEMPERATURE
NOISE SPECTRAL DENSITY
vs
FREQUENCY
9
80
E nv – Noise Spectral Density – nV/ Hz
VCC = ±15 V
8
I CC – Supply Current – mA
8
VCC – Supply Voltage – V
Figure 14
7
6
VCC = ±5 V
5
VCC = ±2.5 V
4
3
2
1
0
–40
6
–20
0
20
40
60
80
100
70
60
50
40
VCC = ±15 V
30
20
10
VCC = ±5 V
and ±2.5 V
0
10
TA – Free-Air Temperature – °C
100
1k
10k
100k
f – Frequency – Hz
Figure 16
Figure 17
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• DALLAS, TEXAS 75265
9
THS4001
270-MHz HIGH-SPEED AMPLIFIER
SLOS206A– DECEMBER 1997 – REVISED MARCH 1999
TYPICAL CHARACTERISTICS
TOTAL HARMONIC DISTORTION
vs
FREQUENCY
THD – Total Harmonic Distortion – dB
–50
–55
G = +2
VIN = 1 V(PP)
VCC = ±15 V
RL = 150 Ω
3 rd Harmonic
–60
–65
2 nd Harmonic
–70
–75
–80
–85
0.5
10
1
f – Frequency – MHz
Figure 18
10
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• DALLAS, TEXAS 75265
THS4001
270-MHz HIGH-SPEED AMPLIFIER
SLOS206A– DECEMBER 1997 – REVISED MARCH 1999
APPLICATION INFORMATION
theory of operation
The THS4001 is a high speed, operational amplifier configured in a voltage feedback architecture. It is built
using a 30-V, dielectrically isolated, complementary bipolar process with NPN and PNP transistors possessing
fTs of several GHz. This results in an exceptionally high performance amplifier that has a wide bandwidth, high
slew rate, fast settling time, and low distortion. A simplified schematic is shown in Figure 19.
(7) VCC +
(6) OUT
IN – (2)
IN + (3)
(4) VCC –
NULL (1)
NULL (8)
Figure 19. THS4001 Simplified Schematic
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11
THS4001
270-MHz HIGH-SPEED AMPLIFIER
SLOS206A– DECEMBER 1997 – REVISED MARCH 1999
APPLICATION INFORMATION
offset nulling
The THS4001 has very low input offset voltage for a high-speed amplifier. However, if additional correction is
required, an offset nulling function has been provided. By placing a potentiometer between terminals 1 and 8
of the device and tying the wiper to the negative supply, the input offset can be adjusted. This is shown in
Figure 20.
VCC+
0.1 µF
+
THS4001
_
10 kΩ
0.1 µF
VCC –
Figure 20. Offset Nulling Schematic
optimizing unity gain response
Internal frequency compensation of the THS4001 was selected to provide very wideband performance yet still
maintain stability when operated in a noninverting unity gain configuration. When amplifiers are compensated
in this manner there is usually peaking in the closed loop response and some ringing in the step response for
very fast input edges, depending upon the application. This is because a minimum phase margin is maintained
for the G=+1 configuration. For optimum settling time and minimum ringing, a feedback resistor of 200 Ω should
be used as shown in Figure 21. Additional capacitance can also be used in parallel with the feedback resistance
if even finer optimization is required.
Input
+
Output
THS4001
_
200 Ω
Figure 21. Noninverting, Unity Gain Schematic
12
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THS4001
270-MHz HIGH-SPEED AMPLIFIER
SLOS206A– DECEMBER 1997 – REVISED MARCH 1999
APPLICATION INFORMATION
driving a capacitive load
Driving capacitive loads with high performance amplifiers is not a problem as long as certain precautions are
taken. The first is to realize that the THS4001 has been internally compensated to maximize its bandwidth and
slew rate performance. When the amplifier is compensated in this manner, capacitive loading directly on the
output will decrease the device’s phase margin leading to high frequency ringing or oscillations. Therefore, for
capacitive loads of greater than 10 pF, it is recommended that a resistor be placed in series with the output of
the amplifier, as shown in Figure 22. A minimum value of 20 Ω should work well for most applications. For
example, in 75-Ω transmission systems, setting the series resistor value to 75 Ω both isolates any capacitance
loading and provides the proper line impedance matching at the source end.
1 kΩ
1 kΩ
Input
_
20 Ω
Output
THS4001
+
CLOAD
Figure 22. Driving a Capacitive Load
circuit layout considerations
In order to achieve the levels of high frequency performance of the THS4001, it is essential that proper
printed-circuit board high frequency design techniques be followed. A general set of guidelines is given below.
In addition, a THS4001 evaluation board is available to use as a guide for layout or for evaluating the device
performance.
D
D
D
D
Ground planes – It is highly recommended that a ground plane be used on the board to provide all
components with a low inductive ground connection. However, in the areas of the amplifier inputs and
output, the ground plane can be removed to minimize the stray capacitance.
Proper power supply decoupling – Use a 6.8-µF tantalum capacitor in parallel with a 0.1-µF ceramic
capacitor on each supply terminal. It may be possible to share the tantalum among several amplifiers
depending on the application, but a 0.1-µF ceramic capacitor should always be used on the supply terminal
of every amplifier. In addition, the 0.1-µF capacitor should be placed as close as possible to the supply
terminal. As this distance increases, the inductance in the connecting trace makes the capacitor less
effective. The designer should strive for distances of less than 0.1 inches between the device power
terminals and the ceramic capacitors.
Sockets – Sockets are not recommended for high speed op amps. The additional lead inductance in the
socket pins will often lead to stability problems. Surface-mount packages soldered directly to the
printed-circuit board is the best implementation.
Short trace runs/compact part placements – Optimum high frequency performance is achieved when stray
series inductance has been minimized. To realize this, the circuit layout should be made as compact as
possible thereby minimizing the length of all trace runs. Particular attention should be paid to the inverting
input of the amplifier. Its length should be kept as short as possible. This will help to minimize stray
capacitance at the input of the amplifier.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
13
THS4001
270-MHz HIGH-SPEED AMPLIFIER
SLOS206A– DECEMBER 1997 – REVISED MARCH 1999
APPLICATION INFORMATION
circuit layout considerations (continued)
D
Surface-mount passive components – Using surface mount passive components is recommended for high
frequency amplifier circuits for several reasons. First, because of the extremely low lead inductance of
surface-mount components, the problem with stray series inductance is greatly reduced. Second, the small
size of surface-mount components naturally leads to a more compact layout thereby minimizing both stray
inductance and capacitance. If leaded components are used, it is recommended that the lead lengths be
kept as short as possible.
evaluation board
An evaluation board is available for the THS4001 (literature number SLOP119). This board has been configured
for very low parasitic capacitance in order to realize the full performance of the amplifier. A schematic of the
evaluation board is shown in Figure 23. The circuitry has been designed so that the amplifier may be used in
either an inverting or noninverting configuration. To order the evaluation board contact your local TI sales office
or distributor. For more detailed information, refer to the THS4001 EVM User’s Manual (literature number
SLOU017).
VCC+
+
C2
0.1 µF
R1
1 kΩ
IN +
C1
6.8 µF
NULL
R2
49.9 Ω
+
R3
49.9 Ω
OUT
THS4001
_
NULL
R5
1 kΩ
+
C4
0.1 µF
IN –
VCC –
R4
49.9 Ω
Figure 23.
14
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
C3
6.8 µF
PACKAGE OPTION ADDENDUM
www.ti.com
5-Feb-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
THS4001CD
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
THS4001CDG4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
THS4001CDR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
THS4001CDRG4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
THS4001ID
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
THS4001IDG4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
THS4001IDR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
THS4001IDRG4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
THS4001CDR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
THS4001IDR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
THS4001CDR
SOIC
D
8
2500
367.0
367.0
35.0
THS4001IDR
SOIC
D
8
2500
367.0
367.0
35.0
Pack Materials-Page 2
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