HUASHAN HFP740

HFP740
Shantou Huashan Electronic Devices Co.,Ltd.
N-Channel Enhancement Mode Field Effect Transistor
█ General Description
TO-220
This Power MOSFET is produced using advanced planar stripe, DMOS
technology. This latest technology has been especially designed to minimize
on-state resistance, have a high rugged avalanche characteristics. This
devices is specially well suited for half bridge and full bridge resonant
topolgy like a electronic lamp ballast.
1- G 2-D 3-S
█ Features
• 10A, 400V, RDS(on) <0.55Ω@VGS = 10 V
• Fast switching
• 100% avalanche tested
• Improved dv/dt capability
• Equivalent Type:IRF740
█ Maximum Ratings(Ta=25℃ unless otherwise specified)
T stg ——Storage Temperature ------------------------------------------------------ -55~150℃
T j ——Operating Junction Temperature -------------------------------------------------- 150℃
V DSS —— Drain-Source Voltage ----------------------------------------------------------400V
VDGR —— Drain-Gate Voltage (RGS=20kΩ) ------------------------------------------------------------ 400V
VGSS —— Gate-Source Voltage -------------------------------------------------------------------------- ±20V
ID —— Drain Current (Continuous) --------------------------------------------------------------------- 10A
PD —— Maximum Power Dissipation --------------------------------------------------------------- 125W
IAR —— Avalanche Current, Repetitive or Not-Repetitive
(pulse width limited by Tj max, d < 1%) ------------------------------------------------------ 10 A
EAS—— Single Pulse Avalanche Energy
(starting Tj = 25℃, ID = IAR, VDD = 50 V) --------------------------------------------------- 450 mJ
EAR—— Repetitive Avalanche Energy(pulse width limited by Tj max, d < 1%) ---------------- 13.4mJ
█ Thermal Characteristics
Symbol
Rthj-case
Items
Thermal Resistance Junction-case
TO-220
Max 1.0
Unit
℃/W
Rthj-amb
Thermal Resistance Junction-ambient
Max 62.5
℃/W
Rth c-s
Thermal Resistance Case-sink
Typ
℃/W
0.5
HFP740
Shantou Huashan Electronic Devices Co.,Ltd.
█ Electrical Characteristics(Ta=25℃ unless otherwise specified)
Symbol
Items
Min.
Typ.
Max.
Unit
Conditions
Off Characteristics
BVDSS
Drain-Source Breakdown Voltage
IDSS
Zero Gate Voltage Drain Current
IGSS
Gate – Body Leakage
On Characteristics
Gate Threshold Voltage
VGS(th)
RDS(on)
gFS
400
2.0
Static Drain-Source On-Resistance
Forward Transconductance
25
V
µA
ID=250µA ,VGS=0V
VDS =400V, VGS=0V
250
±100
µA
nA
VDS =320V, VGS=0V,Tj=125℃
VGS= ±20V , VDS =0V
4.0
V
VDS = VGS , ID=250µA
0.55
Ω
VGS=10V, ID=5A
VDS=40V, ID=5A (Note 1)
9.6
S
Dynamic Characteristics and Switching Characteristics
Ciss
Input Capacitance
1800
pF
Coss
Output Capacitance
195
pF
Crss
Reverse Transfer Capacitance
45
pF
td(on)
Turn - On Delay Time
50
nS
Rise Time
170
nS
Turn - Off Delay Time
260
nS
Fall Time
180
nS
Qg
Total Gate Charge
53
nC
Qgs
Gate–Source Charge
7
nC
Qgd
Gate–Drain Charge
17
nC
tr
td(off)
tf
Drain-Source Diode Characteristics and Maximun Ratings
Continuous Source–Drain Diode
IS
Forward Current
Pulsed
Drain-Source
Diode
ISM
Forward Current
Source–Drain Diode Forward
VSD
On–Voltage
Notes:
1. Pulse Test: Pulse width≤300μS,Duty cycle≤2%
2. Essentially independent of operating temperature
10
A
40
A
2.0
V
VDS = 25 V, VGS = 0V,
f = 1.0 MHz
VDD = 200 V, ID = 10Apk
RG= 25 Ω (Note 1,2)
VDS=0.8VDSS, ID=10A,
VGS = 10 V (Note 1,2)
IS=10A,VGS=0
Shantou Huashan Electronic Devices Co.,Ltd.
█ Typical Characteristics
HFP740
Shantou Huashan Electronic Devices Co.,Ltd.
█ Typical Characteristics
HFP740
Shantou Huashan Electronic Devices Co.,Ltd.
█ Typical Characteristics
HFP740
Shantou Huashan Electronic Devices Co.,Ltd.
█ Typical Characteristics
HFP740