Product Guide F_1105W Series, Dome Lens Type AlInGaP SMT LED ■ Applications ■ Features • High brightness AllnGaP die material • Dome lens provides intensified narrow, bright beam • Available for both standard and reverse mounting • Wider operating temperature: -40° ~ +100°C • High-beam indicator for automotive use • Backlighting for automotive dashboards • Indoor / outdoor full-color signboards ■ Outline Dimensions ■ Recommended Solder Pad at Surface Mount (1.6) 0.3 0.6 1.55 1.6 1.5 Anode 2.1 + 0.05 1.5 HOLE Polarity Mark 0.6 R0.8 Cathode Mark (2) (4.6) 0.5 1.6 3.2 0.5 1.6 ■ Recommended Solder Pad at reverse mount Cathode 2.3+0.05 PCB Unit: mm Tolerance + 0.1 ■ Electro-Optical Characteristics Part No. Material Emitted Lens Color Color Luminous Intensity IV MIN. FR1105W AlInGaP Red FA1105W AlInGaP Orange FY1105W AlInGaP Yellow Units (Ta=25°C) TYP. IF 70 180 20 Water 70 200 20 Clear 70 180 20 mcd mA Forward Voltage V Wavelength Peak λp TYP. Dominant λd TYP. 635 626 609 592 Spectral Line Half Width λ ∆λ TYP. Reverse Viewing Current IR Angle F IF TYP. MAX. IF MAX. VR 15 20 1.9 2.4 20 100 5 605 15 20 1.9 2.4 20 100 5 590 15 20 1.9 2.4 20 100 5 mA µA V nm mA V (2 θ 1/2) 50° Deg. ■ Absolute Maximum Ratings Item Red-Orange Orange-Red Amber Symbol FR FA FY (Ta=25°C) Units Pd 81 81 81 mW Forward Current IF 30 30 30 mA Peak Forward Current IFM 100 100 100 mA Reverse Voltage VR 5 5 5 V Power Dissipation -40 to +100 °C Operating Temperature Topr Storage Temperature Tstg -40 to +120 °C ∆IF 1.0 (DC) 3.33 (Pulse) mA/°C Derating* * Ta=25°C, IFM applies for the pulse width ≤ 1msec. and duty cycle ≤1/20. 4+0.1 Center Hole 8+0.2 Quantity on tape: 2000 pieces per reel (0.5) 2 + 0.05 ( φ 1.1) Center Hole Cathode (2.2) for Standard Mount Type (0.25) 1.75 +0.1 (1.85) 3.5 +0.05 Center Hole 4+0.1 φ 1.5 +0.1 0 3.5+0.05 2+0.05 ( φ 1.1) ■ Taping Specifications (0.25) 8+0.2 (1.8) (3.5) φ 1.5 +0.1 0 1.75 + 0.1 4+0.1 for Reverse Mount Type Quantity on tape: 2000 pieces per reel (3.45) ■ Taping Specifications (2.1) 2+0.5 4+0.1 φ 21+0.8 +1 φ 60 -0 φ 13+0.2 φ 13+0.2 Direction to pull Cathode RR 9+0.3 11.4+1 ■ Operation Current Derating Chart (DC) +0 φ 180 3 Direction to pull TR ■ Precautions FR, FA, FY Please follow these handling precautions to prevent damage to the chip and ensure its reliability. 1. Soldering conditions: • Soldering iron: Temperature at tip of iron: 280°C max. (30W max.) Soldering time: 3 sec. max. • Dip soldering: Preheating: 120 ~ 150°C max. (resin surface temp.) 60 ~ 120 sec. max. Bath temperature: 260°C max. Dipping Time: 5 sec. max. • Reflow Soldering: Operation Heating 150 ~ (X & Y) LED Surface Temperature ■ Spatial Distribution °C 240 Pre-heating Temperature rise: 5°C/sec. Cooling: —5°C/sec. 120 0 60 to 120 sec. 5 sec. max 2. Cleaning: • If cleaning is required, use the following solutions for less than 1 minute, at less than 40°C. • Appropriate chemicals: Ethyl alcohol and isopropyl alcohol. FR, FA, FY • Effect of ultrasonic cleaning on the LED resin body differs depending on such factors as the oscillator output, size of PCB and LED mounting method. The use of ultrasonic cleaning should be enforced at proper output after confirming there is no problem. Product specifications subject to change without notice. PGF_1105W-0301 Stanley Electric Sales of America, Inc. 2660 Barranca Parkway, Irvine, CA 92606 • Tel: 800-LED-LCD1 (533-5231) • Fax: 949-222-0555 Website: www.stanley-electric.com