ETC TXC-02050C

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MRT
TXC-02050C
DATA SHEET
BLOCK DIAGRAM
LINE SIDE
TERMINAL SIDE
EQB1 EQB0 LOW
VAGC
GNDA
AGFIL
RXLOS
VCOC
PLLC
PNENB
RXDIS
+
RP/RD
HDB3
-
RN
Decoder
clk
+
DI1
DI2
Equalization
Network
AGC
Clock
Recovery clk
RXAIS
CLKO
CLKO
Receive
(Line)
Loopback
DCK
Transmit
(Terminal)
Loopback
LBKTX
TPO
HDB3
Encoder
Output
Driver
I/O
Circuits
CV
Detector
and LQ
Indicator
TNO
+
TP/TD
-
TN
clk
VDD
GNDD
DCK
LBKRX
BERCK CV
LQLTY
CLKI
TXAIS
TXLOC
Figure 1. MRT TXC-02050C Block Diagram
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DATA SHEET
MRT
TXC-02050C
BLOCK DIAGRAM DESCRIPTION
On the Line Side, a symmetrical bipolar signal is applied to the input signal pin (DI1), which requires an external 75Ω termination. DI2 is a DC reference voltage output which serves as an AC ground.
Equalization for various lengths of cable having a √f attenuation characteristic is compensated by setting the
states of the EQB0 and EQB1 signal leads. The Equalization Network Block is connected to an AGC Block
which has approximately a 20 dB dynamic range. The AGC has separate voltage and ground leads for noise
immunity, and uses an external capacitor as part of an AGC filter. The AGC output is connected to the Clock
Recovery Block.
The Clock Recovery Block contains a phase-locked loop and supporting logic to generate a clock signal from
the line signal. The signal lead LOW selects the appropriate circuit in the Clock Recovery Block for the operating frequency and provides input attenuation for the receive line signal. The line input is monitored for loss of
signal, with an alarm indication provided on the RXLOS signal lead. The Clock Recovery Block requires an
external reference clock at the operating frequency (DCK). The reference clock is also used for generating and
sending a receive Alarm Indication Signal (AIS). The generation and sending of AIS for recovered data is controlled by the RXAIS signal lead.
The output of the Clock Recovery Block is connected to the HDB3 Decoder Block, when enabled, or directly to
the I/O Circuits Block. When the decoder is enabled, indications of coding violation errors, other than the normal HDB3 zero substitution codes, are provided as pulses on the signal lead labeled CV by the CV Detector
and LQ Indicator Block. Examples of HDB3 coding and violations are shown in Figure 19. An external clock
(BERCK) is used to generate a 10-second sampling window for detecting a 10-6 or greater error rate. The
resulting line quality indication is provided on the output signal lead LQLTY.
Two Terminal Side interfaces are provided, a positive and negative rail (RP and RN) or NRZ (RD) interface. The
selection is determined by the state placed on the input signal lead PNENB. When a low is applied to this signal lead, the HDB3 Decoder and HDB3 Encoder Blocks are bypassed, and the terminal side I/O is a positive
and negative rail interface. When a high is applied to the signal lead, an NRZ interface is provided. Data is
clocked out of the MRT on negative edges of the clock output signal (CLKO). Receive data and the clock signals are disabled, and forced to a high impedance state, by placing a low on the receive disable input lead
(RXDIS). For a receive positive and negative rail interface, an inverted clock output signal (CLKO) is also provided.
The terminal side interface for the transmitter can either be positive and negative rail (TP and TN) or NRZ (TD)
data depending on the state of the common control input lead PNENB (see Figure 20 for examples). Data is
clocked into the MRT on positive transitions of the clock signal (CLKI). The input clock is monitored for the loss
of clock. When the input clock remains high or low, TXLOC will be set low. The MRT also provides the capability to generate and insert AIS (all ones signal), independent of the transmit data. A low placed on the TXAIS
input lead enables the transmit AIS generator.
Two loopbacks are provided, transmit loopback and receive loopback. Transmit loopback connects the data
path from the transmitter Output Driver Block to the Clock Recovery Block, and disables the external receiver
input. Transmit loopback is activated by placing a low on the LBKTX input signal lead. Receive loopback connects the receive data path to the transmit output circuits and disables the transmit input. Receive loopback is
activated by placing a low on the LBKRX input signal lead.
For 6 Mbit/s operation, the MRT should be operated in the P and N rail mode, bypassing the HDB3 Decoder/
Encoder. When the MRT is used with the TranSwitch JT2F device at this bit rate, the JT2F can provide either
B6ZS or B8ZS encoding and decoding.
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TXC-02050C-MB
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MRT
TXC-02050C
DATA SHEET
TP/TD
8
40
TN
VDD
42
TXAIS
44
VCOC
PNENB
GNDD
GNDD
TXLOC
2
RXAIS
BERCK
4
LQLTY
6
GNDD
PIN DIAGRAM
GNDD
38
CLKI
VDD
DCK
VDD
GNDD
RN
34
12
Pin Diagram
32
30
DI2
28
DI1
EQB0
EQB1
26
LOW
LBKTX
24
LBKRX
VAGC
22
AGFIL
RXDIS
20
RXLOS
CV
18
16
VDD
PLLC
GNDD
GNDA
CLKO
GNDD
TPO
TNO
(Top View)
14
GNDD
VDD
TXC-02050C
RP/RD
CLKO
36
MRT
10
Figure 2. MRT TXC-02050C Pin Diagram
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MRT
TXC-02050C
DATA SHEET
PIN DESCRIPTIONS
Power Supply and Ground
Symbol
Pin No.
I/O/P*
Type
Name/Function
VDD
10,18,35,
37,42
P
VDD: VDD, +5 volt supply, ± 5%.
GNDD
1,6,11,16,32,
36,39,44
P
Digital Ground: 0 volts reference.
VAGC
23
P
AGC VDD: +4.3 volt supply, derived from VDD using
1N914 or 1N4148 diode (see Figure 10).
GNDA
31
P
Analog Ground: 0 volts reference.
*Note: I = Input; O = Output; P = Power.
Line Side I/O
Symbol
Pin No.
I/O/P
Type *
Name/Function
DI1
29
I
Analog
Data In 1: HDB3 or B8ZS encoded bipolar receive data
input.
DI2
30
O
Analog
Data In 2: DC Voltage Reference for Data Input DI1.
The MRT uses an internally generated voltage reference as an AC ground for the received data input. An
external 0.1 µF capacitor, in parallel with a 10 µF/6.3 V
tantalum capacitor, is connected between this pin and
ground. No other connection should be made to this pin.
TNO
33
O
TTL24mA
Transmit Negative Out: Line transmit negative; output
is active high.
TPO
34
O
TTL24mA
Transmit Positive Out: Line transmit positive; output is
active high.
* See Input and Output Parameters section for digital Type definitions.
Terminal Side I/O
Symbol
Pin No.
I/O/P
Type
Name/Function
RN
12
O
TTL4mA
(Tristate)
Receive Negative: When PNENB is low, the HDB3
codec is bypassed and N-rail (RN) data is provided on
this pin. When PNENB is high or RXDIS is low, this pin
is forced to a high impedance state (disabled).
RP/RD
13
O
TTL4mA
(Tristate)
Receive Positive/Receive Data: When PNENB is low,
the HDB3 codec is bypassed and P-Rail (RP) data is
provided on this pin. When PNENB is high, NRZ data
(RD) is provided. When RXDIS is low, this pin is forced
to a high impedance state (disabled).
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MRT
TXC-02050C
DATA SHEET
Symbol
Pin No.
I/O/P
Type
Name/Function
CLKO
14
O
CMOS8mA
(Tristate)
Clock Out Inverted: Receive inverted clock output.
Positive and negative rail receive data is clocked out on
the rising edge. When PNENB is high or RXDIS is low,
this pin is forced to a high impedance state (disabled).
CLKO
15
O
CMOS8mA
(Tristate)
Clock Out: Receive clock output. Receive positive and
negative rail and NRZ data is clocked out on the falling
edge. When RXDIS is low, this pin is forced to a high
impedance state (disabled).
CLKI
38
I
TTLr
Clock In: Transmit clock input for P and N rail and NRZ
data. Transmit data is clocked into the MRT on the rising
edge. This clock must have a frequency accuracy of
± 20 ppm for the 34368 kbit/s operation and ± 30 ppm
for the 6312/8448 kbit/s operation (ref: ITU-T recommendation G.703). The duty cycle requirement for this
clock signal is (50 ± 5) %, measured at the 1.4V TTL
threshold level.
TP/TD
40
I
TTL
Transmit Positive/Transmit Data: When PNENB is
low, the HDB3 codec is bypassed and transmit P-rail
(TP) data is applied to this pin. When PNENB is high,
NRZ transmit data (TD) is applied.
TN
41
I
TTL
Transmit Negative: When PNENB is low, the HDB3
codec is bypassed and transmit N-Rail (TN) is applied to
this pin. When PNENB is high, this input is disabled.
Alarm Signal Outputs
Symbol
Pin No.
I/O/P
Type
Name/Function
TXLOC
2
O
TTL2mA
Transmit Loss Of Clock: Active low output. A transmit
loss of clock alarm occurs when the transmit clock input
(CLKI) is stuck high or low for about 500 clock cycles.
Recovery occurs on the first input clock transition. DCK
is required for proper operation.
LQLTY
5
O
TTL2mA
Line Quality: This signal represents an estimate of the
line quality which is determined by counting coding violations for 34 (8) Mbit/s operation. If the line error rate
exceeds a 10-6 threshold during a 10 (40) second interval, LQLTY goes active high. LQLTY is active low when
coding violations do not exceed the 10-6 threshold in a
10 (40) second interval. The output on this pin is only
valid when the appropriate clock signal is applied to
BERCK. It should be disregarded in the P and N mode
of operation or in 6 Mbit/s operation.
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MRT
TXC-02050C
DATA SHEET
Symbol
Pin No.
I/O/P
Type
Name/Function
CV
19
O
TTL2mA
Coding Violation: Active high output. A coding violation
pulse occurs when an HDB3 coding violation is detected
in the received line data input. A coding violation is not
part of the HDB3 zero-substitution code. A coding violation occurs because of noise or other impairments
affecting the line signal. The output of this pin should be
disregarded in the P and N mode.
RXLOS
20
O
TTL2mA
Receive Loss Of Signal: Active low output. A receive
loss of signal occurs when the input data is zero for
40-50 µs. Recovery occurs when the receive signal
returns.
MRT Control Leads
Symbol
Pin No.
I/O/P
Type
Name/Function
RXAIS
3
I
CMOSr
Receive Alarm Indication Signal: When RXAIS is low,
the MRT generates AIS (all ones signal) for the terminal
side receive output data. The line side receive data path
is disabled. The reference clock (DCK) provides the
clock source required for generating AIS.
BERCK
4
I
TTLr
Bit Error Rate Clock: This clock establishes the time
base for estimating the coding violation error rate. For
34 Mbit/s operation the clock frequency must be 6 kHz,
and for 8 Mbit/s operation the clock frequency must be
1.5 kHz. This pin should be left open for P and N mode
operation.
PNENB
8
I
CMOSr
P And N Enable: When PNENB is low, the P and N rail
interface is enabled, and the HDB3 codec is bypassed.
When PNENB is high, the terminal side I/O data is NRZ
and the HDB3 codec is enabled. This pin must be held
low for 6 Mbit/s operation.
DCK
9
I
TTL
Reference Clock: Operating frequency reference clock.
For receive signal clock recovery, ± 200 ppm frequency
accuracy is adequate. If the transmit and receive AIS
features are used, the frequency accuracy must be ± 20
ppm for 34368 kbit/s and ± 30 ppm for 8448 and 6312
kbit/s operation. The duty cycle requirement for this
clock signal is (50 ± 5) % as measured at the 1.4V TTL
threshold level.
RXDIS
21
I
CMOSr
Receive Disable: When RXDIS is low, the receive side
of the MRT is disabled and the RN, RP/RD, CLKO and
CLKO output leads are forced to a high impedance
state.
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MRT
TXC-02050C
DATA SHEET
Symbol
Pin No.
I/O/P
Type
Name/Function
LBKRX
24
I
CMOSr
Loopback Receive: When LBKRX is low, the MRT
loops back receive data as transmit data. The receive
data is also sent to the terminal side, but the transmit
data input on the terminal side is disabled (see Note 1).
LBKTX
25
I
CMOSr
Loopback Transmit: When LBKTX is low, the MRT
loops back transmit data as receive data. The transmit
data is sent on the line side, but the receive data input
on the line side is disabled (see Note 1).
Note 1: Setting LBKTX and LBKRX low simultaneously will cause invalid outputs at the receive terminal and transmit line
ports.
LOW
26
I
CMOSr
Low Frequency: When LOW is low, the MRT enables
equalization and input attenuator settings for 6312 or
8448 kbit/s operation. When LOW is high, the settings
for 34368 kbit/s operation are enabled. This lead also
controls the clock recovery high/low frequency range circuit.
EQB1
EQB0
27
28
I
I
CMOSr
Equalizer Bit 1: MSB of equalizer setting.
Equalizer Bit 0: LSB of equalizer setting.
The equalizer setting depends on cable length
(attenuation) as shown in the following tables.
For 34 Mbit/s operation:
EQB1 EQB0 Cable Attenuation @ f *
1
1
0dB < cable < 5.7dB
1
0
4.1dB < cable < 12dB
0
0
5.7dB < cable < 14dB
0
1
6.8dB < cable <14 dB
For 8 Mbit/s operation:
1
1
0dB < cable < 3.5dB
1
0
3.0dB < cable < 6.5dB
0
0
3.6dB < cable < 6.8dB
For 6 Mbit/s operation (see Note 2):
1
1
0dB < cable < 2.4dB
1
0
2.4dB < cable < 5.1dB
0
0
3.1dB < cable < 6.0dB
* f = 1/2 the bit rate
TXAIS
43
I
CMOSr
Equivalent
ATT 734A Cable
0 - 550 ft.
400 - 1150 ft.
550 - 1350 ft.
650 - 1350 ft.
0 - 550 ft.
500 - 1100 ft.
700 - 1350 ft.
Equivalent
ATT 734A Cable
0 - 550 ft.
500 - 1100 ft.
700 - 1350 ft
Transmit AIS: When TXAIS is low, the MRT sends an
AIS (all ones signal) for the line side transmit output
data. The terminal side transmit data path is disabled.
The reference clock (DCK) provides the clock required
for generating AIS. equivalent
Note 2: For 6 Mbit/s operation, setting the equalizer for long cable length while having a short cable will cause an error in
the recovered clock frequency. The recovered clock frequency will not be 6.312 MHz.
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MRT
TXC-02050C
DATA SHEET
Pins With External Components
Symbol
Pin No.
I/O/P
Type
Name/Function
VCOC
7
I
Analog
Voltage Controlled Oscillator Capacitor: For 6, 8, and
34 Mbit/s operation, a 470 ohm ± 5% 1/8 watt resistor is
connected in series with a 0.1 µF ± 10% capacitor from
this pin to ground. This component is used in the phaselocked loop filter.
PLLC
17
I
Analog
Phase-Locked Loop Capacitor: 0.1 µF ± 10% ceramic
disk capacitor connected to ground.
AGFIL
22
I
Analog
Automatic Gain Filter: For 6 , 8, and 34 Mbit/s operation, a 0.1 µF ± 10% ceramic disk capacitor is connected from this pin to ground.
- 10 of 36 -
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TXC-02050C
DATA SHEET
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Min *
Max *
Unit
Supply voltage
VDD
-0.3
+7.0
V
AGC Supply Voltage
VAGC
-0.5
+6.5
V
DC input voltage
VIN
-0.5
VDD + 0.5
V
Continuous power dissipation
PC
750
mW
Ambient operating temperature
TA
Operating junction temperature
TJ
Storage temperature range
TS
*Note:
-40
o
85
-55
C
125
oC
150
oC
Operating conditions exceeding those listed in Absolute Maximum Ratings may cause permanent failure. Exposure to absolute maximum ratings for extended periods may impair device reliability.
THERMAL CHARACTERISTICS
Parameter
Min
Typ
Thermal Resistance:
junction to ambient
Max
Unit
46
oC/W
Test Conditions
0 ft/min linear airflow
POWER REQUIREMENTS
Parameter
Min
Typ
Max
Unit
Test Conditions
VDD
4.75
5.0
5.25
V
VAGC
VDD - 0.3
VDD - 0.62
V
IDD
100
mA
VDD = 5.25V
IAGC
20
mA
VAGC = 4.63V
PDD
525
mW
VDD = 5.25V *
PAGC
93
mW
VAGC = 4.75V *
Derived from VDD via a
1N914 or 1N4148 diode.
* with inputs switching and outputs terminated.
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TXC-02050C
DATA SHEET
INPUT AND OUTPUT PARAMETERS
Input Parameters For TTL
Parameter
Min
Typ
Max
Unit
Test Conditions
VIH
2.0
VDD+0.3
V
4.75 <VDD < 5.25
VIL
-0.3
0.8
V
4.75 <VDD < 5.25
10
µA
VDD = 5.25
Input leakage current
Input capacitance
5.5
pF
Input Parameters For TTLr
Parameter
Min
Typ
Max
Unit
Test Conditions
VIH
2.0
VDD+0.3
V
4.75 <VDD < 5.25
VIL
-0.3
0.8
V
4.75 <VDD < 5.25
120
µA
VDD = 5.25
Input leakage current
50
Input capacitance
5.5
Note:
pF
Input has a 100K (nominal) internal pull-up resistor.
Input Parameters For CMOSr
Parameter
Min
Typ
Max
Unit
Test Conditions
VIH
2.0
VDD+0.3
V
4.75 <VDD < 5.25
VIL
-0.3
0.8
V
4.75 <VDD < 5.25
120
µA
VDD = 5.25
Input leakage current
50
Input capacitance
5.5
Note:
pF
Input has a 100K (nominal) internal pull-up resistor.
Output Parameters For TTL2mA
Parameter
VOH
Min
Typ
Max
VDD - 0.5
Unit
V
VDD = 4.75; IOH = -1.0 mA
VDD = 4.75; IOL = 2.0 mA
VOL
0.4
V
IOL
2.0
mA
IOH
-1.0
mA
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Test Conditions
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TXC-02050C
DATA SHEET
Parameter
Min
Typ
Max
Unit
Test Conditions
tRISE
5.5
12.5
18.2
ns
CLOAD = 15pF
tFALL
2.3
4.4
6.5
ns
CLOAD = 15pF
Typ
Max
Unit
Output Parameters For TTL4mA
Parameter
Min
VDD - 0.5
VOH
Test Conditions
V
VDD = 4.75; IOH = -2.0 mA
VDD = 4.75; IOL = 4.0 mA
VOL
0.4
V
IOL
4.0
mA
IOH
-2.0
mA
tRISE
2.8
6.5
9.2
ns
CLOAD = 15 pF
tFALL
1.3
2.3
3.4
ns
CLOAD = 15 pF
Typ
Max
Unit
Output Parameters For TTL24mA
Parameter
Min
VDD - 0.5
VOH
Test Conditions
V
VDD = 4.75; IOH = -12.0 mA
VDD = 4.75; IOL = 24.0 mA
VOL
0.4
V
IOL
24.0
mA
IOH
-12.0
mA
tRISE
0.8
1.4
1.8
ns
CLOAD = 25 pF
tFALL
0.5
0.8
1.0
ns
CLOAD = 25 pF
Typ
Max
Unit
Output Parameters For CMOS8mA
Parameter
VOH
Min
VDD - 0.5
Test Conditions
V
VDD = 4.75; IOH = -8.0 mA
VDD = 4.75; IOL = 8.0 mA
VOL
0.4
V
IOL
8.0
mA
IOH
-8.0
mA
tRISE
1.3
2.4
3.8
ns
CLOAD = 25 pF
tFALL
1.1
1.8
2.5
ns
CLOAD = 25 pF
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TXC-02050C
DATA SHEET
TIMING CHARACTERISTICS
Detailed timing diagrams for the MRT are illustrated in Figures 3 through 9. All output times are measured with
maximum load capacitance appropriate for the pin type. Timing parameters are measured at voltage levels of
(VIH + VIL)/2 for input signals or (VOH + VOL)/2 for output signals.
Line Side Timing Characteristics
The line side timing characteristics of the MRT are designed so that the line output at the transformer output
meets the pulse shapes specified in ITU-T Rec. G.703 for 34 and 8 Mbit/s operation and the NTT Technical
Reference for High-Speed Digital Leased Circuit Services for 6 Mbit/s operation. The pulse masks for each of
the three modes of operation are shown in Figures 3, 4, and . Refer to the corresponding standard cited in
each case for further details regarding the interface. The output circuits to be used are shown in Figures 12, 13
and 14.
17 ns
(14.55 + 2.45)
0.1
0.2
V
1.0
0.2
0.1
8.65 ns
(14.55 - 5.90)
Nominal pulse
14.55 ns
0.5
12.1 ns
(14.55 - 2.45)
0.1
0.1
0.2
0
0.1 0.1
24.5 ns
(14.55 + 9.95)
29.1 ns
(14.55 + 14.55)
Reference: ITU-T Recommendation G.703
Figure 3. Pulse Mask at the 34368 kbit/s Interface
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TXC-02050C
DATA SHEET
69 ns
(59 + 10)
0.474
0.237
V
35 ns
0.474
0.237
2.370
(59 - 24)
Nominal pulse
59 ns
1.185
49 ns
(59 - 10)
0.474
0
0.237 0.237
0.237 0.237
100 ns
(59 + 41)
118 ns
(59 + 59)
Reference: ITU-T Recommendation G.703
Figure 4. Pulse Mask at the 8448 kbit/s Interface
Horizontal axis 20 ns/div
Vertical axis 1 V/div
Pulse amplitude
A
B
(0,2)
F
Nominal
pulse
shape
G
(0,1)
2.0V peak
50% width
H
I
(0,0)
Coordinates of each point
A : (0.0, 2.3)
F : (0.0,
B : (2.4, 2.3)
G : (0.4,
C : (2.4, 1.0)
H : (1.6,
D : (3.2, 0.3)
I : (1.6,
E : (4.0, 0.3)
1.7)
1.7)
0.9)
0.3)
C
D
E
(4,0)
Time
Reference: NTT Technical Reference for High-Speed
Digital Leased Circuit Services
(Third edition, 1990)
Figure 5. Pulse Mask at the 6312 kbit/s Interface
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DATA SHEET
Terminal Side Timing Characteristics
Figure 6. NRZ Transmit Input Timing
tCYC
tPWH
CLKI
1.4V
tSU
TP,TD
DATA
VALID
tH
DATA
VALID
Parameter
Symbol
CLKI clock period
DATA
VALID
Min
tCYC
CLKI duty cycle (tPWH/tCYC) (Note 1)
Typ
Max
(Note 2)
Unit
ns
--
45
55
%
TP,TD set-up time to CLKI↑
tSU
3
ns
TP,TD hold time after CLKI↑
tH
2
ns
Figure 7. NRZ Receive Output Timing
tPWH
tCYC
CLKO
tOD(1)
RP,RD
tOD(2)
CV
Parameter
CLKO clock period
CLKO duty cycle (tPWH/tCYC) (Note 1)
Symbol
Min
Typ
Max
(Note 2)
tCYC
Unit
ns
--
45
55
%
RP,RD output delay after CLKO↓
tOD(1)
-5
5
ns
CV output delay after CLKO↓ (Note 3)
tOD(2)
-5
5
ns
See Notes on next page.
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MRT
TXC-02050C
DATA SHEET
Notes:
1. CLKO symmetry is measured about the 50% amplitude point.
2. 158.4 ns for 6312 kbit/s; 118.4 ns for 8448 kbit/s; 29.10 ns for 34368 kbit/s.
3. The CV pulse occurs at the same time as the errored bit is presented at the output.
Figure 8. P and N Rail Transmit Input Timing
tCYC
tPWH
CLKI
1.4V
tSU
TP,TD
TN
tH
DATA
VALID
DATA
VALID
DATA
VALID
DATA
VALID
DATA
VALID
DATA
VALID
Parameter
CLKI clock period
CLKI duty cycle (tPWH/tCYC) (Note 1)
Symbol
Min
Typ
Max
Unit
(Note 2)
tCYC
ns
--
45
55
%
TP,TD & TN set-up time to CLKI↑
tSU
3
ns
TP,TD & TN hold time after CLKI↑
tH
2
ns
Notes:
1. CLKI symmetry is measured about the 1.4VDC threshold in order to assure symmetric output waveforms.
2. 158.4 ns for 6312 kbit/s; 118.4 ns for 8448 kbit/s; 29.10 ns for 34368 kbit/s.
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MRT
TXC-02050C
DATA SHEET
Figure 9. P and N Rail Receive Output Timing
tOD(1)
tCYC
tPWH
CLKO
CLKO
RP, RD
tOD(2)
RN
Parameter
CLKO clock period
CLKO duty cycle (tPWH/tCYC) (Note 1)
Symbol
Min
CLKO↓ output delay after CLKO↑
tOD(1)
RP, RD and RN output delay after CLKO↓
tOD(2)
Max
(Note 2)
tCYC
--
Typ
45
-5
Unit
ns
55
%
2
ns
6
ns
Notes:
1. CLKO symmetry is measured about the 50% amplitude point.
2. 158.4 ns for 6312 kbit/s; 118.4 ns for 8448 kbit/s; 29.10 ns for 34368 kbit/s.
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MRT
TXC-02050C
DATA SHEET
OPERATION
POWER SUPPLY, GROUND AND PLL CONNECTIONS
Ferrite Bead *(See Note 2)
10/6.3v
23
VAGC
A
VDD
31
capacitor
removed
VDD
GNDA
VDD
A
VDD
7
VCOC
A
470
17
PLLC
A
22
A
AGFIL
10
+
A
VDD, +5V
A
10/6.3v
18
D
35
D
37
1
6
11
16
32
36
39
44
D
Legend:
A = Analog Ground
D = Digital Ground
D
VDD
+
D
D
42
GNDD
GNDD
GNDD
GNDD
GNDD
GNDD
GNDD
GNDD
1N914 or 1N4148
D
D
Notes:
1. All capacitors are 0.1 microfarad unless otherwise specified.
TXC-02050C
2. Ferrite bead is part number 2743002111 of Fair
Rite Corp., Walkill, NY, (914) 895-2055 or
equivalent.
Figure 10. MRT Power Supply, Ground and PLL Connections
The MRT device has separate power supply pins labeled VDD and VAGC. The VAGC supply pin is connected
to the internal AGC amplifier and is derived from the VDD supply as indicated in Figure 10. Separate bypass
networks must be used for connecting the VDD and VAGC supply pins on the MRT to +5V. The bypass network
on the VAGC pin consists of a 1N4148 or 1N914 diode, a ferrite bead and a 10 microfarad 6.3 volt (tantalum)
capacitor connected to analog ground in parallel with a 0.1 microfarad capacitor, as shown in Figure 10.
TranSwitch recommends that the 0.1 microfarad decoupling capacitors be of RF quality and that they be connected in close proximity to the device.
The recommended ground plane for the MRT device is a common ground plane for both analog and digital
ground. The ground plane beneath and approximately 0.25" beyond the physical dimensions of the MRT needs
to be separated into analog and digital grounds by notching approximately 25 mils of the copper ground plane,
as shown in Figure 11. Additional MRT application design considerations are discussed in TranSwitch
Application Note AN-517 “Design Considerations for use of the MRT device with the E2/E3F Device.”
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MRT
TXC-02050C
DATA SHEET
6
1
40
7
39
D
D
A
29
17
18
28
D
Legend: --- 25 mil notching of ground plane under device to
separate analog (A) and digital (D) ground areas
Figure 11. Ground Plane of Application Circuit Board
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MRT
TXC-02050C
DATA SHEET
OVERVIEW
Line Side Input Impedance
The input impedance of the MRT is a function of the state of the LOW lead and the operating rate. The table
below lists the input impedance of the MRT at the operating line rates (which are 1/2 the bit rates).
MRT Input Impedance
Condition
Minimum Input Impedance, | Z |
LOW = 1, line rate = 17184 kHz (E3)
1260 ohms
LOW = 0, line rate = 4224 kHz (E2)
2390 ohms
LOW = 0, line rate = 3156 kHz (JT2)
3670 ohms
Line Side Input Sensitivity
The input voltage sensitivity of the MRT depends on the state of the LOW lead as shown in the table below.
MRT Input Sensitivity
Input Sensitivity (peak volts)
Min
Max
LOW Lead
Rate, Mbit/s
0
6/8 (JT2/E2)
0.5
2.7
1
34 (E3)
0.15
1.1
Line Side Input Circuit
The circuit shown in Figure 12 illustrates the components required for operating the MRT device at 34368,
8448 or 6312 kbit/s. The 1:1 transformer should have a frequency response of 0.2 MHz < f < 80 MHz with an
insertion loss of 1 dB, maximum (suitable devices include Coilcraft part no. WB-1010 and Pulse Engineering
part no. PE-65966). This gives return loss and isolation voltage values that meet or exceed requirements.
1:1
Receive
Data
Input
29
75
5%
+
10/6.3
30
+
0.1
10/6.3
TXC-02050C
MRT
Device
0.1
Figure 12. Line Side Input Circuit
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TXC-02050C
DATA SHEET
Line Side Output Characteristics
The line side output of the MRT switches from “rail to rail” on both of its output leads, TPO and TNO. This provides the maximum voltage swing, and makes the output voltage depend on the +5 volt power supply input to
the chip. The external circuit design must therefore be done with care in order to assure meeting the amplitude
requirements.
Line Side Output Circuits
Figure 13 illustrates the output circuit required for operating the MRT device in a 34368 kbit/s application without a socket. The transformer and resistors shown assure that the output waveform meets the ITU-T mask for
34368 kbit/s transmission and that the MRT device is operated within the current limits of the TTL24mA output
parameters. The 1:2 transformer should have a frequency response of 0.2 MHz < f < 80 MHz with an insertion
loss of 1dB, maximum (suitable devices include Coilcraft part no. WB-1040 and Pulse Engineering part no.
PE-65969).
1:2
150
Transmit
Data
Output
34
33
TXC-02050C
MRT
Device
150
Figure 13. Line Side Output Circuit Outline - No Socket (34368 kbit/s)
Figure 14 shows a variation of the circuit in Figure 13. This circuit improves performance in applications when
a plastic device is mounted in a socket. The additional low-pass filter compensates for possible overshoot
caused by inductance created by the device/socket interface. The 1:2 transformer should have a frequency
response of 0.2 MHz < f < 80 MHz with an insertion loss of 1dB, maximum (suitable devices include Coilcraft
part no. WB-1040 and Pulse Engineering part no. PE-65969).
1:2
75
100
Transmit
Data
Output
18 pf
100
34
33
TXC-02050C
MRT
Device
75
18 pf
Figure 14. Line Side Output Circuit Outline - Socket (34368 kbit/s)
The peak voltage and current output requirements for 6312 and 8448 kbit/s operation are different from those
for 34368 kbit/s operation. Figure 15 illustrates the output circuit required for 6312 kbit/s and 8448 kbit/s operation. The 1:1 transformer should have a frequency response of 0.2 MHz < f < 80 MHz with an insertion loss of
1dB, maximum (suitable devices include Coilcraft part no. WB-1010 and Pulse Engineering part no.
PE-65966). The transformer, drivers and resistors assure that the output waveform meets the pulse mask
requirements for these rates and that the MRT device is operated within the current limits of the TTL24mA output parameters.
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MRT
TXC-02050C
DATA SHEET
R1
1:1
34
Transmit
Data
Output
33
TXC-02050C
MRT
Device
R2
For 8448 kbit/s operation: R1 and R2 = 27Ω
74ACT11244
or equivalent
For 6312 kbit/s operation: R1 and R2 = 36Ω
Figure 15. Line Side Output Circuit Outline (8448 and 6312 kbit/s)
JITTER AND INTERFERING TONE TOLERANCES
The jitter measurements described in this subsection are performed using an ANRITSU model ME502B Digital
Transmission Analyzer, or equivalent.
Jitter Tolerance
ITU-T Recommendations G.823 and JT-G703 specify that network equipment must be able to accommodate
and tolerate levels of jitter up to certain specified limits. The MRT accommodates and tolerates more input jitter
than the level of input jitter specified by these Recommendations.
With input jitter applied to the MRT line side receive input DI1 (pin 29), the MRT properly recovers clock,
decodes the signal, and outputs error-free NRZ data over (and beyond) the ITU-T ranges specified for jitter
input and frequency. Performance characteristics are shown below in Figure 16 (34368 kbit/s operation),
Figure 17 (8448 kbit/s operation) and Figure 18 (6312 kbit/s operation).
LOG SCALE
Measured
10.0
30
kHz
Input Jitter
(UI Peak- Peak)
Minimum Requirement
1.5
Acceptance
Range
1.0
ITU-T Rec. G.823 Limit
0.15
0.1
10Hz
100Hz
1kHz
10kHz
Frequency
100kHz
1MHz
LOG SCALE
Notes: Unit Interval (UI) = 1/(System Clock Frequency) = 29.10 ns
Test conditions: VDD=5V, TA=25°C, HDB3 coding, 223-1 data pattern
Figure 16. MRT Jitter Tolerance at 34368 kbit/s
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TXC-02050C
DATA SHEET
LOG SCALE
Measured
10.0
Input Jitter
(UI Peak- Peak)
10
kHz
Minimum Requirement
1.5
1.0
Acceptance
Range
ITU-T Rec. G.823 Limit
0.2
0.1
20
10Hz
100Hz
3k
400
10kHz
1kHz
Frequency
100kHz
1MHz
LOG SCALE
Notes: Unit Interval (UI) = 1/(System Clock Frequency) = 118.4 ns
Test conditions: VDD=5V, TA=25°C, HDB3 coding, 215-1 data pattern
Figure 17. MRT Jitter Tolerance at 8448 kbit/s
LOG SCALE
200Hz
10
Minimum Requirement
(JT-G703)
Measured
Input Jitter
(UI Peak- Peak)
5
Acceptance
Range
1
0.3
0.13
0.1
0.1
50Hz
10Hz
100Hz
2.5kHz
1kHz
10kHz 20kHz 40kHz
Frequency
LOG SCALE
60kHz
Notes: Unit Interval (UI) = 1/(System Clock Frequency) = 158.4 ns
Test conditions: VDD=5V, TA=25°C, B8ZS coding, 215-1 data pattern
Figure 18. MRT Jitter Tolerance at 6312 kbit/s
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DATA SHEET
MRT
TXC-02050C
Maximum Output Jitter In Absence of Input Jitter
ITU-T Recommendation G.823 specifies that it is necessary to restrict the amount of jitter generated by individual equipment at an output port. The amount of jitter allowed is dependent on the application in which the
equipment is used. For example, in a repeater application the recovered clock will be used for the transmit
clock. The recovered clock will have jitter due to the sending transmitter and to clock recovery of distorted data.
The jitter will be additive through each repeater. Therefore, it would be necessary to add a dejitter buffer (a PLL
with a very low bandwidth, usually using a VCXO) to reduce the jitter in the recovered clock before using it as a
transmit clock.
For the MRT in non-repeater applications, the maximum output jitter measurement is made on the transmit
path. The recovered clock output jitter is unimportant as long as proper clocking of following devices in possible
(with the exception of the above-mentioned repeater applications). The transmit clock in these cases is coming
from a device such as a framer whose clock is derived from the local oscillator on the board. To make this measurement, apply a signal with known jitter characteristics to the transmitter inputs and measure the jitter at the
transmitter outputs.
In the absence of applied jitter, the transmit path of the MRT introduces a maximum 0.05 Unit Intervals (UIs)
peak-to-peak jitter over the following frequency ranges:
At 6.312 Mbit/s: 10 Hz to 160 kHz
At 8448 kbit/s: 20 Hz to 400 kHz
At 34368 kbit/s: 100 Hz to 800 kHz
This operation is with the MRT terminated by the external components (and component values) specified in the
Pin Description Table for pin 7 (VCOC), pin 17 (PLLC), and pin 22 (AGFIL).
Jitter Transfer
Transfer of jitter through individual equipment is characterized by the relationship between the applied input jitter and the resulting output jitter as a function of frequency. ITU-T Recommendation G.823 specifies that it is
important to restrict jitter gain. Figure 4 of G.823 shows a typical jitter transfer characteristic. Note that a small
jitter gain is allowed. British Standard 6328: Section 8.1, 1990 gives the allowable gain as 0.5 dB.
With applied input jitter at the MRT receive input terminals, the maximum MRT receive output jitter is not
greater than the level of input jitter plus a maximum of 0.05 UI peak-to-peak jitter in the range of 10 Hz to 160
kHz for 6 Mbit/s, 20 Hz to 400 kHz for 8 Mbit/s, and 100 Hz to 800 kHz for 34 Mbit/s. These values are measured by applying a controlled, sinusoidal jitter signal to pins DI1 and DI2, then measuring the jitter at the
receiver output (i.e., CLKO).
This operation is with the same MRT external terminations as described in the Maximum Output Jitter section
above.
Interfering Tone Tolerance
The MRT will properly recover clock and present error-free output to the receive terminal side interface in the
presence of a PRBS interfering tone with the same data sequence as the data input while operating at 6, 8 or
34 Mbit/s, as specified in the following table:
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MRT
TXC-02050C
DATA SHEET
PRBS* Interfering Tone Tolerance
Data Rate (kbit/s)
Tone Rate (kbit/s)
Maximum Tone
Level
Data Sequence
Requirement
34368
34368 ± 100ppm
-11.5 dB
223 - 1
- 20
8448 ± 100ppm
8448
-14.5 dB
2
15
-1
- 18.5
*PRBS = Pseudo-Random Binary Sequence
HDB3 PATTERNS
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
1
0
1
0
0
0
0
1
1
0
0
0
0
1
0
0
0
0
HDB3
HDB3
E
HDB3
OD
OD
V
B
E
V
0
B
OD
0
0
0
V
V
E = indicates even number of pulses since last violation (V)
OD = indicates odd number of pulses since last violation (V)
V = intentional violation of alternating plus and minus pulses used for 1’s
B = pulse that follows the normal alternating Bipolar coding scheme
•
four zeros are replaced with B00V or 000V; the substitution choice is made so that the number of pulses between
violations (V’s) is odd; note that sequential violations are of opposite polarity so the net charge on the transmission
medium is zero.
Figure 19. Examples of HDB3 Coding
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TXC-02050C
DATA SHEET
EXAMPLES OF TRANSMIT INPUT AND OUTPUT DATA (34368 KBIT/S OPERATION)
TXCABLE
CLKI
1:1
TPO
MRT
TP/TD
TNO
TN
Unencoded NRZ Data (0 1 0 1 0 .....)
TP/TD
5
0
TN
0
TPO
1
0
TNO
1
0
CLKI
1
0
TXCABLE
1
0
-1
0
1
0
1
0
1
0
1
t0
RZ pulse
BIPOLAR RZ signal
Encoded NRZ P & N Data (0 1 0 1 0 ....)
TP/TD
5
0
TN
5
0
1
1
1
1
TPO, TNO, CLKI and TXCABLE are the same as in the unencoded NRZ case.
Figure 20. Examples of Transmit Input and Output Data (34368 kbit/s operation)
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MRT
TXC-02050C
DATA SHEET
PACKAGING
The MRT device is packaged in a 44-pin plastic leaded chip carrier suitable for socket or surface mounting, as
illustrated in Figure 21. All dimensions shown are in inches and are nominal unless otherwise noted.
0.170
0.650 SQ.
0.500 SQ.
0.075
6
1
0.690 SQ.
0.149
40
40
1
6
0.050 typ
7
39
7
39
TRANSWITCH
0.015 typ
17
29
18
17
29
28
28
18
BOTTOM VIEW
TOP VIEW
Figure 21. MRT TXC-02050C 44-Pin Plastic Lead Chip Carrier
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TXC-02050C-MB
Ed. 1, May 2002
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DATA SHEET
MRT
TXC-02050C
ORDERING INFORMATION
Part Number: TXC-02050CIPL
44-pin Plastic Leaded Chip Carrier
RELATED PRODUCTS
TXC-03701 E2/E3F Framer VLSI device. The E2/E3 Framer directly interfaces with the MRT
and provides multi-mode framing for ITU-T Rec. G.751/G.753 (34368 kbit/s) or ITU-T Rec.
G.742/G.745 (8448 kbit/s) signals.
TXC-03702 JT2F Framer VLSI device. The JT2F Framer directly interfaces with the MRT and
provides framing for ITU-T Rec. G.704 (6312 kbit/s) signals.
TXC-06125 XBERT VLSI device (Bit Error Rate Generator / Receiver). Programmable multirate test pattern generator and receiver in a single chip with bit-serial, nibble-parallel or byteparallel interface capability.
TXC-21055 MRT Evaluation Board. A complete ready-to-use single board that demonstrates
the functions and features of the MRT line interface VLSI device.
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TXC-02050C
DATA SHEET
STANDARDS DOCUMENTATION SOURCES
Telecommunication technical standards and reference documentation may be obtained from the following
organizations:
ANSI (U.S.A.):
American National Standards Institute
25 West 43rd Street
New York, New York 10036
Tel: (212) 642-4900
Fax: (212) 398-0023
Web: www.ansi.org
The ATM Forum (U.S.A., Europe, Asia):
Tel: (415) 561-6275
Fax: (415) 561-6120
Web: www.atmforum.com
404 Balboa Street
San Francisco, CA 94118
ATM Forum Europe Office
Kingsland House - 5th Floor
361-373 City Road
London EC1 1PQ, England
Tel: 20 7837 7882
Fax: 20 7417 7500
ATM Forum Asia-Pacific Office
Tel: 3 3438 3694
Fax: 3 3438 3698
Hamamatsucho Suzuki Building 3F
1-2-11, Hamamatsucho, Minato-ku
Tokyo 105-0013, Japan
Bellcore (See Telcordia)
CCITT (See ITU-T)
EIA (U.S.A.):
Tel:
Tel:
Fax:
Web:
Electronic Industries Association
Global Engineering Documents
15 Inverness Way East
Englewood, CO 80112
(800) 854-7179 (within U.S.A.)
(303) 397-7956 (outside U.S.A.)
(303) 397-2740
www.global.ihs.com
ETSI (Europe):
European Telecommunications
Standards Institute
650 route des Lucioles
06921 Sophia-Antipolis Cedex, France
- 30 of 36 -
Tel: 4 92 94 42 00
Fax: 4 93 65 47 16
Web: www.etsi.org
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MRT
TXC-02050C
DATA SHEET
GO-MVIP (U.S.A.):
The Global Organization for Multi-Vendor
Integration Protocol (GO-MVIP)
3220 N Street NW, Suite 360
Washington, DC 20007
Tel:
Tel:
Fax:
Web:
(800) 669-6857 (within U.S.A.)
(903) 769-3717 (outside U.S.A.)
(903) 769-3818
www.mvip.org
ITU-T (International):
Publication Services of International
Telecommunication Union
Telecommunication Standardization Sector
Place des Nations, CH 1211
Geneve 20, Switzerland
Tel: 22 730 5852
Fax: 22 730 5853
Web: www.itu.int
MIL-STD (U.S.A.):
DODSSP Standardization Documents
Ordering Desk
Building 4 / Section D
700 Robbins Avenue
Philadelphia, PA 19111-5094
Tel: (215) 697-2179
Fax: (215) 697-1462
Web: www.dodssp.daps.mil
PCI SIG (U.S.A.):
PCI Special Interest Group
5440 SW Westgate Dr., #217
Portland, OR 97221
Tel:
Tel:
Fax:
Web:
(800) 433-5177 (within U.S.A.)
(503) 291-2569 (outside U.S.A.)
(503) 297-1090
www.pcisig.com
Tel:
Tel:
Fax:
Web:
(800) 521-2673 (within U.S.A.)
(732) 699-2000 (outside U.S.A.)
(732) 336-2559
www.telcordia.com
Telcordia (U.S.A.):
Telcordia Technologies, Inc.
Attention - Customer Service
8 Corporate Place Rm 3A184
Piscataway, NJ 08854-4157
TTC (Japan):
TTC Standard Publishing Group of the
Telecommunication Technology Committee
Hamamatsu-cho Suzuki Building
1-2-11, Hamamatsu-cho, Minato-ku
Tokyo 105-0013, Japan
- 31 of 36 -
Tel: 3 3432 1551
Fax: 3 3432 1553
Web: www.ttc.or.jp
TXC-02050C-MB
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DATA SHEET
MRT
TXC-02050C
LIST OF DATA SHEET CHANGES
This change list identifies those areas within the updated MRT Data Sheet that have technical differences relative to the superseded MRT Data Sheet:
Updated MRT “C” Data Sheet:
Edition 1, May 2002
Superseded MRT Data Sheet:
Edition 3, April 1994
The page numbers indicated below of the updated data sheet include changes relative to the superseded data
sheet.
Page Number of
Updated Data Sheet
Summary of the Change
All
Changed edition number and date.
All
Changed GND to GNDD.
1
Made changes to items 3, 5, 6, 7 and 10 of the Feature list.
1
Added items 9, 11 and 12 to the Feature list.
1
Modified the first paragraph of Description section. Changed Patent information.
2
Added Table of Contents and List of Figures.
3
Modified Figure 1 and added product number to the figure title.
4
Made changes to Block Diagram Description section.
5
Added product number to the Figure title 2.
6
Made changes to Name/Function column for VDD, GNDD, VAGC, GNDA,
TNO and TPO.
6
Added a Note below the table to explain Type column heading for ‘Line Side
I/O’ section.
6-7
Made changes to Type and Name/Function columns for RN, RP/RD, CLKO
and CLKO.
7-10
Made changes to Name/Function column for CLKI, TXLOC, LQLTY,
RXLOS, DCK, LOW, EQB1, EQB0, VCOC and AGFIL.
10
Made changes to I/O/P column for VCOC, PLLC, AGFIL and added Note
below the table.
11
Added Test Conditions column to the second table.
Made changes to VAGC row of the last table.
Changed Test Condition for IAGC and changed Max for PAGC to the last
table. Changed in first table Max. Operating Junction Temperature.
Added a note below the table.
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DATA SHEET
Page Number of
Updated Data Sheet
12
MRT
TXC-02050C
Summary of the Change
Added Max for VIH and Min for VIL of the first three tables.
14-18
Made changes to Timing Characteristics section.
19-24
Made changes to Operation section. Removed capacitor from pin 31 and
Note 3 from Figure 10. Updated Jitter requirements in Figure 18.
28
Made minor changes to Packaging section.
29
Added item 3 to the Related Products section.
30-31
Updated the Standards Documentation Sources section.
32-33
Updated List of Data Sheet Changes.
35
Added Documentation Update Registration Form.
TranSwitch reserves the right to make changes to the product(s) or
circuit(s) described herein without notice. No liability is assumed as a
result of their use or application. TranSwitch assumes no liability for
TranSwitch applications assistance, customer product design, software performance, or infringement of patents or services described
herein. Nor does TranSwitch warrant or represent that any license,
either express or implied, is granted under any patent right, copyright,
mask work right, or other intellectual property right of TranSwitch covering or relating to any combination, machine, or process in which
such semiconductor products or services might be or are used.
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TXC-02050C-MB
Ed. 1, May 2002
TranSwitch Corporation
•
3 Enterprise Drive
•
Shelton, CT 06484 USA
•
Tel: 203-929-8810
- 34 of 36 -
•
Fax: 203-926-9453
•
www.transwitch.com
Proprietary TranSwitch Corporation Information for use Solely by its Customers
MRT
TXC-02050C
DATA SHEET
DOCUMENTATION UPDATE REGISTRATION FORM
If you would like to receive updated documentation for selected devices as it becomes available, please provide
the information requested below (print clearly or type) then tear out this page, fold and mail it to the Marketing
Communications Department at TranSwitch. Marketing Communications will ensure that the relevant Product
Information Sheets, Data Sheets, Application Notes, Technical Bulletins and other publications are sent to you.
You may also choose to provide the same information by fax (203.926.9453), or by e-mail ([email protected]), or
by telephone (203.929.8810). Most of these documents will also be made immediately available for direct
download as Adobe PDF files from the TranSwitch World Wide Web Site (www.transwitch.com).
Name: ________________________________________________________________________________
Company: ___________________________________________Title: ______________________________
Dept./Mailstop: __________________________________________________________________________
Street: ________________________________________________________________________________
City/State/Zip: __________________________________________________________________________
If located outside U.S.A., please add - Country: _______________
Telephone: ________________________
Postal Code: ___________________
Ext.: _____________ Fax: __________________________
E-mail: ________________________________________________
Please provide the following details for the managers in charge of the following departments at your company
location.
Department
Title
Name
Company/Division
__________________
__________________
Engineering
__________________
__________________
Marketing
__________________
__________________
Please describe briefly your intended application(s) and indicate whether you would like to have a TranSwitch
applications engineer contact you to provide further assistance:
_____________________________________________________________________________________________
_____________________________________________________________________________________________
_____________________________________________________________________________________________
_____________________________________________________________________________________________
If you are also interested in receiving updated documentation for other TranSwitch device types, please list them below
rather than submitting separate registration forms:
__________
__________
__________
__________
__________
__________
__________
__________
__________
__________
__________
__________
__________
__________
Please fold, tape and mail this page (see other side) or fax it to Marketing Communications at 203.926.9453.
- 35 of 36 -
TXC-02050C-MB
Ed. 1, May 2002
(Fold back on this line second, then tape closed, stamp and mail.)
First
Class
Postage
Required
3 Enterprise Drive
Shelton, CT 06484-4694
U.S.A.
TranSwitch Corporation
Attention: Marketing Communications Dept.
3 Enterprise Drive
Shelton, CT 06484-4694
U.S.A.
(Fold back on this line first.)
Please complete the registration form on this back cover sheet, and fax or mail it, if you wish
to receive updated documentation on this TranSwitch product as it becomes available.
TranSwitch Corporation
•
3 Enterprise Drive
•
Shelton, CT 06484 USA
•
Tel: 203-929-8810
•
Fax: 203-926-9453
•
www.transwitch.com