LIGITEK LHY2092-TBS-X

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
TAPE AND BOX TYPE LED LAMPS
LHY2092/TBS-X
DATA SHEET
DOC. NO :
QW0905- LHY2092/TBS-X
REV.
:
A
DATE
:
06 - Dec. - 2005
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO.LHY2092/TBS-X
Page 1/6
Package Dimensions
P2
H2
W2
H1
L
W0
W3
W1
D
+ - +
F
F
H
Y
P1
P
1
2
3
1.ANODE YELLOW
2.COMMON CATHODE
3.ANODE RED
T
LHY2092
3.0
4.0
4.2
5.2
6.7 ±0.5
H
Y
1.5
MAX
□0.5
18.0MIN
TYP
1
2
2.0MIN
2.0MIN
2.54TYP
1
2
3
3
1.ANODE YELLOW
2.COMMON CATHODE
3.ANODE RED
2.54TYP
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO.LHY2092/TBS-X
Page 2/6
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Symbol
Parameter
UNIT
H
Y
Forward Current
IF
15
20
mA
Peak Forward Current
Duty 1/10@10KHz
IFP
60
80
mA
Power Dissipation
PD
40
60
mW
Reverse Current @5V
Ir
10
μA
Operating Temperature
Topr
-40 ~ +85
℃
Storage Temperature
Tstg
-40 ~ +100
℃
Soldering Temperature
Tsol
Max 260 ℃ for 5 sec Max
(2mm from body)
Typical Electrical & Optical Characteristics (Ta=25 ℃)
PART NO
COLOR
MATERIAL
Emitted
GaP
Forward
Peak Spectral
voltage
wave halfwidth
length △λ nm @ 20mA(V)
λPnm
@10mA(mcd)
Viewing
angle
2θ 1/2
(deg)
Min. Max. Min. Typ.
Lens
Red
Luminous
intensity
697
90
1.7
2.6
1.2
3.0
60
585
35
1.7
2.6
8.0
12
60
White Diffused
LHY2092/TBS-X
GaAsP/GaP Yellow
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO.LHY2092/TBS-X
Page 3/6
•Dimensions Symbol Information
SPECIFICATIONS
OPTION
SYMBOL
CODE
SYMBOL ITEMS
Minimum
Maximum
mm
inch
mm
inch
Tape Feed Hole Diameter
-------
D
3.8
0.15
4.2
0.17
Component Lead Pitch
-------
F
2.3
0.09
3.0
0.12
Front-To-Rear Deflection
-------
△H
-------
-------
2.0
0.08
TBS-1
TBS-2
TBS-3
TBS-4
TBS-5
TBS-6
TBS-7
TBS-8
TBS-9
TBS-10
H1
17.5
21.5
25.5
27.5
22.5
19.9
24.0
24.5
19.0
18.4
0.69
0.85
1.0
1.08
0.89
0.78
0.94
0.96
0.75
0.72
-------
H2
-------
-------
18.5
22.5
26.5
28.5
23.5
20.9
25.0
25.5
20.0
19.4
36
0.73
0.89
1.04
1.12
0.93
0.82
0.98
1.0
0.79
0.76
1.42
Lead Length After Component Height
-------
L
11.0
0.43
Feed Hole Pitch
-------
P
12.4
0.49
13.0
0.51
Lead Location
-------
P1
4.4
0.17
5.8
0.23
Center Of Component Location
-------
P2
5.1
0.2
7.7
0.3
Overall Taped Package Thickness
-------
T
-------
-------
1.42
0.06
Feed Hole Location
-------
W0
8.5
0.33
9.75
0.38
Adhesive Tape Width
-------
W1
14.5
0.57
15.5
0.61
Adhesive Tape Position
-------
W2
0
0
4.0
0.16
Tape Width
-------
W3
17.5
0.69
19.0
0.75
Feed Hole To Bottom Of Component
Feed Hole To Overall Component Height
W0
REMARK:TBS=Tape And Box Straight Leads
• Dimensions Symbol Information
• Package Dimensions
Specification
Description
Symbol
minimum
maxmum
W
mm
inch
mm
inch
Overall Length
L
330
13.0
340
13.4
Overall Width
W
265
10.4
275
10.8
Overall Thickness
H
50
1.97
60
2.4
Quantity/Box
2500PCS
L
H
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 4/6
PART NO.LHY2092/TBS-X
Typical Electro-Optical Characteristics Curve
H CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1.0
2.5
2.0
1.5
1.0
0.5
0.1
0.0
1.0
2.0
3.0
4.0
5.0
1.0
10
Fig.4 Relative Intensity vs. Temperature
1.2
Relative Intensity@20mA
Normalize @25℃
Forward Voltage@20mA
Normalize @25℃
Fig.3 Forward Voltage vs. Temperature
1.1
1.0
0.9
0.8
-20
0
20
40
60
80
3.0
2.5
2.0
1.5
1.0
0.5
0.0
100
-40
-20
0
20
40
60
80
100
Ambient Temperature( ℃)
Ambient Temperature( ℃)
Fig.5 Relative Intensity vs. Wavelength
Relative Intensity@20mA
1000
Forward Current(mA)
Forward Voltage(V)
-40
100
Fig.6 Directivity Radiation
0°
1.0
-30°
30°
-60°
0.5
0.0
100% 75% 50%
600
700
800
900
Wavelength (nm)
1000
60°
25%
0
25% 50% 75% 100%
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 5/6
PART NO.LHY2092/TBS-X
Typical Electro-Optical Characteristics Curve
Y CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1.0
0.1
2.5
2.0
1.5
1.0
0.5
0.0
1.0
2.0
3.0
4.0
5.0
1.0
10
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
Relative Intensity@20mA
Normalize @25℃
Forward Voltage@20mA
Normalize @25℃
1.2
1.1
1.0
0.9
0.8
-20
0
20
40
60
80
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-40
100
-20
0
20
40
60
80
100
Ambient Temperature( ℃)
Ambient Temperature( ℃)
Fig.5 Relative Intensity vs. Wavelength
Relative Intensity@20mA
1000
Forward Current(mA)
Forward Voltage(V)
-40
100
Fig.6 Directivity Radiation
0°
1.0
-30°
30°
-60°
0.5
0.0
100% 75% 50%
500
550
600
650
Wavelength (nm)
700
60°
25%
0
25% 50% 75% 100%
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 6/6
PART NO.LHY2092/TBS-X
Reliability Test:
Test Item
Test Condition
Description
Reference
Standard
Operating Life Test
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resisance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=105 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of
the device which is laid under ondition
of high temperature for hours.
MIL-STD-883:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
High Temperature
High Humidity Test
1.Ta=65 ℃±5℃
2.RH=90 %~95%
3.t=240hrs ±2hrs
The purpose of this test is the resistance
of the device under tropical for hous.
Thermal Shock Test
1.Ta=105 ℃±5 ℃&-40 ℃±5 ℃
(10min) (10min)
2.total 10 cycles
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solderability Test
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
This test intended to see soldering well
performed or not.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
JIS C 7021: B-12
MIL-STD-202:103B
JIS C 7021: B-11