LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only TAPE AND BOX TYPE LED LAMPS LHY2092/TBS-X DATA SHEET DOC. NO : QW0905- LHY2092/TBS-X REV. : A DATE : 06 - Dec. - 2005 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO.LHY2092/TBS-X Page 1/6 Package Dimensions P2 H2 W2 H1 L W0 W3 W1 D + - + F F H Y P1 P 1 2 3 1.ANODE YELLOW 2.COMMON CATHODE 3.ANODE RED T LHY2092 3.0 4.0 4.2 5.2 6.7 ±0.5 H Y 1.5 MAX □0.5 18.0MIN TYP 1 2 2.0MIN 2.0MIN 2.54TYP 1 2 3 3 1.ANODE YELLOW 2.COMMON CATHODE 3.ANODE RED 2.54TYP Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO.LHY2092/TBS-X Page 2/6 Absolute Maximum Ratings at Ta=25 ℃ Ratings Symbol Parameter UNIT H Y Forward Current IF 15 20 mA Peak Forward Current Duty 1/10@10KHz IFP 60 80 mA Power Dissipation PD 40 60 mW Reverse Current @5V Ir 10 μA Operating Temperature Topr -40 ~ +85 ℃ Storage Temperature Tstg -40 ~ +100 ℃ Soldering Temperature Tsol Max 260 ℃ for 5 sec Max (2mm from body) Typical Electrical & Optical Characteristics (Ta=25 ℃) PART NO COLOR MATERIAL Emitted GaP Forward Peak Spectral voltage wave halfwidth length △λ nm @ 20mA(V) λPnm @10mA(mcd) Viewing angle 2θ 1/2 (deg) Min. Max. Min. Typ. Lens Red Luminous intensity 697 90 1.7 2.6 1.2 3.0 60 585 35 1.7 2.6 8.0 12 60 White Diffused LHY2092/TBS-X GaAsP/GaP Yellow Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO.LHY2092/TBS-X Page 3/6 •Dimensions Symbol Information SPECIFICATIONS OPTION SYMBOL CODE SYMBOL ITEMS Minimum Maximum mm inch mm inch Tape Feed Hole Diameter ------- D 3.8 0.15 4.2 0.17 Component Lead Pitch ------- F 2.3 0.09 3.0 0.12 Front-To-Rear Deflection ------- △H ------- ------- 2.0 0.08 TBS-1 TBS-2 TBS-3 TBS-4 TBS-5 TBS-6 TBS-7 TBS-8 TBS-9 TBS-10 H1 17.5 21.5 25.5 27.5 22.5 19.9 24.0 24.5 19.0 18.4 0.69 0.85 1.0 1.08 0.89 0.78 0.94 0.96 0.75 0.72 ------- H2 ------- ------- 18.5 22.5 26.5 28.5 23.5 20.9 25.0 25.5 20.0 19.4 36 0.73 0.89 1.04 1.12 0.93 0.82 0.98 1.0 0.79 0.76 1.42 Lead Length After Component Height ------- L 11.0 0.43 Feed Hole Pitch ------- P 12.4 0.49 13.0 0.51 Lead Location ------- P1 4.4 0.17 5.8 0.23 Center Of Component Location ------- P2 5.1 0.2 7.7 0.3 Overall Taped Package Thickness ------- T ------- ------- 1.42 0.06 Feed Hole Location ------- W0 8.5 0.33 9.75 0.38 Adhesive Tape Width ------- W1 14.5 0.57 15.5 0.61 Adhesive Tape Position ------- W2 0 0 4.0 0.16 Tape Width ------- W3 17.5 0.69 19.0 0.75 Feed Hole To Bottom Of Component Feed Hole To Overall Component Height W0 REMARK:TBS=Tape And Box Straight Leads • Dimensions Symbol Information • Package Dimensions Specification Description Symbol minimum maxmum W mm inch mm inch Overall Length L 330 13.0 340 13.4 Overall Width W 265 10.4 275 10.8 Overall Thickness H 50 1.97 60 2.4 Quantity/Box 2500PCS L H LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 4/6 PART NO.LHY2092/TBS-X Typical Electro-Optical Characteristics Curve H CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 2.5 2.0 1.5 1.0 0.5 0.1 0.0 1.0 2.0 3.0 4.0 5.0 1.0 10 Fig.4 Relative Intensity vs. Temperature 1.2 Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ Fig.3 Forward Voltage vs. Temperature 1.1 1.0 0.9 0.8 -20 0 20 40 60 80 3.0 2.5 2.0 1.5 1.0 0.5 0.0 100 -40 -20 0 20 40 60 80 100 Ambient Temperature( ℃) Ambient Temperature( ℃) Fig.5 Relative Intensity vs. Wavelength Relative Intensity@20mA 1000 Forward Current(mA) Forward Voltage(V) -40 100 Fig.6 Directivity Radiation 0° 1.0 -30° 30° -60° 0.5 0.0 100% 75% 50% 600 700 800 900 Wavelength (nm) 1000 60° 25% 0 25% 50% 75% 100% LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 5/6 PART NO.LHY2092/TBS-X Typical Electro-Optical Characteristics Curve Y CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 0.1 2.5 2.0 1.5 1.0 0.5 0.0 1.0 2.0 3.0 4.0 5.0 1.0 10 Fig.3 Forward Voltage vs. Temperature Fig.4 Relative Intensity vs. Temperature Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ 1.2 1.1 1.0 0.9 0.8 -20 0 20 40 60 80 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 100 -20 0 20 40 60 80 100 Ambient Temperature( ℃) Ambient Temperature( ℃) Fig.5 Relative Intensity vs. Wavelength Relative Intensity@20mA 1000 Forward Current(mA) Forward Voltage(V) -40 100 Fig.6 Directivity Radiation 0° 1.0 -30° 30° -60° 0.5 0.0 100% 75% 50% 500 550 600 650 Wavelength (nm) 700 60° 25% 0 25% 50% 75% 100% LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 6/6 PART NO.LHY2092/TBS-X Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hous. Thermal Shock Test 1.Ta=105 ℃±5 ℃&-40 ℃±5 ℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11