4 PIN SOP 3.0 pF LOW OUTPUT CAPACITANCE 1-CH OPTICAL COUPLED MOSFET PS7200A-1A FEATURES DESCRIPTION • LOW C X R: C X R = 30 pF • Ω PS7200A-1A is a low output capacitance solid state relay containing a GaAs LED on the light emitting side (input side) and MOS FETs on the output side. • LOW OUTPUT CAPACITANCE: COUT = 3.0 pF TYP It is suitable for high-frequency signal control, due to its low C x R, low output capacitance, and low off-state leakage current. • LOW OFF-STATE LEAKAGE CURRENT: ILOFF = 0.1 nA TYP • HIGH SPEED TURN-ON TIME: tON = 0.01 ms TYP APPLICATIONS • 1 CHANNEL TYPE: (1a output) • MEASUREMENT EQUIPMENT • DESIGNED FOR AC/DC SWITCHING LINE CHANGER • SMALL PACKAGE: 4 pin SOP • HIGH ISOLATION VOLTAGE: (BV = 1500 Vr.m.s.) • LOW OFFSET VOLTAGE • LOW LED OPERATING CURRENT: IF = 2 mA • SURFACE MOUNT AVAILABLE ELECTRICAL CHARACTERISTICS (TA = 25 °C) PART NUMBER Coupled MOS Diode FET SYMBOLS PS7200A-1A PARAMETERS UNITS MIN TYP MAX 1.2 1.4 VF Forward Voltage, IF = 10 mA V IR Reverse Current, VR = 5 V µA ILOFF Off-State Leakage Current, VD = 40 V nA 0.1 COUT Output Capacitance, V = 0 V, f = 1 MHz pF 3.0 IFon LED On-state Current, IL = 100 mA mA RON1 RON2 On-State Resistance tON Turn-on Time1 tOFF Time1 Turn-off IF = 10 mA, IL = 10 mA IF = 10 mA, IL = 100 mA, t≤10 ms IF = 10 mA, VO = 5 V, PW ≥ 10 ms 5.0 2.0 Ω 9.3 12 ms 0.01 0.5 0.07 0.2 ms RI-O Isolation Resistance, VI-O = 1.0 kVDC CI-O Isolation Capacitance, V = 0 V, f = 1 MHz Ω pF/ch Note: 1. Test Circuit for Switching Time: 100 9 10 0.5 PS7200A-1A IF Pulse Input 4 3 1 2 VL Input 50% 0 Input Monitor VO Monitor Rin RL VO = 5 V 90% Output 10% ton toff California Eastern Laboratories PS7200A-1A ABSOLUTE MAXIMUM RATINGS1 (TA = 25°C) SYMBOLS Diode IF VR PD IFP MOSFET VL IL ILP PD Coupled BV PT TOP TSTG PARAMETERS UNITS RATINGS mA V mW/ch A 50 5.0 50 1 V mA 40 100 RECOMMENDED OPERATING CONDITIONS (TA = 25°C) PART NUMBER Forward Current (DC) Reverse Voltage Power Dissipation Peak Foward Current2 PS7200A-1A SYMBOLS PARAMETERS IF LED Operating Current VF LED Off Voltage UNITS mA V MIN TYP MAX 2 10 20 0 0.5 ORDERING INFORMATION Break Down Voltage Continuous Load Current Pulse Load Current3 AC/DC Connection Power Dissipation mA mW/ch 200 100 Isolation Voltage4 Total Power Dissipation Operating Ambient Temp. Storage Temperature Vr.m.s. mW °C °C 1500 150 -40 to +80 -40 to +100 PART NUMBER PACKAGE PACKING STYLE PS7200A-1A 4-pin SOP Magazine case 100 pcs PS7200A-1A-E3 Embossed tape 900 pcs/reel PS7200A-1A-E4 PS7200A-1A-F3 Embossed tape 3500 pcs/reel PS7200A-1A-F4 Notes: 1. Operation in excess of any one of these parameters may result in permanent damage. 2. PW = 100 µs, Duty Cycle = 1 % 3. PW = 100 ms, 1 shot. 4. AC voltage for 1 minute at TA = 25 °C, RH = 60 % between input and output. TYPICAL PERFORMANCES CURVES (TA = 25˚C) MAXIMUM LOAD CURRENT vs. AMBIENT TEMPERATURE MAXIMUM FORWARD CURRENT vs. AMBIENT TEMPERATURE 150 Maximum Load Current, IL (mA) Maximum Forward Current, IF (mA) 100 80 60 40 20 0 -25 0 25 50 75 80 100 50 0 -25 100 0 75 80 50 100 Ambient Temperature (TA ˚C) Ambient Temperature (TA ˚C) OUTPUT CAPACITANCE vs. APPLIED VOLTAGE FORWARD VOLTAGE vs. AMBIENT TEMPERATURE 1.6 5.0 1.4 IF = 50 mA 30 mA 20 mA 1.2 10 mA 5 mA 1.0 1 mA Output Capacitance, COUT (pF) Forward Voltage, VF (V) 25 f = 1 MHz 4.0 3.0 2.0 1.0 0 0.8 -25 0 25 50 75 Ambient Temperature (TA ˚C) 100 0 5 10 15 20 25 Applied Voltage, VD (V) 30 PS7200A-1A TYPICAL PERFORMANCE CURVES (TA = 25˚C) NORMALIZED ON-STATE RESISTANCE vs. AMBIENT TEMPERATURE ON-STATE RESISTANCE DISTRIBUTION 30 Normalized to 1.0 at TA = 25˚C, IF = 10 mA IL = 10 mA 2.5 n = 50 pcs IF = 10 mA IL = 10 mA 25 Number (pcs) Normalized On-state Resistance, Ron 3.0 2.0 1.5 1.0 20 15 10 5 0.5 0 0.0 -25 8.8 0 25 50 75 9.0 9.2 9.4 9.6 100 Ambient Temperature,TA (˚C) On-state Resistance, Ron (Ω) OFF-STATE LEAKAGE CURRENT vs. APPLIED VOLTAGE LOAD CURRENT vs. LOAD VOLTAGE 10-6 10-7 Load Current, IL (mA) Off-state Leakage Current, ILoff (A) IF = 10 mA 100 TA = 80˚C 10-8 10-9 25˚C 10 -10 50 -2.0 0 -1.0 2.0 1.0 -50 10-11 -100 10-12 0 10 20 30 40 50 Load Voltage, VL (V) Applied Voltage, VCC (V) TURN-OFF TIME vs. FORWARD CURRENT TURN-ON TIME vs. FORWARD CURRENT 0.5 0.05 VO = 5 V VO = 5 V 0.4 Turn-off Time toff (mS) Turn-on Time ton (mS) 0.04 0.03 0.02 0.01 0.3 0.2 0.1 0 0 5 10 15 20 Forward Current IF (mA) 25 30 0 5 10 15 20 Forward Current IF (mA) 25 30 PS7200A-1A TYPICAL PERFORMANCE CURVES (TA = 25˚C) TURN-OFF TIME DISTRIBUTION TURN-ON TIME DISTRIBUTION 30 30 n = 50 pcs IF = 10 mA VO = 5 V (pcs) 25 20 TNumber TNumber (pcs) 25 15 10 0.01 0.02 0.03 0.04 10 0.06 0.05 0.08 Turn-on Time, ton (mS) Turn-off Time, toff (mS) NORMALIZED TURN-ON TIME vs. AMBIENT TEMPERATURE NORMALIZED TURN-OFF TIME vs. AMBIENT TEMPERATURE 3.0 3.0 Normalized Turn-off Time, ton Normalized to 1.0 at TA = 25˚C, IF = 10 mA VO = 5 V 2.5 Normalized Turn-on Time, ton 15 0 0 2.0 1.5 1.0 0.5 0.0 -25 0 25 50 75 TOP VIEW 4 3 1 2 7.0±0.3 4.4 +0.10 0.15 -0.05 +0.10 0.4 -0.05 2.54 0.25 M 2.0 1.5 1.0 0.5 0 25 50 75 Ambient Temperature,TA (˚C) PS7200A-1A 2.05 +0.08 -0.05 2.5 -25 OUTLINE DIMENSIONS (Units in mm) 4.0±0.5 Normalized to 1.0 at TA = 25˚C, IF = 10 mA VO = 5 V 0.0 100 Ambient Temperature,TA (˚C) 0.5 20 5 5 +0.08 -0.05 n = 50 pcs IF = 10 mA VO = 5 V 0.5±0.3 1. LED Anode 2. LED Cathode 3. MOS FET 4. MOS FET 100 PS7200A-1A TAPING SPECIFICATIONS (Units in mm) Tape Outline and Dimensions 2.0 ± 0.1 1.75 ± 0.1 4.0 ± 0.1 2.4 ± 0.1 1.55 ± 0.1 5.5 ± 0.1 7.4 ± 0.1 12.0 ± 0.2 0.3 1.55 ± 0.1 4.6 ± 0.1 8.0 ± 0.1 Tape Direction PS7200A-1A-E4 PS7200A-1A-E3 Reel Outline and Dimensions 2.0 2.0±0.5 13.0±0.5 ø60 15° 15° ø180 ø13.0±0.5 ø21.0±0.8 13.0±1.0 Packing: 900 pcs/reel PS7200A-1A TAPING SPECIFICATIONS (Units in mm) Tape Outline and Dimensions 2.0 ± 0.1 1.75 ± 0.1 4.0 ± 0.1 2.4 ± 0.1 1.55 ± 0.1 5.5 ± 0.1 7.4 ± 0.1 12.0 ± 0.2 0.3 1.55 ± 0.1 4.6 ± 0.1 8.0 ± 0.1 Tape Direction PS7200A-1A-F4 PS7200A-1A-F3 Reel Outline and Dimensions 1.5 ± 0.1 1.5 ± 0.1 12 0° 1.5 ± 0.5 60 ° φ13.0±0.5 φ 330 2.0 ± 0.5 φ80±5.0 φ21.0 ± 0.8 6.0 ± 1 +2.0 12.4 -0.0 PS7200A-1A RECOMMENDED SOLDERING CONDITIONS (1) Infrared reflow soldering • Peak reflow temperature • Time of temperature higher than 210 °C • Number of reflows • Flux 235 °C or below (package surface temperature) 30 seconds or less Two Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt % is recommended.) Package Surface Temperature T (˚C) Recommended Temperature Profile of Infrared Reflow (heating) to 10 s 235 ˚C (peak temperature) 210 ˚C to 30 s 100 to 160 ˚C 60 to 120 s (preheating) Time (s) (2) Dip soldering • Temperature • Time • Number of times • Flux 260 °C or below (molten solder temperature) 10 seconds or less One Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt % is recommended.) (3) Cautions • Fluxes Avoid removing the residual flux with freon-based cleaning solvent. EXCLUSIVE NORTH AMERICAN AGENT FOR NEC RF, MICROWAVE & OPTOELECTRONIC SEMICONDUCTORS CALIFORNIA EASTERN LABORATORIES • Headquarters • 4590 Patrick Henry Drive • Santa Clara, CA 95054-1817 • (408) 988-3500 • Telex 34-6393 • FAX (408) 988-0279 Internet: http://WWW.CEL.COM DATA SUBJECT TO CHANGE WITHOUT NOTICE 09/04/2001