NEC UPG2404T6Q-E2

DATA SHEET
GaAs INTEGRATED CIRCUIT
μPG2404T6Q
L-BAND SP3T SWITCH
DESCRIPTION
The μPG2404T6Q is an L-band SP3T GaAs FET switch which was developed for CDMA/PCS/GPS triple mode
digital cellular telephone application.
This device can operate frequency from 10 MHz to 2.0 GHz, having the low insertion loss and high isolation.
This device is housed in a 10-pin plastic TSSON (Thin Shrink Small Out-line Non-leaded) package. And this
package is able to high-density surface mounting.
FEATURES
• Low insertion loss
: Lins = 0.45 dB TYP. @ f = 1.0 GHz, Vcont (H) = 2.8 V, Vcont (L) = 0 V
: Lins = 0.55 dB TYP. @ f = 2.0 GHz, Vcont (H) = 2.8 V, Vcont (L) = 0 V
• High isolation
: ISL = 21 dB TYP. @ f = 2.0 GHz, Vcont (H) = 2.8 V, Vcont (L) = 0 V
• High power
: Pin (0.1 dB) = +33.0 dBm TYP. @ f = 1.0 GHz, Vcont (H) = 2.8 V, Vcont (L) = 0 V
• High-density surface mounting : 10-pin plastic TSSON package (2.0 × 1.35 × 0.37 mm)
APPLICATIONS
• CDMA/PCS/GPS triple mode digital cellular telephone etc.
• NFC (FeliCaTM etc.)
ORDERING INFORMATION
Part Number
μPG2404T6Q-E2
Order Number
Package
μPG2404T6Q-E2-A 10-pin plastic TSSON
(Pb-Free)
Marking
G5H
Supplying Form
• Embossed tape 8 mm wide
• Pin 5, 6 face the perforation side of the tape
• Qty 3 kpcs/reel
Remark To order evaluation samples, contact your nearby sales office.
Part number for sample order: μPG2404T6Q
Caution Although this device is designed to be as robust as possible, ESD (Electrostatic Discharge) can
damage this device. This device must be protected at all times from ESD. Static charges may
easily produce potentials of several kilovolts on the human body or equipment, which can
discharge without detection. Industry-standard ESD precautions must be employed at all times.
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.
Document No. PG10726EJ01V0DS (1st edition)
Date Published October 2008 NS
Printed in Japan
2008
μPG2404T6Q
PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM
(Top View)
1
10
G5H
2
3
4
(Bottom View)
(Top View)
5
1
10
Pin No.
Pin Name
1
RF1
2
GND
3
RF2
4
Vcont2
5
RF3
6
Vcont3
7
GND
8
ANT
9
GND
10
Vcont1
1
10
9
2
9
9
2
8
3
8
8
3
7
4
7
7
4
6
5
6
6
5
Remark Exposed pad : GND
TRUTH TABLE
Vcont1
Vcont2
Vcont3
ANT−RF1
ANT−RF2
ANT−RF3
High
Low
Low
ON
OFF
OFF
Low
High
Low
OFF
ON
OFF
Low
Low
High
OFF
OFF
ON
ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified)
Parameter
Switch Control Voltage
Symbol
Ratings
+6.0
Vcont
Unit
Note
V
Input Power
Pin
+36
dBm
Operating Ambient Temperature
TA
−45 to +85
°C
Storage Temperature
Tstg
−55 to +150
°C
Note ⎪Vcont (H) − Vcont (L)⎪ ≤ 6.0 V
RECOMMENDED OPERATING RANGE (TA = +25°C)
Parameter
Symbol
MIN.
TYP.
MAX.
Unit
Switch Control Voltage (H)
Vcont (H)
2.7
2.8
3.0
V
Switch Control Voltage (L)
Vcont (L)
−0.2
0
0.2
V
2
Data Sheet PG10726EJ01V0DS
μPG2404T6Q
ELECTRICAL CHARACTERISTICS
(TA = +25°C, Vcont (H) = 2.8 V, Vcont
otherwise specified)
Parameter
Insertion Loss
Isolation
(L)
= 0 V, ZO = 50 Ω, DC blocking capacitors = 56 pF, unless
Symbol
Pass
Test Conditions
MIN.
TYP.
MAX.
Unit
Lins
ANT to RF1, 2, 3
f = 0.5 to 1.0 GHz
−
0.45
0.65
dB
f = 1.0 to 2.0 GHz
−
0.55
0.80
dB
ANT to RF1, 2, 3
f = 0.5 to 1.0 GHz
22
26
−
dB
(OFF)
f = 1.0 to 2.0 GHz
17
21
−
dB
ISL
Input Return Loss
RLin
ANT to RF1, 2, 3
f = 0.5 to 2.0 GHz
15
20
−
dB
Output Return Loss
RLout
ANT to RF1, 2, 3
f = 0.5 to 2.0 GHz
15
20
−
dB
Pin (0.1 dB)
ANT to RF1, 2, 3
f = 1.0 GHz
+31.0
+33.0
−
dBm
2f0
ANT to RF1, 2, 3
f = 1.0 GHz,
65
75
−
dBc
65
75
−
dBc
−
1
50
μA
−
150
−
ns
0.1 dB Loss Compression
Input Power
Note
2nd Harmonics
Pin = 27 dBm
3rd Harmonics
3f0
ANT to RF1, 2, 3
f = 1.0 GHz,
Pin = 27 dBm
Switch Control Current
Icont
Switch Control Speed
tSW
RF None
Note Pin (0.1 dB) is measured the input power level when the insertion loss increases more 0.1 dB than that of linear
range.
Data Sheet PG10726EJ01V0DS
3
μPG2404T6Q
EVALUATION CIRCUIT
(Top View)
RF1
1
10
2
9
3
8
Vcont1
C1
C2
RF2
ANT
C1
C1
Vcont2
4
7
5
6
C2
RF3
Vcont3
C1
C2
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
USING THE NEC EVALUATION BOARD
Symbol
Values
C1
56 pF
C2
1 000 pF
APPLICATION INFORMATION
CB
Switch
LESD
CB
CB
• CB are DC blocking capacitors external to the device.
A value of 56 pF is sufficient for operation from 500 MHz to 2.5 GHz bands.
The value may be tailored to provide specific electrical responses.
• The RF ground connections should be kept as short as possible and connected to directly to a good RF ground
for best performance.
• LESD provides a means to increase the ESD protection on a specific RF port, typically the port attached to the
antenna.
4
Data Sheet PG10726EJ01V0DS
μPG2404T6Q
MOUNTING PAD LAYOUT DIMENSIONS
10-PIN PLASTIC TSSON (UNIT: mm)
10-0.18
MOUNTING PAD
0.8
0.4
1.49
0.4
0.8
0.45
0.475
0.825
0.475
0.825
Remark The mounting pad layout in this document is for reference only.
Data Sheet PG10726EJ01V0DS
5
μPG2404T6Q
PACKAGE DIMENSIONS
10-PIN PLASTIC TSSON (UNIT: mm)
(Top View)
(Bottom View)
(Side View)
0.45±0.1
A
10-0.08 MIN.
0.37+0.03
–0.05
10-0.18+0.07
–0.05
A
2.0±0.1
1.49±0.1
0.4±0.06
1.35±0.1
0.2±0.1
Remark A>0
( ) : Reference value
6
Data Sheet PG10726EJ01V0DS
(C 0.15)
μPG2404T6Q
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Infrared Reflow
Wave Soldering
Soldering Conditions
Condition Symbol
Peak temperature (package surface temperature)
: 260°C or below
Time at peak temperature
: 10 seconds or less
Time at temperature of 220°C or higher
: 60 seconds or less
Preheating time at 120 to 180°C
: 120±30 seconds
Maximum number of reflow processes
: 3 times
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (molten solder temperature)
: 260°C or below
Time at peak temperature
: 10 seconds or less
IR260
WS260
Preheating temperature (package surface temperature) : 120°C or below
Partial Heating
Maximum number of flow processes
: 1 time
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (terminal temperature)
: 350°C or below
Soldering time (per side of device)
: 3 seconds or less
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
HS350
Caution Do not use different soldering methods together (except for partial heating).
Data Sheet PG10726EJ01V0DS
7
μPG2404T6Q
FeliCa is the contactless IC card technology developed by Sony Corporation.
FeliCa is a trademark of Sony Corporation.
• The information in this document is current as of October, 2008. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC Electronics data
sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not
all products and/or types are available in every country. Please check with an NEC Electronics sales
representative for availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without the prior
written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may
appear in this document.
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• Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
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The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC
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(Note)
(1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its
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(2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as
defined above).
M8E 02. 11-1
8
Data Sheet PG10726EJ01V0DS
μPG2404T6Q
Caution
GaAs Products
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.