DATA SHEET GaAs INTEGRATED CIRCUIT μPG2404T6Q L-BAND SP3T SWITCH DESCRIPTION The μPG2404T6Q is an L-band SP3T GaAs FET switch which was developed for CDMA/PCS/GPS triple mode digital cellular telephone application. This device can operate frequency from 10 MHz to 2.0 GHz, having the low insertion loss and high isolation. This device is housed in a 10-pin plastic TSSON (Thin Shrink Small Out-line Non-leaded) package. And this package is able to high-density surface mounting. FEATURES • Low insertion loss : Lins = 0.45 dB TYP. @ f = 1.0 GHz, Vcont (H) = 2.8 V, Vcont (L) = 0 V : Lins = 0.55 dB TYP. @ f = 2.0 GHz, Vcont (H) = 2.8 V, Vcont (L) = 0 V • High isolation : ISL = 21 dB TYP. @ f = 2.0 GHz, Vcont (H) = 2.8 V, Vcont (L) = 0 V • High power : Pin (0.1 dB) = +33.0 dBm TYP. @ f = 1.0 GHz, Vcont (H) = 2.8 V, Vcont (L) = 0 V • High-density surface mounting : 10-pin plastic TSSON package (2.0 × 1.35 × 0.37 mm) APPLICATIONS • CDMA/PCS/GPS triple mode digital cellular telephone etc. • NFC (FeliCaTM etc.) ORDERING INFORMATION Part Number μPG2404T6Q-E2 Order Number Package μPG2404T6Q-E2-A 10-pin plastic TSSON (Pb-Free) Marking G5H Supplying Form • Embossed tape 8 mm wide • Pin 5, 6 face the perforation side of the tape • Qty 3 kpcs/reel Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: μPG2404T6Q Caution Although this device is designed to be as robust as possible, ESD (Electrostatic Discharge) can damage this device. This device must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD precautions must be employed at all times. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. Document No. PG10726EJ01V0DS (1st edition) Date Published October 2008 NS Printed in Japan 2008 μPG2404T6Q PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM (Top View) 1 10 G5H 2 3 4 (Bottom View) (Top View) 5 1 10 Pin No. Pin Name 1 RF1 2 GND 3 RF2 4 Vcont2 5 RF3 6 Vcont3 7 GND 8 ANT 9 GND 10 Vcont1 1 10 9 2 9 9 2 8 3 8 8 3 7 4 7 7 4 6 5 6 6 5 Remark Exposed pad : GND TRUTH TABLE Vcont1 Vcont2 Vcont3 ANT−RF1 ANT−RF2 ANT−RF3 High Low Low ON OFF OFF Low High Low OFF ON OFF Low Low High OFF OFF ON ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified) Parameter Switch Control Voltage Symbol Ratings +6.0 Vcont Unit Note V Input Power Pin +36 dBm Operating Ambient Temperature TA −45 to +85 °C Storage Temperature Tstg −55 to +150 °C Note ⎪Vcont (H) − Vcont (L)⎪ ≤ 6.0 V RECOMMENDED OPERATING RANGE (TA = +25°C) Parameter Symbol MIN. TYP. MAX. Unit Switch Control Voltage (H) Vcont (H) 2.7 2.8 3.0 V Switch Control Voltage (L) Vcont (L) −0.2 0 0.2 V 2 Data Sheet PG10726EJ01V0DS μPG2404T6Q ELECTRICAL CHARACTERISTICS (TA = +25°C, Vcont (H) = 2.8 V, Vcont otherwise specified) Parameter Insertion Loss Isolation (L) = 0 V, ZO = 50 Ω, DC blocking capacitors = 56 pF, unless Symbol Pass Test Conditions MIN. TYP. MAX. Unit Lins ANT to RF1, 2, 3 f = 0.5 to 1.0 GHz − 0.45 0.65 dB f = 1.0 to 2.0 GHz − 0.55 0.80 dB ANT to RF1, 2, 3 f = 0.5 to 1.0 GHz 22 26 − dB (OFF) f = 1.0 to 2.0 GHz 17 21 − dB ISL Input Return Loss RLin ANT to RF1, 2, 3 f = 0.5 to 2.0 GHz 15 20 − dB Output Return Loss RLout ANT to RF1, 2, 3 f = 0.5 to 2.0 GHz 15 20 − dB Pin (0.1 dB) ANT to RF1, 2, 3 f = 1.0 GHz +31.0 +33.0 − dBm 2f0 ANT to RF1, 2, 3 f = 1.0 GHz, 65 75 − dBc 65 75 − dBc − 1 50 μA − 150 − ns 0.1 dB Loss Compression Input Power Note 2nd Harmonics Pin = 27 dBm 3rd Harmonics 3f0 ANT to RF1, 2, 3 f = 1.0 GHz, Pin = 27 dBm Switch Control Current Icont Switch Control Speed tSW RF None Note Pin (0.1 dB) is measured the input power level when the insertion loss increases more 0.1 dB than that of linear range. Data Sheet PG10726EJ01V0DS 3 μPG2404T6Q EVALUATION CIRCUIT (Top View) RF1 1 10 2 9 3 8 Vcont1 C1 C2 RF2 ANT C1 C1 Vcont2 4 7 5 6 C2 RF3 Vcont3 C1 C2 The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. USING THE NEC EVALUATION BOARD Symbol Values C1 56 pF C2 1 000 pF APPLICATION INFORMATION CB Switch LESD CB CB • CB are DC blocking capacitors external to the device. A value of 56 pF is sufficient for operation from 500 MHz to 2.5 GHz bands. The value may be tailored to provide specific electrical responses. • The RF ground connections should be kept as short as possible and connected to directly to a good RF ground for best performance. • LESD provides a means to increase the ESD protection on a specific RF port, typically the port attached to the antenna. 4 Data Sheet PG10726EJ01V0DS μPG2404T6Q MOUNTING PAD LAYOUT DIMENSIONS 10-PIN PLASTIC TSSON (UNIT: mm) 10-0.18 MOUNTING PAD 0.8 0.4 1.49 0.4 0.8 0.45 0.475 0.825 0.475 0.825 Remark The mounting pad layout in this document is for reference only. Data Sheet PG10726EJ01V0DS 5 μPG2404T6Q PACKAGE DIMENSIONS 10-PIN PLASTIC TSSON (UNIT: mm) (Top View) (Bottom View) (Side View) 0.45±0.1 A 10-0.08 MIN. 0.37+0.03 –0.05 10-0.18+0.07 –0.05 A 2.0±0.1 1.49±0.1 0.4±0.06 1.35±0.1 0.2±0.1 Remark A>0 ( ) : Reference value 6 Data Sheet PG10726EJ01V0DS (C 0.15) μPG2404T6Q RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Wave Soldering Soldering Conditions Condition Symbol Peak temperature (package surface temperature) : 260°C or below Time at peak temperature : 10 seconds or less Time at temperature of 220°C or higher : 60 seconds or less Preheating time at 120 to 180°C : 120±30 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (molten solder temperature) : 260°C or below Time at peak temperature : 10 seconds or less IR260 WS260 Preheating temperature (package surface temperature) : 120°C or below Partial Heating Maximum number of flow processes : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (terminal temperature) : 350°C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below HS350 Caution Do not use different soldering methods together (except for partial heating). Data Sheet PG10726EJ01V0DS 7 μPG2404T6Q FeliCa is the contactless IC card technology developed by Sony Corporation. FeliCa is a trademark of Sony Corporation. • The information in this document is current as of October, 2008. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. • NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. • While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC Electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. • NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) (1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. (2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). M8E 02. 11-1 8 Data Sheet PG10726EJ01V0DS μPG2404T6Q Caution GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. • Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. • Do not burn, destroy, cut, crush, or chemically dissolve the product. • Do not lick the product or in any way allow it to enter the mouth.