DATA SHEET GaAs INTEGRATED CIRCUIT μPG2157T5F ED NON-REFLECTIVE HIGH POWER SPDT SWITCH FOR WiMAX DESCRIPTION IN U The UPG2157T5F is a non-reflective (50 termination) GaAs MMIC high power SPDT (Single Pole Double Throw) switch for WiMAX. This device can operate from frequency 2.3 to 5.85 GHz, with low insertion loss and high isolation. This device is housed in a 12-pin plastic QFN (Quad Flat Non-leaded) package, and is suitable for highdensity surface mounting. FEATURES • Control voltage : Vcont (H) = 2.5 to 3.3 V (3.0 V TYP.) : Vcont (L) = 0 to 0.4 V (0 V TYP.) • Low insertion loss : Lins1 = 0.60 dB TYP. @ f = 2.3 to 2.7 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : Lins2 = 0.60 dB TYP. @ f = 3.3 to 3.8 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V NT : Lins3 = 0.80 dB TYP. @ f = 5.15 to 5.85 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V • High isolation : ISL1 = 28 dB TYP. @ f = 2.3 to 2.7 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : ISL2 = 25 dB TYP. @ f = 3.3 to 3.8 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : ISL3 = 22 dB TYP. @ f = 5.15 to 5.85 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V • Power Handling : Pin (1 dB) ≥ +37.0 dBm TYP. @ f = 2.5 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : Pin (1 dB) ≥ +37.0 dBm TYP. @ f = 5.85 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V SC O • High-density surface mounting : 12-pin plastic QFN package (3.0 × 3.0 × 0.75 mm) APPLICATIONS • Antenna switch for WiMAX, 802.11a/b/g access point ORDERING INFORMATION Part Number Order Number μPG2157T5F-E2 μPG2157T5F-E2-A Package 12-pin plastic QFN (Pb-Free) Marking 2157 Supplying Form • Embossed tape 8 mm wide • Pin 1 indicates roll-in direction of tape • Qty 3 kpcs/reel Remark To order evaluation samples, contact your nearby sales office. DI Part number for sample order: μPG2157T5F-A Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Document No. PG10641EJ02V0DS (2nd edition) Date Published August 2007 NS The mark <R> shows major revised points. The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field. 2006, 2007 μPG2157T5F PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM (Top View) (Bottom View) 12 11 10 12 11 10 10 11 12 50 Ω 2157 2 3 4 5 9 1 9 9 8 2 8 8 7 3 7 7 1 2 3 50 Ω 6 4 5 6 1 GND 2 INPUT 3 GND 4 GND 5 Vcont2 6 GND 7 OUTPUT2 8 GND IN U 1 Pin Name ED (Top View) Pin No. 6 5 4 9 OUTPUT1 10 GND 11 Vcont1 12 GND Remark Exposed pad : GND TRUTH TABLE Vcont2 High Low Low High INPUT−OUTPUT1 INPUT−OUTPUT2 ON OFF OFF ON NT Vcont1 ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified) Symbol Ratings Unit Vcont +6.0 V Input Power (ON Port, peak) Pin +38 dBm Input Power (ON Port, average) Pin +28 dBm Pin (OFF) +20 dBm Operating Ambient Temperature TA −45 to +85 °C Storage Temperature Tstg −55 to +150 °C SC O Parameter Switch Control Voltage <R> <R> Input Power (OFF Port) RECOMMENDED OPERATING RANGE (TA = +25°C, unless otherwise specified) Parameter Symbol MIN. TYP. MAX. Unit fopt1 2.3 − 2.7 GHz fopt2 3.3 − 3.8 GHz fopt3 5.15 − 5.85 GHz Switch Control Voltage (H) Vcont (H) 2.5 3.0 3.3 V Switch Control Voltage (L) Vcont (L) 0 0 0.4 V DI <R> Operating Frequency 2 Data Sheet PG10641EJ02V0DS μPG2157T5F ELECTRICAL CHARACTERISTICS (TA = +25°C, Vcont (H) = 3.0 V, Vcont specified) Parameter (L) = 0 V, DC blocking capacitors = 8 pF, unless otherwise Symbol Test Conditions MIN. TYP. MAX. Unit − 0.60 0.85 dB Lins1 f = 2.3 to 2.7 GHz Insertion Loss 2 Lins2 f = 3.3 to 3.8 GHz Insertion Loss 3 Lins3 f = 5.15 to 5.85 GHz Isolation 1 (INPUT−OFF Port) ISL1 f = 2.3 to 2.7 GHz Isolation 2 (INPUT−OFF Port) ISL2 f = 3.3 to 3.8 GHz Isolation 3 (INPUT−OFF Port) ISL3 f = 5.15 to 5.85 GHz Isolation 4 (OUTPUT1−OUTPUT2) ISL4 f = 2.3 to 2.7 GHz Isolation 5 (OUTPUT1−OUTPUT2) ISL5 f = 3.3 to 3.8 GHz 20 Isolation 6 (OUTPUT1−OUTPUT2) ISL6 f = 5.15 to 5.85 GHz Input Return Loss 1 RLin1 Input Return Loss 2 0.60 0.85 dB − 0.80 1.05 dB 25 28 − dB 22 25 − dB 19 22 − dB 23 26 − dB 23 − dB 18 21 − dB f = 2.3 to 2.7 GHz − 20 − dB RLin2 f = 3.3 to 3.8 GHz − 20 − dB Input Return Loss 3 RLin3 f = 5.15 to 5.85 GHz − 20 − dB Output Return Loss 1 RLout1 f = 2.3 to 2.7 GHz − 20 − dB Output Return Loss 2 RLout2 f = 3.3 to 3.8 GHz − 20 − dB f = 5.15 to 5.85 GHz − 20 − dB f = 2.3 to 2.7 GHz − 15 − dB f = 3.3 to 3.8 GHz − 15 − dB f = 5.15 to 5.85 GHz − 15 − dB f = 2.5 GHz − ≥ +37.0 − dBm f = 5.85 GHz − ≥ +37.0 − dBm − 20 30 μA − 100 − ns Output Return Loss 3 Return Loss (OFF Port) 1 dB Loss Compression RL Pin (1 dB) SC O Input Power Note RLout3 IN U − NT ED Insertion Loss 1 Switch Control Current Icont Switch Control Speed tSW 50% CTL to 90/10% RF Note Pin (1 dB) is the measured input power level when the insertion loss increases 1dB more than that of the linear DI range. Data Sheet PG10641EJ02V0DS 3 μPG2157T5F EVALUATION CIRCUIT Vcont1 12 11 10 8 pF 50 Ω 9 OUTPUT1 IN U 1 8 2 INPUT ED 1 000 pF 8 pF 50 Ω OUTPUT2 7 3 8 pF 5 6 NT 4 1 000 pF Vcont2 DI SC O The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. 4 Data Sheet PG10641EJ02V0DS μPG2157T5F MOUNTING PAD LAYOUT DIMENSIONS 12-PIN PLASTIC QFN (UNIT: mm) 0.65 0.65 1.0 1.0 0.5 IN U 0.65 1.0 0.5 1.55 0.5 1.0 0.65 ED 0.5 12–0.3 1.55 DI SC O NT Remark The mounting pad layouts in this document are for reference only. Data Sheet PG10641EJ02V0DS 5 μPG2157T5F PACKAGE DIMENSIONS 12-PIN PLASTIC QFN (UNIT: mm) 3.0±0.1 0.24+0.07 –0.05 1.55±0.1 0.4±0.1 DI 0.4±0.1 0.4±0.1 6 0.4 Data Sheet PG10641EJ02V0DS 0.4 0.9 0.9 SC O 1.0 0.5±0.06 0.5±0.06 1.55±0.1 NT 1.0 0.4±0.1 (Bottom View) IN U 3.0±0.1 ED 0.75±0.1 Dimensions of pin No.1 indication μPG2157T5F RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Wave Soldering Condition Symbol Peak temperature (package surface temperature) : 260°C or below Time at peak temperature : 10 seconds or less Time at temperature of 220°C or higher : 60 seconds or less Preheating time at 120 to 180°C : 120±30 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below IR260 ED Infrared Reflow Soldering Conditions Peak temperature (molten solder temperature) : 260°C or below Time at peak temperature : 10 seconds or less WS260 Partial Heating IN U Preheating temperature (package surface temperature) : 120°C or below Maximum number of flow processes : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (terminal temperature) : 350°C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below HS350 DI SC O NT Caution Do not use different soldering methods together (except for partial heating). Data Sheet PG10641EJ02V0DS 7 ED μPG2157T5F SC O NT IN U • The information in this document is current as of August, 2007. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. 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NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. • While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC Electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. • NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. DI The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) (1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. (2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). M8E 02. 11-1 8 Data Sheet PG10641EJ02V0DS μPG2157T5F Caution GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. • Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. ED 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. • Do not burn, destroy, cut, crush, or chemically dissolve the product. DI SC O NT IN U • Do not lick the product or in any way allow it to enter the mouth. 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