DATA SHEET GaAs INTEGRATED CIRCUIT μPG2155TB L-BAND 4 W HIGH POWER SPDT SWITCH DESCRIPTION The μPG2155TB is an L-band SPDT GaAs FET switch which was developed for digital cellular or cordless telephone application. The device can operate from 500 MHz to 2.5 GHz, having the low insertion loss and high linearity. FEATURES • Low insertion loss : LINS = 0.35 dB TYP. @ Vcont = +2.6 V/0 V, f = 1.0 GHz : LINS = 0.40 dB TYP. @ Vcont = +2.6 V/0 V, f = 2.0 GHz : LINS = 0.45 dB TYP. @ Vcont = +2.6 V/0 V, f = 2.5 GHz • High linearity : 2f0 = 70 dBc TYP. @ Vcont = +2.6 V/0 V, f = 0.9 GHz, Pin = +34.5 dBm : 3f0 = 75 dBc TYP. @ Vcont = +2.6 V/0 V, f = 0.9 GHz, Pin = +34.5 dBm • 6-pin super minimold package (2.1 × 2.0 × 0.9 mm) APPLICATION • GSM Triple/Quad band digital cellular ORDERING INFORMATION Part Number μPG2155TB-E4 Order Number Package μPG2155TB-E4-A 6-pin super minimold (Pb-Free) Marking G4R Supplying Form • Embossed tape 8 mm wide • Pin 4, 5, 6 face the perforation side of the tape • Qty 3 kpcs/reel Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: μPG2155TB Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices representative for availability and additional information. Document No. PG10583EJ02V0DS (2nd edition) Date Published January 2008 NS Printed in Japan The mark <R> shows major revised points. The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field. 2005, 2008 μPG2155TB <R> PIN CONNECTIONS (Top View) 2 3 G4R 1 (Bottom View) 6 6 1 5 5 2 4 4 3 ABSOLUTE MAXIMUM RATINGS (TA = +25°C) Parameter Symbol Ratings Unit Vcont +6.0 V Input Power Pin +38 dBm Operating Ambient Temperature TA −45 to +85 °C Storage Temperature Tstg −55 to +150 °C Control Voltage RECOMMENDED OPERATING RANGE (TA = +25°C) Parameter Symbol MIN. TYP. MAX. Unit Control Voltage (High) Vcont (H) +2.4 +2.6 +5.0 V Control Voltage (Low) Vcont (L) −0.2 0 +0.2 V 2 Data Sheet PG10583EJ02V0DS Pin No. Pin Name 1 RF2 2 GND 3 RF3 4 Vcont2 5 RF1 6 Vcont1 μPG2155TB ELECTRICAL CHARACTERISTICS (TA = +25°C, Vcont = +2.6 V/0 V, ZO = 50 Ω, off chip DC blocking capacitors value: 56 pF, unless otherwise specified) Parameter Insertion Loss Isolation <R> Symbol LINS ISL <R> MIN. TYP. MAX. Unit f = 0.5 to 1.0 GHz − 0.35 0.45 dB f = 1.0 to 2.0 GHz − 0.40 0.50 dB f = 2.0 to 2.5 GHz − 0.45 0.55 dB f = 0.5 to 1.0 GHz 22 24 − dB f = 1.0 to 2.0 GHz 17 19 − dB f = 2.0 to 2.5 GHz 15 17 − dB Input Return Loss RLin f = 0.5 to 2.5 GHz 15 20 − dB Output Return Loss RLout f = 0.5 to 2.5 GHz 15 20 − dB f = 0.9 GHz − 37.5 − dBm f = 1.8 GHz − 37.5 − dBm f = 0.9 GHz, Pin = +34.5 dBm 65 70 − dBc f = 1.8 GHz, Pin = +31.5 dBm 64 70 − dBc f = 0.9 GHz, Pin = +34.5 dBm 65 75 − dBc f = 1.8 GHz, Pin = +31.5 dBm 64 75 − dBc − 1 5 μs − 0.5 5.0 μA 0.1 dB Loss Compression Pin (0.1 dB) Input Power <R> Test Conditions 2nd Harmonics 3rd Harmonics 2f0 3f0 Switching Speed tsw Control Current Icont RF Non Data Sheet PG10583EJ02V0DS 3 μPG2155TB <R> EVALUATION CIRCUIT Off chip DC blocking capacitors value C1 = 56 pF, C2 = 1 000 pF (Bypass), using NEC standard evaluation board. C2 C1 Vcont2 G4R RF3 C1 RF1 Vcont1 RF2 C2 C1 The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. <R> TRUTH TABLE 4 Vcont2 RF3 RF1 GND Vcont1 RF2 Vcont1 Vcont2 RF1-RF2 RF1-RF3 High Low ON OFF Low High OFF ON Data Sheet PG10583EJ02V0DS μPG2155TB PACKAGE DIMENSIONS 6-PIN SUPER MINIMOLD (UNIT: mm) 2.1±0.1 0.2+0.1 –0.05 0.65 0.65 1.3 1.25±0.1 Data Sheet PG10583EJ02V0DS 0.15+0.1 –0.05 0 to 0.1 0.7 0.1 MIN. 0.9±0.1 2.0+0.15 –0.20 <R> 5 μPG2155TB RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Wave Soldering Soldering Conditions Condition Symbol Peak temperature (package surface temperature) : 260°C or below Time at peak temperature : 10 seconds or less Time at temperature of 220°C or higher : 60 seconds or less Preheating time at 120 to 180°C : 120±30 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (molten solder temperature) : 260°C or below Time at peak temperature : 10 seconds or less IR260 WS260 Preheating temperature (package surface temperature) : 120°C or below Partial Heating Maximum number of flow processes : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (terminal temperature) : 350°C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Caution Do not use different soldering methods together (except for partial heating). 6 Data Sheet PG10583EJ02V0DS HS350 μPG2155TB • The information in this document is current as of January, 2008. 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(2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). M8E 02. 11-1 Data Sheet PG10583EJ02V0DS 7 μPG2155TB Caution GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. • Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. • Do not burn, destroy, cut, crush, or chemically dissolve the product. • Do not lick the product or in any way allow it to enter the mouth.