NEC UPG2164T5N-E2-A

DATA SHEET
GaAs INTEGRATED CIRCUIT
μPG2164T5N
DPDT SWITCH FOR 2.4 GHz AND 6 GHz DUAL-BAND WIRELESS LAN
DESCRIPTION
The μPG2164T5N is a GaAs MMIC DPDT (Double Pole Double Throw) switch which was developed for 2.4 GHz
and 6 GHz dual-band wireless LAN. This device can operate frequency from 2.4 GHz band and 6 GHz band, having
the low insertion loss and high isolation.
This device is housed in a 6-pin plastic TSON (Thin Small Out-line Non-leaded) package. And this package is able
to high-density surface mounting.
FEATURES
• Operating frequency
• Switch control voltage
: f = 2.4 to 2.5 GHz and 4.9 to 6.0 GHz
: Vcont (H) = 2.8 to 5.0 V (3.0 V TYP.)
: Vcont (L) = −0.3 to 0.3 V (0 V TYP.)
• Low insertion loss
: Lins1 = 0.50 dB TYP. @ f = 2.4 to 2.5 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V
: Lins2 = 0.70 dB TYP. @ f = 4.9 to 6.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V
• High isolation
: ISL1 = 25 dB TYP. @ f = 2.4 to 2.5 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V
: ISL2 = 17 dB TYP. @ f = 4.9 to 6.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V
• Handling power
: Pin (1 dB) = +31.0 dBm TYP. @ f = 2.5 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V
: Pin (1 dB) = +29.0 dBm TYP. @ f = 6.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V
• High-density surface mounting : 6-pin plastic TSON package (1.5 × 1.5 × 0.37 mm)
APPLICATION
• Dual-band wireless LAN (IEEE802.11a + b/g)
ORDERING INFORMATION
Part Number
Order Number
μPG2164T5N-E2
μPG2164T5N-E2-A
Package
6-pin plastic TSON
(Pb-Free)
Marking
G5B
Supplying Form
• Embossed tape 8 mm wide
• Pin 1, 6 face the perforation side of the tape
• Qty 3 kpcs/reel
Remark To order evaluation samples, contact your nearby sales office.
Part number for sample order: μPG2164T5N
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.
Document No. PG10636EJ02V0DS (2nd edition)
Date Published February 2008 NS
Printed in Japan
The mark <R> shows major revised points.
The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field.
2006, 2008
μPG2164T5N
PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM
(Top View)
G5B
1
2
3
(Bottom View)
(Top View)
6
1
6
6
1
5
2
5
5
2
4
3
4
Pin No.
Pin Name
1
ANT2
2
Vcont2
3
OUT2 (RX)
4
OUT1 (TX)
5
Vcont1
6
ANT1
3
4
Remark Exposed pad : GND
TRUTH TABLE
Vcont1
Vcont2
ANT1−OUT1 (TX)
ANT1− OUT2 (RX)
ANT2− OUT1 (TX)
ANT2−OUT2 (RX)
High
Low
OFF
ON
ON
OFF
Low
High
ON
OFF
OFF
ON
ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified)
Parameter
Symbol
Ratings
Unit
Vcont
−6.0 to +6.0
V
Input Power
Pin
+32
dBm
Operating Ambient Temperature
TA
−45 to +85
°C
Storage Temperature
Tstg
−55 to +135
°C
Switch Control Voltage
RECOMMENDED OPERATING RANGE (TA = +25°C, unless otherwise specified)
Parameter
Symbol
MIN.
TYP.
MAX.
Unit
Switch Control Voltage (H)
Vcont (H)
2.8
3.0
5.0
V
Switch Control Voltage (L)
Vcont (L)
−0.3
0
0.3
V
Operating Frequency 1
f1
2.4
−
2.5
GHz
Operating Frequency 2
f2
4.9
−
6.0
GHz
2
Data Sheet PG10636EJ02V0DS
μPG2164T5N
ELECTRICAL CHARACTERISTICS
(TA = +25°C, Vcont (H) = 3.0 V, Vcont
otherwise specified)
Parameter
Symbol
(L)
= 0 V, Z0 = 50 Ω, DC blocking capacitors = 4 pF, unless
Test Conditions
MIN.
TYP.
MAX.
Unit
Insertion Loss 1
Lins1
f = 2.4 to 2.5 GHz
−
0.50
0.75
dB
Insertion Loss 2
Lins2
f = 4.9 to 6.0 GHz
−
0.70
1.00
dB
Isolation 1 (ANT to OUT)
ISL1
f = 2.4 to 2.5 GHz
22
25
−
dB
Isolation 2 (ANT to OUT)
ISL2
f = 4.9 to 6.0 GHz
14
17
−
dB
Isolation 3 (ANT1 to ANT2, TX to RX)
ISL3
f = 2.4 to 2.5 GHz
22
25
−
dB
Isolation 4 (ANT1 to ANT2, TX to RX)
ISL4
f = 4.9 to 6.0 GHz
15
17
−
dB
Input Return Loss 1
RLin1
f = 2.4 to 2.5 GHz
−
15
−
dB
Input Return Loss 2
RLin2
f = 4.9 to 6.0 GHz
−
15
−
dB
Output Return Loss 1
RLout1
f = 2.4 to 2.5 GHz
−
15
−
dB
Output Return Loss 2
RLout2
f = 4.9 to 6.0 GHz
−
15
−
dB
1 dB Loss Compression
Note
Input Power 1
Pin (1 dB) 1 f = 2.4 to 2.5 GHz
−
+31.0
−
dBm
1 dB Loss Compression
Note
Input Power 2
Pin (1 dB) 2 f = 4.9 to 6.0 GHz
−
+29.0
−
dBm
−
+50
−
dBm
−
0.1
1.0
μA
−
50
−
ns
Input 3rd Order Intercept Point
IIP3
f1 = 2 500 MHz, f2 = 2 501 MHz,
Pin (1 tone) = +20 dBm
Switch Control Current
Icont
Switch Control Speed
tSW
Note Pin
(1 dB)
50% CTL to 90/10%
is measured the input power level when the insertion loss increases more 1 dB than that of linear
range.
Caution This device is used it is necessary to use DC blocking capacitors.
Data Sheet PG10636EJ02V0DS
3
μPG2164T5N
EVALUATION CIRCUIT
4 pF
ANT2
Vcont2
4 pF
1
6
2
5
1 000 pF
Vcont1
1 000 pF
4
3
OUT2 (RX)
ANT1
OUT1 (TX)
4 pF
4 pF
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
4
Data Sheet PG10636EJ02V0DS
μPG2164T5N
MOUNTING PAD AND SOLDER MASK LAYOUT DIMENSIONS
6-PIN PLASTIC TSON (UNIT: mm)
MOUNTING PAD
0.3
0.2
0.5
1.0
0.5
0.3
0.5
0.3
0.3
SOLDER MASK
0.475
0.15
0.5
0.55
0.5
0.25
0.35
0.475
0.25
Solder thickness : 0.08 mm
Remark The mounting pad and solder mask layouts in this document are for reference only.
Data Sheet PG10636EJ02V0DS
5
μPG2164T5N
PACKAGE DIMENSIONS
6-PIN PLASTIC TSON (UNIT: mm)
(Bottom View)
(Side View)
0.3±0.07
0.5±0.06
1.5±0.1
0.2+0.07
–0.05
1.2±0.1
(Top View)
1.5±0.1
<R>
0.37+0.03
–0.05
6
0.2±0.1
Data Sheet PG10636EJ02V0DS
0.7±0.1
μPG2164T5N
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Infrared Reflow
Wave Soldering
Soldering Conditions
Condition Symbol
Peak temperature (package surface temperature)
: 260°C or below
Time at peak temperature
: 10 seconds or less
Time at temperature of 220°C or higher
: 60 seconds or less
Preheating time at 120 to 180°C
: 120±30 seconds
Maximum number of reflow processes
: 3 times
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (molten solder temperature)
: 260°C or below
Time at peak temperature
: 10 seconds or less
IR260
WS260
Preheating temperature (package surface temperature) : 120°C or below
Partial Heating
Maximum number of flow processes
: 1 time
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (terminal temperature)
: 350°C or below
Soldering time (per side of device)
: 3 seconds or less
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
HS350
Caution Do not use different soldering methods together (except for partial heating).
Data Sheet PG10636EJ02V0DS
7
μPG2164T5N
• The information in this document is current as of February, 2008. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC Electronics data
sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not
all products and/or types are available in every country. Please check with an NEC Electronics sales
representative for availability and additional information.
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(2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as
defined above).
M8E 02. 11-1
8
Data Sheet PG10636EJ02V0DS
μPG2164T5N
Caution
GaAs Products
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.