NEC UPG2157T5F-E2-A

DATA SHEET
GaAs INTEGRATED CIRCUIT
μPG2157T5F
50 Ω TERMINATION TYPE HIGH POWER SPDT SWITCH FOR WiMAX
DESCRIPTION
The μPG2157T5F is a GaAs MMIC 50 Ω termination type high power SPDT (Single Pole Double Throw) switch
which was developed for WiMAX. This device can operate frequency from 2.3 to 5.85 GHz, having the low insertion
loss and high isolation.
This device is housed in a 12-pin plastic QFN (Quad Flat Non-leaded) package. And this package is able to highdensity surface mounting.
FEATURES
• Control voltage
: Vcont (H) = 2.5 to 3.3 V (3.0 V TYP.)
: Vcont (L) = 0 to 0.4 V (0 V TYP.)
• Low insertion loss
: Lins1 = 0.60 dB TYP. @ f = 2.3 to 2.7 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V
: Lins2 = 0.60 dB TYP. @ f = 3.3 to 3.8 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V
: Lins3 = 0.80 dB TYP. @ f = 5.15 to 5.85 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V
• High isolation
: ISL1 = 28 dB TYP. @ f = 2.3 to 2.7 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V
: ISL2 = 25 dB TYP. @ f = 3.3 to 3.8 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V
: ISL3 = 22 dB TYP. @ f = 5.15 to 5.85 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V
: Pin (1 dB) ≥ +37.0 dBm TYP. @ f = 2.5 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V
• Handling power
: Pin (1 dB) ≥ +37.0 dBm TYP. @ f = 5.85 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V
• High-density surface mounting : 12-pin plastic QFN package (3.0 × 3.0 × 0.75 mm)
APPLICATIONS
• Antenna switch for WiMAX, 802.11a/b/g access point
ORDERING INFORMATION
Part Number
Order Number
μPG2157T5F-E2
μPG2157T5F-E2-A
Package
12-pin plastic QFN
(Pb-Free)
Marking
2157
Supplying Form
• Embossed tape 8 mm wide
• Pin 1 indicates roll-in direction of tape
• Qty 3 kpcs/reel
Remark To order evaluation samples, contact your nearby sales office.
Part number for sample order: μPG2157T5F
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.
Document No. PG10641EJ02V0DS (2nd edition)
Date Published August 2007 NS
Printed in Japan
The mark <R> shows major revised points.
The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field.
2006, 2007
μPG2157T5F
PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM
(Top View)
(Top View)
(Bottom View)
12 11 10
12 11 10
10 11 12
50 Ω
2157
1
2
3
4
5
9
1
9
9
1
8
2
8
8
2
7
3
7
7
3
50 Ω
6
4
5
6
6
5
4
Pin No.
Pin Name
1
GND
2
INPUT
3
GND
4
GND
5
Vcont2
6
GND
7
OUTPUT2
8
GND
9
OUTPUT1
10
GND
11
Vcont1
12
GND
Remark Exposed pad : GND
TRUTH TABLE
Vcont1
Vcont2
INPUT−OUTPUT1
INPUT−OUTPUT2
High
Low
ON
OFF
Low
High
OFF
ON
ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified)
Parameter
Switch Control Voltage
Symbol
Ratings
Unit
Vcont
+6.0
V
<R>
Input Power (ON Port, peak)
Pin
+38
dBm
<R>
Input Power (ON Port, average)
Pin
+28
dBm
<R>
Input Power (OFF Port)
Pin (OFF)
+20
dBm
Operating Ambient Temperature
TA
−45 to +85
°C
Storage Temperature
Tstg
−55 to +150
°C
RECOMMENDED OPERATING RANGE (TA = +25°C, unless otherwise specified)
Parameter
Symbol
MIN.
TYP.
MAX.
Unit
fopt1
2.3
−
2.7
GHz
fopt2
3.3
−
3.8
GHz
fopt3
5.15
−
5.85
GHz
Switch Control Voltage (H)
Vcont (H)
2.5
3.0
3.3
V
Switch Control Voltage (L)
Vcont (L)
0
0
0.4
V
Operating Frequency
2
Data Sheet PG10641EJ02V0DS
μPG2157T5F
ELECTRICAL CHARACTERISTICS
(TA = +25°C, Vcont (H) = 3.0 V, Vcont
specified)
Parameter
Symbol
(L)
= 0 V, DC blocking capacitors = 8 pF, unless otherwise
Test Conditions
MIN.
TYP.
MAX.
Unit
Insertion Loss 1
Lins1
f = 2.3 to 2.7 GHz
−
0.60
0.85
dB
Insertion Loss 2
Lins2
f = 3.3 to 3.8 GHz
−
0.60
0.85
dB
Insertion Loss 3
Lins3
f = 5.15 to 5.85 GHz
−
0.80
1.05
dB
Isolation 1 (INPUT−OFF Port)
ISL1
f = 2.3 to 2.7 GHz
25
28
−
dB
Isolation 2 (INPUT−OFF Port)
ISL2
f = 3.3 to 3.8 GHz
22
25
−
dB
Isolation 3 (INPUT−OFF Port)
ISL3
f = 5.15 to 5.85 GHz
19
22
−
dB
Isolation 4 (OUTPUT1−OUTPUT2)
ISL4
f = 2.3 to 2.7 GHz
23
26
−
dB
Isolation 5 (OUTPUT1−OUTPUT2)
ISL5
f = 3.3 to 3.8 GHz
20
23
−
dB
Isolation 6 (OUTPUT1−OUTPUT2)
ISL6
f = 5.15 to 5.85 GHz
18
21
−
dB
Input Return Loss 1
RLin1
f = 2.3 to 2.7 GHz
−
20
−
dB
Input Return Loss 2
RLin2
f = 3.3 to 3.8 GHz
−
20
−
dB
Input Return Loss 3
RLin3
f = 5.15 to 5.85 GHz
−
20
−
dB
Output Return Loss 1
RLout1
f = 2.3 to 2.7 GHz
−
20
−
dB
Output Return Loss 2
RLout2
f = 3.3 to 3.8 GHz
−
20
−
dB
Output Return Loss 3
RLout3
f = 5.15 to 5.85 GHz
−
20
−
dB
f = 2.3 to 2.7 GHz
−
15
−
dB
f = 3.3 to 3.8 GHz
−
15
−
dB
f = 5.15 to 5.85 GHz
−
15
−
dB
f = 2.5 GHz
−
≥ +37.0
−
dBm
f = 5.85 GHz
−
≥ +37.0
−
dBm
−
20
30
μA
−
100
−
ns
Return Loss (OFF Port)
1 dB Loss Compression
Input Power
RL
Pin (1 dB)
Note
Switch Control Current
Icont
Switch Control Speed
tSW
50% CTL to 90/10% RF
Note Pin (1 dB) is measured the input power level when the insertion loss increases more 1 dB than that of linear
range.
Data Sheet PG10641EJ02V0DS
3
μPG2157T5F
EVALUATION CIRCUIT
Vcont1
1 000 pF
12
11
10
8 pF
50 Ω
INPUT
1
9
2
8
OUTPUT1
8 pF
50 Ω
OUTPUT2
7
3
8 pF
4
5
6
1 000 pF
Vcont2
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
4
Data Sheet PG10641EJ02V0DS
μPG2157T5F
MOUNTING PAD LAYOUT DIMENSIONS
12-PIN PLASTIC QFN (UNIT: mm)
0.65
0.65
1.0
1.0
0.5
0.65
1.0
0.5
1.55
0.5
1.0
0.65
0.5
12–0.3
1.55
Remark The mounting pad layouts in this document are for reference only.
Data Sheet PG10641EJ02V0DS
5
μPG2157T5F
PACKAGE DIMENSIONS
12-PIN PLASTIC QFN (UNIT: mm)
3.0±0.1
3.0±0.1
0.75±0.1
1.0
0.9
0.4
0.24+0.07
–0.05
0.4±0.1
6
1.55±0.1
0.4±0.1
0.9
1.0
1.55±0.1
0.4
0.5±0.06
0.5±0.06
0.4±0.1
(Bottom View)
0.4±0.1
Data Sheet PG10641EJ02V0DS
Dimensions of pin No.1 indication
μPG2157T5F
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Infrared Reflow
Wave Soldering
Soldering Conditions
Condition Symbol
Peak temperature (package surface temperature)
: 260°C or below
Time at peak temperature
: 10 seconds or less
Time at temperature of 220°C or higher
: 60 seconds or less
Preheating time at 120 to 180°C
: 120±30 seconds
Maximum number of reflow processes
: 3 times
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (molten solder temperature)
: 260°C or below
Time at peak temperature
: 10 seconds or less
IR260
WS260
Preheating temperature (package surface temperature) : 120°C or below
Partial Heating
Maximum number of flow processes
: 1 time
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (terminal temperature)
: 350°C or below
Soldering time (per side of device)
: 3 seconds or less
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
HS350
Caution Do not use different soldering methods together (except for partial heating).
Data Sheet PG10641EJ02V0DS
7
μPG2157T5F
• The information in this document is current as of August, 2007. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC Electronics data
sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not
all products and/or types are available in every country. Please check with an NEC Electronics sales
representative for availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without the prior
written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may
appear in this document.
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or any other liability arising from the use of such products. No license, express, implied or otherwise, is
granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
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(2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as
defined above).
M8E 02. 11-1
8
Data Sheet PG10641EJ02V0DS
μPG2157T5F
Caution
GaAs Products
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
• Do not lick the product or in any way allow it to enter the mouth.