SSC SK32

SK32 – SK36
Surface Mount Schottky Barrier Rectifiers
FEATURES
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Reverse voltage 20 to 60 V
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Forward current 3.0 A
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For surface mounted applications
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Metal-Semiconductor junction with guard ring
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Epitaxial construction
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Very low forward voltage drop
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High current capability
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Plastic material has UL flammability classification
94V-0
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For use in low voltage, high frequency inverters,
free wheeling, and polarity protection applications
MECHANICAL DATA
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Case : JEDEC DO-214AB(SMC) molded plastic
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Polarity : Color band denotes cathode
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Weight : 0.009 ounce, 0.25 gram
ELECTRICAL CHARACTERISTICS AND MAXIMUM RATINGS
Unless otherwise specified, these specifications apply over the operating ambient temperature of 25℃.
Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%.
Notes: 1. Measured at 1.0MHz and applied reverse voltage of 4.0V DC.
2. Thermal Resistance Junction to Lead.
3. Thermal Resistance Junction to Ambient.
12/21/2006 Rev. 1.00
www.SiliconStandard.com
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SK32 – SK36
RATINGS AND CHARACTERISTIC CURVES (TA = 25℃ unless otherwise specified)
12/21/2006 Rev. 1.00
www.SiliconStandard.com
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SK32 – SK36
Disclaimer
Information furnished by Silicon Standard Corporation is believed to be accurate and reliable. However, Silicon Standard Corporation
makes no guarantee or warranty, expressed or implied, as to the reliability, accuracy, timeliness or completeness of such
information and assumes no responsibility for its use, or for infringement of any patent or other intellectual property rights of
third parties that may result from its use. Silicon Standard reserves the right to make changes as it deems necessary to any
products described herein for any reason, including without limitation enhancement in reliability, functionality or design. No license
is granted, whether expressly or by implication, in relation to the use of any products described herein or to the use of any
information provided herein, under any patent or other intellectual property rights of Silicon Standard Corporation or any third parties.
12/21/2006 Rev. 1.00
www.SiliconStandard.com
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