FAIRCHILD FQP95N03L

QFET
TM
FQP95N03L
30V LOGIC N-Channel MOSFET
General Description
Features
These N-Channel enhancement mode power field effect
transistors are produced using Fairchild’s proprietary,
planar stripe, DMOS technology.
This advanced technology has been especially tailored to
minimize on-state resistance, provide superior switching
performance, and withstand high energy pulse in the
avalanche and commutation mode. These devices are well
suited for low voltage applications such as DC/DC
converters, high efficiency switching for power
management in portable and battery operated products.
•
•
•
•
•
•
•
95A, 30V, RDS(on) = 0.0085Ω @VGS = 10 V
Low gate charge ( typical 36 nC)
Low Crss ( typical 240 pF)
Fast switching
100% avalanche tested
Improved dv/dt capability
175°C maximum junction temperature rating
D
!
"
G
G!
DS
Absolute Maximum Ratings
Symbol
VDSS
ID
TO-220
!
S
TC = 25°C unless otherwise noted
- Continuous (TC = 100°C)
Drain Current
"
"
FQP Series
Parameter
Drain-Source Voltage
- Continuous (TC = 25°C)
Drain Current
IDM
! "
- Pulsed
(Note 1)
FQP95N03L
30
Units
V
95
A
67.2
A
380
A
VGSS
Gate-Source Voltage
± 20
V
EAS
Single Pulsed Avalanche Energy
(Note 2)
400
mJ
IAR
Avalanche Current
(Note 1)
95
A
EAR
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Power Dissipation (TC = 25°C)
(Note 1)
15
7.0
150
1.0
-55 to +175
mJ
V/ns
W
W/°C
°C
300
°C
dv/dt
PD
TJ, TSTG
TL
(Note 3)
- Derate above 25°C
Operating and Storage Temperature Range
Maximum lead temperature for soldering purposes,
1/8" from case for 5 seconds
Thermal Characteristics
Symbol
RθJC
Parameter
Thermal Resistance, Junction-to-Case
Typ
--
RθCS
Thermal Resistance, Case-to-Sink
0.5
--
°C/W
RθJA
Thermal Resistance, Junction-to-Ambient
--
62.5
°C/W
©2001 Fairchild Semiconductor Corporation
Max
1.0
Units
°C/W
Rev. A1. May 2001
FQP95N03L
May 2001
Symbol
TC = 25°C unless otherwise noted
Parameter
Test Conditions
Min
Typ
Max
Units
30
--
--
V
--
V/°C
Off Characteristics
BVDSS
Drain-Source Breakdown Voltage
VGS = 0 V, ID = 250 µA
∆BVDSS
/ ∆TJ
Breakdown Voltage Temperature
Coefficient
ID = 250 µA, Referenced to
25°C
VDS = 30 V, VGS = 0 V
--
0.03
--
--
1
µA
VDS = 24 V, TC = 150°C
--
--
10
µA
Gate-Body Leakage Current, Forward
VGS = 20 V, VDS = 0 V
--
--
100
nA
Gate-Body Leakage Current, Reverse
VGS = -20 V, VDS = 0 V
--
--
-100
nA
Gate Threshold Voltage
VDS = VGS, ID = 250 µA
1.0
--
2.5
V
RDS(on)
Static Drain-Source
On-Resistance
VGS = 10 V, ID = 47.5 A
VGS = 5 V, ID = 47.5 A
---
0.0069
0.009
0.0085
0.0115
Ω
gFS
Forward Transconductance
VDS = 15 V, ID = 47.5 A
--
57
--
S
--
1750
2280
pF
--
1080
1400
pF
--
240
310
pF
IDSS
IGSSF
IGSSR
Zero Gate Voltage Drain Current
On Characteristics
VGS(th)
(Note 4)
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
VDS = 25 V, VGS = 0 V,
f = 1.0 MHz
Switching Characteristics
td(on)
Turn-On Delay Time
tr
Turn-On Rise Time
td(off)
Turn-Off Delay Time
tf
Turn-Off Fall Time
Qg
Total Gate Charge
Qgs
Gate-Source Charge
Qgd
Gate-Drain Charge
VDD = 15 V, ID = 47.5 A,
RG = 25 Ω
(Note 4, 5)
VDS = 24 V, ID = 95 A,
VGS = 5 V
(Note 4, 5)
--
25
60
ns
--
250
510
ns
--
18
45
ns
--
135
280
ns
--
36
47
nC
--
13.4
--
nC
--
17.6
--
nC
Drain-Source Diode Characteristics and Maximum Ratings
IS
Maximum Continuous Drain-Source Diode Forward Current
--
--
95
A
ISM
--
--
380
A
VSD
Maximum Pulsed Drain-Source Diode Forward Current
VGS = 0 V, IS = 95 A
Drain-Source Diode Forward Voltage
--
--
1.5
V
trr
Reverse Recovery Time
--
55
--
ns
Qrr
Reverse Recovery Charge
VGS = 0 V, IS = 95 A,
dIF / dt = 100 A/µs
--
65
--
nC
(Note 4)
Notes:
1. Repetitive Rating : Pulse width limited by maximum junction temperature
2. L = 45µH, IAS = 95A, VDD = 15V, RG = 25 Ω, Starting TJ = 25°C
3. ISD ≤ 95A, di/dt ≤ 300A/us, VDD ≤ BVDSS, Starting TJ = 25°C
4. Pulse Test : Pulse width ≤ 300µs, Duty cycle ≤ 2%
5. Essentially independent of operating temperature
6. Continuous Drain Current Calculated by Maximum Junction Temperature : Limited by Package
©2001 Fairchild Semiconductor Corporation
Rev. A1. May 2001
FQP95N03L
Electrical Characteristics
FQP95N03L
Typical Characteristics
VGS
10.0 V
8.0 V
6.0 V
5.0 V
4.5 V
4.0 V
3.5 V
Bottom : 3.0 V
Top :
ID, Drain Current [A]
ID, Drain Current [A]
2
10
2
10
1
10
175℃
25℃
0
10
-55℃
※ Notes :
1. VDS = 15V
2. 250μ s Pulse Test
※ Notes :
1. 250μ s Pulse Test
2. TC = 25℃
1
10
-1
10
-1
0
10
0
1
10
10
2
4
6
8
10
VGS, Gate-Source Voltage [V]
VDS, Drain-Source Voltage [V]
Figure 1. On-Region Characteristics
Figure 2. Transfer Characteristics
20
2
10
VGS = 5V
IDR , Reverse Drain Current [A]
RDS(ON) [mΩ ],
Drain-Source On-Resistance
15
VGS = 10V
10
5
1
10
0
10
175℃
※ Note : TJ = 25℃
-1
0
0
200
400
600
800
10
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
ID, Drain Current [A]
VSD, Source-Drain voltage [V]
Figure 3. On-Resistance Variation vs.
Drain Current and Gate Voltage
Figure 4. Body Diode Forward Voltage
Variation vs. Source Current
and Temperature
12
6000
Ciss = Cgs + Cgd (Cds = shorted)
Coss = Cds + Cgd
Crss = Cgd
4000
Coss
3000
Ciss
※ Notes :
1. VGS = 0 V
2. f = 1 MHz
2000
Crss
1000
VDS = 15V
10
VGS, Gate-Source Voltage [V]
5000
Capacitance [pF]
※ Notes :
1. VGS = 0V
2. 250μ s Pulse Test
25℃
VDS = 24V
8
6
4
2
※ Note : ID = 95A
0
-1
10
0
0
10
1
10
VDS, Drain-Source Voltage [V]
Figure 5. Capacitance Characteristics
©2001 Fairchild Semiconductor Corporation
0
10
20
30
40
50
60
70
QG, Total Gate Charge [nC]
Figure 6. Gate Charge Characteristics
Rev. A1. May 2001
(Continued)
2.5
1.2
2.0
1.1
RDS(ON) , (Normalized)
Drain-Source On-Resistance
BV DSS , (Normalized)
Drain-Source Breakdown Voltage
FQP95N03L
Typical Characteristics
1.0
※ Notes :
1. VGS = 0 V
2. ID = 250 μ A
0.9
0.8
-100
-50
0
50
100
150
1.5
1.0
0.5
※ Notes :
1. VGS = 10 V
2. ID = 47.5 A
0.0
-100
200
-50
o
0
50
100
150
200
o
TJ, Junction Temperature [ C]
TJ, Junction Temperature [ C]
Figure 7. Breakdown Voltage Variation
vs. Temperature
Figure 8. On-Resistance Variation
vs. Temperature
100
Operation in This Area
is Limited by R DS(on)
3
10
80
1 ms
2
10
ID, Drain Current [A]
ID, Drain Current [A]
100 µs
10 ms
DC
1
10
※ Notes :
60
Limited by Package
40
20
o
1. TC = 25 C
o
2. TJ = 175 C
3. Single Pulse
0
10
-1
0
10
0
25
1
10
10
50
100
125
150
175
Figure 10. Maximum Drain Current
vs. Case Temperature
0
D = 0 .5
※ N o te s :
1 . Z θ J C ( t) = 1 .0 ℃ /W M a x .
2 . D u ty F a c to r , D = t 1 /t 2
3 . T J M - T C = P D M * Z θ J C ( t)
0 .2
10
0 .1
-1
0 .0 5
PDM
0 .0 2
0 .0 1
θ JC
( t) , T h e r m a l R e s p o n s e
Figure 9. Maximum Safe Operating Area
10
75
TC, Case Temperature [℃]
VDS, Drain-Source Voltage [V]
t1
Z
s i n g l e p u ls e
10
t2
-2
10
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
1
t 1 , S q u a r e W a v e P u ls e D u r a t io n [ s e c ]
Figure 11. Transient Thermal Response Curve
©2001 Fairchild Semiconductor Corporation
Rev. A1. May 2001
FQP95N03L
Gate Charge Test Circuit & Waveform
VGS
Same Type
as DUT
50KΩ
Qg
200nF
12V
5V
300nF
VDS
VGS
Qgs
Qgd
DUT
3mA
Charge
Resistive Switching Test Circuit & Waveforms
VDS
RL
VDS
90%
VDD
VGS
RG
VGS
DUT
5V
10%
td(on)
tr
td(off)
t on
tf
t off
Unclamped Inductive Switching Test Circuit & Waveforms
BVDSS
1
EAS = ---- L IAS2 -------------------2
BVDSS - VDD
L
VDS
BVDSS
IAS
ID
RG
VDD
DUT
10V
tp
©2001 Fairchild Semiconductor Corporation
ID (t)
VDS (t)
VDD
tp
Time
Rev. A1. May 2001
FQP95N03L
Peak Diode Recovery dv/dt Test Circuit & Waveforms
DUT
+
VDS
_
I SD
L
Driver
RG
VGS
VGS
( Driver )
Same Type
as DUT
VDD
• dv/dt controlled by RG
• ISD controlled by pulse period
Gate Pulse Width
D = -------------------------Gate Pulse Period
10V
IFM , Body Diode Forward Current
I SD
( DUT )
di/dt
IRM
Body Diode Reverse Current
VDS
( DUT )
Body Diode Recovery dv/dt
VSD
VDD
Body Diode
Forward Voltage Drop
©2001 Fairchild Semiconductor Corporation
Rev. A1. May 2001
FQP95N03L
Package Dimensions
TO-220
4.50 ±0.20
2.80 ±0.10
(3.00)
+0.10
1.30 –0.05
18.95MAX.
(3.70)
ø3.60 ±0.10
15.90 ±0.20
1.30 ±0.10
(8.70)
(1.46)
9.20 ±0.20
(1.70)
9.90 ±0.20
1.52 ±0.10
0.80 ±0.10
2.54TYP
[2.54 ±0.20]
10.08 ±0.30
(1.00)
13.08 ±0.20
)
(45°
1.27 ±0.10
+0.10
0.50 –0.05
2.40 ±0.20
2.54TYP
[2.54 ±0.20]
10.00 ±0.20
©2001 Fairchild Semiconductor Corporation
Rev. A1. May 2001
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CORPORATION.
As used herein:
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which, (a) are intended for surgical implant into the body,
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when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
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2. A critical component is any component of a life support
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PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Definition
Advance Information
Formative or In
Design
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
Preliminary
First Production
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
No Identification Needed
Full Production
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
Obsolete
Not In Production
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
©2001 Fairchild Semiconductor Corporation
Rev. H2
This datasheet has been download from:
www.datasheetcatalog.com
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